1363587 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種立體性電路基板的形成裝置及形 成方法，尤其有關一種將電路基板貼附於輥（roller)的表 面，藉此形成立體性電路基板之裝置及方法。 【先前技術】 隨著行動電話等電子機器的小型化、多功能化、及低 成本化，係要求將電路基板緊密地安裝於框體的裡面盘外 面。因此，有時會需要立體性的電路基板而不是平面性的 電路基板。此外，在轉印機的領域中，已提案有一種方法， 係將電路基板貼附於顯像用輥、帶電輥、或轉印輥等輕的 表面一部分或全周，藉此形成立體性電路基板。 6就形成此種立舰電路基板的—般性方法而言，以往 稱為X射出成型法或二次射出成型法之射出成型法。 在一次射出成型法中，首先將可進行無電解鍵覆且且 =導電性的樹卿成射的立體形狀，接著於樹脂的表面 立佈感光性阻劑，將電路圖案予以曝光顯像，錄未曝光 #分的感光性阻劑’於露出的樹脂表面舒無電解鍵覆， 而獲得立體性電路基板。 的縮^對於此’在二次射出成型法中，使用調配有鐘覆用 产媒之樹脂，藉由最初的射出成型形成可進行無電解鍵 =立體形狀，藉由第二次的射出成型於表面的預定部分 觸姐仃’、電解鍍覆的表面層，接著於調配有鍍覆用的 觸媒的樹輯顯露的表面部分施予無電解鑛覆，而獲得立 320804 4 1363587 體性電路基板。 然而，不論是一次射出成型法或二次射出成型法，皆 4 有以下的問題。例如，在一次射出成型法中，製造步驟非 / 常長且成本高。此外，不適合製造具有三次元的曲面形狀 的立體形狀。再者，樹脂材料有限制，難以進行電路的圖 案化。 另一方面，在二次射出成型法中，雖適用於製造具有 三次元的曲面形狀的立體形狀，然而由於要求高精密度的 • 成型用模具，且進行兩次的射出成型等，因此成本變高。 因此，不論是哪種射出成型法，皆不適合作為用以將 電路基板形成於輥的表面全周之方法。 就這種將電路基板形成於輥的表面全周之方法而 言，係考慮一種方法，係於聚醯亞胺等絕緣性薄膜的表面 使用設置有銅等導體層之基材，將導體層予以圖案化，以 形成電路基板，將所獲得的電路基板貼附於輥的表面全 Φ 周。由於此種電路基板能大量且低價的製造，因此只要能 貼附於輥，即具有優勢。 此外，後述之專利文獻1已記載有一種方法，係以旋 切刀（Rotary cutter )方式將薄膜貼附於圓柱狀或圓筒狀的 罐體。在該方法中，高精密度地將無法自我保持的柔軟性 薄膜切斷成期望的長度，將切斷而得的薄膜供給至罐體， 良好地進行層疊（laminate )，藉此將可薄膜貼附於罐體。 更具體而言，使捲取狀態之無法自我保持的柔軟性薄膜真 空吸附並捲繞於進給報（feed roll )及乳花較（cutting 5 320804 1363587 roll)，將進給報的輪緣速率（peripheral speed)設定成比軋 花輥的輪緣速率還慢，對薄膜賦予張力，將軋花輥的真空 吸附部位分割成複數個並調整真空強度，藉此對薄膜賦予 滑動性，對切斷後的薄膜設置一定的間隔，以獲得朝向罐 體的層疊時序，在層疊輥的層疊部位中旋轉一周予以加 壓，消除薄膜的凹陷，使罐體與薄膜間無空氣殘留，而良 好地朝罐體層疊。 專利文獻1所記載的以旋切刀方式進行之貼附方法係 以將標籤貼附於罐體或瓶等飲料容器的瓶表面為目的而開 發者。因此，無須嚴密地管理用以貼附標籤的位置精密度 等，此外，在將標籤貼附於飲料容器的表面全周時，即使 於薄膜產生重疊或間隙亦不會成為問題。 然而，在將電子機器用途的電路基板貼附於輥的表面 全周之情形中，當於電路基板存在有重疊或大間隙時，由 於會於構成電路之配線產生短路或導通不良，而影響電路 的電性特性，因此會變成大問題。此外，在形成立體性電 路基板後的步驟中，為了持續進行從外部對電路基板進行 通電處理等之安裝步驟，因此若未將電路基板貼附於正確 的位置，則會在後續的安裝步驟中造成問題。因此，關於 貼合的位置精密度係被要求非常嚴密的管理。 此外，在將貼附有電路基板的輥作為旋轉體來使用的 情形中，當貼附時產生重疊或大間隙時，會於電路基板產 生凹凸，而產生於旋轉時發生局部性接觸等問題。因此， 係要求小至無重疊且容許間隙之程度。 6 320804 1363587 再者，於專利文獻1所記載的方法中，當欲將電路基 板貼附於輥的表面全周時，需在竪立的狀態下保持輥來予 ' 以搬運。然而，當輥為細長的形狀或者兩端或一端被加工 - 成複雜的形狀時，係難以經常垂直地保持來進行搬運，且 於輥之表面全周貼附電路基板。 如此，在將電路基板形成於輥的表面全周之立體性電 路基板的形成中，無法採用上述旋切刀方式的貼附方法。 專利文獻1 :日本特開平10-236446號公報 籲【發明内容】 (發明所欲解決之課題） 本發明的目的係提供一種能以正確的位置精密度將 電路基板貼附於圓柱狀或圓筒狀的輥表面（尤其是全周） 之立體性電路基板的形成裝置及形成方法。 (解決課題的手段） 本發明的立體性電路基板的形成裝置係具備有：旋轉 φ 機構，係在中心軸呈水平的狀態下保持圓柱狀或圓筒狀的 對象物，且將該中心軸作為旋轉軸而旋轉；保持機構，係 以使接著劑層朝下之方式保持電路基板，且水平搬運；以 及控制機構，係可調節相對位置關係，俾使所搬運的前述 電路基板的接著劑層接觸於進行旋轉的前述對象物表面， 且可將推壓至前述對象物表面之前述電路基板的壓力控制 在一定範圍。 前述電路基板的接著劑層係由在常溫下具有黏著性 的常溫硬化型的接著劑所構成，在前述電路基板的接著劑 7 320804 1363587 層被保護薄膜覆蓋的情形中，較佳為復具有用以去除該保 護薄膜之去除機構。 此外，在前述電路基板的接著劑層係由加熱後會顯現 黏著性的加熱硬化性的接著劑所構成之情形中，較佳為復 具有用以加熱前述接著劑層或前述對象物之加熱機構。 具體而言，前述旋轉機構係由以使前述對象物載置在 兩者間而旋轉之方式配置的兩個旋轉報所構成。 此外，復具有可配合載置於前述旋轉機構的前述對象 物的軸方向來收容前述電路基板之基準產生機構，藉此僅 朝與前述對象物的中心軸垂直的方向移動，而可貼附電路 基板。 此外，本發明的立體性電路基板的形成方法係由下述 步驟所構成：將在中心軸呈水平的狀態下以可旋轉的方式 保持圓柱狀或圓筒狀的對象物，一面具有電路且另一面設 置有接著劑層的電路基板切斷成預定大小，復將該電路基 板載置於基準位置，使該電路基板吸附於移動手段，並移 動該移動手段，將前述電路基板的接著劑層的端部接合於 前述對象物的表面，一邊控制用以將前述電路基板推壓至 前述對象物表面之壓力，一邊使前述電路基板水平移動， 且使前述對象物旋轉，藉此將前述電路基板貼附於前述對 象物的表面。 具體而言，使用上述立體性電路基板的形成裝置，調 節前述壓力，藉此控制間隙而將前述電路基板貼附於前述 對象物的表面全周。 8 320804 1363587 (發明之效果） ' 藉由本發明，可位置精密度佳、不會產生重疊、將間 隙抑制到最小限度、並正確地將電路基板貼附於難以垂直 地保持來進行搬運的電子機器用途的輥表面。 【實施方式】 一依據附圖詳細說明本發明的一實施形態。第}圖係顯 示本發明的立體性電路基板的形成裝置的一實施形態的概 •略圖。第2圖係顯不第1圖的基準產生機構的概略圖。 本發明的立體性電路基板的形成裝置係具備有：旋轉 f構（10)，係在中心軸呈水平的狀態下保持圓柱狀或圓 筒狀的對象物（1)，且將中心軸作為旋轉軸而旋轉；保持 機構（2〇)，係以使接著劑層朝下之方式保持電路基板（2)， 且水平搬運；以及控制機構（3〇)，係可調節相對位置關 係，俾使所搬運的電路基板（2)的接著劑層接觸於進行旋 轉的對象物（1)表面，且可將推壓至對象物表面之 φ 電路基板（2)的壓力控制在一定範圍。 電路基板（2)係收容於基準產生機構（4〇)。電路 基板（2)係配合被貼附的對象物（丨）的大小預先切斷成 預定尺寸。例如，在將電路基板（2)形成於屬於對象物（1) 的輥的全面之情形中，將對象物（1)的旋轉軸方向中的電 路基板（2)的側邊長度作成與對象物〇)的旋轉軸方向 的長度相同。此外，將對應對象物（1)的圓周方向之側邊 長度作成與對象物（1)的圓周大致相同。然而，如同後述， .切斷精密度會有誤差，且對象物（1)的形狀亦有公差，由 320804 9 1363587 於這些誤差會被修正，因此無須嚴密地使這些值一致。 基準產生機構（40)係作為切斷成預定尺寸的薄膜狀 的電路基板（2)的固持具而發揮功能。基準產生機構（4〇) 係例如由樹脂製的固定板（41)與可動板（42)所構成。 在將電路面朝上（接著劑層朝下）的狀態下，將切斷成預 疋尺寸的薄膜狀的電路基板（2)設置於基準產生機構 (40)。以基準產生機構（4〇)進行的定位係可動板（42) 將薄膜狀的電路基板（2)朝屬於χγ方向的固定式的基準 板之固定板（41)推壓，藉此設置於正確的位置。 已切斷的薄膜狀的電路基板（2)係可逐片設置，亦 可複數片聚集設置。在複數片聚集設置的情形中，將可重 疊收容複數片之匣安裝於基準產生機構（40)。 已設置在正確位置的薄膜狀的電路基板（2)係藉由 真空抽吸逐片被具有小孔的保持機構（2〇)吸附並予以搬 運。具體而吕’保持機構（20)係由具有可真空抽吸之以 小孔的樹脂板或金屬板所構成的吸附板、與該孔連通的真 空抽引系統、以及使該吸附板與真空抽吸系統上升下降及 朝水平方向移動之機構所構成。 保持機構（20)係在吸附薄膜狀的電路基板（？）後 上升。 在接著劑層由加熱後顯現黏著性的接著劑所構成的 情形中，使用以加熱電路基板（2)之加熱機構（5〇)通過。 就加熱機構（50)而言，係能採用已知的加熱器等。由於 活性的條件係根據接者劑的種類而不同，因此根據所使用 320804 10 1363587 的接著劑將加熱器所產生的加熱溫度以及加熱時間予以最 佳化，以進行加熱。加熱溫度係設成各接著劑的活性溫度 ' 範圍。 除了加熱電路基板（2)的接著劑層之外，加熱機構 (50)亦可採用藉由加熱對象物（丨）而於接合時加熱接著 劑層之機構。 ·， 此外，在圖示的態樣中，雖顯示接著劑層由加熱後顯 現黏著性的加熱硬化型的接著劑所構成之情形，但在接著 •劑層由在常溫下具有黏著性的接著劑所構成，且保護薄膜 貼附於接著劑層之情形中，係作成具備有用以去除保護薄 膜之去除機構。該去除機構亦可使用用以使保護薄膜剝離 去除之已知的裝置。 亦可同時具備這些加熱機構（5〇)與去除機構。 之後’使保持機構（20)移動，使電路基板（2)朝 設置有由金屬製或樹脂製的輥所構成的對象物〇)之旋轉 #機構（10)的上方移動。依需要，在該位置使保持機構（2〇) 下降’將電路基板（2)減至對象物⑴的表面，藉此 使電路基板⑵的接著劑層的端部（在朝對象物⑴的 旋轉轴方向伸長的側邊且為行進方向前側的端部）接合至 對象物（1)的表面。然而，亦可僅進行水平移動來該 接合。 旋轉機構（10)係具有使可自由旋轉的兩支旋轉㈣ 接之構造。就旋轉輕而言，能採用金屬製的輕。依需要， 亦能採用橡谬等彈性構材貼附於全周者。藉由轴承等以可 320804 11 1363587 奴轉之方式支撐該輥的兩端，而可追隨對象物 :象物⑴係載置於兩支旋轉㈣，保 〇疋° =狀的電路基板(2)的旋轉轴方向伸長心： 物⑴的旋轉轴成為平行之方式移動。在其他的情形中， =無;將電路基板(2)形成於對象物（υ的兩端之 二中柱亦可藉由轴承等來支樓該兩端部，而以可旋轉之 万式支持。 之後’吸附有薄膜狀的電路基板⑺之保持機構（則 =平移動，同時隨著對象物⑴的旋轉而從薄膜狀的電 路基板⑵的側邊接著於對象物⑴的表面全周。因此， 在接著劑層與對象物⑴之間不會捲入空氣。此外，即使 長度或直徑等對象物⑴的形狀改變，保持機構（2〇)亦 無須變更治具與構造，可將薄膜狀的電路基板⑵貼附於 對象物（1)。此外，亦能以使接著時的壓力成為—定之方 式，藉由使用有空氣或油壓之機構來進行。 由於薄膜狀的電路基板⑴係為於樹脂薄膜上形成 有銅等薄的導體之構造’因此會產生某種程度的伸展。在 本發明中，由於吸附於保持機構⑶）的薄膜狀的電路基 板（2)係為以捲繞之方式被貼附於對象物（丨）之構造， 因此藉由控制機構（30)令用以將電路基板（2)推壓 象物⑴之壓力產生魏，藉此薄膜狀的電(路)基推板 的伸展會不同，結果可以前述壓力控制貼附於對象物（1) 的表面全周之薄膜狀的電路基板（2)的間隙（貼附後的旋 轉軸方向之側邊間的距離）。具體而言，求出以預定尺寸 320804 12 1363587 切斷的薄膜狀的電路基板（2)的尺寸偏差或對象物（1) 的直徑偏差，一邊以不超出貼附後所要求的間隙之方式控 1 制壓力’ 一邊藉由捲繞來調整伸展。 ' 此外，會有因為在薄膜狀的電路基板（2)的切斷精 密度的偏差' 對象物（丨）為金屬製或樹脂製的輥時的直徑 之公差、以及在輥間所產生的製作上的偏差，造成計算上 的間隙不同之情形。然而，如上所述，在本發明中，可在 控制機構（30)中操作貼附時的壓力，使電路基板（2)的 ®伸展產生改變’而可將間隙控制在容許值以下的一定值。 (實施例一） • 首先’以下述方式製作電路基板（2)。 使用厚度35# m的PET (聚對苯二曱酸乙二酯）薄膜 (曰本東洋紡織股份有限公司製造，A4i〇0)，藉由濺鍍 於表面成膜銅薄膜，之後藉由銅電鍍法形成銅層。銅電鍍 係在室溫使用硫酸銅濃度9〇g/公升、硫酸濃度18〇g/公 φ升的鍍覆液，藉由陰極電流密度2A/dm2來形成厚度8# m的銅被覆。 並且’猎由光阻劑方式於銅層表面貼附乾膜光阻劑 (dry film photo resist)(日本旭化成股份有限公司製造， AQ-1158)，使用預定配線形狀的遮罩於乾膜光阻劑上進 行曝光、顯像、蝕刻，並進行乾膜光阻劑的剝離。此外， 於電路基板的背侧層疊在常溫下具有黏著性的接著劑（曰 本大日本顏料化學工業股份有限公司製造，雙面膠帶 #8616)來使用。從而’於接著劑層貼附保護薄膜。 320804 13 !363587 藉由模具切斷以上述方式所獲得的電路基板（2)， 使旋轉軸方向的側邊成為50.3mm、垂直方向的側邊成為 350mm。切斷後，設置於第2圖所示的卡匣（4〇)。 接著，使用第1圖的概略圖所示的立體性電路基板的 形成裝置，進行貼附步驟。該裝置係具備有：真空吸附（真 空）升降機（使用汽缸之升降機構）（3〇)、連接於該升 降機之吸附板（20)、加熱器（50)、保護薄膜去除裝置 (係在貼附於電路基板的保護薄膜之薄膜端部貼附有引導 帶（leader tape)，藉由抓住剝離引導帶而剝離保護薄膜之 機構）、旋轉裝置（10)、以及旋轉裝置用加熱器（未圖 示）。真空升降機（30)係可使吸附板（20)進行上升下 降移動，並可從卡匣（40)朝旋轉裝置（1〇)的方向水平 移動。保護薄膜去除裝置係鄰接加熱器（50),設置在從 卡S (40)朝向旋轉裝置（10)的生產線上。此外，未使 用加熱器（50)。就旋轉裝置（10)的旋轉輥而言，係使 用分別於金屬製輥表面裝設有矽橡，膠之直徑為4〇mm'長 度為400mm的輥。 將由直徑16mm、長度350mm的鋁管所構成的報（1) 作為對象物（1)載置於該旋轉裝置（1〇)的旋轉輥間。 此外，為了後述的測量，預先正確地測量電路基板（2 ) 與輥（1)的尺寸。 使吸附板（20)下降至收容於卡匣（4〇)的電路基板 (2)上而吸附電路基板（2)。使吸附板（2〇)上升且進 行水平移動。在水平移動的途中，係藉由保護薄膜去除裝 320804 14 1363587 ，剝離去除覆蓋於電路基板⑺的下側的接著劑層之保護 薄膜。當吸附板（2〇)的行進方向端部到達旋轉裝置上的 親⑴上時，韻板（20)係、下降直到藉由預設的壓力推 壓輥（1)為止。接著劑層的行進方向端部接觸至輥 的表面後，使吸附板（20)水平移動時，隨著吸附板的水 平移動輥（1)亦會旋轉，使電路基板（2)貼附於輥（ι) 的全周。 根據電路基板（2)的尺寸與輥（1)的直徑來計算電 路基板（2)側邊之間的間隙時，計算出的理論值為 0.20mm。 之後，排出貼附有電路基板（2)的輥（1；)，將新的 輥（1)載置於旋轉裝置（10)上，使貼附時的壓力如表工 所示般變化’對複數個輥（1)貼附電路基板。 根據所獲得的立體性電路基板，針對各個試料測量貼 附後的電路基板（2)侧邊間的間隙。將測量結果顯示於表1363587 VI. Description of the Invention: [Technical Field] The present invention relates to a device and a method for forming a three-dimensional circuit substrate, and more particularly to a method of attaching a circuit substrate to a surface of a roller, thereby forming a three-dimensionality Apparatus and method for a circuit board. [Prior Art] With the miniaturization, multi-functionalization, and low cost of electronic devices such as mobile phones, it is required to closely attach the circuit board to the outer surface of the inner disk of the casing. Therefore, a three-dimensional circuit substrate is sometimes required instead of a planar circuit substrate. Further, in the field of a transfer machine, there has been proposed a method of attaching a circuit board to a light surface or a whole circumference of a developing roller such as a developing roller, a charging roller, or a transfer roller, thereby forming a stereoscopic circuit. Substrate. 6 is a general method for forming such a shipboard circuit board, and is conventionally referred to as an injection molding method of an X injection molding method or a secondary injection molding method. In the primary injection molding method, first, a three-dimensional shape in which electrolessly bonded and = conductive is formed, and then a photosensitive resist is placed on the surface of the resin, and the circuit pattern is exposed and developed. The unexposed #photosensitive resist' is electrolessly bonded to the exposed resin surface to obtain a three-dimensional circuit substrate. In the secondary injection molding method, a resin prepared with a clock-coating medium is used, and the first injection molding can be performed to perform electroless bonding = three-dimensional shape, and the second injection molding is performed. The predetermined portion of the surface is contacted with the surface layer of the electrolytically plated surface, and then the electroless mineral coating is applied to the surface portion of the tree layer in which the catalyst for plating is prepared, thereby obtaining the body circuit substrate of 320804 4 1363587 . However, both the primary injection molding method and the secondary injection molding method have the following problems. For example, in a single injection molding process, the manufacturing steps are not/usually long and costly. Further, it is not suitable to manufacture a three-dimensional shape having a three-dimensional curved shape. Furthermore, the resin material is limited, and it is difficult to pattern the circuit. On the other hand, in the secondary injection molding method, although it is suitable for manufacturing a three-dimensional shape having a three-dimensional curved surface shape, a high-precision molding die is required, and two injection moldings are performed, so that the cost is changed. high. Therefore, neither of the injection molding methods is suitable as a method for forming the circuit substrate on the entire circumference of the surface of the roll. In the method of forming the circuit board on the entire circumference of the surface of the roll, a method is considered in which a conductor layer provided with a conductor layer such as copper is used on the surface of an insulating film such as polyimide or the like. Patterning to form a circuit substrate, and the obtained circuit substrate is attached to the surface of the roller for all Φ weeks. Since such a circuit board can be manufactured in a large amount and at a low price, it is advantageous as long as it can be attached to a roller. Further, Patent Document 1 described later has a method of attaching a film to a cylindrical or cylindrical can body by a rotary cutter. In this method, the flexible film which cannot be self-retained is cut into a desired length with high precision, and the cut film is supplied to the can body, and is laminated well, thereby applying the film. Attached to the tank. More specifically, the flexible film which is not self-retaining in the coiled state is vacuum-adsorbed and wound on a feed roll and a milking (cutting 5 320804 1363587 roll), and the rim rate of the feed is reported. The peripheral speed is set to be slower than the rim speed of the embossing roll, tension is applied to the film, and the vacuum adsorption portion of the embossing roll is divided into a plurality of pieces and the vacuum strength is adjusted, thereby imparting slidability to the film, after cutting The film is provided with a certain interval to obtain a lamination timing toward the can body, and is rotated by one rotation in the lamination portion of the laminating roller to eliminate the depression of the film, so that no air remains between the can body and the film, and the tank is well formed. Cascade. The attachment method by the rotary cutter method described in Patent Document 1 is developed for the purpose of attaching a label to the surface of a bottle of a beverage container such as a can body or a bottle. Therefore, it is not necessary to strictly manage the positional precision for attaching the label, and the like, and even when the label is attached to the entire surface of the beverage container, even if the film is overlapped or gapped, it does not become a problem. However, in the case where the circuit board for electronic equipment is attached to the entire circumference of the surface of the roller, when there is overlap or large gap in the circuit substrate, a short circuit or a conduction failure occurs in the wiring constituting the circuit, thereby affecting the circuit. The electrical characteristics are therefore a big problem. Further, in the step after forming the three-dimensional circuit board, in order to continue the mounting process of energizing the circuit board from the outside, if the circuit board is not attached to the correct position, it will be in the subsequent mounting step. Causes problems. Therefore, the positional precision regarding the fit is required to be very closely managed. Further, in the case where a roller to which a circuit board is attached is used as a rotating body, when overlap or a large gap occurs at the time of attaching, irregularities are generated in the circuit board, and local contact occurs during rotation. Therefore, the requirements are as small as no overlap and tolerance. In the method described in Patent Document 1, when the circuit board is to be attached to the entire surface of the roll, it is necessary to hold the roll in an upright state for transportation. However, when the roller has an elongated shape or both ends or one end are processed into a complicated shape, it is difficult to hold it vertically for transportation, and the circuit substrate is attached to the entire surface of the roller. As described above, in the formation of the three-dimensional circuit substrate in which the circuit board is formed on the entire circumference of the surface of the roller, the above-described method of attaching the rotary cutter method cannot be employed. [Problem to be Solved by the Invention] An object of the present invention is to provide a circuit board which can be attached to a cylindrical shape or a cylinder with correct positional precision. A device for forming a three-dimensional circuit substrate of a roll surface (especially for the entire circumference) and a method of forming the same. (Means for Solving the Problem) The apparatus for forming a three-dimensional circuit board of the present invention includes a rotation φ mechanism that holds a cylindrical or cylindrical object while the central axis is horizontal, and the central axis is used as the object Rotating the shaft and rotating; the holding mechanism holds the circuit board with the adhesive layer facing downward and horizontally conveys; and the control mechanism adjusts the relative positional relationship to contact the adhesive layer of the circuit substrate to be transported The surface of the object to be rotated is rotated, and the pressure of the circuit board pressed against the surface of the object can be controlled within a certain range. The adhesive layer of the circuit board is made of a room temperature curing type adhesive having adhesiveness at normal temperature, and in the case where the layer of the adhesive 7320804 1363587 of the circuit board is covered with a protective film, it is preferably used. To remove the removal mechanism of the protective film. Further, in the case where the adhesive layer of the circuit board is composed of a heat-curable adhesive which exhibits adhesiveness after heating, it is preferable to further have a heating mechanism for heating the adhesive layer or the object. . Specifically, the rotation mechanism is constituted by two rotation reports arranged such that the object is placed between the two and rotated. Further, the reference generating means for accommodating the circuit board in the axial direction of the object placed in the rotating mechanism is configured to move only in a direction perpendicular to the central axis of the object, and the circuit can be attached Substrate. Further, the method of forming a three-dimensional circuit board of the present invention comprises the steps of rotatably holding a cylindrical or cylindrical object while the central axis is horizontal, and having a circuit on one side and another The circuit board provided with the adhesive layer is cut into a predetermined size, the circuit board is placed on the reference position, the circuit board is attracted to the moving means, and the moving means is moved to bond the adhesive layer of the circuit board. The end portion is bonded to the surface of the object, and while controlling the pressure for pressing the circuit board against the surface of the object, the circuit board is horizontally moved, and the object is rotated to thereby affix the circuit board Attached to the surface of the aforementioned object. Specifically, the above-described substrate for forming a three-dimensional circuit board is used to adjust the pressure, thereby controlling the gap and attaching the circuit board to the entire circumference of the surface of the object. 8 320804 1363587 (Effects of the Invention) According to the present invention, it is possible to provide an electronic device which is excellent in positional precision, does not overlap, minimizes a gap, and accurately attaches a circuit board to a substrate that is difficult to hold vertically. Roll surface for use. [Embodiment] An embodiment of the present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a schematic view showing an embodiment of a device for forming a three-dimensional circuit board of the present invention. Fig. 2 is a schematic view showing a reference generating mechanism of Fig. 1; The apparatus for forming a three-dimensional circuit board according to the present invention includes a rotating structure (10), and holds a cylindrical or cylindrical object (1) while the central axis is horizontal, and rotates the central axis as a rotation. The shaft is rotated; the holding mechanism (2〇) holds the circuit board (2) with the adhesive layer facing downward, and horizontally conveys; and the control mechanism (3〇) adjusts the relative positional relationship. The adhesive layer of the transferred circuit board (2) is in contact with the surface of the object (1) to be rotated, and the pressure of the φ circuit board (2) pressed against the surface of the object can be controlled to a constant range. The circuit board (2) is housed in a reference generating mechanism (4〇). The circuit board (2) is previously cut into a predetermined size in accordance with the size of the object to be attached. For example, in the case where the circuit board (2) is formed on the entire surface of the roller belonging to the object (1), the length of the side of the circuit board (2) in the direction of the rotation axis of the object (1) is made and the object 〇) has the same length in the direction of the rotation axis. Further, the length of the side in the circumferential direction of the corresponding object (1) is made substantially the same as the circumference of the object (1). However, as will be described later, there is an error in the cutting precision, and the shape of the object (1) is also toleranced, and these errors are corrected by 320804 9 1363587, so that it is not necessary to strictly match these values. The reference generating means (40) functions as a holder for cutting a film-shaped circuit board (2) of a predetermined size. The reference generating means (4) is composed of, for example, a fixing plate (41) made of resin and a movable plate (42). The film-form circuit board (2) cut into a predetermined size is placed in the reference generating mechanism (40) with the circuit surface facing up (the adhesive layer facing downward). The positioning system movable plate (42) by the reference generating mechanism (4) pushes the film-shaped circuit board (2) toward the fixing plate (41) of the fixed reference plate belonging to the χγ direction, thereby being set correctly. s position. The cut film-shaped circuit board (2) can be arranged one by one, or a plurality of sheets can be stacked. In the case where the plurality of sheets are collectively arranged, the stack of the plurality of sheets that can be stacked is mounted on the reference generating mechanism (40). The film-shaped circuit board (2) which has been placed at the correct position is sucked and carried by a holding mechanism (2) having a small hole by vacuum suction. Specifically, the L' holding mechanism (20) is an adsorption plate composed of a resin plate or a metal plate having a vacuum-aspitable small hole, a vacuum drawing system communicating with the hole, and vacuuming the adsorption plate and the suction plate The mechanism in which the suction system rises and falls and moves in the horizontal direction. The holding mechanism (20) rises after adsorbing the film-shaped circuit board (?). In the case where the adhesive layer is composed of an adhesive which exhibits adhesiveness after heating, it is passed through a heating means (5) which heats the circuit board (2). As the heating means (50), a known heater or the like can be used. Since the conditions of the activity differ depending on the type of the carrier, the heating temperature and the heating time generated by the heater are optimized according to the adhesive used in 320804 10 1363587 for heating. The heating temperature is set to the range of the activity temperature of each of the adhesives. In addition to heating the adhesive layer of the circuit board (2), the heating mechanism (50) may employ a mechanism for heating the adhesive layer during bonding by heating the object (丨). Further, in the illustrated embodiment, the adhesive layer is formed of a heat-curing adhesive which exhibits adhesiveness after heating, but the adhesive layer is adhered to at room temperature. In the case where the agent is formed and the protective film is attached to the adhesive layer, it is provided with a removal mechanism for removing the protective film. The removal mechanism can also use a known device for peeling off the protective film. These heating mechanisms (5〇) and removal mechanisms can also be provided. Thereafter, the holding mechanism (20) is moved to move the circuit board (2) above the rotation # mechanism (10) provided with an object made of a metal or resin roller. If necessary, the holding mechanism (2〇) is lowered to reduce the circuit substrate (2) to the surface of the object (1), thereby causing the end portion of the adhesive layer of the circuit substrate (2) to rotate toward the object (1). The side edge extending in the axial direction and the end portion on the front side in the traveling direction is joined to the surface of the object (1). However, it is also possible to perform only horizontal movement to join. The rotating mechanism (10) has a structure in which two rotating (four) joints are freely rotatable. As far as the rotation is light, it can be made of metal. If necessary, it can also be attached to the whole week with elastic members such as rubber. The two ends of the roller are supported by a bearing or the like in a manner of 320804 11 1363587, and the object can be followed: the object (1) is placed on two rotating (four), circuit-protected circuit boards (2) The direction of rotation in the direction of the rotation axis: The rotation axis of the object (1) moves in parallel. In other cases, = none; the circuit substrate (2) is formed on the object (the two middle columns of the two ends of the crucible can also support the two ends by bearings, etc., and can be supported by the rotatable type Then, the holding mechanism of the film-shaped circuit board (7) is adsorbed (the flat movement is performed, and the side of the film-form circuit board (2) is attached to the entire surface of the object (1) as the object (1) rotates. Air is not entrapped between the adhesive layer and the object (1). Further, even if the shape of the object (1) such as the length or diameter is changed, the holding mechanism (2) does not need to change the jig and structure, and the film can be formed. The circuit board (2) is attached to the object (1). It can also be carried out by using a mechanism having air or oil pressure so that the pressure at the time of the next step is fixed. The film-shaped circuit board (1) is The structure of a thin conductor such as copper is formed on the resin film. Therefore, a certain degree of stretching is caused. In the present invention, the film-like circuit substrate (2) adsorbed to the holding mechanism (3) is wound. Attached to the object ( The structure is such that the pressure applied to push the circuit substrate (2) against the object (1) by the control mechanism (30) causes the stretching of the film-like electric (road)-based push plate to be different, and the result can be The pressure is applied to the gap (the distance between the sides of the film-axis in the direction of the rotation axis) of the film-formed circuit board (2) on the entire circumference of the surface of the object (1). Specifically, it is determined to be predetermined. Size 320804 12 1363587 The dimensional deviation of the cut film-form circuit board (2) or the diameter deviation of the object (1) is controlled by the pressure while not exceeding the gap required after the attachment. In addition, there is a tolerance of the diameter when the object (丨) is a metal or resin roller, and the roller is in the roll. The manufacturing deviation caused by the difference causes the calculation gap to be different. However, as described above, in the present invention, the pressure at the time of attachment can be operated in the control mechanism (30) to make the circuit substrate (2) ® stretch produces a change' while the gap can be Controlling a certain value below the allowable value. (Example 1) • First, make a circuit board (2) in the following manner. PET (polyethylene terephthalate) film with a thickness of 35# m (Sakamoto Toyo) Manufactured by Textiles Co., Ltd., A4i〇0), by forming a copper film by sputtering on the surface, and then forming a copper layer by copper plating. The copper plating system uses a copper sulfate concentration of 9 〇g/liter and sulfuric acid concentration at room temperature. 18 〇 g / φ liter of plating solution, a copper coating with a thickness of 8 # m is formed by a cathode current density of 2 A/dm 2 , and a dry film photoresist is attached to the surface of the copper layer by a photoresist method ( Dry film photo resist (manufactured by Asahi Kasei Co., Ltd., AQ-1158), exposed, dried, and etched using a mask having a predetermined wiring shape on a dry film photoresist, and peeling off the dry film photoresist. In addition, an adhesive having adhesiveness at normal temperature (manufactured by Nippon Denya Pigment Chemical Co., Ltd., double-sided tape #8616) was laminated on the back side of the circuit board. Thus, a protective film is attached to the adhesive layer. 320804 13 !363587 The circuit board (2) obtained as described above was cut by a mold so that the side in the direction of the rotation axis was 50.3 mm, and the side in the vertical direction was 350 mm. After cutting, set it to the cassette (4〇) shown in Fig. 2. Next, the attaching step is performed using the apparatus for forming a three-dimensional circuit board shown in the schematic view of Fig. 1 . The apparatus includes a vacuum adsorption (vacuum) elevator (a lifting mechanism using a cylinder) (3〇), an adsorption plate (20) connected to the elevator, a heater (50), and a protective film removing device (attached to the attached device) a guide tape attached to a film end portion of a protective film of a circuit board, a mechanism for peeling off the protective film by grasping the peeling guide tape, a rotating device (10), and a heater for a rotating device (not shown) Show). The vacuum lifter (30) allows the suction plate (20) to move up and down and horizontally from the cassette (40) toward the rotary unit (1). The protective film removing device is adjacent to the heater (50) and is disposed on a production line from the card S (40) toward the rotating device (10). In addition, the heater (50) is not used. In the case of the rotating roller of the rotating device (10), a roller having a diameter of 4 mm and a length of 400 mm was attached to the surface of the metal roller. The object (1) composed of an aluminum tube having a diameter of 16 mm and a length of 350 mm was placed between the rotating rolls of the rotating device (1) as an object (1). Further, the dimensions of the circuit board (2) and the roller (1) are accurately measured in advance for measurement to be described later. The adsorption plate (20) is lowered to the circuit board (2) accommodated in the cassette (4) to adsorb the circuit board (2). The adsorption plate (2〇) is raised and moved horizontally. On the way of horizontal movement, the protective film covering the adhesive layer covering the lower side of the circuit substrate (7) is peeled off by the protective film removing device 320804 14 1363587. When the end of the suction plate (2〇) reaches the pro (1) on the rotating device, the plate (20) is lowered until the roller (1) is pushed by the preset pressure. After the end portion of the agent layer in the traveling direction contacts the surface of the roller, when the adsorption plate (20) is horizontally moved, the horizontally moving roller (1) of the adsorption plate also rotates, so that the circuit substrate (2) is attached to the roller. (ι) for the whole week. When the gap between the sides of the circuit board (2) is calculated from the size of the circuit board (2) and the diameter of the roller (1), the theoretical value calculated is 0.20 mm. Thereafter, the roller (1;) to which the circuit board (2) is attached is discharged, and the new roller (1) is placed on the rotating device (10) so that the pressure at the time of attachment changes as shown in the table. A plurality of rollers (1) are attached to the circuit substrate. Based on the obtained three-dimensional circuit substrate, the gap between the side edges of the attached circuit board (2) was measured for each sample. Display the measurement results on the table
表1Table 1
No. 貼附時的壓力 (MPa( kg/cm2)) 間隙β Cti J測量結果（mm) -异值 0.20mm) 一方端 中央 另一方端 1 0.049 ( 0.5 ) 0.16 0.16 0.16 2 0.0784 (0.8) 0.12 0.12 0.12 3 0.098 (1.0) 0.10 0.10 0.10 4 0.147 (1.5) 0.06 0.06 0.06 320804 15 1363587 (實施例二） 首先，以下述方式製作電路基板（2)。 使用於厚度38# m的聚醯亞胺薄膜上層疊有厚度8// m的銅箔之二層基板（曰本住友金屬鑛山股份有限公司製 造，S’perFlex)，藉由光阻劑方式於銅層表面貼附乾膜光 阻劑（日本旭化成股份有限公司製造，AQ-1158)，使用 預定配線形狀的遮罩，於乾膜光阻劑上進行曝光、顯像、 蝕刻，並進行乾膜光阻劑的剝離。此外，於電路基板的背 側層疊熱壓著型的接著劑（曰本NIKKAN工業股份有限公 司製造，SAFW)，予以暫時性接著。 藉由模具切斷以上述方式所獲得的電路基板（2)， 設置於第2圖所示的卡匣（40)。 接著，與實施例一同樣使用第1圖的概略圖所示的立 體性電路基板的形成裝置，實施貼附步驟。 取代保護薄膜去除裝置，使用加熱器（50)或旋轉裝 置用加熱器（未圖示）。在試料No.l與No.2中，以使電 路基板（2)成為120°C之方式設定加熱器溫度，在10秒 内停止吸附板（20)並藉由加熱器（50)進行加熱。此外， 在試料No.3與No.4中，加熱旋轉裝置的旋轉輥，將旋轉 輥的表面溫度加熱至120°C，於該旋轉輥上載置鋁管製的 輥（1)，以進行貼附。屬於對象物之輥（1)係使用與實 施例一相同之報。 根據電路基板（2)的尺寸與輥（1)的直徑來計算電 路基板侧邊之間的間隙時，計算出的理論值為0.20mm。 16 320804 1363587 根據所獲得的立體性電路基板，針對各個試料測量貼 附後的電路基板側邊間的間隙。將測量結果顯示於表2。 1 表2No. Pressure at the time of attachment (MPa (kg/cm2)) Gap β Cti J measurement result (mm) - an odd value of 0.20 mm) The other end of one end is 1 0.049 ( 0.5 ) 0.16 0.16 0.16 2 0.0784 (0.8) 0.12 0.12 0.12 3 0.098 (1.0) 0.10 0.10 0.10 4 0.147 (1.5) 0.06 0.06 0.06 320804 15 1363587 (Example 2) First, a circuit board (2) was produced in the following manner. A two-layer substrate (S'perFlex manufactured by Sakamoto Sumitomo Metal Mining Co., Ltd.) laminated with a copper foil having a thickness of 8/m on a polythene film having a thickness of 38# m, by means of a photoresist A dry film photoresist (AQ-1158, manufactured by Asahi Kasei Co., Ltd., Japan) was attached to the surface of the copper layer, and exposed, developed, etched, and dried on a dry film photoresist using a mask having a predetermined wiring shape. Peeling of the film photoresist. Further, a heat-pressing adhesive (manufactured by Sakamoto NiKKAN Industrial Co., Ltd., SAFW) was laminated on the back side of the circuit board, and was temporarily placed. The circuit board (2) obtained as described above is cut by a die and placed on the cassette (40) shown in Fig. 2. Next, in the same manner as in the first embodiment, the apparatus for forming a vertical circuit board shown in the schematic view of Fig. 1 is used, and the attaching step is carried out. Instead of the protective film removing device, a heater (50) or a heater for a rotating device (not shown) is used. In samples No. 1 and No. 2, the heater temperature was set such that the circuit board (2) was 120 ° C, and the adsorption plate (20) was stopped in 10 seconds and heated by the heater (50). Further, in samples No. 3 and No. 4, the rotating roller of the rotating device was heated, and the surface temperature of the rotating roller was heated to 120 ° C, and an aluminum-controlled roller (1) was placed on the rotating roller to perform the bonding. Attached. The roller (1) belonging to the object is reported in the same manner as in the first embodiment. When the gap between the sides of the circuit board is calculated from the size of the circuit board (2) and the diameter of the roller (1), the calculated theoretical value is 0.20 mm. 16 320804 1363587 The gap between the side edges of the attached circuit board was measured for each sample based on the obtained three-dimensional circuit board. The measurement results are shown in Table 2. 1 Table 2
No. 加熱對象 貼附時的壓力 (MPa ( kg/cm2 )) 間隙的測量結果（mm) (計算值0.20mm) 一方端 中央 另一方端 1 電路基板 0.098 (1.0) 0.13 0.13 0.13 2 電路基板 0.147 (1.5) 0.08 0.08 0.08 3 對象物 0.098 (1.0) 0.13 0.13 0.13 4 對象物 0.147 (1.5) 0.08 0.08 0.08 【圖式簡單說明】 第1圖係顯示本發明的立體性電路基板之形成裝置的 實施例的概略圖。 第2圖係顯示第1圖的基準產生機構的概略圖。 【主要元件符號說明】 1 對象物（輥） 2 電路基板 10 旋轉機構（旋轉裝置） 20 保持機構（吸附板） 30 控制機構（真空升降機） 40 基準產生機構（卡匣） 41 固定板 42 可動板 50 加熱機構（加熱器） 17 320804No. Pressure at the time of attachment of the heating target (MPa (kg/cm2)) Measurement result of the gap (mm) (calculated value 0.20 mm) The other end of the one end is 1 circuit board 0.098 (1.0) 0.13 0.13 0.13 2 Circuit board 0.147 (1.5) 0.08 0.08 0.08 3 Object 0.098 (1.0) 0.13 0.13 0.13 4 Object 0.147 (1.5) 0.08 0.08 0.08 [Brief Description] Fig. 1 shows an embodiment of a device for forming a three-dimensional circuit board of the present invention. Schematic diagram. Fig. 2 is a schematic view showing a reference generating mechanism of Fig. 1. [Description of main components] 1 Object (roller) 2 Circuit board 10 Rotating mechanism (rotating device) 20 Holding mechanism (adsorption plate) 30 Control mechanism (vacuum lift) 40 Reference generating mechanism (click) 41 Fixing plate 42 Actuating plate 50 heating mechanism (heater) 17 320804