KR20090063098A - Device and method for forming a three-dimensional circuit board - Google Patents

Abstract

A device and a method for forming a three-dimensional circuit board are provided to attach a circuit board through a surface of a roller of a circumferential shape or a cylindrical shape, especially, an entire circumference with position precision. A device for forming a three-dimensional circuit board includes a rotational unit(10), a retaining unit(20), and a control unit(30). The rotational unit maintains a central axis of a target(1) having a circumferential shape or a cylindrical shape in a horizontal state. The rotational unit is rotated around the central axis as a rotary axis. The retaining unit retains a downwardly directed state of an adhesive layer of a circuit board(2). The retaining unit is transferred horizontally. The control unit controls a relatively position to form a contacting state between the surface of the rotating target and the adhesive layer of the transferred circuit board. The control unit controls constantly the pressure of the circuit board.

Description

Device and method for forming a three-dimensional circuit board

The present invention relates to an apparatus and method for forming a three-dimensional circuit board, and more particularly, to an apparatus and method for forming a three-dimensional circuit board by adhering the circuit board to the surface of the roller.

With the miniaturization, multifunctionality, and low cost of electronic devices such as mobile phones, it is required to make circuit boards compact on the inner and outer surfaces of the tube. For this reason, it may be necessary to make a circuit board three-dimensional rather than planar. Also in the field of copiers, it has been proposed to form a three-dimensional circuit board by adhering the circuit board to a part or the whole of the surface of a roller such as a developing roller, a charging roller, or a transfer roller.

As a general method for forming such a three-dimensional circuit board, an injection molding method known as a one shot mold method or a two shot mold method is conventionally known.

In the short mold method, first, electroless plating and electroconductive resin are formed into a desired three-dimensional shape, and then a photosensitive resist is applied to the surface thereof, the circuit pattern is exposed, and then developed and exposed. After removing the photosensitive resist of the unsupported portion, electroless plating is performed on the exposed resin surface to obtain a three-dimensional circuit board.

On the other hand, in the two shot mold method, by using the resin in which the catalyst for plating is mixed, a three-dimensional shape capable of electroless plating is formed by the first injection molding, and a predetermined portion of the surface is formed by the second injection molding. A surface layer free of electroless plating is formed, and then electroless plating is performed on the surface portion covered with the resin containing the plating catalyst, thereby obtaining a three-dimensional circuit board.

However, any of the one short mold method or the two short mold methods has the following problems. For example, in the one shot mold method, the manufacturing process becomes very long and expensive. Moreover, it is not suitable for manufacture of the three-dimensional shape which has a three-dimensional curved shape. Moreover, the material of the resin is limited and patterning of the circuit is difficult.

On the other hand, although the two shot mold method is suitable for the production of a three-dimensional shape having a three-dimensional curved shape, a high-precision molding die is required, and the cost is high because two injection molding is required.

Therefore, none of these injection molding methods is suitable as a method for forming a circuit board around the entire roller surface.

As a method of forming a circuit board around this whole roller surface, the circuit board is formed by patterning a conductor layer using the base material which has a conductor layer like copper on the surface of insulating films, such as polyimide, and obtained the circuit board Has been considered to stick around the entire roller surface. Since such a circuit board can be manufactured in large quantities and at low cost, it can be advantageous if it can be adhered with a roller.

By the way, patent document 1 has described the method of sticking to a tubular body which made the film cylindrical or cylindrical by rotary cutting method. In this method, the flexible film that cannot be maintained on its own can be cut to a desired length with high precision, the film obtained by cutting is supplied to the tube, and the lamination can be performed to the tube by performing a good lamination. More specifically, the flexible film that is not self-supporting in the wound state is vacuum-adsorbed with a feeder roll and a cutting roll, and the feed roll is made slower than the cutting roll to give tension to the film, and By dividing the vacuum adsorption site into a plurality of parts to give activity to the film by adjusting the vacuum strength, to make a certain interval on the film after cutting, to give the timing of the laminate to the tube, and to rotate in the laminate site of the laminate roll to wrinkle the press film It is possible to make the tube free of lamination and to ensure that there is no air remaining between the tube and the film, so that a good laminate can be obtained on the tube.

The adhesive method by the rotary cutter system of patent document 1 was developed for the purpose of labeling the bottle surface of a beverage container, such as a tubular body or a bottle. Therefore, it is not necessary to strictly control the labeling position accuracy and the like, and when labeling around the entire surface of the beverage container, there is no problem even if the film overlaps or a gap occurs.

However, in the case where the circuit board for electronic equipment is adhered around the entire roller surface, if the circuit board overlaps or there is a large gap, a short circuit or poor conduction may occur in the wiring constituting the circuit, affecting the electrical characteristics of the circuit. There is a big problem. In addition, in the process after forming the three-dimensional circuit board, the assembling process for conducting the energization process from the outside is continued to the circuit board, and thus, if the circuit board is not adhered to the correct position, it may cause trouble in the subsequent assembly process. There is a problem. For this reason, very strict management is required about the position to stick.

In addition, in the case of using a roller adhered to the circuit board as a rotating body, when overlapping or a large gap is generated during adhesion, problems such as irregularities are formed in the circuit board and partial contact occurs during rotation. Therefore, the extent to which clearance is allowed without overlapping is also required.

Moreover, in the method of patent document 1, when a circuit board adheres around the whole roller surface, it is necessary to hold | maintain and convey a roller in the upright state. However, in the case of an elongated shape or when both ends and one end are processed into a complicated shape, it is always necessary to vertically convey it, so that it is very difficult to adhere the circuit board to it.

As described above, in forming a three-dimensional circuit board which forms a circuit board around the entire surface of the roller, the adhesive method of the rotary cutter method cannot be adopted.

[Patent Document 1] Japanese Patent Application Laid-Open No. 10-236446

It is an object of the present invention to provide a three-dimensional circuit board forming apparatus and a method for forming a circuit board, which can adhere a circuit board with an accurate positional accuracy over the surface of a cylindrical or cylindrical roller, especially the entire circumference.

An apparatus for forming a three-dimensional circuit board according to the present invention includes a rotating mechanism for maintaining a cylindrical or cylindrical object in a state where its central axis is horizontal, and rotating the central axis as a rotation axis, and an adhesive layer on the circuit board. It is possible to adjust the relative positional relationship so that the holding mechanism which faces this downward and simultaneously conveys horizontally, and the adhesive bond layer of the said circuit board conveyed with respect to the surface of the said object to rotate, and the surface of the said object The control mechanism which makes it possible to control the pressure of the said circuit board pressed against the constant is provided.

The adhesive layer of the circuit board is made of an adhesive at room temperature curable type at room temperature, and when the adhesive layer of the circuit board is covered by a protective film, the adhesive layer further has a removal mechanism capable of removing the protective film. It is desirable to.

In addition, when the adhesive layer of the circuit board is made of a heat-curable adhesive that exhibits adhesiveness due to heating, it is preferable to further have a heating mechanism for heating the adhesive layer or the object.

Specifically, the rotating mechanism is composed of two rotating rollers arranged such that the object rotates therebetween.

In addition, the reference dispensing mechanism capable of accommodating the circuit board according to the axial direction of the object mounted on the rotating mechanism is provided, thereby moving only in a direction perpendicular to the central axis of the object. Adhesion is possible.

However, the method for forming a three-dimensional circuit board according to the present invention is rotatably supported on a cylindrical or cylindrical object in a state where the central axis is horizontal, has a circuit on one side, and an adhesive on the other side. The circuit board provided with a layer is cut | disconnected to predetermined size, this circuit board is mounted in a reference position, this circuit board is attracted to a moving means, this moving means is moved, and the edge part of the said circuit board adhesive layer is moved to the object of the said object. Bonding the surface of the circuit board to the surface of the object while controlling the pressure for pressing the circuit board against the surface of the object while horizontally moving the circuit board and rotating the object. It is characterized by.

Specifically, by using the apparatus for forming a three-dimensional circuit board described above, the pressure is adjusted by adjusting the pressure so that the gap is controlled over the entire periphery of the surface of the object, so that adhesion is achieved.

According to the present invention, the positional accuracy is good on the surface of the roller for an electronic device, which is difficult to be conveyed while maintaining the vertical, and the circuit board can be adhered accurately without overlapping each other and controlling the gap to a minimum.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of this invention is described in detail based on drawing.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows one Embodiment of the formation apparatus of the three-dimensional circuit board of this invention.

FIG. 2 is a schematic view showing a mechanism for sending out the reference of FIG. 1. FIG.

The apparatus for forming a three-dimensional circuit board according to the present invention includes a rotating mechanism 10 which maintains a cylindrical or cylindrical object 1 in a state where the central axis is horizontal, and rotates the central axis as a rotation axis, The adhesive layer of the circuit board 2 faces downward, and the holding mechanism 20 to convey horizontally and the adhesive layer of the circuit board 2 conveyed with respect to the surface of the rotating object 1 contact | connect. The relative positional relationship is adjustable, and the control apparatus 30 which can control the pressure of the circuit board 2 pressed against the surface of the target object 1 is provided constantly.

The circuit board 2 is housed in the reference delivery mechanism 40. In addition, the circuit board 2 is previously cut to a predetermined size in accordance with the size of the object 1 to be adhered. For example, in the case where the circuit board 2 is formed on the front surface of the roller that is the object 1, the length of the side end of the circuit board 2 in the rotation axis direction of the object 1 is equal to the length of the rotation axis direction of the object 1. Make it the same. In addition, the length of the side end corresponding to the circumferential direction of the object 1 is made to be substantially the same as the circumference of the object 1. However, as will be described later, there is an error in cutting accuracy and a tolerance in the shape of the object 1, but since these are corrected, it is not necessary to exactly match this value.

The reference delivery mechanism 40 functions as a holder of the film-shaped circuit board 2 cut to a constant size. The standard delivery mechanism 40 is comprised from the fixing plate 41 and the movable plate 42 of resin material, for example. The film-shaped circuit board 2 cut to a certain size is set on the standard delivery mechanism 40 with the circuit surface up (the adhesive layer down). As the position of the reference delivery mechanism 40, the fixed plate 41 which becomes a fixed reference plate in the XY direction is set, and the movable plate 42 is set to an accurate position by pressing the circuit board 2 in the form of a film.

The cut | disconnected film-form circuit board 2 may be set one by one, and may bundle and set several sheets. In the case where a plurality of sheets are bundled and set, a magazine capable of stacking and storing a plurality of sheets can be attached to the standard delivery mechanism 40 and used.

The film-shaped circuit board 2 set in the correct position is adsorbed and conveyed by vacuum suction to the holding mechanism 20 in which a small hole is perforated. Specifically, the holding mechanism 20 is a suction plate made of a resin plate or metal plate having a small hole to enable vacuum suction, and a vacuum suction system communicating with the hole, and the suction plate and the vacuum suction system are raised and lowered. It consists of a mechanism that can move in the direction.

The holding mechanism 20 rises after absorbing the film-shaped circuit board 2.

When the adhesive layer is made of an adhesive that exhibits adhesiveness by heating, the adhesive layer passes through a heating mechanism 50 for heating the circuit board 2. The heating mechanism 50 may employ a known heating heater or the like. Since the active conditions vary depending on the type of adhesive, the heating temperature and heating time by the heating heater are optimized and heated according to the adhesive used. The heating temperature is controlled within the active temperature range of each adhesive.

In addition, the heating mechanism 50 can adopt not only the heating of the adhesive bond layer of the circuit board 2 but the thing of the mechanism which heats an adhesive bond layer at the time of bonding by heating the object 1, for example.

In addition, in the illustrated embodiment, the case where the adhesive layer is composed of a heat-curable adhesive that exhibits adhesiveness by heating is shown. However, when the adhesive layer is composed of an adhesive having adhesiveness at room temperature and a protective film is adhered to the adhesive layer, A removal mechanism for removing the protective film is provided. The well-known apparatus for peeling and removing a protective film can also be used also about this removal mechanism.

Such a heating mechanism 50 and a removal mechanism may be provided simultaneously.

Thereafter, the holding mechanism 20 is moved to move the circuit board 2 above the rotating mechanism 10 in which the object 1 composed of a metal or resin roller is set. If necessary, the holding mechanism 20 is lowered at the position, and the circuit board 2 is pressed against the surface of the object 1 so that the end portion of the adhesive layer of the circuit board 2 (the direction of the rotation axis of the object 1). The end in the advancing direction at the side end extending in the crosswise direction is bonded to the surface thereof. However, its joining may be achieved only by horizontal movement.

The rotating mechanism 10 has a structure which adjoins two rotating rollers rotatable freely. As the rotating roller, a metal roller can be adopted. If necessary, a rubber-like elastic material may also be adopted to adhere around the entirety. Both ends of the roller to be caught are rotatably supported by a bearing or the like, and can be followed in accordance with the rotation of the object 1. The holding mechanism 20 moves so that the object 1 may be interposed between two rotary rollers, and the side edge which extends in the direction of the rotation axis of the film-shaped circuit board 2 and the rotation axis of the object 1 will be parallel. In addition, when the circuit board 2 does not need to be formed at both ends of the object 1, for example, both ends may be supported by a bearing or the like and rotatably supported.

Thereafter, the holding mechanism 20 that absorbs the film-shaped circuit board 2 moves horizontally, and the object 1 is rotated along the rotation of the object 1 from the side of the film-shaped circuit board 2. Adhesion around the entire surface. Accordingly, no air enters between the adhesive layer and the object 1. In addition, even if the shape of the object 1, such as length and diameter, changes, the holding mechanism 20 can paste the film-shaped circuit board 2 to the object 1, without changing a dimension and a structure. have. Moreover, in order to make a pressure constant at the time of adhesion | attachment, you may use the mechanism using air or hydraulic pressure.

Since the film-form circuit board 2 is a structure which forms thin conductors, such as copper, on a resin film, a certain extent of extension | stretching arises. In the present invention, since the film-shaped circuit board 2 adsorbed to the holding mechanism 20 is wound around the object 1, the circuit device 2 is connected to the object 1 by the control mechanism 30. By changing the pressure for pressing 2), the elongation of the film-shaped circuit board 2 is different from each other, and as a result, the gap (adhesion) of the film-shaped circuit board 2 adhered around the entire surface of the object 1. It is possible to control the distance between the side edges in the later rotation axis direction with the above-mentioned pressure. Specifically, the elongation can be adjusted by determining the difference in the dimensions of the film-shaped circuit board 2 cut in predetermined dimensions or the difference in the diameter of the object 1 and winding it while controlling the pressure in accordance with the required gap after the adhesion. have.

In particular, calculation gaps may be caused by differences in cutting accuracy of the film-shaped circuit board 2, tolerances in diameter when the object 1 becomes a roller made of metal or plastic, and manufacturing differences occurring between the lots. There may be other cases. However, in the present invention, as mentioned above, by controlling the pressure at the time of attachment in the control mechanism 30, it is possible to change the elongation of the circuit board 2 to control the gap to a constant value below the allowable value.

Example

Example 1

First, the circuit board 2 was produced as follows.

The film was formed by sputtering a thin copper film on the surface using a PET film (A4100, manufactured by Tokyo Co., Ltd.) having a thickness of 35 µm, and then a copper layer was formed by electroplating. In electroplating, a copper bath having a thickness of 8 µm was formed using a plating bath having a copper sulfate concentration of 90 g / liter and a sulfuric acid concentration of 180 g / liter at room temperature, with a cathode current density of 2 A / dm ² .

Further, a dry film resist (AQ-1158, manufactured by AQAS Co., Ltd.) was attached to the surface of the copper layer by a photoresist method, and the exposure was performed on the dry film resist using a mask having a predetermined wiring shape, developing, etching, and drying. Peeling of the film resist was performed. In addition, the adhesive agent (The double-sided adhesive tape # 8616 made from Daiko Ink Chemical Co., Ltd.) which has viscosity at normal temperature was laminated and used on the back surface side of a circuit board. Thus, a protective film is attached to the adhesive layer.

The circuit board 2 obtained as mentioned above was cut | disconnected by the metal mold | die, and the side edge of a rotation axis direction became 50.3 mm, and it was set so that the side edge of a vertical direction might be 350 mm here. After cutting, it was set in the cassette 40 as shown in FIG.

Next, the adhesion process was performed using the apparatus for forming a three-dimensional circuit board shown in FIG. 1. The device is vacuum vacuum lift 30 (lift mechanism by air cylinder), suction plate 20 connected to the lift, heating heater 50, protective film removal device (protective film pasted on circuit board is film The leader tape is attached to the edge, and the leader tape is peeled off, and the protective film is peeled off, and the rotary device 10 and the rotary heater (not shown) are provided. The vacuum suction lift 30 may move the suction plate 20 up and down and move horizontally in the direction of the rotating device 10 from the cassette 40. The protective film removing device is provided on the line from the cassette 40 to the rotating device 10 adjacent to the heating heater 50. However, the heating heater 50 is not used. As the rotary roller of the rotating apparatus 10, the roller of 40 mm in diameter and 400 mm in length which attached the silicone rubber to the metal roller surface was used, respectively.

About the object 1, the roller 1 which consists of aluminum pipes whose diameter is 16 mm and length is 350 mm was installed between the rotating rollers of this rotating apparatus 10. As shown in FIG.

In addition, each circuit board 2 and the roller 1 must be accurately measured for the measurement described later.

The adsorption plate 20 was lowered to the top of the circuit board 2 accommodated in the cassette 40 and the circuit board 2 was adsorbed. The suction plate 20 was raised and then horizontally moved. In the middle of horizontal movement, the protective sheet which coat | covers the adhesive bond layer of the lower side of the circuit board 2 was removed by the protective film removal apparatus etc., and was removed. When the advancing direction end of the adsorption plate 20 reaches up to the roller 1 on the rotating apparatus, the adsorption plate 20 is lowered until the roller 1 is pressed by a predetermined pressure. When the advancing direction end of the adhesive layer contacts the surface of the roller 1 and moves the suction plate 20 horizontally, the roller 1 also rotates with it, and the circuit board 2 adheres over the whole.

The theoretical value was 0.20 mm as a result of calculating the clearance between one side surface of the circuit board 2 from the size of the circuit board 2 and the diameter of the roller 1.

Then, the roller 1 to which the circuit board 2 is adhered is discharged, a new roller 1 is placed on the rotating device 10, and the pressure at the time of adhesion is changed as shown in Table 1, thereby providing a plurality of rollers 1 The circuit board was adhered to

The gap between one side surface of the circuit board 2 after adhesion was measured with respect to each sample from the obtained three-dimensional circuit board | substrate. The measurement results are shown in Table 1.

number Pressure at adhesion (MPa (kg / ㎠)) Measurement result of clearance (mm) (calculated value 0.20mm) One end center The other end One 0.049 (0.5) 0.16 0.16 0.16 2 0.0784 (0.8) 0.12 0.12 0.12 3 0.098 (1.0) 0.10 0.10 0.10 4 0.147 (1.5) 0.06 0.06 0.06

Example 2

First, the circuit board 2 was produced as follows.

A thin film of Cu having a thickness of 8 μm was laminated on a polyimide film having a thickness of 38 μm, and a dry film resist was formed on the surface of the copper layer by photoresist using a two-layer substrate (S'perFlex). Co., Ltd., AQ-1158) was used for exposure on a dry film resist using a mask having a predetermined wiring shape, and development, etching and desorption of the dry film resist were performed. Moreover, the temporary bonding was performed by laminating | stacking the thermocompression-type adhesive agent (SAFW by Nikkan Industries, Ltd.) on the back surface of a circuit board.

The circuit board 2 obtained as mentioned above was cut | disconnected according to the metal mold | die, and it set to the cassette 40 as shown in FIG.

 Then, in the same manner as in Example 1, an adhesion process was carried out using a three-dimensional circuit board forming apparatus shown schematically in FIG.

Instead of the protective film removing device, a heating heater 50 or a heating heater (not shown) for a rotating device was used. Sample No. In 1 and 2, heating temperature was set so that the circuit board 2 might be 120 degreeC, and heating was carried out with the adsorption plate 20 on the heating heater 50 for 10 second. In addition, sample No. In 3 and 4, the rotating roller of the rotating apparatus was heated, and the roller 1 made of aluminum pipe was mounted on the rotating roller at 120 degreeC, and the adhesion was performed. In addition, the roller 1 which is an object was used similarly to Example 1.

From the size of the circuit board 2 and the diameter of the roller 1, the gap between the side edges of the circuit board was calculated, and the theoretical value was 0.20 mm.

The gap between one side surface of the circuit board after adhesion from the obtained three-dimensional circuit board | substrate was measured about each sample. The measurement results are shown in Table 2.

number Heating target Pressure at adhesion (MPa (kg / ㎠)) Measurement result of clearance (mm) (calculated value 0.20mm) One end center The other end One Circuit board 0.098 (1.0) 0.13 0.13 0.13 2 Circuit board 0.147 (1.5) 0.08 0.08 0.08 3 quid pro quo 0.098 (1.0) 0.13 0.13 0.13 4 quid pro quo 0.147 (1.50 0.08 0.08 0.08

1 is a schematic view showing an embodiment of an apparatus for forming a three-dimensional circuit board of the invention,

Fig. 2 is a schematic diagram showing the reference delivery mechanism of Fig. 1.

* Explanation of symbols for main parts of the drawings

1 --- Object (roller)

2 --- Circuit Board

10 --- rotating mechanism

20 --- keeping mechanism

30 --- control mechanism

40 --- Standard delivery mechanism

41 --- fixing plate

42 --- movable plate

50 --- heating apparatus

Claims (7)

A rotating mechanism for maintaining a cylindrical or cylindrical object in a state where the central axis is horizontal, and rotating the central axis as a rotation axis; A holding mechanism for holding the circuit board with the adhesive layer downward and conveying it horizontally; A control mechanism that makes it possible to adjust the relative positional relationship so that the adhesive layer of the circuit board conveyed with respect to the surface of the rotating object is brought into contact, and makes it possible to constantly control the pressure of the circuit board pressed against the surface of the object. Apparatus for forming a three-dimensional circuit board comprising a. The method of claim 1, And a removing mechanism for removing the protective film covering the adhesive layer of the circuit board. The method of claim 1, And a heating mechanism for heating the adhesive layer or the object of the circuit board. The method of claim 1, And said rotating mechanism is comprised of two rotating rollers arranged to rotate said object loaded therebetween. The method of claim 1, And a reference dispensing mechanism capable of accommodating the circuit board in accordance with the axial direction of the object placed on the rotating mechanism. By using the apparatus for forming a three-dimensional circuit board according to any one of claims 1 to 5, by adjusting the pressure, the circuit board is adhered by controlling a gap around the entire surface of the object to form a three-dimensional circuit board. Way. A cylindrical or cylindrical object is rotatably maintained while its central axis is horizontal, and a circuit board having a circuit on one side and an adhesive layer provided on the other side is cut to a predetermined size. And placing the circuit board at a reference position, adsorbing the circuit board by the moving means to move the moving means, bonding the end of the adhesive layer of the circuit board to the surface of the object, and attaching the circuit board to the Forming a three-dimensional circuit board by controlling the pressure to be pressed against the surface of the object, and simultaneously rotating the circuit board and rotating the object to adhere the circuit board to the surface of the object. .

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