KR101119802B1 - 웨이퍼 가공용 테이프 - Google Patents

웨이퍼 가공용 테이프 Download PDF

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Publication number
KR101119802B1
KR101119802B1 KR1020110015334A KR20110015334A KR101119802B1 KR 101119802 B1 KR101119802 B1 KR 101119802B1 KR 1020110015334 A KR1020110015334 A KR 1020110015334A KR 20110015334 A KR20110015334 A KR 20110015334A KR 101119802 B1 KR101119802 B1 KR 101119802B1
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KR
South Korea
Prior art keywords
adhesive layer
adhesive
tape
test piece
tear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020110015334A
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English (en)
Korean (ko)
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KR20120018047A (ko
Inventor
도시미쯔 나까무라
야스마사 모리시마
신이찌 이시와따
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from JP2010184015A external-priority patent/JP4785095B2/ja
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20120018047A publication Critical patent/KR20120018047A/ko
Application granted granted Critical
Publication of KR101119802B1 publication Critical patent/KR101119802B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020110015334A 2010-08-19 2011-02-22 웨이퍼 가공용 테이프 Active KR101119802B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010184015A JP4785095B2 (ja) 2009-08-25 2010-08-19 ウエハ加工用テープ
JPJP-P-2010-184015 2010-08-19

Publications (2)

Publication Number Publication Date
KR20120018047A KR20120018047A (ko) 2012-02-29
KR101119802B1 true KR101119802B1 (ko) 2012-03-22

Family

ID=45794725

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110015334A Active KR101119802B1 (ko) 2010-08-19 2011-02-22 웨이퍼 가공용 테이프

Country Status (3)

Country Link
KR (1) KR101119802B1 (cg-RX-API-DMAC10.html)
CN (1) CN102373017A (cg-RX-API-DMAC10.html)
TW (1) TW201142280A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101616680B1 (ko) * 2013-03-28 2016-04-28 후루카와 덴키 고교 가부시키가이샤 점착 테이프 및 웨이퍼 가공용 테이프
US9070745B1 (en) * 2013-12-13 2015-06-30 Lam Research Corporation Methods and systems for forming semiconductor laminate structures
JP5863914B1 (ja) * 2014-09-05 2016-02-17 古河電気工業株式会社 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156754A (ja) 2004-11-30 2006-06-15 Furukawa Electric Co Ltd:The ダイシングダイボンドテープ
JP2007053325A (ja) 2005-07-20 2007-03-01 Furukawa Electric Co Ltd:The ダイシングダイボンドテープおよびダイシングテープ
JP2010251727A (ja) 2009-03-24 2010-11-04 Furukawa Electric Co Ltd:The 半導体ウエハ加工用テープ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009063793A1 (ja) * 2007-11-15 2009-05-22 The Furukawa Electric Co., Ltd. 半導体ウエハ加工用粘着テープ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156754A (ja) 2004-11-30 2006-06-15 Furukawa Electric Co Ltd:The ダイシングダイボンドテープ
JP2007053325A (ja) 2005-07-20 2007-03-01 Furukawa Electric Co Ltd:The ダイシングダイボンドテープおよびダイシングテープ
JP2010251727A (ja) 2009-03-24 2010-11-04 Furukawa Electric Co Ltd:The 半導体ウエハ加工用テープ

Also Published As

Publication number Publication date
TWI363869B (cg-RX-API-DMAC10.html) 2012-05-11
KR20120018047A (ko) 2012-02-29
TW201142280A (en) 2011-12-01
CN102373017A (zh) 2012-03-14

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