TWI363869B - - Google Patents

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Publication number
TWI363869B
TWI363869B TW100105801A TW100105801A TWI363869B TW I363869 B TWI363869 B TW I363869B TW 100105801 A TW100105801 A TW 100105801A TW 100105801 A TW100105801 A TW 100105801A TW I363869 B TWI363869 B TW I363869B
Authority
TW
Taiwan
Prior art keywords
adhesive layer
film
wafer
adhesive
elongation
Prior art date
Application number
TW100105801A
Other languages
English (en)
Chinese (zh)
Other versions
TW201142280A (en
Inventor
Toshimitsu Nakamura
Yasumasa Morishima
Shinichi Ishiwata
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010184015A external-priority patent/JP4785095B2/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW201142280A publication Critical patent/TW201142280A/zh
Application granted granted Critical
Publication of TWI363869B publication Critical patent/TWI363869B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW100105801A 2010-08-19 2011-02-22 Wafer processing tape TW201142280A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010184015A JP4785095B2 (ja) 2009-08-25 2010-08-19 ウエハ加工用テープ

Publications (2)

Publication Number Publication Date
TW201142280A TW201142280A (en) 2011-12-01
TWI363869B true TWI363869B (cg-RX-API-DMAC10.html) 2012-05-11

Family

ID=45794725

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100105801A TW201142280A (en) 2010-08-19 2011-02-22 Wafer processing tape

Country Status (3)

Country Link
KR (1) KR101119802B1 (cg-RX-API-DMAC10.html)
CN (1) CN102373017A (cg-RX-API-DMAC10.html)
TW (1) TW201142280A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101616680B1 (ko) * 2013-03-28 2016-04-28 후루카와 덴키 고교 가부시키가이샤 점착 테이프 및 웨이퍼 가공용 테이프
US9070745B1 (en) * 2013-12-13 2015-06-30 Lam Research Corporation Methods and systems for forming semiconductor laminate structures
JP5863914B1 (ja) * 2014-09-05 2016-02-17 古河電気工業株式会社 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156754A (ja) 2004-11-30 2006-06-15 Furukawa Electric Co Ltd:The ダイシングダイボンドテープ
JP4748518B2 (ja) 2005-07-20 2011-08-17 古河電気工業株式会社 ダイシングダイボンドテープおよびダイシングテープ
WO2009063793A1 (ja) * 2007-11-15 2009-05-22 The Furukawa Electric Co., Ltd. 半導体ウエハ加工用粘着テープ
JP2010251727A (ja) 2009-03-24 2010-11-04 Furukawa Electric Co Ltd:The 半導体ウエハ加工用テープ

Also Published As

Publication number Publication date
KR20120018047A (ko) 2012-02-29
TW201142280A (en) 2011-12-01
KR101119802B1 (ko) 2012-03-22
CN102373017A (zh) 2012-03-14

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