TW201013803A - A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method - Google Patents
A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method Download PDFInfo
- Publication number
- TW201013803A TW201013803A TW97136450A TW97136450A TW201013803A TW 201013803 A TW201013803 A TW 201013803A TW 97136450 A TW97136450 A TW 97136450A TW 97136450 A TW97136450 A TW 97136450A TW 201013803 A TW201013803 A TW 201013803A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- tested
- unit
- bearing surface
- flexible unit
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000003825 pressing Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000007689 inspection Methods 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000013022 venting Methods 0.000 claims description 4
- 239000000523 sample Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims 1
- 230000002496 gastric effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 81
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000012856 packing Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97136450A TW201013803A (en) | 2008-09-23 | 2008-09-23 | A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97136450A TW201013803A (en) | 2008-09-23 | 2008-09-23 | A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201013803A true TW201013803A (en) | 2010-04-01 |
| TWI364086B TWI364086B (enExample) | 2012-05-11 |
Family
ID=44829474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97136450A TW201013803A (en) | 2008-09-23 | 2008-09-23 | A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201013803A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI425221B (zh) * | 2010-11-26 | 2014-02-01 | Nihon Micronics Kk | Probe cards and semiconductor inspection devices and semiconductor inspection methods |
| CN113251976A (zh) * | 2021-06-30 | 2021-08-13 | 苏师大半导体材料与设备研究院(邳州)有限公司 | 硅片外形尺寸检测工具及检测方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI581904B (zh) * | 2014-11-18 | 2017-05-11 | 漢民科技股份有限公司 | 工件處理裝置與方法 |
-
2008
- 2008-09-23 TW TW97136450A patent/TW201013803A/zh not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI425221B (zh) * | 2010-11-26 | 2014-02-01 | Nihon Micronics Kk | Probe cards and semiconductor inspection devices and semiconductor inspection methods |
| CN113251976A (zh) * | 2021-06-30 | 2021-08-13 | 苏师大半导体材料与设备研究院(邳州)有限公司 | 硅片外形尺寸检测工具及检测方法 |
| CN113251976B (zh) * | 2021-06-30 | 2021-09-24 | 苏师大半导体材料与设备研究院(邳州)有限公司 | 硅片外形尺寸检测工具及检测方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI364086B (enExample) | 2012-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4985513B2 (ja) | 電子部品の剥離方法及び剥離装置 | |
| TWI671824B (zh) | 半導體製造裝置及半導體裝置的製造方法 | |
| CN101393885A (zh) | 晶圆检测机台用固定/释放辅助装置、该检测机台及方法 | |
| KR101970884B1 (ko) | 반도체 제조 장치 및 반도체 장치의 제조 방법 | |
| KR102256369B1 (ko) | 이차전지 셀 제조용 전극 픽앤플레이스 장치 및 방법 | |
| KR102175509B1 (ko) | 플렉시블 디스플레이 및 곡면 커버 부재의 합착 장치 및 합착 방법 | |
| KR20150059566A (ko) | 플렉시블 디스플레이 및 곡면 커버 부재의 합착 장치 및 합착 방법 | |
| JP2000208447A (ja) | 半導体製造装置及び半導体装置の製造方法 | |
| JP4814284B2 (ja) | テープ貼付装置 | |
| JP5515024B2 (ja) | チップ積層デバイス検査方法及びチップ積層デバイス再配列ユニット並びにチップ積層デバイス用検査装置 | |
| TW201013803A (en) | A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method | |
| JP4500173B2 (ja) | 静電気除去方法および基板処理装置 | |
| JP2014031270A (ja) | シート貼付方法及びシート貼付装置 | |
| JP2018029171A (ja) | 電子部品実装装置 | |
| TW200303067A (en) | Chip pickup device, its manufacturing method and semiconductor manufacturing device | |
| TW201036819A (en) | Attaching device and attaching method using the same | |
| JP2001308033A (ja) | ウエハ固定方法 | |
| JP2008244125A (ja) | 電子部品の実装ツール、実装装置及び実装方法 | |
| JP2015169589A (ja) | 半導体試験装置 | |
| KR101403850B1 (ko) | 대면적 기판 홀딩 장치 | |
| JP5373008B2 (ja) | 基板貼合せ方法 | |
| CN109204933B (zh) | 贴膜设备及一种贴覆方法 | |
| CN112895417A (zh) | 一种用于贴敷手机玻璃盖板的pe保护膜 | |
| JPH10154671A (ja) | 半導体製造装置、及び半導体装置の製造方法 | |
| CN114507484B (zh) | 一种粘着吸附装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |