CN102373017A - 晶片加工用胶带 - Google Patents

晶片加工用胶带 Download PDF

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Publication number
CN102373017A
CN102373017A CN2011100430576A CN201110043057A CN102373017A CN 102373017 A CN102373017 A CN 102373017A CN 2011100430576 A CN2011100430576 A CN 2011100430576A CN 201110043057 A CN201110043057 A CN 201110043057A CN 102373017 A CN102373017 A CN 102373017A
Authority
CN
China
Prior art keywords
adhesive layer
adhesive
film
wafer processing
test piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011100430576A
Other languages
English (en)
Chinese (zh)
Inventor
中村俊光
盛岛泰正
石渡伸一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010184015A external-priority patent/JP4785095B2/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of CN102373017A publication Critical patent/CN102373017A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN2011100430576A 2010-08-19 2011-02-21 晶片加工用胶带 Pending CN102373017A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010184015A JP4785095B2 (ja) 2009-08-25 2010-08-19 ウエハ加工用テープ
JP2010-184015 2010-08-19

Publications (1)

Publication Number Publication Date
CN102373017A true CN102373017A (zh) 2012-03-14

Family

ID=45794725

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011100430576A Pending CN102373017A (zh) 2010-08-19 2011-02-21 晶片加工用胶带

Country Status (3)

Country Link
KR (1) KR101119802B1 (cg-RX-API-DMAC10.html)
CN (1) CN102373017A (cg-RX-API-DMAC10.html)
TW (1) TW201142280A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104716021A (zh) * 2013-12-13 2015-06-17 朗姆研究公司 形成半导体叠层结构的方法和系统
CN106663617A (zh) * 2014-09-05 2017-05-10 古河电气工业株式会社 半导体加工用带及使用此所制造的半导体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101616680B1 (ko) * 2013-03-28 2016-04-28 후루카와 덴키 고교 가부시키가이샤 점착 테이프 및 웨이퍼 가공용 테이프

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009063793A1 (ja) * 2007-11-15 2009-05-22 The Furukawa Electric Co., Ltd. 半導体ウエハ加工用粘着テープ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156754A (ja) 2004-11-30 2006-06-15 Furukawa Electric Co Ltd:The ダイシングダイボンドテープ
JP4748518B2 (ja) 2005-07-20 2011-08-17 古河電気工業株式会社 ダイシングダイボンドテープおよびダイシングテープ
JP2010251727A (ja) 2009-03-24 2010-11-04 Furukawa Electric Co Ltd:The 半導体ウエハ加工用テープ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009063793A1 (ja) * 2007-11-15 2009-05-22 The Furukawa Electric Co., Ltd. 半導体ウエハ加工用粘着テープ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104716021A (zh) * 2013-12-13 2015-06-17 朗姆研究公司 形成半导体叠层结构的方法和系统
CN104716021B (zh) * 2013-12-13 2019-04-09 朗姆研究公司 形成半导体叠层结构的方法和系统
CN106663617A (zh) * 2014-09-05 2017-05-10 古河电气工业株式会社 半导体加工用带及使用此所制造的半导体装置
CN106663617B (zh) * 2014-09-05 2018-05-29 古河电气工业株式会社 半导体加工用带及使用此所制造的半导体装置

Also Published As

Publication number Publication date
TWI363869B (cg-RX-API-DMAC10.html) 2012-05-11
KR20120018047A (ko) 2012-02-29
TW201142280A (en) 2011-12-01
KR101119802B1 (ko) 2012-03-22

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