JP2002353575A - Composite tubular body and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing composite tubular body, by which a prescribed conductor pattern can be formed easily and surely on at least either of the inner peripheral surface or the outer peripheral surface of a tubular film body with accuracy, and to provide a composite tubular body manufactured by the method. SOLUTION: The composite tubular body 15 on which the prescribed conductor pattern 5 is formed, by either transferring the pattern 5 from a sheet-like carrier material 1 having the pattern 5 on at least one of the inner and outer peripheral surface of the tubular film body 12 to the tubular body 15 or by laminating the carrier material 1 upon the tubular body 15, as it is.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite tubular body and a method of manufacturing the same, and more particularly, to a composite tubular body used as a tubular member such as a drum member, a belt member or a roller member provided in a copying machine or a printer, and the composite tubular body. It relates to a manufacturing method.

[0002]

2. Description of the Related Art Conventionally, in a copying machine, a printer, or the like, a drum member, a belt member, a roller member, or the like is used for forming an electrostatic latent image or a toner image, transferring the image to paper, and further transporting the image. Are used.

[0003] These tubular members are usually provided with an appropriate semiconducting property on a substrate or a surface, and are configured to function as each member by being charged or gradually charged while rotating. I have.

However, in recent years, it has been required to control electric field and static electricity in a tubular member with high precision from the viewpoint of higher definition of an image and higher function of the member. A conductive pattern consisting of a linear wiring pattern is formed on the surface of a film-like endless belt, and a voltage is applied to the conductive pattern to control the charge, thereby electrostatically adsorbing the paper, and conveying the paper. It is described that the printing speed is increased to correspond to high-speed printing.

In Japanese Patent Laid-Open No. 2000-318865, such a conductor pattern is formed on the surface of the tubular member.
Formed by a method such as screen-printing a conductive paste in a predetermined pattern, applying a metal thin film and etching it into a predetermined pattern through a mask, or depositing a metal in a predetermined pattern through a mask. It states that it can.

[0006]

However, since the surface of the tubular member is a curved surface, in order to accurately form a fine conductor pattern, a mask on which a fine pattern is formed is brought into close contact with the curved surface. It is necessary to perform paste printing, etching or vapor deposition with high accuracy. for that purpose,
It requires extremely complicated steps, and when exposure is required, it is difficult to improve production efficiency and reduce costs because complicated equipment is required to fix the optical system and the work. is there. In particular, it is very difficult to form a conductor pattern on the inner peripheral surface of the tubular member due to restrictions on the device.

Further, when a conductor pattern is formed by these methods, steps or irregularities are generated due to the thickness of the conductor pattern, thereby causing an uneven electric field and an uneven pressure, which makes charging control difficult. .

The present invention has been made in view of such circumstances, and an object of the present invention is to easily and reliably apply a predetermined conductor pattern to at least one of an inner peripheral surface and an outer peripheral surface of a film tubular body. An object of the present invention is to provide a method of manufacturing a composite tubular body that can be formed with high accuracy, and a composite tubular body manufactured by the method.

[0009]

In order to achieve the above object, a method of manufacturing a composite tubular body according to the present invention is characterized in that a predetermined conductor pattern is formed on at least one of an inner peripheral surface and an outer peripheral surface of a film tubular body. A method for producing a composite tubular body, wherein a sheet-shaped carrier material on which the conductor pattern is formed is prepared, and at least one of the inner peripheral surface and the outer peripheral surface of the film tubular body from the carrier material, The conductive pattern is transferred.

According to this method, the conductor pattern is simply transferred from the carrier material to the film tubular body, even though at least one of the inner peripheral surface and the outer peripheral surface of the composite tubular body is curved, A fine conductor pattern can be formed easily, reliably and accurately.
Therefore, it is possible to efficiently produce a composite tubular body on which a fine conductor pattern is formed, thereby improving production efficiency and reducing costs. Particularly, according to this method, since only transfer is performed, the conductor pattern can be easily and reliably formed even on the inner peripheral surface of the composite tubular body.

The present invention also relates to a method for producing a composite tubular body, wherein a predetermined conductor pattern is formed on at least one of the inner peripheral surface and the outer peripheral surface of the film tubular body,
A sheet-like carrier material on which the conductor pattern is formed is prepared, and the film tubular body and the carrier material are provided on at least one of an inner peripheral surface and an outer peripheral surface of a tubular mold. And transferring the conductive pattern to at least one of the inner peripheral surface and the outer peripheral surface of the film tubular body.

With the use of a tubular mold, simple and reliable
It can be formed into a tube.

In these methods, it is preferable that the transfer is performed so that the surface of the composite tubular body to which the conductor pattern is transferred is substantially smooth.

When the transferred surface is substantially smooth,
Since there are no steps or irregularities due to the thickness of the conductor pattern,
Electric field unevenness and pressure unevenness are small, and charge control unevenness can be effectively prevented.

Further, the present invention is a method for producing a composite tubular body in which a predetermined conductor pattern is formed on at least one of an inner peripheral surface and an outer peripheral surface of a film tubular body,
Preparing a sheet-like carrier material on which the conductor pattern is formed, laminating the carrier material on at least one of an inner peripheral surface and an outer peripheral surface of the film tubular body, including a method for producing a composite tubular body. I have.

According to this method, despite the fact that at least one of the inner peripheral surface and the outer peripheral surface of the composite tubular body is a curved surface, the fine conductor can be formed by a simple process of merely laminating the carrier material on the film tubular body. A pattern can be formed easily and reliably with high accuracy. Therefore, it is possible to efficiently produce a composite tubular body on which a fine conductor pattern is formed, thereby improving production efficiency and reducing costs. In particular, according to this method, since only the lamination is performed, the conductor pattern can be easily and reliably formed even on the inner peripheral surface of the composite tubular body.

The present invention also relates to a method for producing a composite tubular body in which a predetermined conductor pattern is formed on at least one of the inner peripheral surface and the outer peripheral surface of the film tubular body,
A sheet-like carrier material on which the conductor pattern is formed is prepared, and the film tubular body and the carrier material are provided on at least one of an inner peripheral surface and an outer peripheral surface of a tubular mold. Is laminated on at least one of the inner peripheral surface and the outer peripheral surface of the film tubular body.

If a tubular mold is used, simple and reliable
It can be formed into a tube.

Further, in these methods, it is preferable that the carrier material is laminated so that the conductor pattern contacts at least one of the inner peripheral surface and the outer peripheral surface of the film tubular body.

When the carrier material is laminated so that the conductor pattern contacts at least one of the inner peripheral surface and the outer peripheral surface of the film tubular body, the inner peripheral surface and the outer peripheral surface of the obtained composite tubular body are made substantially smooth. Can be formed. Therefore, since there is no step or unevenness due to the thickness of the conductive pattern, unevenness in electric field and pressure is small, and unevenness in charge control can be effectively prevented.

In the method using a tubular mold, it is preferable that there is a difference in the coefficient of thermal expansion between the mold and the film tubular body.

If there is a difference in the coefficient of thermal expansion between the mold and the tubular film, heating them causes either one to contract or expand with respect to the other due to the difference in the coefficient of thermal expansion. In addition, the film tubular body and the carrier material can be satisfactorily adhered to each other. Therefore, simply and reliably,
It can be transferred or laminated.

The composite tubular body of the present invention thus formed is a tubular member of an electric or electronic device, more specifically, a drum member, a belt member or a roller provided in a copying machine or a printer. It can be suitably used as a tubular member such as a member, and can reliably control charging.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION In the method for producing a composite tubular body of the present invention, a conductor pattern is transferred from a sheet-like carrier material having a conductor pattern formed on at least one of an inner peripheral surface and an outer peripheral surface of a film tubular body. Alternatively, a sheet-like carrier material on which a conductor pattern is formed is laminated as it is.

In the method of the present invention, the film tubular body is formed by forming a film-shaped member made of resin or resin and metal foil into a tubular shape.
It is preferable to form an annular shape extending in the longitudinal direction and have a seamless shape in the circumferential direction. In addition, it is preferable that the composite tubular body is thin and flexible in order to increase the degree of freedom in installation or design of the apparatus in which the composite tubular body is used. When used as a member, it is preferable that its surface is flexible in order to make it come into soft contact with paper, toner or other members.

As the resin, for example, polyester, polyethylene, polycarbonate, polyamide, polyimide, fluororesin, silicone resin, etc., which are excellent in mechanical properties and heat resistance, are used.

In order to improve the mechanical strength while ensuring the flexibility of the surface, for example, the above resin is laminated on a metal belt made of a metal foil such as stainless steel, nickel, copper, and aluminum. Is also good.

The thickness of the film tubular body is not particularly limited, but is preferably not less than 20 μm from the viewpoint of mechanical properties, for example, when it is formed only of resin, while it is flexible. From the viewpoint of properties, the thickness is preferably 500 μm or less. Further, when the resin is laminated on the metal belt, the thickness of the resin is preferably, for example, 2 μm or more from the viewpoint of abrasion resistance, while the thickness of the resin is 500 μm or less from the viewpoint of flexibility. Preferably, there is. Further, the thickness of the metal belt is preferably, for example, 10 μm or more from the viewpoint of mechanical properties.
From the viewpoint of flexibility, the thickness is preferably 200 μm or less.

In such a film tubular body, depending on the purpose and use, in order to impart appropriate charging performance, conductivity is imparted by blending and dispersing carbon, metal oxide, or the like into a resin. In such a case, for example, the film tubular body has a volume resistance of 1.0 × 10 ³ Ω · cm or more and 1.0 × 10 ¹⁶ Ω · cm or more.
cm or less. 1.0
When it is less than × 10 ³ Ω · cm, the charge is easily dissipated,
On the other hand, if it exceeds 1.0 × 10 ¹⁶ Ω · cm, static elimination is difficult, and proper charging may not be applied to the surface of the resin.

Further, such a film tubular body will be described in detail later. For example, when the film tubular body is formed only of a resin, for example, a tubular mold is prepared, and first, the inner periphery of the mold is prepared. A resin coating solution such as a molten resin obtained by melting the resin, a resin solution in which the resin is dissolved or a precursor solution in which a resin precursor is dissolved is applied to at least one of the surface and the outer peripheral surface, and dried. Then, it is shaped into a tubular body along the inner or outer peripheral surface of the mold. The tubular mold is not particularly limited, but can be formed of a metal material or a resin material having pressure resistance and heat resistance.

Next, after the predetermined conductor pattern is transferred or the carrier material on which the predetermined conductor pattern is formed is laminated, the film-shaped tubular body formed into a tube is further heated, if necessary. By doing so, it can be molded by removing the solvent and curing.

In order to remove the solvent and harden, the material may be heated while being supported by the mold as it is.
The mold may be once removed, fitted into at least one of the inner peripheral surface and the outer peripheral surface of another mold, and heated.

As described above, if a tubular mold is used,
It can be easily and reliably formed into a tube.

When laminating the resin on the metal belt, the same resin coating solution as described above is applied to at least one of the inner peripheral surface and the outer peripheral surface of the prepared endless belt-shaped metal belt. Can be formed by drying, after which a predetermined conductor pattern is transferred, or after the carrier material on which the predetermined conductor pattern is formed is laminated, by further heating, desolvation and What is necessary is just to harden.

In the method of the present invention, the sheet-like carrier material on which the conductor pattern is formed is made of a flexible sheet member or a film member such as a metal foil or a resin film. Are formed.

As the metal foil, for example, stainless steel foil,
Copper foil, nickel foil, chrome foil, aluminum foil and the like are used. The thickness of the metal foil is preferably 10 μm or more and 200 μm or less. If it is less than 10 μm, dimensional stability may be poor, and folds and wrinkles may easily occur, which may make handling inconvenient. On the other hand, if it exceeds 200 μm, it may be difficult to bend, for example, it may be difficult to follow a tubular body of 30 mmφ or less.

As the resin film, a resin film made of, for example, polyester, polyethylene, polycarbonate, polyamide, polyimide, fluororesin, silicone resin or the like is used in the same manner as described above. The thickness of the resin film is preferably 15 μm or more and 1 mm or less. If it is less than 15 μm, dimensional stability may be poor, and folds and wrinkles may easily occur, which may make handling inconvenient. If it exceeds 1 mm, it may be difficult to bend, for example, it may be difficult to follow a tubular body having a diameter of 30 mm or less.

There is no particular limitation on the formation of a predetermined conductor pattern on the surface of the carrier material. For example, a subtractive method, an additive method, a semi-additive method, or a screen printing method may be used.

In the subtractive method, for example, FIG.
As shown in (a), a carrier material 1 is prepared, and FIG.
As shown in (b), first, a metal thin film 2 is laminated on a carrier material 1, and then, as shown in FIG. 1 (c), a photoresist 3 is laminated on the metal thin film 2, The resist 3 is exposed through a photomask 4 and then developed to be patterned so as to correspond to a predetermined conductor pattern as shown in FIG. Next, as shown in FIG.
Is used as a resist, the metal thin film 2 is etched, and then, as shown in FIG. 1F, the photoresist 3 is removed to form the metal thin film 2 as a predetermined conductor pattern 5.

In the additive method, for example, FIG.
As shown in FIG. 2A, a carrier material 1 is prepared, and FIG.
As shown in FIG. 2B, first, a photoresist 3 is laminated on the carrier material 1, and then, as shown in FIG.
The photoresist 3 is exposed through a photomask 4 and then developed to be patterned so as to correspond to a predetermined conductor pattern 5 as shown in FIG. Next, as shown in FIG. 2E, the metal thin film 2 is plated on the exposed carrier material 1 so that a predetermined conductor pattern 5 is formed.
As shown in (1), the metal thin film 2 may be formed as a predetermined conductor pattern 5 by removing the photoresist 3.

In the semi-additive method, for example,
As shown in FIG. 3A, a carrier material 1 is prepared, and as shown in FIG. 3B, first, a metal base 6 is deposited on the carrier material 1 and then, Then, a photoresist 3 is laminated, and then, as shown in FIG.
The photoresist 3 is exposed through a photomask 4 and then developed to be patterned so as to correspond to a predetermined conductor pattern 5 as shown in FIG. Next, as shown in FIG. 4E, the metal thin film 2 is plated on the exposed base 6 so that a predetermined conductor pattern 5 is formed, and thereafter, as shown in FIG. Next, the photoresist 3 is removed and FIG.
As shown in (g), the metal thin film 2 may be formed as a predetermined conductor pattern 5 by removing the base 6 on which the photoresist 3 has been formed.

In the screen printing method, for example, a carrier material 1 is prepared as shown in FIG.
As shown in (b), a screen plate 7 on which a predetermined conductor pattern 5 is formed is arranged on the carrier material 1, and metal particles, metal oxide particles and carbon particles are mixed with the binder resin by a squeegee 8. The conductive paste 9 is printed and then heated to form the metal thin film 2 on the carrier material 1 as a predetermined conductor pattern 5 as shown in FIG.

The thickness of the conductor pattern thus formed is preferably 0.1 μm or more and 50 μm or less. When the thickness is less than 0.1 μm, the film strength is insufficient, and cracks may occur when transferring or laminating to the film tubular body or when rotating as a composite tubular body. On the other hand, if it exceeds 50 μm, the thickness of the film tubular body cannot be absorbed when transferred or laminated on the film tubular body, and irregularities may occur on the surface of the obtained composite tubular body. . Also, 50 μm
When it exceeds, the elastic modulus of the transferred or laminated portion becomes very high, and the surface of the composite tubular body is distorted, or the composite tubular body is eccentrically rotated, and the nip portion with other members ( (Contact portion), there is a case where the nip pressure fluctuates periodically.

The predetermined conductor pattern is not particularly limited, and may be appropriately selected depending on the purpose and application, such as a linear wiring pattern or a dot matrix pattern.

When the conductor pattern is formed on the surface of the carrier material, a metal or a metal is provided at the interface to improve the adhesive force between the carrier material and the conductor pattern.
An inorganic release layer of a metal oxide such as SiO ₂ or TiO ₂ or an organic release layer of a nitrogen-containing compound such as a silicone compound or a triazole, or a fluorine compound may be formed.

According to the method of the present invention, at least one of the inner peripheral surface and the outer peripheral surface of the film tubular body is formed from a sheet-like carrier material having a conductor pattern formed thereon.
Transfer the conductor pattern. The transfer method is not particularly limited. For example, a tubular mold may be used and a film tubular body and a carrier material may be placed on at least one of the inner peripheral surface and the outer peripheral surface of the mold to perform the transfer.

In order to place and transfer the film tubular body and the carrier material on the inner peripheral surface of the tubular mold, first, FIG.
As shown in (a), a tubular inner frame mold 11 is prepared,
As shown in FIG. 5B, a resin coating solution is applied to the inner peripheral surface of the inner frame mold 11 and dried to form the film tubular body 12.

The inner frame mold 11 has a cylindrical shape and is made of metal such as stainless steel. When used as a tubular member of a copying machine or a printer, the inner frame mold 11 has an inner diameter of, for example, 10 to 1000 mmφ. Is done. In addition,
The inner frame mold 11 has an inner peripheral surface used as a mold, and has an inner diameter larger than an outer diameter of an outer frame mold 14 described later.

As described above, the film tubular body 12 is coated with a resin such as a molten resin obtained by melting a resin, a resin solution in which the resin is dissolved, or a precursor solution in which a resin precursor is dissolved. The liquid is applied by a known application method such as a brush application method, a spray method, a spin coating method, a doctor blade method, and the like, and then dried at 50 to 250 ° C. to some extent (not completely) to form an inner frame. What is necessary is just to shape in a tubular shape along the inner peripheral surface of the metal mold | die 11.
At the time of coating, the inner frame mold 1 depends on the coating method.
1 may be rotated to generate a centrifugal force, thereby making the coating film uniform and reducing voids.

Next, as shown in FIG. 5C, the sheet-like carrier material 1 on which the conductor pattern 5 composed of a linear wiring pattern is formed is placed in a state where the conductor pattern 5 faces outward. The conductor pattern 5 is rounded into a cylindrical shape along the inner peripheral surface of the inner frame mold 11, and the conductor pattern 5 is fitted so as to be in contact with the inner peripheral surface of the film tubular body 12. Install.

After that, as shown in FIG.
Transfer to the inner peripheral surface of Although the transfer method is not particularly limited, for example, the transfer may be performed by pressing or heating, and an adhesive layer such as an adhesive or an adhesive sheet may be interposed between the carrier material 1 and the film tubular body 12. You may let it.

In FIG. 5D, pressure transfer is performed by bringing the pressure roller 13 into contact with the inner peripheral surface of the carrier material 1 and rotating it while moving it in the circumferential direction. The pressure roller 13 is preferably formed of an elastic material such as silicone rubber, and the pressing force is preferably, for example, 0.01 to 10 MPa.

Then, as shown in FIG. 6E, only the carrier material 1 is peeled off, and then, as shown in FIG. After the solvent was removed and cured, FIG. 6 (g)
As shown in FIG.

In order to place and transfer the film tubular body and the carrier material on the outer peripheral surface of the tubular mold, first,
As shown in FIG. 7A, a tubular inner frame mold 11 is prepared in the same manner as described above, and as shown in FIG. A resin coating solution is applied to the peripheral surface and dried to form a tubular film tubular body 12.
Then, as shown in FIG. 7 (c), the film-shaped tubular body 12 shaped like a tube is released from the inner frame mold 11.
Incidentally, the film tubular body 12 is provided with an outer frame mold 14 described below.
Is formed as a predetermined diameter that can be installed on the outer peripheral surface of the carrier material 1 installed on the outer peripheral surface of the carrier material.

On the other hand, as shown in FIG. 7D, a tubular outer frame mold 14 is prepared, and a conductor pattern 5 composed of a linear wiring pattern is formed on the outer peripheral surface of the outer frame mold 14. Is formed into a cylindrical shape along the outer peripheral surface of the outer frame mold 14 with the conductor pattern 5 facing outward, and the outer periphery of the outer frame mold 14 is formed. Install on the surface.

The outer frame mold 14 is made of a metal such as aluminum, and its outer peripheral surface is used as a mold. The outer frame mold 14 has a cylindrical shape smaller in diameter than the inner frame mold 11 and is copied. When used as a tubular member of a machine or a printer, for example, the outer diameter is 10 to 1000 mmφ
It is formed as. In addition, the difference between the inner diameter of the inner frame mold 11 and the outer diameter of the outer frame mold 14 is 0.05
It is preferably about 1 mm.

Next, as shown in FIG. 8E, the film tubular body 12 is placed on the outer peripheral surface of the carrier material 1 installed on the outer peripheral surface of the outer frame mold 14 on which the conductor pattern 5 is formed. It is fitted and installed on the outer peripheral surface of the carrier material 1.

Thereafter, as shown in FIG. 8 (f), the conductor pattern 5 is
2 is transferred to the inner peripheral surface. The method of transfer is not particularly limited, for example, transfer may be performed by pressing or heating,
In addition, an adhesive layer such as an adhesive or an adhesive sheet,
It may be interposed between the carrier material 1 and the film tubular body 12. In such transfer, the outer frame mold 14
The outer peripheral surface may be coated with a silicone-based resin or a fluorine-based resin to impart flexibility to the outer peripheral surface, so that the pressing force acts more uniformly.

In FIG. 8F, the layers are laminated by heating and pressing in a predetermined chamber. The heating temperature is, for example, 50 to 250 ° C.
The pressurizing pressure is preferably from 0.01 to 10 MPa.

Further, in such a transfer, the transfer may be performed by utilizing a difference in thermal expansion coefficient between the outer frame mold 14 and the film tubular body 12.

That is, the outer frame mold 14 made of metal is
Since the thermal expansion coefficient is larger than that of the film tubular body 12 made of resin, the carrier material 1 and the film tubular body 1
2 heats the outer frame mold 14 installed on the outer peripheral surface,
The outer frame mold 14 expands more greatly with respect to the film tubular body 12, whereby the carrier material 1 is strongly pressed against the film tubular body 12, so that the conductor formed on the carrier material 1 is formed. The pattern 5 is transferred to the inner peripheral surface of the film tubular body 12 by the pressing force. When the transfer is performed in this manner, the film tubular body 12 and the carrier material 1 can be satisfactorily brought into close contact with each other, and the transfer can be easily and reliably performed. The heating temperature is, for example, 100
To 300 ° C, preferably 150 to 250 ° C.

When the transfer is performed by the difference in the thermal expansion coefficient between the outer frame mold 14 and the film tubular body 12 as described above, the outer frame mold 14 has a thermal expansion coefficient of 1 to 30 ppm /
° C, the coefficient of thermal expansion of the film tubular body 12 is -100 to 1
It is preferably 00 ppm / ° C, and the difference between these is preferably 1 to 125 ppm / ° C. If the difference in thermal expansion coefficient is less than 1 ppm / ° C., a sufficient dimensional expansion difference cannot be obtained, and good transfer may not be achieved. If it exceeds 125 ppm / ° C., the pressure becomes too large. Therefore, the film tubular body 12 may be damaged.

Although not shown, by appropriately selecting a material, the carrier material 1 and the film tubular body 12 are sequentially placed on the inner frame mold 11 in reverse, and the inner frame mold 11 is removed. By contracting, by the pressing force,
The conductor pattern may be transferred to the outer peripheral surface of the film tubular body 12.

Such transfer due to the difference in the coefficient of thermal expansion between the outer frame mold 14 and the film tubular body 12 may be used in combination with the above-described heating and pressurizing in a predetermined chamber. You may do it.

Then, as shown in FIG. 8 (g), after removing the film tubular body 12 from the outer frame mold 14 together with the carrier material 1, the film tubular body 12 is removed from the film tubular body 12 as shown in FIG. The carrier material 1 is peeled off, and then, as shown in FIG. 9 (i), the film tubular body 12 is again fitted on the outer peripheral surface of an outer frame mold 14 made of aluminum or the like, and
By heating at 00 to 450 ° C., the film tubular body 12 is desolvated and cured, and then removed from the outer frame mold 14 as shown in FIG. 9 (j).

The composite tubular body 15 thus formed is
10A, for example, as shown in FIG. 10A, a predetermined conductor pattern 5 is formed as a linear wiring pattern over the entire circumferential surface of the inner peripheral surface of the film tubular body 12. As shown in FIG.
The conductor pattern 5 is embedded in the inner peripheral surface of the film tubular body 12, and the inner peripheral surface is formed as a smooth curved surface without irregularities. Therefore, since there is no step or unevenness due to the thickness of the conductor pattern 5, unevenness in electric field and pressure is small, and unevenness in charge control can be effectively prevented.

Therefore, such a composite tubular body 15
Is a tubular member of an electric or electronic device, more specifically,
It can be suitably used as a tubular member such as a drum member, a belt member, or a roller member provided in a copying machine or a printer, and can form a good image with less image unevenness due to uneven charge control.

When the composite tubular body 15 is manufactured by this method, the conductor pattern 5 is transferred from the carrier material 1 to the film tubular body 12 even though the inner peripheral surface of the composite tubular body 15 is a curved surface. The fine conductor pattern 5 can be formed simply, reliably, and accurately with only a simple process. Therefore, a complicated laser exposure and a work handling mechanism are not required, and the composite tubular body 15 on which the fine conductor pattern 5 is formed can be efficiently produced, and the production efficiency can be improved and the cost can be reduced. In particular, according to this method, the conductor pattern 5 can be easily and reliably formed even on the inner peripheral surface of the composite tubular body 15.

In the manufacturing method shown in FIGS. 5 and 6, and the manufacturing methods shown in FIGS. 7 to 9, the predetermined conductor pattern 5 is formed on the inner peripheral surface of the film tubular body 12.
For example, as shown in FIGS. 11 and 12, a predetermined conductor pattern 5 may be formed on the outer peripheral surface of the film tubular body 12.

First, as shown in FIG. 11A, a tubular inner frame mold 11 similar to the above is prepared, and a dot-shaped matrix pattern is formed on the inner peripheral surface of the inner frame mold 11. The sheet-like carrier material 1 on which the conductor pattern 5 made of is formed is rolled into a cylindrical shape along the inner peripheral surface of the inner frame mold 11 with the conductor pattern 5 facing inward, as shown in FIG. As shown in (b), it is installed on the inner peripheral surface of the inner frame mold 11. Next, as shown in FIG. 11 (c), a resin coating solution is applied to the inner peripheral surface of the carrier material 1 installed on the inner peripheral surface of the inner frame mold 11, and to a certain degree (not complete) at 50 to 250 ° C. 3) By drying, the film tubular body 12 is formed into a tubular shape along the inner peripheral surface of the carrier material 1. During this shaping, the film tubular body 12 is satisfactorily adhered to the conductor pattern 5. Thereafter, as shown in FIG. 11D, the film tubular body 12 is removed from the inner frame mold 11 together with the carrier material 1. Note that the film tubular body 12 is formed to have a predetermined diameter that can be installed on the outer peripheral surface of the outer frame mold 14 described below.

Then, as shown in FIG. 12E, the conductor pattern 5 is transferred to the outer peripheral surface of the film tubular body 12 by peeling the carrier material 1 from the film tubular body 12, and then, as shown in FIG. As shown in FIG. 12), the film tubular body 12 is again fitted on the outer peripheral surface of the outer frame mold 14 and heated at 100 to 450 ° C. as shown in FIG. May be removed from the outer frame mold 14 as shown in FIG. 12 (h).

The composite tubular body 15 thus formed is
13A, for example, as shown in FIG. 13A, a predetermined conductor pattern 5 is formed as a dot matrix pattern over the entire circumferential surface of the outer peripheral surface of the film tubular body 12. As shown in b), the conductor pattern 5 is buried in the outer peripheral surface of the film tubular body 12 by transfer, and the outer peripheral surface is formed as a smooth curved surface without unevenness. Therefore, as described above, despite the inner peripheral surface of the composite tubular body 15 being a curved surface, the fine conductor pattern 5 can be formed by a simple process.
Since it can be formed simply and reliably with high accuracy, and there are no steps or irregularities due to the thickness of the conductor pattern 5,
Electric field unevenness and pressure unevenness are small, and charge control unevenness can be effectively prevented.

The composite tubular body 15 shown in FIG. 13 has a predetermined conductor pattern 5 formed as a dot-shaped matrix pattern on the outer peripheral surface.
As shown in FIG. 14, the predetermined conductor pattern 5 may be formed as a linear wiring pattern on the outer peripheral surface of the composite tubular body 15, similarly to the composite tubular body 15 shown in FIG.

In the method of the present invention, a sheet-like carrier material having a conductor pattern formed thereon may be directly laminated on at least one of the inner peripheral surface and the outer peripheral surface of the tubular film.

As described above, when the layers are laminated as they are,
It is preferable that the sheet-shaped carrier material on which the conductor pattern is formed is laminated so that the conductor pattern comes into contact with at least one of the inner peripheral surface and the outer peripheral surface of the film tubular body.

To laminate a sheet-like carrier material carrying a conductor pattern so that the conductor pattern contacts at least one of the inner peripheral surface and the outer peripheral surface of the tubular film, for example, first, as shown in FIG. As shown in FIG. 15, a tubular inner frame mold 11 is prepared and
(B) As shown in FIG.
After the resin coating solution is applied to the inner peripheral surface of the film and heated to form the film tubular body 12 into a tubular shape, FIG.
As shown in (c), the tubular tubular film body 12 is released from the inner frame mold 11. Note that the film tubular body 12 is formed to have a predetermined diameter that can be installed on the outer peripheral surface of the carrier material 1 installed on the outer peripheral surface of the outer frame mold 14 described below.

On the other hand, separately, as shown in FIG.
Similarly to the above, a tubular outer frame mold 14 is prepared, and a sheet-shaped carrier material 1 having a conductor pattern 5 formed of a linear wiring pattern formed on the outer peripheral surface of the outer frame mold 14 is prepared. In a state where the conductor pattern 5 faces outward, the conductor pattern 5 is rounded into a cylindrical shape along the outer peripheral surface of the outer frame mold 14 and is placed on the outer peripheral surface of the outer frame mold 14.

Next, as shown in FIG. 16 (e), the film tubular body 12 is placed on the outer peripheral surface of the carrier material 1 installed on the outer peripheral surface of the outer frame mold 14 on which the conductor pattern 5 is formed. It is fitted and installed on the outer peripheral surface of the carrier material 1.

Thereafter, as shown in FIG. 16F, the carrier material 1 is laminated in a state where the conductor pattern 5 is in contact with the inner peripheral surface of the film tubular body 12. The lamination method is
Although not particularly limited, for example, lamination may be performed by pressing or heating, and an adhesive layer made of an adhesive, an adhesive sheet, or the like may be interposed between the carrier material 1 and the film tubular body 12. In such a transfer,
By coating the outer peripheral surface of the outer frame mold 14 with a silicone-based resin or a fluorine-based resin and imparting flexibility to the outer peripheral surface, the pressing force can be applied more evenly. Is also good.

In FIG. 16 (f), in a predetermined chamber, an adhesive sheet (not shown) is interposed between the carrier material 1 and the already formed film tubular body 12, and heated and pressed to form a laminate. are doing. The heating temperature is preferably, for example, 100 to 300 ° C., and the pressure is preferably 0.01 to 10 MPa.

The adhesive sheet is not particularly limited, and a known adhesive sheet such as an acrylic adhesive sheet may be used, and its thickness is preferably 10 to 200 μm.

Note that, even in such a lamination, the difference in the thermal expansion coefficient between the outer frame mold 14 and the film tubular body 12 may be used as described above.

Then, as shown in FIG. 16 (g), the film tubular body 12 on which the carrier material 1 is laminated may be removed from the outer frame mold 14 as it is.

The composite tubular body 15 thus formed is
For example, as shown in FIG. 17A, on the inner peripheral surface of the film tubular body 12, the outer peripheral surface of the carrier material 1 is formed of a linear wiring pattern formed on the outer peripheral surface of the carrier material 1. The conductor pattern 5 is laminated so as to be in contact with the entire inner circumferential surface of the film tubular body 12 in the circumferential direction, and as shown in FIG. 12, the inner peripheral surface of the composite tubular body 15 (the inner peripheral surface of the carrier material 1) and the outer peripheral surface (the film tubular body 1).
2 is formed as a smooth curved surface without irregularities. Therefore, since there are no steps or irregularities due to the thickness of the conductor pattern 5, there is little unevenness in electric field and pressure, and
It is possible to effectively prevent uneven charging control. In addition,
In FIG. 17B, the adhesive layer made of the above-mentioned adhesive sheet is omitted, but the conductor pattern 5 may be embedded in the adhesive layer by, for example, lamination.

Therefore, such a composite tubular body 15
Is a tubular member of an electric or electronic device, more specifically,
It can be suitably used as a tubular member such as a drum member, a belt member, or a roller member provided in a copying machine or a printer, and can form a good image with less image unevenness due to uneven charge control.

When the composite tubular body 15 is manufactured by such lamination, the carrier material on which the conductor pattern 5 is formed despite the inner and outer peripheral surfaces of the composite tubular body 15 being curved. 1 for film tubular body 1
The fine conductive pattern 5 can be easily, reliably, and accurately formed by a simple process of simply laminating the conductive pattern 2. Therefore, a complicated laser exposure and a work handling mechanism are not required, and the composite tubular body 15 on which the fine conductor pattern 5 is formed can be efficiently produced, and the production efficiency can be improved and the cost can be reduced.

In the manufacturing method shown in FIG. 15 and FIG. 16, the carrier material 1 is laminated on the inner peripheral surface of the film tubular body 12. For example, as shown in FIG. 18 and FIG. The carrier material 1 may be laminated on the outer peripheral surface.

That is, first, as shown in FIG. 18A, a tubular inner frame mold 11 is prepared in the same manner as described above, and as shown in FIG. After applying a resin coating solution to the inner peripheral surface of the inner frame mold 11 and drying it, the film tubular body 12 is formed into a tubular shape.
As shown in FIG. 8 (c), the film-shaped tubular body 12 formed into a tubular shape is released from the inner frame mold 11. In addition, the film tubular body 12 is formed as a predetermined diameter which can be installed on the outer peripheral surface of the outer frame mold 14 described below.

Thereafter, as shown in FIG. 18 (d), the film tubular body 12 is fitted on the outer peripheral surface of the outer frame mold 14, and as shown in FIG.
Is placed on the outer peripheral surface of the outer frame mold 14.

Next, as shown in FIG. 19 (f), a ribbon-shaped sheet-like sheet in which a conductor pattern 5 consisting of a dot-like matrix pattern is formed on the outer peripheral surface of the film tubular body 12 is formed. The carrier material 1 is placed on the film tubular body 1 with the conductor pattern 5 facing inward.
After being installed by spirally winding along the outer peripheral surface of 2, as shown in FIG. Laminate. The method of lamination is not particularly limited, but may be lamination by pressing or heating, as described above. In FIG. 19 (g), by heating and pressurizing in a predetermined autoclave,
The film tubular body 12 and the carrier material 1 are directly laminated by curing and bonding the shaped film tubular body 12. The heating temperature is, for example, 100 to 450.
It is preferable that the pressure is 0.01 to 10 MPa.

Then, as shown in FIG. 19H, the film tubular body 12 on which the carrier material 1 is laminated may be removed from the outer frame mold 14 as it is.

The composite tubular body 15 thus formed is
For example, as shown in FIG. 20A, the inner peripheral surface of the carrier material 1 is formed on the outer peripheral surface of the film tubular body 12 from a dot-like matrix pattern formed on the inner peripheral surface of the carrier material 1. The conductor pattern 5 is laminated so as to be in contact with the entire outer circumferential surface of the film tubular body 12 in the circumferential direction. Further, as shown in FIG. The inner peripheral surface of the composite tubular body 15 (the inner peripheral surface of the film tubular body 12) and the outer peripheral surface (the outer peripheral surface of the carrier material 1) are formed as smooth curved surfaces without irregularities. ing. Therefore, since there is no step or unevenness due to the thickness of the conductor pattern 5, unevenness in electric field and pressure is small, and unevenness in charge control can be effectively prevented.

In the composite tubular body 15 shown in FIG. 20, the predetermined conductor pattern 5 is formed as a dot matrix pattern. For example, as shown in FIG. It may be formed as a wiring pattern of a shape.

Further, in the composite tubular body 15 shown in FIGS. 20 and 21, the carrier material 1 is laminated so that the conductor pattern 5 is in contact with the inner peripheral surface or the outer peripheral surface of the film tubular body 12. As shown in FIG. 22 and FIG. 23, the carrier material 1 may be laminated so that the conductor pattern 5 does not contact the inner peripheral surface or the outer peripheral surface of the film tubular body 12.

That is, in the composite tubular body 15 shown in FIG. 22, the inner peripheral surface of the carrier material 1 is formed of a linear wiring pattern on the outer peripheral surface of the film tubular body 12 as shown in FIG. The conductor pattern 5 faces outward and is laminated so as not to contact the outer peripheral surface of the film tubular body 12, and as shown in FIG. It is formed so as to protrude from the surface (the outer peripheral surface of the carrier material 1). Thereby, in the composite tubular body 15 shown in FIG. 22, the conductor pattern 5 is formed on the outer peripheral surface of the film tubular body 12 by the carrier material 1.
Is formed through.

In the composite tubular body 15 shown in FIG.
As shown in FIG. 23 (a), the conductor pattern 5 made of a linear wiring pattern is directed inward on the inner peripheral surface of the film tubular body 12 so that the outer peripheral surface of the carrier material 1 faces inward. The conductor pattern 5 is laminated so as not to come into contact with the peripheral surface, and as shown in FIG. It is formed as follows. As a result, in the composite tubular body 15 shown in FIG.

In the composite tubular body 15 described above,
Although the thickness is not particularly limited, for example, in the case of being formed by transfer, the thickness is 50 to 450 μm.
m, and when formed by lamination, the thickness is preferably 20 to 300 μm.

[0098]

EXAMPLE 1 First, a tubular stainless steel inner frame mold having an inner diameter of 60 mmφ was prepared (see FIG. 5A), and carbon black was coated on the inner peripheral surface of the inner frame mold with resin weight. A 10% by weight polycarbonate solution (solvent: methylene chloride, solid content: 20% by weight) was applied and dried at 100 ° C. for 10 minutes to form a film tubular body (FIG. 5).
(B)). In addition, this film tubular body was not completely dried.

Separately, a screen plate on which a linear wiring pattern is formed is placed on the surface of a 50 μm-thick polyethylene terephthalate film (carrier material) coated with a silicone release material (release layer), and a carbon paste is applied with a squeegee (VP-C1 manufactured by Asahi Chemical Laboratory) was printed, and then heated at 150 ° C. for 1 hour to form a conductor pattern having a thickness of 15 μm, a line width of 200 μm, and an interval of 300 μm (see FIG. 4).

Then, the carrier material on which the conductor pattern is formed is rolled into a cylindrical shape along the inner peripheral surface of the inner frame mold with the conductor pattern facing outward, and the conductor pattern is formed into a film tube. It was fitted so as to be in contact with the inner peripheral surface of the body, and set on the inner peripheral surface of the film tubular body 12 (see FIG. 5C).

Thereafter, a pressure roller made of silicone rubber having a diameter of 25 mm is brought into contact with the inner peripheral surface of the carrier material, and is rotated while being moved in the circumferential direction. Press transfer was performed on the peripheral surface (see FIG. 5D). The pressure of the pressure roller was 1 MPa.

Then, only the carrier material is peeled off (FIG. 6).
(E)), then at 100 ° C. for 10 minutes and 15 minutes.
After heating at 0 ° C. for 20 minutes and cooling, the film tubular body was desolvated and cured (FIG. 6F), and then released from the inner frame mold to form a linear wiring pattern. A composite tubular body having an outer diameter of 60 mmφ was obtained (see FIG. 6 (g)).

Example 2 First, a tubular stainless steel inner frame mold having an inner diameter of 100 mmφ was prepared (see FIG. 7A), and carbon black was coated on the inner peripheral surface of the inner frame mold with a resin weight ratio. A polyimide precursor solution (solvent: N-methyl-pyrrolidone, solid content 15% by weight) blended at 25% by weight was applied at 100 ° C.
By drying for 0 minutes, the film tubular body was shaped (see FIG. 7 (b)), and then the tubular shaped film tubular body was released from the inner frame mold (see FIG. 7 (c)). ).
In addition, this film tubular body was not completely dried.

Separately, chromium and copper each having a thickness of 0.1 μm or less were sputter-deposited on the surface of a 50 μm-thick SUS foil (carrier material), and the copper layer was further reduced to a thickness of 1 μm by electrolytic copper plating. On top of this, a photoresist is laminated, and the resist line width 1
After forming a linear wiring pattern having a thickness of 00 μm and an interval of 100 μm, a copper layer having a thickness of 5 μm was further formed on the surface of the copper layer by electrolytic copper plating. Then, after dissolving and removing the photoresist, the surface of the copper layer was flash-etched with an ammonium persulfate solution to form a
A conductor pattern made of copper having a thickness of 3.5 μm was formed (see FIG. 3).

Then, the carrier material on which the conductor pattern is formed is placed on the outer peripheral surface of a separately prepared tubular aluminum outer frame mold having an outer diameter of 99.5 mmφ with the conductor pattern facing outward. It was rolled into a cylindrical shape along the outer peripheral surface of the frame die, and set on the outer peripheral surface of the outer frame die (see FIG. 7D). Next, the film tubular body was fitted on the outer peripheral surface of the carrier material placed on the outer peripheral surface of the outer frame mold where the conductor pattern was formed, and was placed on the outer peripheral surface of the carrier material (FIG. 8E). reference).

Then, the outer frame mold is placed in the chamber for 1 hour.
By pressing at 00 ° C. and 2 MPa for 30 minutes, the conductor pattern of the carrier material was transferred to the inner peripheral surface of the tubular film body (see FIG. 8F), and after cooling, it was released from the outer frame mold ( FIG. 8 (g)). Next, the carrier material was peeled off from the film tubular body (see FIG. 8 (h)), and the film tubular body was fitted again on the outer peripheral surface of a separately prepared tubular aluminum outer frame mold having an outer diameter of 99 mmφ. And 35
By heating at 0 ° C. for 1 hour, the film tubular body is hardened (see FIG. 9 (i)), and then released from the outer frame mold to obtain an inner diameter of 99 mmφ on which a linear wiring pattern is formed. A composite tubular body having a thickness of 80 μm was obtained (FIG. 9).
(See (i)).

Example 3 First, a thin copper foil having a thickness of 3 μm was placed on a 35 mm
A photoresist was laminated on a copper foil with a carrier (MT-35 manufactured by Mitsui Kinzoku Mining Co., Ltd.) laminated on a thick copper foil of μm, and a matrix pattern in which dots of 100 μm in diameter had a pitch of 150 μm was formed by exposure and development. . Next, the exposed copper foil is etched with a hydrogen peroxide / sulfuric acid solution to a depth of 8 μm, and the photoresist is removed with an alkali solution, thereby forming the copper foil (carrier material).
A conductor pattern composed of a dot-like matrix pattern was formed thereon (see FIG. 1).

Next, a tubular stainless steel inner frame mold having an inner diameter of 150 mmφ was prepared (see FIG. 11A), a carrier material was placed on the inner peripheral surface of the inner frame mold, and the conductor pattern was directed inward. In such a state, it was rolled into a cylindrical shape along the inner peripheral surface of the inner frame die, and set on the inner peripheral surface of the inner frame die (FIG. 11B). Thereafter, the same polyimide precursor solution as in Example 2 was applied to the inner peripheral surface of the carrier material placed on the inner peripheral surface of the inner frame mold, heated at 100 ° C. for 1 hour, and dried. Again, the same polyimide precursor solution as in Example 2 was applied and heated at 100 ° C. for 1 hour,
By drying the surface, a tubular film was formed along the inner peripheral surface of the carrier material (FIG. 11).
(C)).

Thereafter, the film tubular body together with the carrier material is removed from the inner frame mold (see FIG. 11D).
By peeling the carrier material from the film tubular body,
The conductor pattern was transferred to the outer peripheral surface of the film tubular body (see FIG. 12 (e)). Thereafter, the film tubular body was fitted again to the outer peripheral surface of a tubular aluminum outer frame mold having an outer diameter of 149 mmφ. By heating at 350 ° C. for 1 hour in a nitrogen atmosphere, the film tubular body is cured (FIG. 1).
2 (f)) and then released from the outer frame mold to obtain a composite tubular body having an inner diameter of 149 mmφ and a thickness of 80 μm on which a dot-shaped matrix pattern was formed (see FIG. 12 (h)). .

Example 4 First, a tubular stainless steel inner frame mold having an inner diameter of 100 mmφ was prepared (see FIG. 15A), and carbon black was coated on the inner peripheral surface of the inner frame mold with a resin weight ratio. 25% by weight
The compounded polyimide precursor solution (pyromellitic dianhydride and 4,4′-diaminodiphenyl ether were mixed with N
-Polymerized in methyl-2-pyrrolidone (solid content 1
5% by weight) and heated at 300 ° C. for 10 minutes (see FIG. 15 (b)), and then released from the inner frame mold (see FIG. 15 (c)) to obtain a film having a thickness of 20 μm. A tubular body was formed.

Separately, a polyimide having a thickness of 25 μm and a thickness of 1
A photoresist (SPG102, manufactured by Asahi Kasei Corporation) made of a dry film resist is thermally laminated on a copper foil of a laminated material (Espanex, manufactured by Nippon Steel Chemical Co., Ltd.) with 8 μm of copper foil. A linear wiring pattern having an interval of 100 μm was formed. Then
Etch the exposed copper foil with ferric chloride solution,
By removing the photoresist, a conductor pattern composed of a linear wiring pattern was formed on the copper foil (carrier material) (see FIG. 1).

Then, a thickness of 35 mm is formed on the conductive pattern.
μm acrylic adhesive sheet (Pilalux, manufactured by DuPont) was thermally laminated at 60 ° C.
5 mmφ tubular aluminum outer frame mold is rolled into a cylindrical shape along the outer surface of the outer frame mold with the conductor pattern facing outward on the outer surface of the outer frame mold. It was set on the surface (see FIG. 15D). Next, the film tubular body was fitted on the outer peripheral surface of the carrier material placed on the outer peripheral surface of the outer frame mold, and placed on the outer peripheral surface of the carrier material (see FIG. 15E).

Then, the outer frame mold is placed in the chamber for 1 hour.
By pressing at 00 ° C. and 2 MPa for 30 minutes, the carrier material and the film tubular body are laminated and pressed via an adhesive sheet (see FIG. 16 (f)), and after cooling, released from the outer frame mold. As a result, a composite tubular body having an inner diameter of 99 mmφ and a thickness of 100 μm on which a linear wiring pattern was formed was obtained (see FIG. 16G).

Example 5 First, a tubular stainless steel inner frame mold having an inner diameter of 150 mmφ was prepared (see FIG. 18A), and carbon black was applied to the inner peripheral surface of the inner frame mold by a resin weight ratio. 25% by weight
The blended polyimide precursor solution (biphenyltetracarboxylic dianhydride and p-phenylenediamine were added to N-
Polymerized in methyl-2-pyrrolidone (solid content 15
%)), Dried at 100 ° C. for 1 hour (see FIG. 18 (b)), and removed from the inner frame mold (see FIG. 18 (c)) to obtain a 50 μm-thick tubular shape. The film tubular body was shaped.

Next, the film tubular body was 149 m in outer diameter.
It was set on the outer peripheral surface of the outer frame die (see FIG. 18 (e)) by fitting it into the outer peripheral surface of a mφ tubular aluminum outer frame die (see FIG. 18 (d)).

Separately, a 3 μm thin copper foil is used as a release layer (release layer).
A polyimide precursor solution (biphenyltetracarbon) in which 25% by weight of carbon black is blended into a copper foil with a carrier (MT-35 manufactured by Mitsui Kinzoku Mining Co., Ltd.) laminated on a 35 μm thick copper foil via a resin An acid dianhydride and p-phenylenediamine polymerized in N-methyl-2-pyrrolidone (solid content 20% by weight) are applied, dried at 150 ° C., and the thick copper foil is removed. ,
A laminated resin film (resin layer thickness: 20 μm) on which a 3 μm-thick copper foil was laminated was formed. After curing the laminated resin film at 250 ° C., a photoresist is laminated on the copper foil in the same manner as in Example 4, and after exposure and development, the copper foil is etched to remove the photoresist. A conductor pattern composed of a matrix pattern in which dots having a diameter of 100 μm were arranged at a pitch of 150 μm was formed on a polyimide (carrier material) (see FIG. 1).

Then, after the obtained sheet-shaped carrier material is cut into a ribbon shape, the conductive pattern is directed inward on the outer peripheral surface of the film tubular body along the outer peripheral surface of the film tubular body. After setting by spirally winding (see FIG. 19 (f)), in an autoclave, under nitrogen atmosphere, under a pressure of 2 MPa, at 350 ° C. for 1 hour.
After heating for a time, the polyimide is cured and adhered (FIG. 19).
(G)), after cooling, the mold was removed from the outer frame mold to form an inner diameter of 149 m in which a dot matrix was formed.
A composite tubular body having mφ and a thickness of 60 μm was obtained (FIG. 19H).
reference).

[0118]

As described above, according to the method for producing a composite tubular body of the present invention, a conductive pattern can be formed from a carrier material into a film even though the inner and outer peripheral surfaces of the composite tubular body are curved. By a simple process of transferring to a tubular body or laminating a carrier material on a film tubular body, a fine conductor pattern can be formed simply, reliably and accurately. Therefore, it is possible to efficiently produce a composite tubular body on which a fine conductor pattern is formed, thereby improving production efficiency and reducing costs. In particular, according to the method of the present invention, since only transfer or lamination is performed, the conductor pattern can be easily and reliably formed even on the inner peripheral surface of the composite tubular body.

The composite tubular body of the present invention is suitable for use as a tubular member of an electric device or an electronic device, more specifically, a tubular member such as a drum member, a belt member or a roller member provided in a copying machine or a printer. Can be used for
Charging control can be performed reliably.

[Brief description of the drawings]

FIG. 1 is an embodiment (subtractive method) showing a step of preparing a sheet-like carrier material on which a conductor pattern is formed in a method for producing a composite tubular body of the present invention, wherein (a) is Preparing a carrier material, (b)
Is a step of laminating a metal thin film on a carrier material, (c)
Is a process of laminating a photoresist on a metal thin film,
(D) shows a step of patterning by exposing and developing the photoresist, (e) shows a step of etching the metal thin film, and (f) shows a step of removing the photoresist.

FIG. 2 is an embodiment (additive method) showing a step of preparing a sheet-like carrier material on which a conductor pattern is formed in the method for producing a composite tubular body of the present invention, wherein (a) is: A step of preparing a carrier material, (b)
Laminating a photoresist on a carrier material, (c)
Is a step of exposing the photoresist through a photomask, (d) is a step of patterning by developing the photoresist, and (e) is a step in which a predetermined conductive pattern is formed by forming a metal thin film on a carrier material. (F) shows a step of removing the photoresist.

FIG. 3 is an embodiment (semi-additive method) showing a step of preparing a sheet-like carrier material on which a conductor pattern is formed in the method for producing a composite tubular body of the present invention, wherein (a) is Preparing a carrier material, (b)
Is a step of depositing a photoresist on the carrier after depositing a foundation on the carrier material, (c) is a step of exposing the photoresist through a photomask, and (d) is developing the photoresist. (E) plating a metal thin film on an exposed base so that a predetermined conductor pattern is formed;
(F) is a step of removing the photoresist, and (g) is a step of removing the photoresist.
4 shows a step of removing a base.

FIG. 4 is an embodiment (screen printing method) showing a step of preparing a sheet-like carrier material on which a conductor pattern is formed in the method for producing a composite tubular body of the present invention, wherein (a) is Preparing a carrier material, (b)
Is a step of printing the conductive paste 9 on the carrier material,
(C) shows a step of forming a metal thin film as a predetermined conductor pattern on a carrier material by heating.

FIG. 5 is an embodiment showing a method for transferring and transferring a film tubular body and a carrier material to the inner peripheral surface of a tubular mold in the method for producing a composite tubular body of the present invention,
(A) is a step of preparing a tubular inner frame die, (b) is
A step of applying a resin coating solution to the inner peripheral surface of the inner frame die to shape the film tubular body, and (c) applying the carrier material to the inner peripheral surface of the inner frame mold in a state where the conductor pattern is in contact with the inner peripheral surface of the film tubular body. , A step of installing on the inner peripheral surface of the film tubular body,
(D) shows a step of transferring the conductor pattern from the carrier material to the inner peripheral surface of the film tubular body by a pressure roller.

FIG. 6 is a diagram illustrating a method for transferring and transferring a film tubular body and a carrier material to the inner peripheral surface of a tubular mold, following FIG. 5; (F) shows a step of removing the solvent and curing the film tubular body, and (g) shows a step of removing the film from the inner frame mold.

FIG. 7 is an embodiment showing a method of transferring and transferring a film tubular body and a carrier material to an outer peripheral surface of a tubular mold in the method for producing a composite tubular body of the present invention,
(A) is a step of preparing a tubular inner frame die, (b) is
A step of applying a resin coating solution to the inner peripheral surface of the inner frame mold to shape the film tubular body, (c) a step of removing the film tubular body from the inner frame mold, and (d) a tubular form 2 shows a step of installing a carrier material on the outer peripheral surface of the outer frame mold in a state where the conductor pattern faces outward.

FIG. 8 is an embodiment showing a method for transferring and transferring a film tubular body and a carrier material to the outer peripheral surface of a tubular mold, following FIG. 7; Installing the carrier pattern on the outer peripheral surface of the outer frame mold on the outer peripheral surface of the carrier material; (f) transferring the conductive pattern from the carrier material to the inner peripheral surface of the film tubular body; (g) Shows a step of releasing the film tubular body from the outer frame mold together with the carrier material, and (h) shows a step of peeling the carrier material from the film tubular body.

FIG. 9 is an embodiment showing a method of transferring and transferring a film tubular body and a carrier material to the outer peripheral surface of a tubular mold, following FIG. 8; By fitting into the outer peripheral surface of the outer frame mold, the film tubular body is
The step of removing the solvent and curing, (j) shows the step of removing the mold from the outer frame mold.

FIG. 10 is an embodiment of the composite tubular body of the present invention (an embodiment in which a conductor pattern composed of a linear wiring pattern is formed on the inner peripheral surface of the film tubular body),
FIG. 3B is a perspective view of the composite tubular body, and FIG.

FIG. 11 is an embodiment showing a method for forming a predetermined conductor pattern on the outer peripheral surface of a film tubular body in the method for producing a composite tubular body of the present invention. Rounding in a state where is facing inward,
(B) is a step of installing a carrier material on the inner peripheral surface of the inner frame mold in a state where the conductor pattern faces inward, (c).
Is a step of applying a resin coating solution to the inner peripheral surface of the carrier material provided on the inner peripheral surface of the inner frame mold to form a film tubular body, and (d) is a step of forming the film tubular body together with the carrier material. 4 shows a step of releasing from a frame mold.

FIG. 12 is a view showing a method for forming a predetermined conductor pattern on the outer peripheral surface of the film tubular body, following FIG. 11, in which (e) is a step of peeling a carrier material from the film tubular body; (F) is a step of fitting the film tubular body to the outer peripheral surface of the outer frame mold, (g) is a step of removing the solvent and curing the film tubular body, and (h) is removing the film tubular body from the outer frame mold. The steps of molding are shown.

FIG. 13 is an embodiment of the composite tubular body of the present invention (an embodiment in which a conductor pattern composed of a dot-like matrix pattern is formed on the outer peripheral surface of the film tubular body), wherein (a) is a composite tubular body. FIG. 3B is a perspective view of the body, and FIG.

FIG. 14 is an embodiment of the composite tubular body of the present invention (an embodiment in which a conductor pattern composed of a linear wiring pattern is formed on the outer peripheral surface of the film tubular body),
FIG. 3B is a perspective view of the composite tubular body, and FIG.

FIG. 15 is an embodiment showing a method of laminating a carrier material in a state where a conductor pattern is in contact with the inner peripheral surface of a film tubular body in the method for producing a composite tubular body of the present invention. Preparing a tubular inner frame mold, (b)
Is a step of applying a resin coating solution to the inner peripheral surface of the inner frame mold to form a film tubular body into a tubular form, (c) is a step of removing the film tubular body from the inner frame mold, and (d). Shows a step of installing a carrier material on the outer peripheral surface of the outer frame mold in a state where the conductor pattern faces outward.

FIG. 16 is an embodiment showing a method of laminating a carrier material in a state where a conductor pattern is in contact with the inner peripheral surface of the film tubular body, following FIG. 15; Installing the carrier material on the outer peripheral surface of the outer frame die, and (f) laminating the carrier material in a state where the conductor pattern is in contact with the inner peripheral surface of the film tubular body. Step (g) shows a step of releasing the film tubular body on which the carrier material is laminated from the outer frame mold as it is.

FIG. 17 is an embodiment of the composite tubular body of the present invention (an embodiment in which a carrier material is laminated in a state where a conductor pattern composed of a linear wiring pattern is in contact with the inner peripheral surface of the film tubular body). (A) is a perspective view of a composite tubular body,
(B) is a sectional plan view of a main part.

FIG. 18 is an embodiment showing a method of laminating a carrier material in a state where a conductor pattern is in contact with the outer peripheral surface of a film tubular body in the method for producing a composite tubular body of the present invention. A step of preparing a tubular inner frame mold, (b)
Is a step of applying a resin coating solution to the inner peripheral surface of the inner frame mold to shape the film tubular body into a tubular shape, (c) a step of removing the film tubular body from the inner frame mold, (d) ) Is a step of fitting the film tubular body to the outer peripheral surface of the outer frame mold;

FIG. 19 is a view showing a method for laminating a carrier material in a state where the conductor pattern is in contact with the outer peripheral surface of the film tubular body, following FIG. 18; A process of installing on the outer peripheral surface of the outer frame mold,
(F) is a step of installing a carrier material on the outer peripheral surface of the film tubular body by winding the conductor pattern in an inward state, and (g) is a step of placing the carrier material on the outer surface of the film tubular body. The step of laminating in a state of being in contact with the outer peripheral surface, and (h) shows the step of removing the film tubular body on which the carrier material is laminated from the outer frame mold as it is.

FIG. 20 is an embodiment of the composite tubular body of the present invention (an embodiment in which a carrier material is laminated in a state where a conductor pattern composed of a dot-shaped matrix pattern is in contact with the outer peripheral surface of the film tubular body), (A) is a perspective view of a composite tubular body, (b) is a principal part plan sectional view.

FIG. 21 is an embodiment of the composite tubular body of the present invention (an embodiment in which a carrier material is laminated in a state where a conductor pattern formed of a linear wiring pattern is in contact with the outer peripheral surface of the film tubular body); (A) is a perspective view of a composite tubular body,
(B) is a sectional plan view of a main part.

FIG. 22 is an embodiment of the composite tubular body of the present invention (an embodiment in which a conductor pattern made of a linear wiring pattern is laminated on the outer peripheral surface of the film tubular body in a state of protruding outward). (A) is a perspective view of a composite tubular body,
(B) is a sectional plan view of a main part.

FIG. 23 is an embodiment of the composite tubular body of the present invention (an embodiment in which a conductor pattern composed of a linear wiring pattern is laminated on the inner peripheral surface of the film tubular body in a state of protruding inward). (A) is a perspective view of a composite tubular body,
(B) is a sectional plan view of a main part.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Carrier material 5 Conductor pattern 11 Inner-frame mold 12 Film tubular body 14 Outer-frame mold 15 Composite tubular body

 ──────────────────────────────────────────────────の Continuing on the front page (72) Kazuo Ouchi 1-2-1 Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation F-term (reference) 2H035 CA05 CB02 CB06 5E338 AA05 AA12 BB51 EE21 EE31 5E343 AA01 AA03 AA12 AA33 BB02 BB24 DD56 DD62 DD76 ER52 GG06 GG11 GG20

Claims (8)

[Claims] 1. A method for producing a composite tubular body in which a predetermined conductor pattern is formed on at least one of an inner peripheral surface and an outer peripheral surface of a film tubular body, the sheet-like sheet having the conductor pattern formed thereon. A method for manufacturing a composite tubular body, comprising preparing a carrier material and transferring the conductive pattern from the carrier material to at least one of an inner peripheral surface and an outer peripheral surface of the film tubular body. 2. A method for manufacturing a composite tubular body, wherein a predetermined conductor pattern is formed on at least one of an inner peripheral surface and an outer peripheral surface of a film tubular body, the sheet-like sheet having the conductor pattern formed thereon. A carrier material is prepared, and the film tubular body and the carrier material are installed on at least one of the inner peripheral surface and the outer peripheral surface of the tubular mold. The inner peripheral surface and the outer periphery of the film tubular body are formed from the carrier material. A method for producing a composite tubular body, comprising transferring the conductor pattern to at least one of the surfaces. 3. The method for producing a composite tubular body according to claim 1, wherein the surface of the composite tubular body on which the conductor pattern is transferred is transferred so as to be substantially smooth. . 4. A method for producing a composite tubular body, wherein a predetermined conductor pattern is formed on at least one of an inner peripheral surface and an outer peripheral surface of a film tubular body, the sheet-like sheet having the conductor pattern formed thereon. A method for producing a composite tubular body, comprising: preparing a carrier material; and laminating the carrier material on at least one of an inner peripheral surface and an outer peripheral surface of the film tubular body. 5. A method for producing a composite tubular body in which a predetermined conductor pattern is formed on at least one of an inner peripheral surface and an outer peripheral surface of a film tubular body, the sheet-like sheet having the conductor pattern formed thereon. A carrier material is prepared, the film tubular body and the carrier material are installed on at least one of the inner peripheral surface and the outer peripheral surface of a tubular mold, and the carrier material is provided on the inner peripheral surface of the film tubular body and A method for producing a composite tubular body, comprising laminating on at least one of the outer peripheral surfaces. 6. The carrier material according to claim 4, wherein the carrier material is laminated such that the conductor pattern contacts at least one of an inner peripheral surface and an outer peripheral surface of the film tubular body. A method for producing a composite tubular body. 7. The method according to claim 2, wherein there is a difference in thermal expansion coefficient between the mold and the film tubular body.
Or the manufacturing method of the composite tubular body as described in 5. 8. A composite tubular body produced by the method for producing a composite tubular body according to any one of claims 1 to 7.