TWI365235B - Method for manufacturing epitaxial wafer - Google Patents
Method for manufacturing epitaxial waferInfo
- Publication number
- TWI365235B TWI365235B TW096140611A TW96140611A TWI365235B TW I365235 B TWI365235 B TW I365235B TW 096140611 A TW096140611 A TW 096140611A TW 96140611 A TW96140611 A TW 96140611A TW I365235 B TWI365235 B TW I365235B
- Authority
- TW
- Taiwan
- Prior art keywords
- epitaxial wafer
- manufacturing epitaxial
- manufacturing
- wafer
- epitaxial
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/206—Controlling or regulating the thermal history of growing the ingot
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/20—Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/02—Heat treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
- H01L21/3225—Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006300644A JP4853237B2 (ja) | 2006-11-06 | 2006-11-06 | エピタキシャルウェーハの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200829732A TW200829732A (en) | 2008-07-16 |
TWI365235B true TWI365235B (en) | 2012-06-01 |
Family
ID=38969955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096140611A TWI365235B (en) | 2006-11-06 | 2007-10-29 | Method for manufacturing epitaxial wafer |
Country Status (5)
Country | Link |
---|---|
US (1) | US8920560B2 (zh) |
EP (1) | EP1926134B1 (zh) |
JP (1) | JP4853237B2 (zh) |
KR (1) | KR100933552B1 (zh) |
TW (1) | TWI365235B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4805681B2 (ja) * | 2006-01-12 | 2011-11-02 | ジルトロニック アクチエンゲゼルシャフト | エピタキシャルウェーハおよびエピタキシャルウェーハの製造方法 |
JP5136518B2 (ja) * | 2008-06-16 | 2013-02-06 | 株式会社Sumco | シリコン単結晶の育成方法 |
JP5555995B2 (ja) * | 2008-09-12 | 2014-07-23 | 株式会社Sumco | 貼り合わせシリコンウェーハの製造方法 |
JP2011054821A (ja) * | 2009-09-03 | 2011-03-17 | Sumco Corp | エピタキシャルウェーハの製造方法及びエピタキシャルウェーハ |
JP2011082443A (ja) * | 2009-10-09 | 2011-04-21 | Sumco Corp | エピタキシャルウェーハおよびその製造方法 |
JP5194146B2 (ja) * | 2010-12-28 | 2013-05-08 | ジルトロニック アクチエンゲゼルシャフト | シリコン単結晶の製造方法、シリコン単結晶、およびウエハ |
US11180866B2 (en) * | 2013-04-10 | 2021-11-23 | Kla Corporation | Passivation of nonlinear optical crystals |
KR101729515B1 (ko) * | 2015-04-14 | 2017-04-24 | 주식회사 엘지실트론 | 실리콘 단결정 잉곳의 성장 방법 |
JP6447351B2 (ja) | 2015-05-08 | 2019-01-09 | 株式会社Sumco | シリコンエピタキシャルウェーハの製造方法およびシリコンエピタキシャルウェーハ |
JP6610056B2 (ja) | 2015-07-28 | 2019-11-27 | 株式会社Sumco | エピタキシャルシリコンウェーハの製造方法 |
JP6631460B2 (ja) * | 2016-10-03 | 2020-01-15 | 株式会社Sumco | シリコン単結晶の製造方法およびシリコン単結晶 |
DE102017213587A1 (de) * | 2017-08-04 | 2019-02-07 | Siltronic Ag | Halbleiterscheibe aus einkristallinem Silizium und Verfahren zur Herstellung der Halbleiterscheibe |
CN113862791A (zh) * | 2021-09-28 | 2021-12-31 | 西安奕斯伟材料科技有限公司 | 一种用于拉制单晶硅棒的拉晶炉 |
CN113862777B (zh) * | 2021-09-30 | 2023-05-16 | 西安奕斯伟材料科技股份有限公司 | 一种用于制造单晶硅棒的拉晶炉、方法及单晶硅棒 |
JP2023093096A (ja) * | 2021-12-22 | 2023-07-04 | グローバルウェーハズ・ジャパン株式会社 | シリコンエピタキシャル基板の製造方法およびシリコンエピタキシャル基板 |
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JP3006669B2 (ja) * | 1995-06-20 | 2000-02-07 | 信越半導体株式会社 | 結晶欠陥の均一なシリコン単結晶の製造方法およびその製造装置 |
KR100319413B1 (ko) | 1996-12-03 | 2002-01-05 | 고지마 마타오 | 반도체 실리콘 에피택셜 웨이퍼 및 반도체 디바이스의 제조 방법 |
JPH10223641A (ja) * | 1996-12-03 | 1998-08-21 | Sumitomo Sitix Corp | 半導体シリコンエピタキシャルウェーハ及び半導体デバイスの製造方法 |
JP2000016897A (ja) * | 1998-07-03 | 2000-01-18 | Sumitomo Metal Ind Ltd | 高品質シリコン単結晶の製造方法 |
JP4233651B2 (ja) * | 1998-10-29 | 2009-03-04 | 信越半導体株式会社 | シリコン単結晶ウエーハ |
JP3601324B2 (ja) * | 1998-11-19 | 2004-12-15 | 信越半導体株式会社 | 結晶欠陥の少ないシリコン単結晶ウエーハ及びその製造方法 |
TW528816B (en) | 1999-04-23 | 2003-04-21 | Mitsubishi Material Silicon | Method for heat treating silicon wafer |
JP4003351B2 (ja) | 1999-07-28 | 2007-11-07 | 株式会社Sumco | Ig処理法 |
JP3855531B2 (ja) | 1999-04-23 | 2006-12-13 | 株式会社Sumco | ポリシリコン層付きシリコンウェーハ及びその製造方法 |
JP4107628B2 (ja) | 1999-11-26 | 2008-06-25 | 株式会社Sumco | シリコンウェーハにig効果を付与するための前熱処理方法 |
US20020142170A1 (en) * | 1999-07-28 | 2002-10-03 | Sumitomo Metal Industries, Ltd. | Silicon single crystal, silicon wafer, and epitaxial wafer |
JP2001217251A (ja) | 1999-11-26 | 2001-08-10 | Mitsubishi Materials Silicon Corp | シリコンウェーハの熱処理方法 |
JP2001253795A (ja) * | 2000-03-09 | 2001-09-18 | Sumitomo Metal Ind Ltd | シリコンエピタキシャルウェーハとその製造方法 |
KR100368331B1 (ko) | 2000-10-04 | 2003-01-24 | 주식회사 실트론 | 반도체 웨이퍼의 열처리 방법 및 이를 통해 제조된 반도체 웨이퍼 |
US6835245B2 (en) * | 2000-06-22 | 2004-12-28 | Sumitomo Mitsubishi Silicon Corporation | Method of manufacturing epitaxial wafer and method of producing single crystal as material therefor |
DE10047346B4 (de) * | 2000-09-25 | 2007-07-12 | Mitsubishi Materials Silicon Corp. | Verfahren zur Herstellung eines Siliciumwafers zur Abscheidung einer Epitaxieschicht und Epitaxiewafer |
JP3624827B2 (ja) * | 2000-12-20 | 2005-03-02 | 三菱住友シリコン株式会社 | シリコン単結晶の製造方法 |
EP2295619B1 (en) * | 2001-01-26 | 2014-04-23 | MEMC Electronic Materials, Inc. | Process for producing Low Defect Density Silicon Having a Vacancy-Dominated Core Substantially Free of Oxidation Induced Stacking Faults |
US6709957B2 (en) * | 2001-06-19 | 2004-03-23 | Sumitomo Mitsubishi Silicon Corporation | Method of producing epitaxial wafers |
JP2004091211A (ja) * | 2002-07-12 | 2004-03-25 | Oki Data Corp | 媒体トレイ及びこれを用いた画像記録装置 |
JP4570317B2 (ja) * | 2002-08-29 | 2010-10-27 | 株式会社Sumco | シリコン単結晶とエピタキシャルウェーハ並びにそれらの製造方法 |
KR20060040733A (ko) * | 2003-08-12 | 2006-05-10 | 신에쯔 한도타이 가부시키가이샤 | 웨이퍼의 제조방법 |
-
2006
- 2006-11-06 JP JP2006300644A patent/JP4853237B2/ja active Active
-
2007
- 2007-10-26 EP EP07021018.2A patent/EP1926134B1/en active Active
- 2007-10-29 TW TW096140611A patent/TWI365235B/zh active
- 2007-11-02 US US11/934,461 patent/US8920560B2/en active Active
- 2007-11-06 KR KR1020070112483A patent/KR100933552B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20080041128A (ko) | 2008-05-09 |
US20080286565A1 (en) | 2008-11-20 |
KR100933552B1 (ko) | 2009-12-23 |
TW200829732A (en) | 2008-07-16 |
EP1926134A1 (en) | 2008-05-28 |
JP4853237B2 (ja) | 2012-01-11 |
EP1926134B1 (en) | 2016-03-30 |
JP2008115050A (ja) | 2008-05-22 |
US8920560B2 (en) | 2014-12-30 |
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