TWI364086B - - Google Patents
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- Publication number
- TWI364086B TWI364086B TW97136450A TW97136450A TWI364086B TW I364086 B TWI364086 B TW I364086B TW 97136450 A TW97136450 A TW 97136450A TW 97136450 A TW97136450 A TW 97136450A TW I364086 B TWI364086 B TW I364086B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- unit
- tested
- flexible
- bearing surface
- Prior art date
Links
- 238000012360 testing method Methods 0.000 claims description 26
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 238000007689 inspection Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000000523 sample Substances 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims description 2
- 238000000429 assembly Methods 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims 1
- 230000002463 transducing effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 72
- 239000013078 crystal Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000000994 depressogenic effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97136450A TW201013803A (en) | 2008-09-23 | 2008-09-23 | A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97136450A TW201013803A (en) | 2008-09-23 | 2008-09-23 | A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201013803A TW201013803A (en) | 2010-04-01 |
| TWI364086B true TWI364086B (enExample) | 2012-05-11 |
Family
ID=44829474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97136450A TW201013803A (en) | 2008-09-23 | 2008-09-23 | A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201013803A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI581904B (zh) * | 2014-11-18 | 2017-05-11 | 漢民科技股份有限公司 | 工件處理裝置與方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012112904A (ja) * | 2010-11-26 | 2012-06-14 | Micronics Japan Co Ltd | プローブカード並びに半導体検査装置及び半導体検査方法 |
| CN113251976B (zh) * | 2021-06-30 | 2021-09-24 | 苏师大半导体材料与设备研究院(邳州)有限公司 | 硅片外形尺寸检测工具及检测方法 |
-
2008
- 2008-09-23 TW TW97136450A patent/TW201013803A/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI581904B (zh) * | 2014-11-18 | 2017-05-11 | 漢民科技股份有限公司 | 工件處理裝置與方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201013803A (en) | 2010-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |