TWI363587B - Three-dimensional circuit board formation apparatus and formation method thereof - Google Patents

Three-dimensional circuit board formation apparatus and formation method thereof Download PDF

Info

Publication number
TWI363587B
TWI363587B TW097146559A TW97146559A TWI363587B TW I363587 B TWI363587 B TW I363587B TW 097146559 A TW097146559 A TW 097146559A TW 97146559 A TW97146559 A TW 97146559A TW I363587 B TWI363587 B TW I363587B
Authority
TW
Taiwan
Prior art keywords
circuit board
forming
adhesive layer
dimensional
circuit
Prior art date
Application number
TW097146559A
Other languages
English (en)
Chinese (zh)
Other versions
TW200938028A (en
Inventor
Hiroshi Okada
Fumiaki Ishida
Tayuru Yoshida
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of TW200938028A publication Critical patent/TW200938028A/zh
Application granted granted Critical
Publication of TWI363587B publication Critical patent/TWI363587B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
TW097146559A 2007-12-13 2008-12-01 Three-dimensional circuit board formation apparatus and formation method thereof TWI363587B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007322342A JP4400673B2 (ja) 2007-12-13 2007-12-13 立体的回路基板の形成装置および形成方法

Publications (2)

Publication Number Publication Date
TW200938028A TW200938028A (en) 2009-09-01
TWI363587B true TWI363587B (en) 2012-05-01

Family

ID=40770561

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097146559A TWI363587B (en) 2007-12-13 2008-12-01 Three-dimensional circuit board formation apparatus and formation method thereof

Country Status (4)

Country Link
JP (1) JP4400673B2 (ja)
KR (1) KR100982590B1 (ja)
CN (1) CN101460012B (ja)
TW (1) TWI363587B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5131013B2 (ja) * 2008-04-24 2013-01-30 住友金属鉱山株式会社 立体的回路基板の形成方法および形成装置
JP5131251B2 (ja) * 2009-06-25 2013-01-30 住友金属鉱山株式会社 立体的回路基板の製造方法
JP5251803B2 (ja) * 2009-09-17 2013-07-31 住友金属鉱山株式会社 立体的回路基板の製造方法
CN109548270A (zh) * 2018-11-09 2019-03-29 广东洲明节能科技有限公司 线路板及其制作方法
US20220250110A1 (en) * 2019-04-30 2022-08-11 Dexerials Corporation Sliding device
CN111712067A (zh) * 2020-05-21 2020-09-25 深圳崇达多层线路板有限公司 一种pcb预定位连续熔铆的制作方法及传送装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0428695A4 (en) * 1989-05-19 1991-12-27 Trove Technology Incorporated Improved three-dimensional circuit component assembly and method corresponding thereto
JP3595695B2 (ja) 1998-08-31 2004-12-02 キヤノン株式会社 円筒状基材上のフッ素樹脂表面に転写部材の表面模様を転写する方法
JP2002353575A (ja) 2001-05-23 2002-12-06 Nitto Denko Corp 複合管状体およびその製造方法
JP4092113B2 (ja) * 2002-02-28 2008-05-28 大和製罐株式会社 缶体へのフィルム貼着方法およびその装置
US7262489B2 (en) * 2003-11-12 2007-08-28 Polymatech Co., Ltd. Three-dimensionally formed circuit sheet, component and method for manufacturing the same
JP2005235803A (ja) * 2004-02-17 2005-09-02 Kunio Oe 部品供給装置および部品供給方法
JP4371860B2 (ja) * 2004-03-09 2009-11-25 新日鐵化学株式会社 フレキシブルプリント配線板用基板の製造方法
JP4428449B2 (ja) * 2008-01-15 2010-03-10 住友金属鉱山株式会社 立体的回路基板の形成装置および形成方法

Also Published As

Publication number Publication date
JP2009147081A (ja) 2009-07-02
CN101460012B (zh) 2011-04-06
CN101460012A (zh) 2009-06-17
KR20090063098A (ko) 2009-06-17
JP4400673B2 (ja) 2010-01-20
TW200938028A (en) 2009-09-01
KR100982590B1 (ko) 2010-09-15

Similar Documents

Publication Publication Date Title
TWI363587B (en) Three-dimensional circuit board formation apparatus and formation method thereof
KR100999212B1 (ko) 입체적 회로기판의 형성장치 및 형성방법
TWI356658B (en) Members for circuit board, method and device for m
TW201219890A (en) System for manufacturing flexible liquid crystal display and method for manufacturing flexible display
JP2007047304A (ja) 液晶表示装置の製造装置および製造方法ならびに液晶表示装置
JP5983845B2 (ja) 圧力センサおよび接続部材の製造方法
TWI435351B (zh) Laminated metal parts manufacturing apparatus and laminated type electronic parts manufacturing method
JP5131013B2 (ja) 立体的回路基板の形成方法および形成装置
TW200945976A (en) Method of manufacturing wiring circuit board
TWI637674B (zh) Method for manufacturing flexible printed circuit board and intermediate product thereof
JP5850574B2 (ja) 連続パターンメッキ転写システム及び連続パターンメッキ転写物製造方法
KR20110119891A (ko) 진공 라미네이터
JP2009267014A (ja) 立体的回路の製造方法
JP5251828B2 (ja) 立体的回路基板の製造方法
JP5440807B2 (ja) 積層型電子部品製造装置及び積層型電子部品の製造方法
JP2007149936A (ja) フレキシブル基板のシート材仮貼付装置
JPH11261244A (ja) 多層配線基板の製造方法及び転写用真空装置
JP5413301B2 (ja) 積層型電子部品製造装置及び積層型電子部品の製造方法
JP2017017169A (ja) 配線板の製造方法および塗布装置
KR101683644B1 (ko) 연권 및 강권이 가능한 경화 오븐 및 이를 이용한 경화 방법
KR20140013466A (ko) 칩 인덕터 제조 방법
JP2013191708A (ja) 立体的回路基板及びその製造方法
WO2016113971A1 (ja) 接続部材を介して接続された複数の配線基板を備える複合配線基板、接続部材の製造方法および接続部材、並びに圧力センサ
WO2013191026A1 (ja) プリント回路基板及びその製造装置並びに製造方法
TW201217859A (en) Laminating apparatus of film

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees