JP2011104856A - Thin film pattern forming method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable forming of a fine thin film pattern for a conventionally difficult-to-pattern forming material. <P>SOLUTION: A forming method of thin film pattern which consists of a printing area with a thin film and a non-printing area without a thin film, includes: a step for coating a resist on a resist releasable film; a step for preliminarily drying the resist to make a dried resist film; a step in which the non-printing area pattern is made a recessed part and the printing area pattern is made a protrusion, is pressed against the predried resist film and then pulled away, and thereby the predried resist film of the printing area pattern is transferred to the protrusion of the letterpress; a step for transferring the non-printing area pattern consisting of the predried resist film left on the resist releasable film on the surface of the base material to be printed to form the non-printing area pattern; a step for forming the thin film of a thin film material on the surface of the base material to be printed in which the non-printing area pattern is formed; and a step which exfoliates the thin film and the resist of the non-printing area pattern. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a thin film pattern forming method for forming a high definition pattern of a thin film on a substrate.

  In recent years, there are very many products around us using thin film generation technology. For example, if you take a computer as an example, not only the central processing unit, but also the memory, liquid crystal display, and hard disk drive are all full of technology.

  Among these techniques, a technique for patterning a thin film with high definition is one of the techniques required in every field, and various methods have been developed.

  For example, when a liquid is deposited to form a thin film pattern on the order of several μm, a photolithography method, an ink jet method, a reverse printing method, or the like is often used. In particular, the reversal printing method does not require large steps such as development / exposure, is very simple and low cost, and can also achieve high definition (Patent Document 1).

  At present, for this reversal printing method, a printing method has been proposed in which a peelable film is supplied from a take-up roll in place of a conventional blanket made of silicone rubber or silicone resin, and the peelable film is used instead of the blanket. (Patent Document 2). According to this printing method, the peelable film can be sequentially sent out and used, so that it is possible to ensure the stability of transfer with little influence of the residual solvent.

  In addition, since the peelable film is optically transparent, the image pattern and alignment mark on the substrate to be printed can be confirmed through the image pattern and alignment mark remaining on the peelable film surface. It is easy to accurately align the position, and it is possible to form a high-definition pattern with high reproducibility.

  As described above, the reversal printing method is an excellent method as a technique for patterning a thin film with high definition, but a high-definition pattern cannot be obtained with all the materials used for pattern formation. Depending on the physical properties of the material to be used for pattern formation, many problems may occur in the transfer process such that the non-pattern part is not removed at all in the process of removing the non-pattern part in the reverse printing method. Of course, materials other than liquid, such as metal thin films, cannot be directly patterned by reverse printing.

JP-A-11-198337 JP 2009-96073 A

  As described above, although the reversal printing method is simple, low-cost, and high-definition as a thin film patterning technology, there is a drawback that the materials that can be patterned are limited, so the selectivity of the material used for pattern formation is very high. As a result, the properties of the printed matter are limited, which leads to hindering development as a thin film patterning technique. An object of the present invention is to make it possible to form a thin film pattern even with a thin film material that has been difficult in the past.

In order to achieve the above-mentioned object in the present invention, the invention according to claim 1 is a method for forming a thin film pattern comprising a thin film image area and a non-image area without a thin film on a substrate to be printed. And
At least a step of applying a resist on the resist peelable film;
Pre-drying the resist to form a pre-dried resist film;
The pre-dried resist film of the image-line part pattern is separated from the relief plate by pressing the non-image-line part pattern as a concave part and pressing the relief plate with the image-line part pattern as a convex part against the pre-dry resist film. A step of transferring to the convex portion of
Transferring the non-image portion pattern consisting of the pre-dried resist film left on the resist peelable film onto the surface of the substrate to be printed to form the non-image portion pattern;
Forming a thin film on the surface of the substrate to be printed on which the non-image area pattern is formed; and
A method of forming a thin film pattern, comprising a step of peeling the resist from the thin film of the non-image portion pattern.

  The invention according to claim 2 is that the step of peeling the resist is performed by peeling the adhesive film on the non-image area pattern on the surface of the substrate to be printed, and then peeling it. The thin film pattern forming method according to claim 1, wherein the thin film pattern is formed.

  In the invention according to claim 3, the adhesion between the resist and the substrate to be printed is weak enough that the resist is peeled off from the substrate to be printed by peeling off the adhesive film after bonding the adhesive film, and The thin film pattern forming method according to claim 2, wherein the thin film pattern forming method is weaker than an adhesion force between the resist and the thin film material.

  Since the present invention has the above features, the following effects are obtained.

  That is, according to the first aspect of the present invention, if a high-definition pattern of a resist can be formed, it is possible to easily form a pattern using various thin film materials by utilizing the patterning accuracy. At this time, it is not necessary to directly pattern the thin film material to be patterned, and it is sufficient if a solid pattern thin film can be formed. Therefore, various material types can be selected. Furthermore, a reduction in level difference can be expected. In addition, even when forming a thin film metal pattern, etc., by forming a thin film by vapor deposition or sputtering, and using a non-image area pattern formed by reverse printing, thin film metal pattern formation using conventional photolithographic methods Compared with, high-definition and removal of large-scale processes such as exposure and development are possible at a low cost.

  Further, according to the second aspect of the present invention, the non-image portion pattern can be easily removed without using a large-scale apparatus or a solvent since it is performed by laminating and peeling with an adhesive film. Further, even if a resist or a metal film adheres to the side wall of the non-image portion pattern, it can be peeled without any problem. Therefore, when forming the non-image portion pattern, it is not necessary to be particular about the shape.

  According to the third aspect of the present invention, the adhesion between the resist and the substrate is weak enough to be peeled off from the substrate by lamination / peeling with an adhesive film, and more than the adhesion between the resist and the material forming the thin film pattern. Since it is weak, only the non-image area pattern is peeled off from the substrate by laminating and peeling off the slightly adhesive film, and the resist can be easily removed.

  Therefore, according to the printing method of the present invention, various types of materials can be patterned on the substrate with high definition. Therefore, a color filter, an organic EL, a gate electrode, and the like, which are electronics members, can be manufactured.

It is a schematic diagram explaining the implementation apparatus structure of an example of the thin film pattern formation method of this invention. It is sectional drawing explaining an example of the thin film pattern formation method of this invention.

  Examples of the substrate to be printed used in the present invention include polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, cycloolefin polymer, polyimide, nylon, aramid, polycarbonate, polymethyl methacrylate, polyvinyl chloride, and triacetyl cellulose. Can be used. Furthermore, by using a light-transmitting substrate to be printed, alignment can be facilitated when the patterns are superimposed. These substrates to be printed are supplied by a long winding roll.

  The substrate used for the resist peelable film can be selected from the same films as the substrate to be printed. It is necessary to apply a release agent represented by silicone oil and silicone varnish to the substrate. A thin film layer of silicone rubber may be formed as a release agent. For the same purpose, fluorine resin and fluorine rubber can also be used, or the fluororesin fine powder may be mixed with silicone rubber or ordinary rubber to give peelability. These silicone-based coatings usually have low adhesion to the film substrate, but thermosetting or UV-curable acrylic resins and epoxy resins that have high adhesion to the substrate from the bottom of the silicone layer on the outermost surface. Such a resin layer can be improved by providing the anchor layer on the substrate in advance.

  It is desirable that both have appropriate resist acceptability and at the same time have complete resist stripping ability of the resist once received.

  Specifically, as silicone, those having various molecular weights of dimethylpolysiloxane, other methylhydrogen polysiloxane, methylphenyl silicone oil, methyl chlorinated phenyl silicone oil, or a copolymer of these polysiloxane and organic compound, Denatured ones can be used.

  Silicone rubber is a combination of two-component diorganopolysiloxane and a trifunctional or higher functional silane as a crosslinking agent, or a combination of siloxane and a curing catalyst. Combinations of silane, methyltriacetoxysilane, and the like are used, and other polysiloxanes for adjusting rubber hardness are appropriately used.

  Moreover, after providing an inorganic film | membrane to the said base material as a resist peelable film used for this invention, what gave the surface treatment by a silane coupling agent can also be used.

  As the silane coupling agent, trimethoxysilanes, triethoxysilanes, and the like can be used. One part of this silane coupling agent can be selected from those having a reactive group with an organic compound such as a vinyl group, an epoxy group, an amino group, a methacryl group, a mercapto group, or an alkyl group or a part thereof. Those in which fluorine atoms are substituted and those in which siloxane is bonded and bonded to a substituent capable of forming a surface having a small surface free energy can be used.

When the former silane coupling agent having a reactive group is used, the surface of the substrate is treated with the silane coupling agent, and then another monomer component is applied so as to obtain a predetermined surface free energy. Can be made. Examples of the silane coupling agent having a reactive group include vinyl methoxy silane, vinyl ethoxy silane, p-styryl trimethoxy silane, 3-glycidoxy propyl trimethoxy silane, 2- (3,4 epoxy cyclohexyl) ethyl trimethoxy silane. , 3-methacryloxypropylmethyldiethoxysilane, 3-acryloxypropyltrimethoxysilane, etc., and styrene, ethylene glycol diglycidyl ether, trimethylpropane triglycidyl ether, lauryl acrylate, dipentaerythritol hexa Acrylate or the like can be used.

  As the silane coupling agent having no reactive group, methyltrimethoxysilane, n-hexyltrimethoxysilane, n-octyltrimethoxysilane, dodecyltrimethoxysilane and the like can be used. However, it is not limited to an alkyl group.

  As a method for immobilizing the silane coupling agent on the substrate, a conventional surface treatment method can be used. For example, a solution obtained by diluting a silane coupling agent in water, an acetic acid aqueous solution, a water-alcohol mixed solution, or an alcohol solution is prepared. The silane coupling agent can be fixed by coating the solution on the surface of the substrate using a known coating method such as a gravure coater, a roll coater, a die coater, and the like, followed by drying. When a silane coupling agent having a reactive group is used, other monomer components can then be applied and bonded in the same manner.

In order to immobilize the silane coupling agent on the substrate, it is preferable that SiO ₂ , TiO ₂ , ZrO ₂ or a composite film thereof is provided on the substrate in advance. As these inorganic oxide films, those provided by using a known vapor deposition method or sputtering method can be used.

In addition, as a method of providing the inorganic oxide film, a metal alkoxide represented by the general formula M (OR) n (M is a metal such as Si, Ti, Al, Zr, R is an alkyl such as CH ₃ or C ₂ H ₅₎ It is possible to use a so-called sol-gel method in which an inorganic oxide film is formed by coating a gel solution obtained by hydrolyzing and condensation polymerization in the presence of water and alcohol on the surface and then heating. it can.

  Furthermore, the silane coupling agent can be added in advance to the metal alkoxide solution used in the sol-gel method. In this case, an effect is particularly obtained for surface property modification.

  Evaluation of resist peelability for the resist peelable film thus obtained is preferably such that the contact angle when dropping the resist on the treated surface is 10 ° or more and 90 ° or less, using the contact angle as a scale. More preferably, it is 20 ° or more and 70 ° or less. If this contact angle is small, resist releasability in the subsequent process is lowered, and pattern defects (such as protrusion, bridge, or reproducibility failure) are likely to occur. If the contact angle is large, a resist liquid film is formed. A repellency will occur.

  As a method of forming a resist liquid film on the resist peelable film described above, a known coating method can be used depending on the viscosity of the resist liquid and the drying property of the solvent. That is, for example, dipping method, roll coating, gravure coating, reverse coating, air knife coating, comma coating, die coating, screen printing method, spray coating, gravure offset method and the like can be mentioned. Among them, a die coating, a cap coating, a roll coating, and an applicator can form a uniform resist liquid film for a resist having a wide range of viscosity.

  After forming a resist liquid film on the resist peelable film by the above method, the resist liquid film is pre-dried. For this preliminary drying, natural drying, cold / hot air drying, microwave irradiation, infrared irradiation, reduced pressure drying, etc. can be used, and radiation such as ultraviolet rays and electron beams can also be used.

  The purpose of this preliminary drying is to increase the viscosity, thixotropy and brittleness of the resist solution film. When drying by preliminary drying is insufficient, the resist liquid film is torn and a defect occurs when the convex part of the relief printing plate in the subsequent process is pressed and peeled off. On the contrary, when the drying is excessive, the tackiness of the resist liquid film surface is lost, and the resist is not transferred to the relief plate. Therefore, although the dry state is adjusted by the drying time and the atmospheric temperature depending on the composition of the resist used, a state in which 0.5 to 4% by weight of the solvent remains in the dried resist film is preferable.

  Because the residual amount of solvent on the order of ppm called so-called dry film is too dry, there is a problem that the resist is not transferred, and there is a problem that the resist film partially peels off due to pressing of the plate, causing dust. It is not suitable as a condition for the pre-dried resist film.

  As a letterpress plate, a photosensitive resin is applied to the surface of a low expansion glass such as alkali-free glass, a pattern is formed by mask exposure and development, and then 2 μm using an existing dry etching process, wet etching process, or sand blasting process. To a plate depth of 30 μm can be used.

  Moreover, what consists of nylon, an acryl, a silicone resin, a styrene-diene copolymer etc. can also be used for a letterpress. Also, rubber plates such as ethylene-propylene, butyl, and urethane rubbers can be used. Such resin-made relief plates have already been used for relief printing and flexographic printing, and can be produced by pouring a predetermined resin into a previously produced mold or engraving. A method using a resin can be manufactured with higher accuracy.

  The material of the resist solution is determined from the contact angle with the resist peelable film described above, the drying property of the resist solution, the adhesion between the substrate to be printed and the target material for pattern formation, the pattern transfer property, and the like. In particular, the adhesion between the substrate to be printed and the target material for pattern formation is an important factor in the printing method of the present invention.

  When the adhesive film is bonded and then peeled off to remove the resist, the non-image portion pattern cannot be peeled from the substrate if the adhesive force with the substrate to be printed is strong. Therefore, it is better that the adhesion between the substrate to be printed and the resist is weak. When the adhesion between the substrate to be printed and the resist is strong, and the adhesion between the thin film and the resist is weaker than the adhesion between the substrate to be printed and the resist, the adhesive film is pasted and then peeled off to remove the resist In addition, instead of peeling from the resist, only the thin film is peeled off from the substrate to be printed.

  In addition to the method of peeling after bonding the adhesive film, it is possible to peel with water or a solvent by using a soluble resist as the material of the resist liquid film, which is simpler.

Next, when a target material is applied by depositing a liquid on a substrate to be printed on which a non-image area pattern of resist is formed, for example, dipping, roll coating, gravure coating, reverse coating, air knife coating , Comma coating, die coating, screen printing, spray coating, gravure offset, and the like can be used. It is appropriately selected and used according to the viscosity of the material to be used, the target coating film thickness, and the like.

  In addition, when a target material is applied by a vapor phase method, for example, when a thin film metal or the like is formed, an evaporation method, a sputtering method, or a chemical vapor deposition method can be used.

  Below, an example for carrying out the transfer of a precision pattern using these materials will be described.

  In the thin film pattern forming method according to the present embodiment, a resist solution is applied to a resist peelable film, and a relief plate whose convex portion pattern is an image portion pattern is pressed against a pre-dried resist film obtained by pre-drying the resist solution. By pulling apart, the unnecessary pattern of the pre-dried resist film is transferred and removed to the convex part of the plate, and the non-image part pattern remaining on the resist peelable film is transferred to the substrate to be printed. Form. Thereafter, the material for which the thin film pattern is to be formed is uniformly applied in a solid pattern to the substrate to be printed on which the non-image portion pattern is formed. Finally, the resist is removed by laminating and peeling the substrate to be printed and the adhesive film to obtain a thin film pattern.

  Next, an example of the thin film pattern forming method according to the present invention will be described along with a patterning step that is actually performed when a film is used as a substrate to be printed.

  As shown in FIG. 1, an apparatus for performing a thin film pattern forming method according to the present invention is an apparatus for controlling and processing a resist peelable film 106, a substrate to be printed 115, and an adhesive film 121, and a resist peelable film. Conveying system and resist of unwinding section 107, resist peelable film winding section 108, printed substrate unwinding section 116, printed substrate winding section 117, adhesive film unwinding section 122, and adhesive film winding section 123 Coating unit 101, resist drying unit 102, pattern removal unit 103, alignment unit 104, laminating / peeling unit 105, printed substrate drying unit 111, thin film material coating unit 112, thin film material drying unit 113, adhesive film laminate The unit 114 is configured.

  Resist releasable film unwinding part 107, resist releasable film rewinding part 108, printed substrate unwinding part 113, printed substrate unwinding part 114, adhesive film unwinding part 122, adhesive film rewinding part 123, etc. The transport unit includes a motor for transporting a film such as a resist peelable film or a substrate to be printed by controlling rotation and tension. The original film width of the film to be mounted can be selected from 100 mm to 1000 mm, but is selected in consideration of the practicality of the pattern and the transfer position accuracy.

  In addition to these devices, the tension of the film can be adjusted by installing a nip portion in the transport system and holding the film. As the nip portion, an adsorption nip formed mainly by air adsorption holes provided in the transport roll is used.

  In the case of transporting, the time difference required in each process is alleviated, and when a buffer for continuously transporting the film is provided, continuous transport can be performed. It is preferable to carry the necessary length for each process.

  The resist coating unit 101 is provided with a movable stage and a coating apparatus that applies a resist to the resist peelable film 106 provided on the movable stage. The movable stage can be driven by a ball screw, a linear motor, etc., and can be made of metal, stone, etc., but can reciprocate while maintaining at least the horizontal direction, It is desirable that the resist strippable film 106 can be adsorbed. In order to prevent unevenness of the surface due to adsorption, a method of providing adsorption holes only near the edge of the film or a method of using an adsorption surface using a porous material can be selected.

  The coating apparatus will be described with respect to a die type which is excellent in continuous processing and film thickness uniformity, but is not limited thereto. A predetermined amount of resist solution can be supplied to the die head from a resist supply pump prepared separately. The gap between the die head and the resist peelable film 106 may be set before the start of printing, or may be adjusted by moving the die head up and down in accordance with the conveyance of the movable stage.

  The resist drying unit 102 is installed to dry the resist coated on the resist peelable film 106 in the resist coating unit 101, and is a hot plate, oven, hot air, vacuum drying, infrared irradiation, ultraviolet irradiation. You may provide drying apparatuses, such as.

  The pattern removing unit 103 has a resin or glass relief plate attached to the movable stage by suction. After the resist coating surface on the resist peelable film 106 is brought close to the relief plate, a roller provided on the stage is moved. The resist peelable film 106 is pressed from above, applied with printing pressure while being rotated, and the resist peelable film 106 is peeled off from the relief printing plate, thereby transferring the coating film in contact with the convex portion of the relief printing plate to the relief release. The coating film in contact with the convex part of the relief plate is removed from the adhesive film.

  At this time, materials such as rubber, metal, and plastic can be used as the material for the outer periphery of the roller. In particular, rubber has plastic properties and is an individual, but its properties are close to liquids and can be applied equally. Specific types of rubber include urethane rubber specialized in mechanical properties and silicone rubber excellent in rubber elasticity in a wide temperature range. Further, as the curvature of the roller, it is desirable to use a roller having a small curvature so as not to contact the bottom of the relief plate to be used.

  The alignment unit 104 includes a movable stage and a plurality of microscope cameras. The pre-dried resist film surface on the resist-peelable film 106 is 100 to 250 μm on the printing substrate 115 adsorbed on the movable stage. Then, utilizing the fact that the resist strippable film is transparent, a part of the pattern obtained on the resist strippable film 106, the alignment mark pattern, and the pattern on the substrate to be printed 115 are transmitted. The transfer position can be corrected by operating the movable stage based on the images recognized by the images and the respective patterns recognized.

  Further, a microscope camera is inserted between the resist peelable film 106 and the substrate to be printed 115, and the position is corrected based on the images in which the respective patterns on the resist peelable film 106 and the substrate to be printed 115 are recognized. You can also choose a method.

  The above-mentioned microscope camera may be either an optical microscope or a CCD (Charge Coupled Device) microscope, but requires the function of either an autofocus or an electrically controllable manual focus control mechanism, or both, Assume that an interface is provided for outputting to an external monitor or an image processing apparatus for position correction in order to observe the acquired image.

  The laminating / peeling unit 105 is provided with a roller on a movable stage installed in the alignment unit 104. As with the pattern removing unit 103, materials such as rubber, metal, and plastic can be used as the material on the outer periphery of the roller. At this time, it is desirable to use a roller having a large curvature so as to follow the unevenness of the minute resist film.

From the substrate 115 to be printed fixed to the movable stage installed in the bonding / peeling part 105 and the resist peelable film 106 installed with a slight gap, the bonding / peeling part is also the same. A non-image portion pattern is applied by pressing a roller installed in 105, applying a printing pressure while rotating the roller along with the movement of the movable stage, and then peeling the resist-removable film 106 from the printing substrate 115. It can be transferred onto the printing substrate 115.

  The printing substrate drying unit 111 is installed to dry the non-image portion pattern of the resist transferred onto the printing substrate 115. The hot plate, oven, hot air, vacuum drying, infrared irradiation It is possible to provide a drying device such as ultraviolet irradiation.

  Thereafter, a material for forming a thin film pattern is applied on the substrate to be printed 115 on which the non-image portion pattern is applied by the thin film material coating unit 112. What is necessary is just to determine suitably as a coating method according to the material to be used.

  The thin film material drying unit 113 is used when it is necessary to dry the material applied to the resist peelable film 106 by the thin film material coating unit 112. The hot plate, oven, hot air, vacuum drying, infrared rays You may provide drying apparatuses, such as irradiation and ultraviolet irradiation.

  The adhesive film laminating unit 114 is installed to peel off after the substrate to be printed 115 and the adhesive film 121 are bonded together. In this step, the thin film and resist in the non-image portion pattern portion printed on the substrate to be printed are removed. Moreover, regarding the method of removing the resist, the method of peeling after bonding with the adhesive film has been described, but the method is not limited thereto.

  FIG. 2 shows as a model diagram how a thin film pattern on a substrate to be printed 115 is formed by an example of a thin film pattern forming method according to the present invention.

  In FIG. 2A, a resist is applied onto the resist-peelable film 106 and pre-dried to form a pre-dried resist film 201. Then, in the pattern removing unit 103, a non-image portion pattern is formed as a concave portion. A relief plate having a line part pattern as a convex part is pressed against the pre-dried resist film 201 and then separated to transfer the pre-dried resist film 201 of the image line part pattern to the convex part of the relief plate. The non-image portion pattern made of the pre-dried resist film 201 is provided on 106.

  FIG. 2 (B) shows the non-image portion pattern made of the preliminary dry resist film 201 left on the resist peelable film 106 on the surface of the substrate to be printed 115 in the bonding / peeling portion 105. It represents the state of being transferred to.

  FIG. 2C shows a state in which the non-image portion pattern made of the pre-dried resist film 201 is transferred onto the surface of the substrate to be printed 115.

  FIG. 2 (D) shows a case where the substrate to be printed 115 to which the non-image portion pattern composed of the preliminary dried resist film 201 is transferred is dried and the preliminary dried resist film 201 is dried in the printed substrate drying unit. A state in which a thin film is formed by the thin film material 202 on the surface of the dry resist film 203 and the image portion pattern portion is shown.

  FIG. 2E shows a state in which the adhesive film 121 is bonded to the thin film surface in the adhesive film laminating unit 114.

In FIG. 2F, by peeling off the adhesive film 121, the dry resist film 203 having a non-image area pattern and the thin film material 202 on the dry resist film 203 are peeled off from the substrate 115 to be printed. It shows that an image portion pattern is formed by the thin film material 202 above.

  According to the thin film pattern forming method of the present invention, a thin film pattern is formed on the substrate to be printed 115 as described above.

  A high-definition thin film pattern of the ITO film was formed by the thin film pattern forming method of the present invention. The pattern to be formed is a stripe pattern having a film thickness of 100 nm and a line width of about 3 to 5 μm.

Regarding the resist, a black resist for a color filter was used.
[Resist composition]
Polyimide precursor Toray Industries, Inc .: Semicofine SP-510 10 parts by weight Black pigment carbon black 7.5 parts by weight Solvent N-methyl-2-pyrrolidone (NMP) 130 parts by weight Dispersant Copper phthalocyanine derivative 5 parts by weight Part / Leveling Agent BYK MY JAPAN Co., Ltd .: BYK333 0.5 part by weight A light-transmissive heat-resistant film substrate having a film thickness of 120 μm was prepared as a substrate to be printed.

  The resist peelable film used was a polyethylene terephthalate coated with a peelable silicone rubber having a thickness of 10 μm and dried.

  The adhesive film used when peeling the non-image area part pattern was a film obtained by applying a rubber adhesive to the cellophane of the base material.

  Using each of the above films, a thin film pattern was formed using the above-described apparatus. Here, thin film material coating was performed with a sputtering apparatus.

  First, the resist was coated on the resist peelable film on the stage of the resist coating part with a thickness of 1.0 μm.

  The resist peelable film after coating is dried by passing through an infrared furnace at 60 ° C. while adjusting the transport speed, and transported until the coating section is placed on the pattern removal section stage.

  The resist coating part of the resist peelable film is pressed against the relief plate that has been installed in the pattern removal part in advance with a rubber roller from the resist peelable film side to remove the image part pattern, and then the non-printed part on the alignment part stage. It was conveyed so that the line part pattern came. Then, after bonding a resist peelable film and a to-be-printed base material with a rubber roller, the non-image part pattern was transferred to the to-be-printed base material by peeling the resist peelable film from the to-be-printed base material.

  The substrate to be printed on which the non-image area pattern is transferred is transported to the drying section, dried in an infrared furnace for 20 minutes, the resist is cured, and the substrate to be printed on which the non-image area pattern is printed Got.

Thereafter, an ITO film was formed on the substrate to be printed on which the non-image area pattern was printed using a sputtering apparatus. As the ITO material, an ITO (SnO ₂ 10 wt%) sputtering target (manufactured by Sumitomo Metal Mining) was used.

  Finally, after sticking an adhesive film on the non-image area pattern on the surface of the substrate to be printed on which the ITO film is formed, the resist is removed by peeling to obtain a high-definition thin film pattern. It was.

DESCRIPTION OF SYMBOLS 101 ... Resist coating part 102 ... Resist drying part 103 ... Pattern removal part 104 ... Alignment part 105 ... Bonding and peeling part 106 ... Resist peeling film 107 ... Resist Peeling film unwinding part 108 ... Resist peeling film winding part 111 ... Printed substrate drying part 112 ... Thin film material coating part 113 ... Thin film material drying part 114 ... Adhesive film Laminating section 115 ... printed substrate 116 ... printed substrate unwinding section 117 ... printed substrate winding section 121 ... adhesive film 122 ... adhesive film unwinding section 123 ... -Adhesive film take-up part 201 ... Pre-dried resist film 202 ... Thin film material 203 ... Dry resist film

Claims (3)

A method for forming a thin film pattern comprising a thin-film image area on a substrate to be printed and a non-image area without a thin film,
At least a step of applying a resist on the resist peelable film;
Pre-drying the resist to form a pre-dried resist film;
The pre-dried resist film of the image-line part pattern is separated from the relief plate by pressing the non-image-line part pattern as a concave part and pressing the relief plate with the image-line part pattern as a convex part against the pre-dry resist film. A step of transferring to the convex portion of
Transferring the non-image portion pattern consisting of the pre-dried resist film left on the resist peelable film onto the surface of the substrate to be printed to form the non-image portion pattern;
Forming a thin film on the surface of the substrate to be printed on which the non-image area pattern is formed; and
A method of forming a thin film pattern, comprising a step of peeling the thin film and the resist of the non-image portion pattern.   2. The thin film according to claim 1, wherein the step of peeling the resist is performed by laminating an adhesive film on the non-image area pattern on the surface of the substrate to be printed, and then peeling the resist film. Pattern formation method.   The adhesion between the resist and the substrate to be printed is weak enough that the resist is peeled off from the substrate to be printed by peeling off the adhesive film, and the adhesion between the resist and the thin film material. The thin film pattern forming method according to claim 2, wherein the thin film pattern forming method is weaker.