200938028 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種立體性電路基板的形成裝置及形 成方法，尤其有關一種將電路基板貼附於輥（roller)的表 面，藉此形成立體性電路基板之裝置及方法。 【先前技術】 隨著行動電話等電子機器的小型化、多功能化、及低 成本化，係要求將電路基板緊密地安裝於框體的裡面與外 面。因此，有時會需要立體性的電路基板而不是平面性的 電路基板。此外，在轉印機的領域中，已提案有一種方法， 係將電路基板貼附於顯像用輥、帶電輥、或轉印輥等輥的 表面一部分或全周，藉此形成立體性電路基板。 就形成此種立體性電路基板的一般性方法而言，以往 有稱為一次射出成型法或二次射出成型法之射出成型法。 在一次射出成型法中，首先將可進行無電解鍍覆且具 有導電性的樹脂形成期望的立體形狀，接著於樹脂的表面 塗佈感光性阻劑，將電路圖案予以曝光顯像，去除未曝光 部分的感光性阻劑，於露出的樹脂表面施予無電解鍍覆， 而獲得立體性電路基板。 相對於此，在二次射出成型法中，使用調配有鍍覆用 的觸媒之樹脂，藉由最初的射出成型形成可進行無電解鍍 覆的立體形狀，藉由第二次的射出成型於表面的預定部分 形成不進行無電解鍍覆的表面層，接著於調配有鍍覆用的 觸媒的樹脂所顯露的表面部分施予無電解鍍覆，而獲得立 4 320804 200938028 體性電路基板。 然而，不論是一次射出成型法或二次射出成型法，皆 ' 有以下的問題。例如，在一次射出成型法中，製造步驟非 - 常長且成本高。此外，不適合製造具有三次元的曲面形狀 的立體形狀。再者，樹脂材料有限制，難以進行電路的圖 案化。 另一方面，在二次射出成型法中，雖適用於製造具有 三次元的曲面形狀的立體形狀，然而由於要求高精密度的 ❹ 成型用模具，且進行兩次的射出成型等，因此成本變高。 因此，不論是哪種射出成型法，皆不適合作為用以將 電路基板形成於輥的表面全周之方法。 就這種將電路基板形成於輥的表面全周之方法而 言，係考慮一種方法，係於聚醯亞胺等絕緣性薄膜的表面 使用設置有銅等導體層之基材，將導體層予以圖案化，以 形成電路基板，將所獲得的電路基板貼附於輥的表面全 Q 周。由於此種電路基板能大量且低價的製造，因此只要能 貼附於輥，即具有優勢。 此外，後述之專利文獻1已記載有一種方法，係以旋 切刀（Rotary cutter )方式將薄膜貼附於圓柱狀或圓筒狀的 罐體。在該方法中，高精密度地將無法自我保持的柔軟性 薄膜切斷成期望的長度，將切斷而得的薄膜供給至罐體， 良好地進行層疊（laminate )，藉此將可薄膜貼附於罐體。 更具體而言，使捲取狀態之無法自我保持的柔軟性薄膜真 空吸附並捲繞於進給親（feed roll )及乳花輕（cutting 5 320804 200938028 roll)，將進給輥的輪緣速率（peripherai Spee(j)設定成比軋 花輥的輪緣速率還慢，對薄膜賦予張力，將軋花輥的真空 吸附部位分割成複數個並調整真空強度，藉此對薄膜賦予 滑動性，對切斷後的薄獏設置一定的間隔，以獲得朝向罐 體的層疊時序，在層疊輥的層疊部位中旋轉一周予以加 壓，消除薄膜的凹陷，使罐體與薄膜間無空氣殘留，而良 好地朝罐體層疊。 义 專利文獻1所記載的以旋切刀方式進行之貼附方法係 以將標藏貼附於罐體或瓶等飲料容器的報表面為目的而開 發者。因此，無須嚴密地管理用以貼附標藏的位置精密度 等，此外，在將標藏貼附於飲料容器的表面全周時，即= 於薄膜產生重疊或間隙亦不會成為問題。 然而，在將電子機器用途的電路基板貼附於親的表面 全周之情形中，當於電路基板存在有重疊或大間隙時，由 於會於構成電路之配線產生短路或導通不良，而影響電路 的電性特性，因此會變成大問題。此外，在形成立體性電 路基板後的步驟中，為了持續進行從外部對電路基板進行 通電處理等之安裝步驟，因此若未將電路基板貼附於正確 的位置，則會在後續的安裝步驟中造成問題。因此，關於 貼合的位置精密度係被要求非常嚴密的管理。 ，外’在將貼附有電路基板的_為旋轉體來使用的 ，當貼_產生重疊或大_時，會於電路基板產 你d ^生於旋轉時發生局部性接觸料題。因此， 係要求小至無重疊且容許間隙之程度。 320804 6 200938028 再者，於專利文獻1所記载的方法中， 板貼附於輥的表面全周時’需在竪立；早拄：路基 以搬運。然而，當親為細長的形狀或者兩端輥來予 成複雜的形狀時，係難以經常垂直地保:端被加工 於輥之表面全周貼附電路基板。，、、進行搬運，且 Ο 〇 如此，在將電路基板形成於觀的表面 路基板的形成中，無法採用上述二，立體性電 專利讀1:日本_似⑽方法。 【發明内容】 m (發明所欲解決之課題） 本發明的目的係提供一種能以正確 電路基板貼附於圓柱狀或圓筒狀物表 ^密度將 之立體性電路基板的形成裝置及形成方法。、疋全周） (解決課題的手段） 本發明的立體性電路基板的形、获 機構，係在中心軸呈水平的狀態下保持圓柱狀、:：··旋轉 對象物，且將該中心轴作=筒狀的 以使接著㈣朝τ之方絲持電 水^構，係 =機構，係可調節相對位置關係 電路基板的接著劑層接觸於進行旋轉的前4 =的前述 且可將健至前述對象物表面 板=表面， 在-定範圍。 疋電路基板的壓力检制 則述電路基板的接著劑層 * π 的常温硬化型的接著劑所構成，在前 200938028 層被保護薄臈覆蓋的情形令 護薄膜之去除機構。 較佳為復具有用以去除讀保 黏著性的卜加路基板的接著劑層係由加熱後會顯現 具有用w ίί的接著劑所構成之情形中，較佳為復 接著縣或前述對象物之加熱機構。 、而言，前述旋轉機構係由以使前述對象物恭 兩者::旋轉之方式配置的兩個旋轉輥所構成。置在 物的具村配合載置於前歧轉機構的前述對象 朝與前述=Γ電路基板之基準產生機構，藉此僅 基板。對象物的中心軸垂直的方向移動’而可貼附電路 扎豕奶叼衣曲，一透控制用以將刖述電路基板、 别述對象物表面之壓力，一邊使前述電路基板水平壓至 且使前述對象物旋轉，藉此將前述電路基板動， 象物的表面。 占附於前逑對 — 具體而言，使用上述立體性電路基板的形成筆 即前述壓力’藉此控綱隙而將前述電路基板:置二調 對象物的表面全周。 、於則逑 步驟戶：本發明的立體性電路基板的形成方法係由下迷 構成.將在中心軸呈水平的狀態下以可旋轉 '、持圓柱狀或圓筒狀的對象物，一面具有電路且另二面j 置有接著劑層的電路基板切斷成預定大小，復將該電面叹 板栽置於基準位置，使該電路基板吸附於移動手段，路基 =該移動手段’將前述電路基板的接著劑層的端部接=移 ⑴这對象物的表面，一邊控制用以將前述雷 ~ 320804 200938028 (發明之效果） 藉由本發明，可位置精密度佳、不會產生重疊、將間 隙抑制到最小限度、並正確地將電路基板貼附於難以垂直 地保持來進行搬運的電子機器用途的輥表面。 【實施方式】 依據附圖詳細說明本發明的一實施形態。第i圖係顯 不本發明的立體性電路基板的形縣置的—實施形態的概 ❹ Ο 略圖第2圖係顯不第丨圖的基準產生機構的概略圖。 2明的立體性電路基板的形成裝置係具備有：旋轉 η狀2 ’係在中心轴呈水平的狀態下保持圓柱狀或圓 诗狀的對象物（1)，且將中心軸 機構（2〇)，传以隸m 乍為㈣轴而;k轉；保持 且水平搬運使接讀層朝下之方式保持電路基板⑺， 係，俾使戶：M及控制機構(3〇) ’係可調節相對位置關 轉的對象的電路基板（2)_著騎接觸於進行旋 電路美柘μ 自，且可將推壓至對象物⑴表面之 電路;板(2)的壓力控制在一定範圍。 基板⑵1板（2)純容於基準產生機構（4G)。電路 預定尺寸。Γ合被貼附的對象物⑴的大小預先切斷成 的輥的全面之如降，在將電路基板（2)形成於屬於對象物⑴ 路基板⑵形中，將對象物⑴的旋轉轴方向中的電 的長度相同的側邊長度作成與對象物⑴的旋轉軸方向 長度作成*對H二對應對象物（1)的κ周方向之侧邊 切斷精密h物⑴的圓周大致相同。然而，如同後述， 又贅有誤差，且對象物（1)的形狀亦有公差，由 320804 9 200938028 於這些誤差會被修正，因此無須嚴密地使這些值一致。 基準產生機構（40)係作為切斷成預定尺寸的薄膜狀 的電路基板（2)的固持具而發揮功能。基準產生機構（40) · 係例如由樹脂製的固定板（41 )與可動板（42 )所構成。 - 在將電路面朝上（接著劑層朝下）的狀態下，將切斷成預 定尺寸的薄膜狀的電路基板（2)設置於基準產生機構 (40)。以基準產生機構（40)進行的定位係可動板（42) 將薄膜狀的電路基板（2)朝屬於XY方向的固定式的基準 板之固定板（41)推壓，藉此設置於正確的位置。 ❹ 已切斷的薄膜狀的電路基板（2)係可逐片設置，亦 可複數片聚集設置。在複數片聚集設置的情形中，將可重 疊收容複數片之匣安裝於基準產生機構（40)。 已設置在正確位置的薄膜狀的電路基板（2)係藉由 真空抽吸逐片被具有小孔的保持機構（20)吸附並予以搬 運。具體而言，保持機構（20)係由具有可真空抽吸之以 小孔的樹脂板或金屬板所構成的吸附板、與該孔連通的真 0 空抽引系統、以及使該吸附板與真空抽吸系統上升下降及 朝水平方向移動之機構所構成。 保持機構（20)係在吸附薄膜狀的電路基板（2)後 上升。 在接著劑層由加熱後顯現黏著性的接著劑所構成的 情形中，使用以加熱電路基板（2)之加熱機構（50)通過。 就加熱機構（50 )而言，係能採用已知的加熱器等。由於 活性的條件係根據接著劑的種類而不同，因此根據所使用 10 320804 200938028 的接著劑將加熱器所產生的加熱溫度以及加熱時間予以最 佳化，以進行加熱。加熱溫度係設成各接著劑的活性溫度 範圍。 除了加熱電路基板（2)的接著劑層之外，加熱機構 (50)亦可採用藉由加熱對象物（1)而於接合時加熱接著 劑層之機構。 此外，在圖示的態樣中，雖顯示接著劑層由加熱後顯 現黏著性的加熱硬化型的接著劑所構成之情形，但在接著 © 劑層由在常溫下具有黏著性的接著劑所構成，且保護薄膜 貼附於接著劑層之情形中，係作成具備有用以去除保護薄 膜之去除機構。該去除機構亦可使用用以使保護薄膜剝離 去除之已知的裝置。 亦可同時具備這些加熱機構（50)與去除機構。 之後，使保持機構（20)移動，使電路基板（2)朝 設置有由金屬製或樹脂製的輥所構成的對象物（1 )之旋轉 q機構（10)的上方移動。依需要，在該位置使保持機構（20) 下降，將電路基板（2)推壓至對象物（1)的表面，藉此 使電路基板（2)的接著劑層的端部（在朝對象物（1)的 旋轉軸方向伸長的側邊且為行進方向前側的端部）接合至 對象物（1)的表面。然而，亦可僅進行水平移動來達成該 接合。 旋轉機構（10)係具有使可自由旋轉的兩支旋轉輥鄰 接之構造。就旋轉輥而言，能採用金屬製的輥。依需要， 亦能採用橡膠等彈性構材貼附於全周者。藉由轴承等以可 11 320804 200938028 旋轉之方式支撐該輥的兩端，而可追隨對象物（1)的旋轉。 對象物（1)係載置於兩支旋轉輥間，保持機構（20)係以 朝薄膜狀的電路基板（2)的旋轉軸方向伸長之侧邊與對象 物（1)的旋轉轴成為平行之方式移動。在其他的情形中， 例如在無須將電路基板（2)形成於對象物（1)的兩端之 情形中，亦可藉由軸承等來支撐該兩端部，而以可旋轉之 方式支持。 之後，吸附有薄膜狀的電路基板（2)之保持機構（20) 係水平移動，同時隨著對象物（1)的旋轉而從薄膜狀的電 路基板（2)的側邊接著於對象物（1)的表面全周。因此， 在接著劑層與對象物（1)之間不會捲入空氣。此外，即使 長度或直徑等對象物（1)的形狀改變，保持機構（20)亦 無須變更治具與構造，可將薄膜狀的電路基板（2)貼附於 對象物（1 )。此外，亦能以使接著時的壓力成為一定之方 式，藉由使用有空氣或油壓之機構來進行。 由於薄膜狀的電路基板（2)係為於樹脂薄膜上形成 有銅等薄的導體之構造，因此會產生某種程度的伸展。在 本發明中，由於吸附於保持機構（20)的薄膜狀的電路基 板（2)係為以捲繞之方式被貼附於對象物（1)之構造， 因此藉由控制機構（30)令用以將電路基板（2)推壓至對 象物（1)之壓力產生變化，藉此薄膜狀的電路基板（2) 的伸展會不同，結果可以前述壓力控制貼附於對象物（1) 的表面全周之薄膜狀的電路基板（2)的間隙（貼附後的旋 轉軸方向之侧邊間的距離）。具體而言，求出以預定尺寸 12 320804 200938028 =;狀τ基板⑴的尺寸偏差·象物⑴ 的直仫偏i —邊以不超出貼附後所要 制壓力，-邊藉由捲繞來調整伸展。 ’隱之方式控 密度細㈣料从⑺的切斷精 又、+象物⑴為金屬製或樹脂製的輥時的直徑 之公、以及在輥間所產生的製作上的偏差，成： 的間除不同之情形。然而，如上所述，在本發; Ο 控制機構(30)中操作貼附時的壓力’使電路基板⑴的 伸展產生改變，而可將間隙控制在容許值以下的一定 (實施例一） ' 首先’以下述方式製作電路基板（2)。 使用厚度35/zm的PET (聚對苯二甲酸乙二酯）薄膜 (曰本東洋紡織股份有限公司製造，A4100)，藉由減鍍 於表面成膜銅薄膜’之後藉由銅電鑛法形成鋼層。銅電鍍 係在室溫使用硫酸銅濃度90g/公升、硫酸濃度180g/公 U升的鍍覆液，藉由陰極電流密度2 A/ dm2來形成厚度8 μ m的銅被覆。 並且，藉由光阻劑方式於銅層表面貼附乾膜光阻劑 (dry film photo resist)(曰本旭化成股份有限公司製造， AQ-1158)，使用預定配線形狀的遮罩於乾膜光阻劑上進 行曝光、顯像、蝕刻，並進行乾膜光阻劑的剝離。此外， 於電路基板的背侧層疊在常溫下具有黏著性的接著劑（曰 本大日本顏料化學工業股份有限公司製造：雙面膠帶 #8616)來使用。從而，於接著劑層貼附保義薄膜 320804 13 200938028 藉由模具切斷以上述方式所獲得的電路基板（2)， 使旋轉軸方向的側邊成為50.3mm、垂直方向的側邊成為 350mm。切斷後，設置於第2圖所示的卡匣（40)。 接著，使用第1圖的概略圖所示的立體性電路基板的 形成裝置，進行貼附步驟。該裝置係具備有：真空吸附（真 空）升降機（使用汽缸之升降機構）（30)、連接於該升 降機之吸附板（20)、加熱器（50)、保護薄膜去除裝置 (係在貼附於電路基板的保護薄膜之薄膜端部貼附有引導 帶（leader tape )，藉由抓住剝離引導帶而剝離保護薄膜之 機構）、旋轉裝置（10)、以及旋轉裝置用加熱器（未圖 示）。真空升降機（30)係可使吸附板（20)進行上升下 降移動，並可從卡匣（40)朝旋轉裝置（10)的方向水平 移動。保護薄膜去除裝置係鄰接加熱器（50)，設置在從 卡匣（40)朝向旋轉裝置（10)的生產線上。此外，未使 用加熱器（50)。就旋轉裝置（10)的旋轉輥而言，係使 用分別於金屬製輥表面裝設有矽橡膠之直徑為40mm、長 度為400mm的輥。 將由直徑16mm、長度350mm的銘管所構成的輥《( 1 ) 作為對象物（1)載置於該旋轉裝置（10)的旋轉輥間。 此外，為了後述的測量，預先正確地測量電路基板（2) 與親（1 )的尺寸。 使吸附板（20)下降至收容於卡匣（40)的電路基板 (2)上而吸附電路基板（2)。使吸附板（20)上升且進 行水平移動。在水平移動的途中，係藉由保護薄膜去除裝 14 320804 200938028 置剝離去除覆蓋於電路基板（2 )的下側的接著劑層之保護 薄膜。當吸附板（20)的行進方向端部到達旋轉裝置上的 輥（1 )上時，吸附板（20 )係下降直到藉由預設的壓力推 '壓輥（1)為止。接著劑層的行進方向端部接觸至輥 的表面後，使吸附板（20)水平移動時，隨著吸附板的水 平移動輥（1)亦會旋轉，使電路基板（2)貼附於輥（1) 的全周。 根據電路基板（2)的尺寸與輥（丨）的直徑來計算電 〇路基板（2)侧邊之間的間隙時，計算出的理論值為 0.20mm。 之後，排出貼附有電路基板（2)的輥〇)，將新的 輥（1)載置於旋轉裝置（10)上，使貼附時的壓力如表1 所示般變化，對複數個輥（1)貼附電路基板。 根據所獲得的立體性電路基板，針對各個試料測量貼 附後的電路基板（2)侧邊間的間隙。將測量結果顯示於表 1 ° 表1 貼附時的壓力 (MPa(kg/cm2)) 間隙的測量結果（_) (s十算值0.20mm、BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device and a method for forming a three-dimensional circuit substrate, and more particularly to a method for attaching a circuit substrate to a surface of a roller, thereby forming a three-dimensionality. Apparatus and method for a circuit board. [Prior Art] With the miniaturization, multi-functionalization, and low cost of electronic devices such as mobile phones, it is required to closely attach the circuit board to the inside and the outside of the casing. Therefore, a three-dimensional circuit substrate is sometimes required instead of a planar circuit substrate. Further, in the field of a transfer machine, there has been proposed a method of attaching a circuit board to a part or the entire circumference of a surface of a developing roller, a charging roller, or a transfer roller, thereby forming a stereoscopic circuit. Substrate. In the conventional method of forming such a three-dimensional circuit board, an injection molding method called a one-shot injection molding method or a secondary injection molding method has been conventionally used. In the primary injection molding method, a resin having electroless plating and having conductivity is first formed into a desired three-dimensional shape, and then a photosensitive resist is applied to the surface of the resin, and the circuit pattern is exposed and developed to remove unexposed. A part of the photosensitive resist is subjected to electroless plating on the exposed resin surface to obtain a three-dimensional circuit substrate. On the other hand, in the secondary injection molding method, a resin in which a catalyst for plating is blended is used, and a three-dimensional shape capable of electroless plating is formed by the first injection molding, and the second injection molding is performed. The predetermined portion of the surface is formed into a surface layer which is not subjected to electroless plating, and then electroless plating is applied to the surface portion exposed by the resin to which the catalyst for plating is applied, thereby obtaining a bulk circuit substrate of Li 4320804 200938028. However, both the injection molding method and the secondary injection molding method have the following problems. For example, in a single injection molding process, the manufacturing steps are not always long and costly. Further, it is not suitable to manufacture a three-dimensional shape having a three-dimensional curved shape. Furthermore, the resin material is limited, and it is difficult to pattern the circuit. On the other hand, in the secondary injection molding method, it is suitable for producing a three-dimensional shape having a three-dimensional curved surface shape. However, since a high-precision boring molding die is required and two injection moldings are performed, the cost is changed. high. Therefore, neither of the injection molding methods is suitable as a method for forming the circuit substrate on the entire circumference of the surface of the roll. In the method of forming the circuit board on the entire circumference of the surface of the roll, a method is considered in which a conductor layer provided with a conductor layer such as copper is used on the surface of an insulating film such as polyimide or the like. Patterning to form a circuit substrate, and the obtained circuit substrate was attached to the surface of the roller for all Q cycles. Since such a circuit board can be manufactured in a large amount and at a low price, it is advantageous as long as it can be attached to a roller. Further, Patent Document 1 described later has a method of attaching a film to a cylindrical or cylindrical can body by a rotary cutter. In this method, the flexible film which cannot be self-retained is cut into a desired length with high precision, and the cut film is supplied to the can body, and is laminated well, thereby applying the film. Attached to the tank. More specifically, the flexible film which is not self-retaining in the coiled state is vacuum-adsorbed and wound around the feed roll and the icing light (cutting 5 320804 200938028 roll), and the rim rate of the feed roller is increased. (peripherai Spee (j) is set to be slower than the rim speed of the embossing roll, tension is applied to the film, and the vacuum adsorption portion of the embossing roll is divided into a plurality of pieces and the vacuum strength is adjusted, thereby imparting slidability to the film, The thinned crucibles are cut at a certain interval to obtain a lamination timing toward the can body, and are rotated one revolution in the laminating portion of the laminating rolls to eliminate the depression of the film, so that no air remains between the can body and the film, and is good. The method of attaching the cans according to the patent document 1 is based on the method of attaching the label to the surface of a beverage container such as a can body or a bottle. Therefore, it is not necessary to be strict. The positional precision for attaching the label, etc., is managed, and when the label is attached to the surface of the beverage container, the overlap or gap of the film is not a problem. When the circuit board for electronic equipment is attached to the entire surface of the pro-surface, when there is overlap or large gap in the circuit board, the short circuit or the conduction failure may occur in the wiring constituting the circuit, thereby affecting the electrical properties of the circuit. In addition, in the step after forming the three-dimensional circuit board, in order to continue the mounting process of energizing the circuit board from the outside, if the circuit board is not attached to the correct position, This will cause problems in the subsequent installation steps. Therefore, the positional precision of the bonding is required to be very tightly managed. The external _ is attached to the circuit board _ is used as a rotating body, when posted _ When an overlap or a large _ occurs, a local contact problem occurs when the circuit substrate is produced by the rotation of the circuit board. Therefore, the requirement is as small as no overlap and the degree of the gap is allowed. 320804 6 200938028 Furthermore, in Patent Document 1 In the method described, the plate is attached to the surface of the roller at all times when it is required to be erected; early: the roadbed is carried. However, when the pro is slender shape or When the end roller is formed into a complicated shape, it is difficult to maintain the vertical direction vertically: the end is processed on the surface of the roller to attach the circuit substrate all the way to the surface of the roller, and is carried, and the circuit substrate is formed in the view. In the formation of the surface circuit substrate, the above two methods cannot be used, and the stereoscopic electric patent read 1: Japanese-like (10) method. [Explanation] m (Problem to be solved by the invention) An object of the present invention is to provide a circuit board capable of correct A device and a method for forming a three-dimensional circuit board, which are attached to a cylindrical or cylindrical surface, and a method for forming a three-dimensional circuit board. (Means for Solving the Problem) The shape and acquisition mechanism of the three-dimensional circuit board of the present invention The columnar body is held in a state in which the central axis is horizontal, and the object is rotated, and the central axis is made into a cylindrical shape so that (4) the electric wire of the square of the τ is held by the electric system. The adhesive layer of the adjustable relative positional relationship is in contact with the first 4 of the rotating front and can be raised to the surface of the object surface = surface.压力The pressure detection of the circuit board is composed of an adhesive layer of the circuit board * π of a room temperature curing type adhesive, and the removal mechanism of the protective film is covered in the case where the front layer of 200938028 is covered with a protective thin layer. Preferably, in the case where the adhesive layer having the Buka circuit for removing the read adhesion is formed by heating with an adhesive having w ίί, it is preferable to repeat the county or the object. Heating mechanism. In other words, the rotating mechanism is constituted by two rotating rollers arranged such that the object is rotated: The object to be placed in the front of the object is placed in the front object of the front substrate, and the substrate is formed by the reference generating mechanism. The central axis of the object moves in a direction perpendicular to the left side of the object, and the circuit can be attached to the milk pad, and the control circuit is used to horizontally press the circuit substrate to the pressure of the surface of the circuit substrate and the object to be described. The object is rotated, whereby the circuit board is moved to the surface of the object. Specifically, the front side of the object is placed on the entire circumference of the surface of the object by using the above-described three-dimensional circuit board to form a pen, i.e., the above-mentioned pressure, thereby controlling the gap.于于逑逑: The method for forming the three-dimensional circuit substrate of the present invention is composed of the following. The object having a rotatable ', cylindrical or cylindrical shape is provided in a state where the central axis is horizontal, and one side has a circuit board on which the other surface j is provided with an adhesive layer is cut into a predetermined size, and the electric board is placed at a reference position, so that the circuit board is adsorbed to the moving means, and the road base = the moving means' The end of the adhesive layer of the circuit board is connected to the surface of the object (1), and is controlled to use the above-mentioned ray to 320804 200938028 (the effect of the invention). With the present invention, the positional precision is excellent and no overlap occurs. The gap is suppressed to the minimum, and the circuit board is accurately attached to the surface of the roller for electronic equipment that is difficult to hold vertically and transported. [Embodiment] An embodiment of the present invention will be described in detail with reference to the drawings. Fig. i is a schematic view of a three-dimensional circuit board according to the present invention. EMBODIMENT OF THE EMBODIMENT EMBODIMENT Fig. 2 is a schematic view showing a reference generating mechanism of a second drawing. In the apparatus for forming a three-dimensional circuit board, the object of the cylindrical shape or the circular shape is held in a state in which the central axis is horizontal, and the central axis mechanism (2) is provided. ), passing m 乍 as (4) axis; k turn; keeping and horizontally moving to keep the circuit board (7) in the way that the reading layer is facing downward, the system: M and the control mechanism (3〇) The circuit board (2) of the object that is rotated relative to the position is placed on the circuit that is pressed against the surface of the object (1); the pressure of the board (2) is controlled within a certain range. The substrate (2) 1 plate (2) is purely contained in the reference generating mechanism (4G). The circuit is of a predetermined size. When the size of the object to be attached (1) is the total amount of the roll that has been cut in advance, the circuit board (2) is formed in the shape of the substrate (2) belonging to the object (1), and the direction of the rotation of the object (1) is reversed. The length of the side of the same length of the electric power is made to be the same as the length of the object (1) in the direction of the rotation axis. * The circumference of the side of the H-corresponding object (1) in the κ circumferential direction is substantially the same as the circumference of the precision object (1). However, as will be described later, there is an error, and the shape of the object (1) is also toleranced, and these errors are corrected by 320804 9 200938028, so that it is not necessary to strictly match these values. The reference generating means (40) functions as a holder for cutting a film-shaped circuit board (2) of a predetermined size. The reference generating means (40) is composed of, for example, a fixing plate (41) made of resin and a movable plate (42). - The film-formed circuit board (2) cut into a predetermined size is placed in the reference generating means (40) with the circuit surface facing up (the adhesive layer facing downward). The positioning system movable plate (42) by the reference generating mechanism (40) presses the film-shaped circuit board (2) toward the fixing plate (41) of the fixed reference plate belonging to the XY direction, thereby being set to the correct one. position. ❹ The cut film substrate (2) can be set one by one, or a plurality of sheets can be stacked. In the case where the plurality of sheets are collectively arranged, the stack of the plurality of sheets that can be stacked is mounted on the reference generating mechanism (40). The film-form circuit substrate (2) which has been placed at the correct position is sucked and transported by a holding mechanism (20) having small holes one by one by vacuum suction. Specifically, the holding mechanism (20) is an adsorption plate composed of a resin plate or a metal plate which can be vacuum-drawn with a small hole, a true-air extraction system which communicates with the hole, and the adsorption plate and the adsorption plate The vacuum suction system consists of a mechanism that rises and falls and moves horizontally. The holding mechanism (20) rises after adsorbing the film-form circuit board (2). In the case where the adhesive layer is composed of an adhesive which exhibits adhesiveness after heating, the heating means (50) for heating the circuit board (2) is used. As the heating means (50), a known heater or the like can be used. Since the conditions of the activity differ depending on the kind of the adhesive, the heating temperature and the heating time generated by the heater are optimized according to the adhesive used in 10 320804 200938028 for heating. The heating temperature is set to the active temperature range of each of the adhesives. In addition to heating the adhesive layer of the circuit board (2), the heating mechanism (50) may employ a mechanism for heating the adhesive layer during bonding by heating the object (1). Further, in the illustrated embodiment, the adhesive layer is formed of a heat-curing adhesive which exhibits adhesiveness after heating, but the adhesive layer is adhered to an adhesive at normal temperature. In the case where the protective film is attached to the adhesive layer, a removal mechanism for removing the protective film is provided. The removal mechanism can also use a known device for peeling off the protective film. These heating mechanisms (50) and removal mechanisms can also be provided at the same time. Thereafter, the holding mechanism (20) is moved to move the circuit board (2) upward over the rotation q mechanism (10) of the object (1) provided with a roll made of metal or resin. If necessary, the holding mechanism (20) is lowered at this position, and the circuit board (2) is pressed against the surface of the object (1), whereby the end of the adhesive layer of the circuit board (2) is made The side of the object (1) that is elongated in the direction of the rotation axis and the end on the front side in the traveling direction is joined to the surface of the object (1). However, it is also possible to perform only the horizontal movement to achieve the engagement. The rotating mechanism (10) has a configuration in which two rotatable rolls that are freely rotatable are adjacent to each other. As for the rotating roller, a metal roller can be used. If necessary, it can also be attached to the whole week with elastic members such as rubber. The both ends of the roller are supported by a bearing or the like so as to be rotatable by 11 320804 200938028, and the rotation of the object (1) can be followed. The object (1) is placed between the two rotating rolls, and the holding mechanism (20) is parallel to the rotation axis of the object (1) by the side extending in the direction of the rotation axis of the film-shaped circuit board (2). The way to move. In other cases, for example, in the case where the circuit board (2) is not required to be formed at both ends of the object (1), the both end portions may be supported by bearings or the like and rotatably supported. Thereafter, the holding mechanism (20) of the film-formed circuit board (2) is horizontally moved, and the object is attached to the object from the side of the film-form circuit board (2) as the object (1) rotates ( 1) The surface is full circumference. Therefore, air is not caught between the adhesive layer and the object (1). Further, even if the shape of the object (1) such as the length or the diameter is changed, the holding mechanism (20) does not need to change the jig and the structure, and the film-shaped circuit board (2) can be attached to the object (1). Further, it is also possible to use a mechanism having air or oil pressure so that the pressure at the subsequent time becomes a constant. Since the film-form circuit board (2) has a structure in which a thin conductor such as copper is formed on the resin film, a certain degree of stretching occurs. In the present invention, since the film-shaped circuit board (2) adsorbed to the holding mechanism (20) is attached to the object (1) by winding, the control mechanism (30) is used. The pressure applied to press the circuit board (2) to the object (1) changes, whereby the stretch of the film-form circuit board (2) is different, and as a result, the pressure control can be attached to the object (1). The gap between the film-formed circuit board (2) on the entire surface of the entire surface (the distance between the side edges in the direction of the rotation axis after attachment). Specifically, it is determined that the size deviation of the substrate (1) in the predetermined size 12 320804 200938028 =; the direct deviation of the substrate (1) is not exceeded beyond the pressure required after the attachment, and is adjusted by winding. stretch. 'Hidden mode control density fine (four) material from (7) cut fine, + elephant (1) is the diameter of the metal or resin roll, and the deviation between the production of the roll, into: Divide different situations. However, as described above, in the present invention, the pressure at the time of attaching the operation in the Ο control mechanism (30) changes the extension of the circuit substrate (1), and the gap can be controlled to a certain value below the allowable value (Embodiment 1). First, the circuit board (2) was fabricated in the following manner. A PET (polyethylene terephthalate) film (manufactured by Sakamoto Toyobo Co., Ltd., A4100) having a thickness of 35/zm was used to form a copper film by surface electroplating by means of copper electrowinning. Steel layer. Copper plating A copper plating having a thickness of 8 μm was formed by using a plating solution having a copper sulfate concentration of 90 g/liter and a sulfuric acid concentration of 180 g/U liter at room temperature by a cathode current density of 2 A/dm2. Further, a dry film photo resist (AQ-1158, manufactured by Sakamoto Asahi Kasei Co., Ltd.) was attached to the surface of the copper layer by a photoresist method, and a mask having a predetermined wiring shape was used for the dry film light. Exposure, development, etching, and peeling of the dry film photoresist are performed on the resist. In addition, an adhesive having an adhesive property at normal temperature (manufactured by Nippon Denya Pigment Chemical Co., Ltd.: double-sided tape #8616) was laminated on the back side of the circuit board. Then, the circuit board (2) obtained as described above was attached to the adhesive layer by a mold layer 320804 13 200938028, and the side in the direction of the rotation axis was 50.3 mm, and the side in the vertical direction was 350 mm. After cutting, the cassette (40) shown in Fig. 2 is set. Next, the attaching step is performed using the apparatus for forming a three-dimensional circuit board shown in the schematic view of Fig. 1 . The apparatus includes a vacuum adsorption (vacuum) elevator (a lifting mechanism using a cylinder) (30), an adsorption plate (20) connected to the elevator, a heater (50), and a protective film removing device (attached to the attached device) A film of the protective film of the circuit board is attached with a leader tape, a mechanism for peeling off the protective film by grasping the peeling guide tape, a rotating device (10), and a heater for the rotating device (not shown) ). The vacuum lifter (30) allows the suction plate (20) to move up and down and horizontally from the cassette (40) toward the rotary unit (10). The protective film removing device is adjacent to the heater (50) and is disposed on a production line from the cassette (40) toward the rotating device (10). In addition, the heater (50) is not used. In the case of the rotating roller of the rotating device (10), a roller having a diameter of 40 mm and a length of 400 mm, which is provided with a ruthenium rubber, is attached to the surface of the metal roller. A roller "(1) composed of a tube having a diameter of 16 mm and a length of 350 mm is placed between the rotating rolls of the rotating device (10) as an object (1). Further, the dimensions of the circuit board (2) and the pro-(1) are accurately measured in advance for the measurement described later. The adsorption plate (20) is lowered to the circuit board (2) accommodated in the cassette (40) to adsorb the circuit board (2). The adsorption plate (20) is raised and moved horizontally. On the way of horizontal movement, the protective film covering the adhesive layer covering the lower side of the circuit substrate (2) is peeled off by the protective film removing device 14 320804 200938028. When the end portion of the suction plate (20) in the traveling direction reaches the roller (1) on the rotary device, the suction plate (20) is lowered until the pressure roller (1) is pushed by a predetermined pressure. After the end portion of the agent layer in the traveling direction contacts the surface of the roller, when the adsorption plate (20) is horizontally moved, the horizontally moving roller (1) of the adsorption plate also rotates, so that the circuit substrate (2) is attached to the roller. (1) The whole week. When the gap between the sides of the circuit board (2) is calculated from the size of the circuit board (2) and the diameter of the roller (?), the calculated theoretical value is 0.20 mm. Thereafter, the roller substrate to which the circuit board (2) is attached is ejected, and the new roller (1) is placed on the rotating device (10), and the pressure at the time of attachment is changed as shown in Table 1, for a plurality of The roller (1) is attached to the circuit substrate. Based on the obtained three-dimensional circuit substrate, the gap between the side edges of the attached circuit board (2) was measured for each sample. The measurement results are shown in Table 1 ° Table 1 Pressure at the time of attachment (MPa (kg/cm2)) Measurement result of gap (_) (s10 is 0.20mm,
320804 15 200938028 (實施例二） 首先，、以下述方式製作電路基板（2)。 使用於厚度38㈣的聚醯亞胺薄膜上層疊有厚度8// =的銅/1之—層基板（日本住友金屬鑛山股份有限公司製 ^ Ρ ΐ6Χ)藉由光阻劑方式於銅層表面貼附乾膜光 阻劑（日本旭化成股份有限公司製造，Am%)，使用 預定配線形狀的遮罩，於乾膜光阻劑上進行曝光 、顯像、 姓刻並進行的剝離。此外，於電路基板的背 側層4熱壓著型的接著劑（日本NIKKAN工業股份有限公 司製造，SAFW) ’予以暫時性接著。 >藉由模具切斷以上述方式所獲得的電路基板⑴， 設置於第2圖所示的卡匣（4〇)。 接著，與實施例一同樣使用第1圖的概略圖所示的立 體性電路基板的形成震置，實施貼附步驟。 取代保護薄膜去除裝置，使用加熱器（則或旋轉裝 置用加熱器（未圖示）°在試料NCU與亂2中，以使電 路基板（2)成為12(TC之方式設定加熱器溫度，在ι〇秒 内停止吸附板（20)並藉由加熱器（5())進行加孰。此外， 在試料No.3與No.4中，加熱旋轉裝置的旋轉輕， 輕的表面溫度加熱至mt：，於該旋轉輕 ^ 輥⑴，以進行賴。屬於對象物 興罝銘g襄的 施例一相同之輥。係使用與實 根據電路基板（2)的尺寸與輥 路基板側邊之間的間隙時，計算出的理論值為=^算電 320804 16 200938028 根據所獲得的立體性電路基板，針對各個試料測量貼 附後的電路基板側邊間的間隙。將測量結果顯示於表2。 表2320804 15 200938028 (Embodiment 2) First, a circuit board (2) is produced in the following manner. A copper/1 layer substrate (manufactured by Sumitomo Metal Mining Co., Ltd., manufactured by Sumitomo Metal Mining Co., Ltd.) laminated on a polyimide film having a thickness of 38 (4) is deposited on the surface of the copper layer by a photoresist. A dry film photoresist (manufactured by Asahi Kasei Co., Ltd., Am%) was attached, and a mask having a predetermined wiring shape was used to perform exposure, development, and peeling on the dry film photoresist. Further, a heat-pressing adhesive (manufactured by NIKKAN Industrial Co., Ltd., SAFW, Japan) on the back side layer 4 of the circuit board was temporarily placed. > The circuit board (1) obtained as described above is cut by a die, and is placed in the cassette (4〇) shown in Fig. 2 . Then, in the same manner as in the first embodiment, the formation of the vertical circuit substrate shown in the schematic view of Fig. 1 is used, and the attaching step is performed. Instead of the protective film removing device, a heater (or a heater for a rotating device (not shown) is used in the sample NCU and the disorder 2, so that the circuit board (2) is set to 12 (TC), and the heater temperature is set. The adsorption plate (20) was stopped in ι〇 seconds and twisted by the heater (5()). Further, in samples No. 3 and No. 4, the rotation of the heating rotary device was light, and the light surface temperature was heated to Mt:, in the rotation of the light roller (1), to perform the Lai. The same roller as the object of the object Xingming Mingg襄. The use and the actual size of the circuit substrate (2) and the side of the roller substrate In the case of a gap between the two, the calculated theoretical value is Δ400640 16 200938028 According to the obtained three-dimensional circuit substrate, the gap between the side edges of the attached circuit board is measured for each sample. The measurement results are shown in Table 2. . Table 2
No. 加熱對象 貼附時的壓力 (MPa(kg/cm2)) 間隙的測量結果（mm) (計算值0.20mm) 一方端 中央 另一方端 1 電路基板 0.098 (1.0) 0.13 0.13 0.13 2 電路基板 0.147 (1.5) 0.08 0.08 0.08 3 對象物 0.098 (1.0) 0.13 0.13 0.13 4 對象物 0.147 (1.5) 0.08 0.08 0.08 【圖式簡單說明】 第1圖係顯示本發明的立體性電路基板之形成裝置的 實施例的概略圖。 第2圖係顯示第1圖的基準產生機構的概略圖。 【主要元件符號說明】 1 對象物（輥） 2 電路基板 10 旋轉機構（旋轉裝置） 20 保持機構（吸附板） 30 控制機構（真空升降機） 40 基準產生機構（卡匣） 41 固定板 42 可動板 50 加熱機構（加熱器） 17 320804No. Pressure at the time of attachment of the heating target (MPa (kg/cm2)) Measurement result of the gap (mm) (calculated value: 0.20 mm) The other end of the one end is 1 circuit board 0.098 (1.0) 0.13 0.13 0.13 2 Circuit board 0.147 (1.5) 0.08 0.08 0.08 3 Object 0.098 (1.0) 0.13 0.13 0.13 4 Object 0.147 (1.5) 0.08 0.08 0.08 [Brief Description] Fig. 1 shows an embodiment of a device for forming a three-dimensional circuit board of the present invention. Schematic diagram. Fig. 2 is a schematic view showing a reference generating mechanism of Fig. 1. [Description of main components] 1 Object (roller) 2 Circuit board 10 Rotating mechanism (rotating device) 20 Holding mechanism (adsorption plate) 30 Control mechanism (vacuum lift) 40 Reference generating mechanism (click) 41 Fixing plate 42 Actuating plate 50 heating mechanism (heater) 17 320804