JP2007047304A - Manufacturing apparatus and method of liquid crystal display apparatus, and liquid crystal display apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low-running cost manufacturing apparatus of a liquid crystal display apparatus, which is made accurately agreement and cement patterns on each flexible substrate surface together in order to manufacture the liquid crystal display apparatus by cementing two or more flexible substrates together with the patterns formed thereon. <P>SOLUTION: The manufacturing apparatus 1 of the liquid crystal display apparatus comprises: a substrate cutting means 2; a 1st carrying means 3 for carrying a 1st flexible substrate 8 to a position where the 1st flexible substrate 8 and a 2nd flexible substrate 9 are cemented together; a 2nd carrying means 4 for carrying the 2nd substrate 9 to a position where the 1st and 2nd substrates 8, 9 are cemented together; an alignment means 5 for aligning the 1st substrate with the 2nd substrate 9; and a substrate cementing mens 6 for cementing the 1st and 2nd substrates 8, 9 together, and each pattern of the 1st substrate 8 and/or the 2nd substrate 9 is cut by the substrate cutting means 2, and then the alignment and cementing are performed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a manufacturing apparatus and a manufacturing method of a liquid crystal display device, and a liquid crystal display device.

  Conventionally, a glass substrate having excellent optical characteristics and low cost has been exclusively used as a substrate for a liquid crystal display device. However, recently, the size of liquid crystal display devices has been increasing, and the range of applications has been expanded. In addition, there is an urgent need to reduce the weight and cost of liquid crystal display devices. In particular, in order to increase the size of the liquid crystal display device, it is necessary to increase the size of the glass substrate. However, the total weight of the liquid crystal display device becomes too large. For example, a large-sized television for home use is required to be further reduced in weight. It is not suitable for applications such as personal computers. Further, the increase in the size of the glass substrate is accompanied by an increase in the size of the glass substrate manufacturing apparatus, which is one of the causes for increasing the cost of the liquid crystal display device.

  In view of such a problem, it has been attempted to use a flexible substrate in place of a glass substrate in a liquid crystal display device. A flexible substrate is a flexible film made of a transparent synthetic resin material, has optical properties that are not problematic in practice, is significantly lighter than a glass substrate, and is easy to process. It has an excellent characteristic that it does not take much. Further, since the flexible substrate itself has flexibility, it can be used even in a state where a physical stress is applied or in a curved state. Therefore, if a flexible substrate is used, it is relatively easy to increase the size of the liquid crystal display device and expand the application range of the liquid crystal display device. However, the manufacturing method for manufacturing the liquid crystal display device efficiently and inexpensively using the flexible substrate is not possible. Establishment is one of the important issues in the current situation.

  Utilizing that the flexible substrate is formed as a long sheet having a certain width, two flexible substrates are used, an electrode pattern, a filter, etc. are formed on the first flexible substrate, and the second flexible substrate is formed. A method for manufacturing a liquid crystal display element has been proposed, in which liquid crystal is dropped to form a liquid crystal layer, and these two flexible substrates are continuously bonded together (see, for example, Patent Document 1). FIG. 5 is a system diagram for explaining a method of manufacturing a liquid crystal display device in Patent Document 1. That is, in the manufacturing method of Patent Document 1, in the process A, in the process of transporting the resin film 104 wound around the roll 101 in the direction of the arrow 125, first, the color filter 110 and the protection are formed on the surface of the resin film 104. The film 111 is sequentially formed, and after the adhesive layer 112 and the flexible substrate 105 are sequentially laminated on the surface opposite to the film thickness direction of the color filter forming surface, the protective film 111 is peeled off. Next, an overcoat film 113, an electrode 114, and an alignment film 115 are sequentially formed on the color filter 110, and the alignment film 115 is baked and hardened by heating. Further, a spacer 116 and a liquid crystal layer 117 are formed on the alignment film 115. On the other hand, in the process B, in the process of transporting the resin film 106 wound around the roll 103 in the direction of the arrow 126, the electrode 120 and the alignment film 121 are sequentially formed on the surface of the flexible substrate 106. It is baked and hardened by heating. The flexible substrate 105 having a predetermined pattern formed on the surface obtained in the step A and the flexible substrate 106 having a predetermined pattern formed on the surface obtained in the step B are formed on the pressure contact portions of the pair of rolls 118 and 119. The liquid crystal display device is obtained by being transported and continuously pasted by passing through the pressure contact portion, further heated, and then cut into a predetermined shape. According to the manufacturing method of Patent Document 1, since the liquid crystal display device is continuously manufactured, the manufacturing cost can be reduced.

  However, when the flexible substrate 105 and the flexible substrate 106 are continuously conveyed and finally bonded together while maintaining the shape of the long sheet as in the manufacturing method of Patent Document 1, for example, two flexible substrates Even if there is a slight difference in tension applied when the substrates 105 and 106 are conveyed, the degree of expansion and contraction of each of the substrates 105 and 106 is slightly different, and the alignment is insufficient in a continuous flow. In addition, it is very difficult to bond the two such that the pattern of the liquid crystal layer and the electrode on the surface of the flexible substrate 106 are exactly coincident with each other, and practically impossible. Therefore, the manufacturing method of Patent Document 1 has a very high defective product rate, cannot achieve a sufficient cost reduction, and hardly uses the advantage of using an inexpensive flexible substrate.

JP 2004-258673 A

  An object of the present invention is to easily align a predetermined pattern formed on the surface of each flexible substrate, despite the fact that a liquid crystal display device is manufactured by successively laminating a plurality of flexible substrates. It is possible to provide a manufacturing apparatus of a liquid crystal display device, a manufacturing method of the liquid crystal display device, and a liquid crystal display device, which can be accurately matched to each other and bonded at a low running cost.

In the present invention, a sheet-like first substrate in which a pattern is continuously formed and a sheet-like second substrate in which a pattern corresponding to the pattern of the first substrate is continuously formed are pasted. In the liquid crystal display manufacturing apparatus to be combined,
First transport means for transporting the first substrate to a bonding position with the second substrate;
Second transport means for transporting the second substrate to a bonding position with the first substrate;
A substrate cutting means for cutting the first substrate and / or the second substrate for each predetermined pattern formed on the first substrate or the second substrate before bonding the first substrate and the second substrate;
An alignment means for aligning both the first substrate and the second substrate in accordance with a pattern formed on the both before bonding the first substrate and the second substrate;
An apparatus for manufacturing a liquid crystal display device comprising a substrate adhering means for adhering a first substrate and a second substrate.

Moreover, the manufacturing apparatus of the liquid crystal display device of the present invention comprises:
The first conveying means is
First holding means for holding a first bonding region of the first substrate with the second substrate;
Second holding means for holding a second bonding area following the first bonding area of the first substrate held by the first holding means, and the substrate cutting means,
First cutting the first substrate between the first bonding area of the first substrate held by the first holding means and the second bonding area of the first substrate held by the second holding means. And a substrate cutting means.

  Furthermore, the apparatus for manufacturing a liquid crystal display device according to the present invention further includes liquid crystal layer forming means for placing a liquid crystal substance on the bonding region of the first substrate surface or the second substrate surface.

Furthermore, the apparatus for manufacturing a liquid crystal display device of the present invention includes:
The substrate sticking means is
A pressure-resistant container capable of sealing the inside, and bonding the first substrate and the second substrate in the interior;
Pressure reducing means for reducing the pressure inside the pressure resistant container,
The first substrate and the second substrate are bonded together in a reduced pressure state.

Furthermore, the apparatus for manufacturing a liquid crystal display device of the present invention includes:
A pressure-resistant housing that houses at least the first substrate and / or the second substrate;
Housing pressure reducing means for bringing the pressure-resistant housing inside into the same pressure-reduced state as the first substrate and the second substrate are bonded together,
A first substrate and / or a second substrate,
The first substrate and the second substrate are placed in the same pressure-reduced state as that for bonding.

Furthermore, the apparatus for manufacturing a liquid crystal display device of the present invention includes:
The first substrate, the second substrate, the first transport unit, the second transport unit, the substrate cutting unit, the alignment unit, and the substrate sticking unit are housed in a pressure-resistant housing and placed in a reduced pressure state.

  Furthermore, the liquid crystal display device manufacturing apparatus of the present invention is characterized in that the transport direction of the first substrate by the first transport means is opposite to the transport direction of the second substrate by the second transport means.

In the present invention, a sheet-like first substrate in which a pattern is continuously formed and a sheet-like second substrate in which a pattern corresponding to the pattern of the first substrate is continuously formed In the manufacturing method of the liquid crystal display device to be bonded,
Holding a first bonding region of the first substrate with the second substrate;
Holding a second bonding area following the first bonding area of the first substrate;
Cutting the first substrate between the first bonding region and the second bonding region of the first substrate;
Transporting the cut piece of the first substrate to the bonding position with the second substrate;
Transporting the second substrate to a bonding position with the cut piece of the first substrate;
A step of aligning the cut piece of the first substrate and the second substrate according to the pattern formed on the cut piece of the first substrate and the second substrate;
A method for manufacturing a liquid crystal display device, comprising: bonding a cut piece of a first substrate and a second substrate.

  Further, the present invention is a liquid crystal display device manufactured by the above-described method for manufacturing a liquid crystal display device.

  According to the present invention, the first transport unit, the second transport unit, the substrate cutting unit, the alignment unit, and the substrate pasting unit are included, and the first substrate and the second substrate are continuously pasted together. An apparatus for manufacturing a liquid crystal display device for manufacturing a liquid crystal display device is provided. According to the manufacturing apparatus, before bonding the first substrate and the second substrate, one or both of the first substrate and the second substrate in the long state are cut by the substrate cutting means to form a single wafer. Therefore, alignment can be performed easily and accurately, and the respective patterns formed on the first substrate and the second substrate can be bonded to each other in a sufficiently operable state as an electric circuit. Therefore, the defective product rate of the obtained liquid crystal display device is remarkably lowered, and the cost can be greatly reduced.

  According to the present invention, the first transfer means includes two holding means for holding two bonding areas (predetermined pattern forming areas) that are continuously present from the front end in the transfer direction of the first substrate in series and separately. By adopting a configuration in which the first substrate is cut by the substrate cutting means between the two bonding regions, the first substrate is accurately cut for each predetermined pattern, and the alignment with the second substrate is more accurate. The defective product rate of the obtained liquid crystal display device can be further reduced. Further, since the end portion of the first substrate is held in series by the two holding means and the portion held by the two holding means is cut, the end portion of the first substrate is always held and fixed by the holding means. The first substrate can be smoothly transferred (drawn).

  According to the present invention, one substrate is provided by providing liquid crystal layer forming means for forming a liquid crystal layer by placing a liquid crystal substance on the bonding region of the first substrate or the second substrate in the manufacturing apparatus of the present invention. In addition, since it is possible to adopt a configuration in which bonding is performed immediately after the liquid crystal layer is formed, simplification of the process and process management, miniaturization of the manufacturing apparatus itself, and the like are facilitated.

  According to the present invention, by adopting a configuration in which the substrate sticking means includes a pressure-resistant container that can be sealed, and a pressure-reducing means that makes the inside of the pressure-resistant container in a reduced pressure state, Can be performed under reduced pressure inside the pressure-resistant container, so that two operations of bonding the substrate and degassing the liquid crystal display device can be performed simultaneously, and the liquid crystal display device can be manufactured more efficiently, This contributes to simplification of the process and the manufacturing apparatus.

  According to the present invention, the manufacturing apparatus of the present invention accommodates at least the first substrate and / or the second substrate, preferably the first substrate, the second substrate, the first transport unit, the second transport unit, and the substrate cutting unit. In addition, by adopting a configuration that further includes a pressure-resistant housing that accommodates the alignment means and the substrate adhering means, and a housing pressure-reducing means that depressurizes the pressure-resistant housing, waste generated when cutting the substrate, etc. Can be prevented from adhering to the substrate after cutting, the liquid crystal layer formed in the bonding region of the substrate, etc., so that the electrical reliability (particularly the reliability of electrical conduction) of the obtained liquid crystal display device is further improved. At the same time, the defective product rate further decreases. Furthermore, since only the bonding is not performed in a reduced pressure state, the process and the manufacturing apparatus can be further simplified.

  According to the present invention, by adopting a configuration in which the transport direction of the first substrate by the first transport means and the transport direction of the second substrate by the second transport means are opposite directions, the cutting position of the first substrate is Since it can be in a position behind the bonding position between the first substrate and the second substrate in the transport direction, the first substrate after cutting dust such as cutting waste of the first substrate, the liquid crystal display after bonding The liquid crystal display device obtained is prevented from adhering to or mixed into the device, and the electrical reliability of the obtained liquid crystal display device is further improved, and the defective product rate is further reduced.

  According to the present invention, it is possible to cut the first substrate from a long state, and to hold the first substrate in a single sheet. Therefore, alignment when the first substrate and the second substrate are bonded is easily and accurately performed. And the defective product rate can be suppressed. Further, since the end portion of the first substrate is held in series by the two holding means, and the gap between the portions held by the two holding means is cut, the end portion of the first substrate is always held by the holding means. Thus, the first substrate can be smoothly transferred (drawn).

  ADVANTAGE OF THE INVENTION According to this invention, the liquid crystal display device which is manufactured efficiently and at low cost using a flexible substrate, and electrical reliability is maintained at a high level over a long period of time is provided.

  FIG. 1 is a perspective view schematically showing a configuration of a liquid crystal display device manufacturing apparatus 1 (hereinafter, simply referred to as “manufacturing apparatus 1” unless otherwise specified) according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view schematically showing a configuration of a main part of the manufacturing apparatus 1. FIG. 3 is a plan view showing positions of alignment marks for alignment applied to the surfaces of the first substrate 8 and the second substrate 9.

  The manufacturing apparatus 1 includes a substrate cutting means 2 for cutting the first substrate 8, a first transfer means 3 for transferring the first substrate 8 to a bonding position with the second substrate 9, and the second substrate 9 as the first substrate. The second transport means 4 for transporting to the bonding position with 8, the alignment means 5 for aligning the first substrate 8 and the second substrate 9, and the first substrate 8 and the second substrate 9 are bonded together. It includes a substrate adhering means 6 and a chamber 7 for accommodating the respective means excluding later-described ultraviolet irradiation means 34 included in the second transport means 4 and later-described CCD cameras 41 and 42 included in the alignment means 5.

  The substrate cutting means 2 removably supports a first substrate roll 10 on which a first substrate 8 formed in a long sheet shape is wound, and is directed toward first and second holding means 12 and 13 described later. A support roller 10a for feeding one substrate 8, a tension roller 11 for assisting the conveyance of the first substrate 8 by the support roller 10a, and a first bonding located closest to the front end in the conveyance direction of the first substrate 8 A first holding means 12 for holding an area (pattern formation area or pixel area), and a second holding means 13 for holding a second bonding area formed subsequent to the first bonding area on the first substrate 8; And a cutting means 14 for cutting the first substrate 8 held by the first and second holding means 12 and 13 between the first bonding area and the second bonding area.

  The first substrate 8 has a rectangular bonding region or a pixel region 8x including a predetermined pattern such as a TFT pattern, an electrode pattern, a color filter pattern on the surface of a flexible flexible substrate formed in a long sheet shape at a constant interval. A pair of coarse cross-shaped positions that are formed continuously and open, in the vicinity of a rectangular bonding area (pixel area) 8x, on one extension of one diagonal line in the area 8x through the area 8x. An alignment mark 8y for alignment is given, and a pair of cross-shaped fine alignment marks 8z facing each other through the region 8x is given on the other diagonal extension line. The alignment marks 8y and 8z for coarse alignment and fine alignment are formed in the same position at the same position with respect to all the bonding regions 8x, and the first substrate 8 and the second substrate 9 by the alignment means 5 described later are used. Used for alignment. Note that the shape of the alignment mark for alignment is not limited to a cross shape, and may be any other shape. Furthermore, the number of alignment marks for alignment, the application position, and the like are not limited, and can be selected as necessary. Further, when a liquid crystal layer is formed on the surface of the bonding region 8x of the first substrate 8, in order to regulate the gap between the substrates when bonded to the second substrate 9 in the pattern of the first substrate 8, A plurality of columnar protrusions are formed in advance. Although any resin material commonly used in this field can be used for the flexible flexible substrate, a transparent resin material is preferable. Examples of the transparent resin material include polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyethylene sulfide, polyimide, and the like. The first substrate 8 is supplied into the manufacturing apparatus 1 in a form wound around the first substrate roll 10.

  The support roller 10a is supported by a support means and a drive means (not shown) so as to be rotatable in the axial direction. The support roller 10a is configured such that, for example, one end of the support roller 10a is detachable from the support means (for example, the support means is designed to advance and retract in the axial direction of the support roller 10a), and the other end is supported. By adopting the above, it is possible to easily mount the first substrate roll 10 on the support roller 10a and remove it from the support roller 10a. For example, a motor or the like can be used as the driving means of the support roller 10a. The rotation direction, rotation torque, and the like of the motor are controlled based on the detection result by a pressure sensor (not shown) attached to the rotation shaft of the tension roller 11 in order to keep the tension during the conveyance of the first substrate 8 constant. The support roller 10a supports the first substrate roll 10 on which the first substrate 8 is wound, and further conveys the first substrate 8 in the direction of the first and second holding means 12 and 13 by its rotation. The first substrate roll 10 rotates following the rotation of the support roller 10a. The first substrate roll 10 on which the first substrate 8 mounted on the support roller 10a is wound is separated from the support roller 10a when the first substrate 8 is completely consumed. The wound first substrate roll 10 is mounted on the support roller 10a.

  The tension roller 11 is supported by a driving means (not shown) so as to be rotatable around its axis. The tension roller 11 applies appropriate tension to the first substrate 8 transported in the direction of the first and second holding means 12 and 13, and assists the smooth transport of the first substrate 8.

  The first holding means 12 includes a holding plate 15 that holds the first bonding region of the first substrate 8 on its lower surface, and a direction perpendicular to the transport direction of the first substrate 8 (hereinafter referred to as “width direction of the first substrate 8”). The second holding means 13 together with the rails 16a and 16b for supporting the both ends of the holding plate 15 in order to keep the holding plate 15 horizontal and the pusher 20 in the second holding means 13 to be described later. And a pusher 19 which is moved so as to be able to move forward and backward. In the present embodiment, the holding plate 15 is an electrostatic chuck, and a magnetic body is fixed on the upper surface thereof. In FIG. 1, the illustration of electrical wiring connected to the electrostatic check is omitted. The holding plate 15 holds the first substrate 8 by electrostatic force. In addition, it is not limited to an electrostatic chuck, For example, other holding means, such as a mechanical holding means and an adhesive holding means, can also be used. According to the first holding means 12, the first bonding region of the first substrate 8 transported by the rotation of the first substrate roll 10 and the tension roller 11 is positioned at the first bonding region located first from the front end in the transport direction. Adsorbed and held on the bottom surface. The configuration and operation of the pusher 19 will be described in the description of the second holding means 13.

  The second holding means 13 is spaced from the first holding means 12 on the same frame as the first holding means 12 and on the downstream side of the first holding means 12 in the transport direction of the first substrate 8. Be placed. The second holding means 13 supports the both ends of the holding plate 17 holding the second bonding region of the first substrate 8 on its lower surface and the holding plate 17 in the width direction of the first substrate 8 and horizontally holds the holding plate 17. Rails 18a and 18b to be held together and a pusher 19 in the first holding means 12, and a pusher 20 for moving the holding plate 17 and the rails 18a and 18b so as to advance and retreat in the transport direction of the first substrate 8. The holding plate 17 has the same configuration as the holding plate 15. The pushers 19 and 20 are provided so as to be able to advance and retreat in the transport direction of the first substrate 8 and to rotate in the width direction (that is, the vertical direction) of the first substrate 8 as indicated by broken lines in the drawing. For the pushers 19 and 20, for example, a mechanism in which a ball screw and a ball spline are combined is used. The pushers 19 and 20 are rotated to sandwich both ends of the holding plate 17 in the width direction of the first substrate 8 by the protrusions 19a and 20a. Further, the pushers 19 and 20 are moved in the transport direction of the first substrate 8, The holding plate 17 and the rails 18a and 18b can be moved. According to the second holding means 13, the second bonding region located second from the front end in the transport direction of the first substrate 8 transported by the rotation of the first substrate roll 10 and the tension roller 11 is arranged on the holding plate 17. Adsorbed and held on the bottom surface.

  Note that the interval at which the first holding unit 12 and the second holding unit 13 are provided depends on the interval between the predetermined patterns formed on the first substrate 8 or the design value of the dimension of the liquid crystal display device 37 to be obtained. It is preferable to determine appropriately.

  The cutting means 14 is provided below the first and second holding means 12 and 13 in the gap between the first holding means 12 and the second holding means 13 and is supported by the support plate 15. In the present embodiment, a roller cutter is used as the cutting means 14, but the invention is not limited thereto. For example, a general cutter used for cutting a resin film such as a cutter using a laser can be used. Note that the roller cutter may be supported by a linear motion guide 21 included in the first substrate transport means 3 described later so as to be able to advance and retreat in the transport direction of the first substrate 8. According to the cutting means 14, the first substrate 8 in a state where the predetermined area is sucked and held by the first and second holding means 12 and 13 is cut, and the first substrate 8 on which the first bonding area is formed is cut. A cut piece 8a is obtained.

  According to the substrate cutting means 2, the first substrate 8 is cut into individual cut pieces 8 a for each bonding region, and the cut pieces 8 a are in a state of being sucked and held by the first holding means 12.

  The first transfer means 3 includes a linear motion guide 21 that is operated by a driving force from a drive source (not shown) provided outside the chamber 7 that is transmitted by a drive transmission means (not shown), and a first substrate by the linear motion guide 21. And an arm 22 that is supported so as to be movable forward and backward in the conveying direction 8 and is provided so as to protrude downward in the vertical direction from the vertical lower surface of the linear guide 21. The arm 22 is directly supported by the linear motion guide 21 and is supported by the rotary stage 23 provided to be rotatable in both clockwise and counterclockwise directions by a driving means (not shown), and is vertically moved in the vertical direction. A vertical motion robot 24 provided in a possible manner and a holding hand 25 attached to the tip of the vertical motion robot 24 and holding the holding plates 15 and 17 by suction are configured.

  The vertical robot 24 includes a vertical robot main body 24a and a telescopic rod 24b. The telescopic rod 24b is provided so as to be movable up and down by driving means provided in the vertical robot main body 24a. An electromagnetic holding means such as an electromagnetic chuck is used for the holding hand 25, and the first and second holding means 12 and 13 are attracted and held via a magnetic material provided on the upper surfaces of the holding plates 15 and 17. The holding hand 25 is not limited to the electromagnetic holding means, and may be, for example, a mechanical holding means. In that case, it is not necessary to attach a magnetic body to the upper surfaces of the holding plates 15 and 17. With such a configuration, the holding hand 25 can advance and retreat in the transport direction of the first substrate 8, can move up and down in the vertical direction, and can rotate about its axis in the horizontal direction.

  According to the first transport means 3, the movement of the arm 22 in the horizontal direction in the horizontal direction and the opposite direction, the rotation of the arm 22 in the horizontal direction, and the vertical movement of the vertical robot 24 in the vertical direction are referred to. By combining the three operations and using the holding hand 25, the first holding means 12 for sucking and holding the cut piece 8a of the first substrate 8 is moved to the bonding position of the first substrate 8 and the second substrate 9. , Positioning, which will be described later, and returning the first holding means 12 to the substrate cutting means 2 after cutting the cut piece 8a. The operation of the first transport unit 3 will be described in detail in the description based on FIG.

  The 2nd conveyance means 4 supports the 2nd substrate roll 30 which wound up the 2nd board | substrate 9 formed in the elongate sheet form so that attachment or detachment is possible, and conveyance of the 2nd board | substrate 9 by the support roller 30a. An auxiliary tension roller 31, a sealant application unit 32 provided downstream of the tension roller 31 in the transport direction of the second substrate 9, and a downstream side of the sealant application unit 32 in the transport direction of the second substrate 9. A liquid crystal dropping means 33 provided; an ultraviolet irradiation means 34 provided vertically below the sealant applying means 32 and outside the chamber 7 so as to be able to advance and retreat in the transport direction of the second substrate 9; Four pairs of transport rollers 38a, 38b, 38c, 38d for transporting the liquid crystal display device 37 obtained by bonding the second substrate 9, a transport roller 38b, and a transport roller 38. Configured to include a cutting means 39 provided vertically below the conveyance position of the liquid crystal display device 37, and a stocker 40 for accommodating the liquid crystal display device 37 between the.

  The second substrate 9 has the same configuration as the first substrate 8. Of course, on the extension of two diagonal lines in the bonding area (pixel area) 9a, a pair of cross-shaped alignment marks for coarse alignment 9y and a pair of cross-shaped so as to face each other via the bonding area 9a. The fine alignment alignment mark 9 z is applied to the same position as that on the first substrate 8. Further, as in the case of the first substrate 8, the shape, number, application position, and the like of the alignment mark for alignment can be selected as appropriate without being limited to the above configuration. Further, since a liquid crystal layer is further formed on the surface of the second substrate 9, a plurality of columnar shapes are included in the pattern of the second substrate 9 in order to regulate the gap between the substrates when the first substrate 8 is bonded. A protrusion is formed in advance.

  The support roller 30a has the same configuration as the support roller 10a. And a motor can be used for the drive means which rotationally drives the support roller 30a similarly to the support roller 10a. The rotation direction, rotation torque, and the like of the motor are controlled based on the detection result by a pressure sensor (not shown) attached to the rotation shaft of the tension roller 31 in order to keep the tension during the conveyance of the second substrate 9 constant. The support roller 30a removably supports the second substrate roll 30 wound around the second substrate 9 in a roll shape, and further conveys the second substrate 9 toward a bonding stage 35 to be described later by rotation thereof. The second substrate roll 30 rotates with the rotation of the support roller 30a.

  The tension roller 31 is supported by a driving means (not shown) so as to be rotatable around its axis. The tension roller 31 applies appropriate tension to the second substrate 9 in the transport state, and assists the smooth transport of the second substrate 9.

  The sealant application unit 32 applies the sealant to the outer periphery so as to surround the bonding region (pattern formation region or pixel region) on the second substrate 9. The sealing agent application means 32 includes a small syringe 32 a that discharges the sealing agent, a dispenser 32 b that is integrated with the small syringe 32 a and quantitatively supplies the sealing agent to the small syringe 32 a, and the dispenser 32 b is arranged in the width of the second substrate 9. And a support 32c that is movably supported in the direction. The sealing agent application unit 32 is not limited to the above-described configuration, and the sealing agent may be applied to the surface of the second substrate 9 using a screen printing technique. In the present embodiment, a photocurable resin is used as the sealant, but the sealant is not limited thereto, and a thermosetting resin, a resin that is cured by a combination of light and heat, and the like can also be used. According to the sealing agent application means 32, the shape of the bonding region formed on the second substrate 9 is detected by a sensor (not shown), and the sealing agent is discharged from the small syringe 32a while moving the dispenser 32b based on the detection result. Then, a sealing agent is applied to the outer periphery of the bonding area.

  The liquid crystal dropping means 33 drops a liquid crystal material onto the bonding region surrounded by the sealant of the second substrate 9 to form a liquid crystal layer. Similarly to the sealant application means 32, the liquid crystal dropping means 33 is also equipped with a small syringe 33a that discharges liquid crystal, a dispenser 33b that is integrated with the small syringe 33a and quantitatively supplies liquid crystal to the small syringe 33a, and a dispenser 33b. And a support 33c that supports the second substrate 9 so as to be movable in the width direction.

  The ultraviolet irradiation means 34 is supported by a driving means (not shown) so as to be able to advance and retreat in a direction parallel to the transport direction of the second substrate 9. The ultraviolet irradiation means 34 not only pre-cures the sealant on the surface of the second substrate 9 but also moves downward in the vertical direction of the bonding stage 35 when bonding the first substrate 8 and the second substrate 9 together. Irradiation with ultraviolet rays promotes adhesion and curing between the first substrate 8 and the second substrate 9. Thereafter, the ultraviolet irradiation means 34 moves downward in the vertical direction of the sealing agent application means 32 to pre-cure the sealing agent. The operation of the ultraviolet irradiation means 34 is repeated. As the ultraviolet irradiation means 34, an ultraviolet irradiation apparatus commonly used in this field can be used.

  The four pairs of transport rollers 38a, 38b, 38c, and 38d are each supported by a driving means (not shown) so as to be rotatable around their respective axis centers. These transport rollers transport the liquid crystal display device 37 obtained by bonding the first substrate 8 and the second substrate 9 to the stocker 40.

  The cutting means 39, in order to individually accommodate the liquid crystal display device 37 formed continuously on the second substrate 9 at a predetermined interval between the transport roller 38 b and the transport roller 38 c in the stocker 40, The second substrate 9 is cut between the two liquid crystal display devices 37 on the second substrate 9. The cutting means 39 has the same configuration as the cutting means 14.

  In the second transport unit 4, it is preferable that each component except the stocker 40 is disposed in the same frame, and the entire frame is provided so as to be movable in the width direction of the second substrate 9. Thereby, for example, alignment of the first substrate 8 and the second substrate 9 described later can be executed more smoothly.

  According to the second conveying means 4, after the liquid crystal layer is formed on the surface of the bonding region on the second substrate 9, it is fed to the bonding stage 35 for bonding with the first substrate 1 and further bonded. The formed liquid crystal display devices 37 are cut one by one and accommodated in the stocker 40.

  The alignment means 5 includes a bonding stage 35 on which at least the bonding region of the second substrate 9 is placed and the cutting piece 8a of the first substrate 8 and the second substrate 9 are bonded together, and the bonding stage 35 A pair of coarse alignment CCD cameras 41 and a pair of fine alignment CCD cameras 42 provided outside the chamber 7 and a support member 47 that supports the CCD cameras 41 and 42 in an integrated manner. including.

  The bonding stage 35 protrudes toward the inside of the chamber 7 with a peripheral edge 43a contacting the vertical bottom surface 7a of the chamber 7, and a protrusion 43b having a planar top 43c for placing the second substrate 9 thereon. A box-shaped main body member 43 is included. The top 43c includes a plate-like light transmissive window member 44 fitted into a through-hole 43d formed in a portion where at least the bonding region of the second substrate 9 is placed on the protrusion 43b, the through-hole 43d and the light A sealing member 45 that is disposed between the permeable window member 44 and ensures airtightness in the chamber 7 and is screwed to the inner side surface of the protruding portion 43b so that at least the bonding region of the second substrate 9 is placed. A plate-like support member 46 including a through hole 46a formed in a portion corresponding to the portion to be formed and a peripheral edge portion 46b extending around the through hole 46a, and supporting the light transmissive window member 44 by the peripheral edge portion 46b. Including.

  When the holding hand 25 attached to the tip of the arm 22 supported by the linear motion guide 21 in the first transport means 3 is lowered and brought into contact with the flat top 43c, the flat top 43c of the bonding stage 35 is It is preferable to arrange so that the center (for example, the intersection of diagonal lines) and the center of the holding hand 25 are located in the vicinity. By adopting such a configuration, the holding hand 25 in a state in which the holding plate 15 that sucks the cut piece 8a of the first substrate 8 is further sucked and held is directed toward the second substrate 9 placed on the top 43c. When the substrate is lowered in the vertical direction, the alignments corresponding to the coarse alignment 8y and 9y and the fine alignment 8z and 9z applied to each substrate are close to each other, and CCD cameras 41 and 42 described later are used. Registration can be performed more easily.

  The inside of the protrusion 43b is open toward the outside of the chamber 7, and the atmospheric pressure in this portion is the same as the atmospheric pressure.

  A quartz plate is used for the plate-like light-transmitting window member 44 in order to efficiently transmit ultraviolet rays. However, if the plate-like member is made of a transparent material that has good ultraviolet transmittance and is not deteriorated by ultraviolet rays, It is not limited to that.

The seal member 45 can be a general seal member such as an O-ring.
The same material as that for the chamber 7 is used for the plate-like support member 46, but the material is not limited to this if there is no problem in strength.

  On the planar top portion 43c of the bonding stage 35, the second substrate 9 on which the liquid crystal layer is formed in the bonding region by the second transport unit 4 is placed.

  The pair of coarse alignment CCD cameras 41 are positioned below the bonding stage 35 in the vertical direction so that the coarse alignments 8y and 9y applied to the first substrate 8 and the second substrate 9 can be photographed. Be placed. When alignment by the CCD camera 41 is performed, the cut pieces 8a of the first substrate 8 and the coarse alignment alignments 8y and 9y of the second substrate 9 match based on the image data photographed by the CCD camera 41. As described above, alignment is performed by the first transport unit 3 and the second transport unit 4.

  The pair of fine alignment CCD cameras 42 are positioned below the bonding stage 35 in the vertical direction so that the fine alignment alignments 8z and 9z applied to the first substrate 8 and the second substrate 9 can be photographed. Be placed. After the rough alignment using the CCD camera 41, the cut pieces 8a of the first substrate 8 and the fine alignment alignments 8z, 9z of the second substrate 9 match based on the image data taken by the CCD camera 42. As described above, alignment is performed by the first transport unit 3 and the fourth transport unit 4.

  The support member 47 that supports the CCD cameras 41 and 42 is integrated with a support member (not shown) supported by the ultraviolet irradiation means 34 and is advanced and retracted in a direction parallel to the transport direction of the second substrate 9 by a drive means (not shown). Provided possible.

  According to the alignment means 5, the cutting piece 8 a of the first substrate 8 that is indirectly attracted and held by the holding hand 25 of the first transport means 3 is lowered to lower the plane of the bonding stage 35. Coarse alignment based on the alignment 8y, 9y for coarse alignment and fine alignment based on the alignment 8z, 9z for fine alignment are performed in proximity to the second substrate 9 placed on the top 43c. Thus, the cut piece 8a of the first substrate 8 and the second substrate 9 are accurately aligned.

  In the substrate adhering means 6, the arm 22 supported by the linear guide 21 in the first conveying means 3, the ultraviolet irradiation means 34 in the second conveying means 4, and the adhering stage 35 in the alignment means 5 are combined. The After the alignment by the alignment means 5 is completed, the arm 22 is in contact with the surface of the second substrate 9 on the bonding stage 35 by the cut piece 8a of the first substrate 8 indirectly attracted and held by the holding hand 25. The holding hand 25 is lowered to a position where it is to be applied, and an appropriate pressure is applied to the cut piece 8 a and the second substrate 9. At the same time, the ultraviolet irradiation means 34 is moved vertically below the bonding stage 35 by a driving means (not shown), irradiates ultraviolet rays toward the top 43c of the bonding stage 35, and the cut piece 8a and the second substrate 9 Bonding is promoted, and the liquid crystal display device 37 is manufactured.

  The chamber 7 is a pressure-resistant housing member having airtightness, and accommodates each of the means except for the ultraviolet irradiation means 34 and the CCD cameras 41 and 42 as described above. The chamber 7 includes decompression means (not shown). By reducing the pressure inside the chamber 7 with the decompression means, for example, the liquid crystal display device 37 obtained by degassing the first substrate 8 and the second substrate 9 and bonding the first substrate 8 and the second substrate 9 together. Degassing etc. For example, a vacuum pump can be used as the decompression means.

  Next, the operation of the manufacturing apparatus 1 will be described in more detail with reference to FIGS. 4A to 4C. 4A (a) to (c), FIGS. 4B (d) to (f), and FIGS. 4C (g) to (i) are cross-sectional views of relevant parts for explaining each operation of the manufacturing apparatus 1. FIG. 4A to 4C, the rails 16a and 16b in the first holding means 12 of the substrate cutting means 2 and the rails 18a and 18b in the second holding means 13 are shown for convenience in order to explain the operation of the manufacturing apparatus 1. Is omitted. Therefore, in FIGS. 4A to 4C, the holding plates 15 and 17 are supported by rails 16a and 16b and rails 18a and 18b (not shown).

  In FIG. 4A (a), before operating the manufacturing apparatus 1, the first substrate roll 10 is attached to the support roller 10a, and the second substrate roll 30 is attached to the support roller 30a. Since the second substrate 9 forms a liquid crystal layer above the bonding region (pattern forming region or pixel region), the bonding region has a gap between the substrates when bonded to the first substrate 8. A plurality of columnar protrusions are formed so as to be a design value.

  Next, the first substrate 8 is pulled out from the first substrate roll 10 via the tension roller 11, and the first bonding region located first from the front end in the transport direction (drawing direction) of the first substrate 8 is first held. The holding plate 15 of the means 12 and the second bonding region located second from the front end in the transport direction of the first substrate 8 are sucked and held by the holding plate 17 of the second holding means 13, respectively. The holding plate 15 is held in the horizontal direction by the rails 16a and 16b, and the holding plate 17 is held in the horizontal direction by the rails 18a and 18b.

  Subsequently, the second substrate 9 is pulled out from the second substrate roll 30 via the tension roller 31 and is sandwiched between the transport rollers 38a, and the transport rollers 38a, 38b, 38c, and 38d are rotationally driven to transport the second substrate 9 ( (Drawer direction) The second substrate 9 is transported until the end reaches the upper part of the stocker 40. At this time, it is preferable that a pattern forming process such as a TFT pattern or an electrode pattern is not performed on a portion from the leading end portion in the transport direction of the second substrate 9 to a position immediately below the liquid crystal dropping means 33.

Further, the chamber 7 is sealed, and the internal pressure of the chamber 7 is reduced to several Pa by a decompression means (here, a vacuum pump) not shown. The pressure is reduced to a predetermined pressure, and the first substrate 8 and the second substrate 9 are deaerated. Even after the deaeration process is completed, the decompressed state inside the chamber 7 is maintained.
The above operation is a preparation step before the manufacturing apparatus 1 is operated.

  FIG. 4A (a) is a cross-sectional view showing a state in which the above preparation process is completed (that is, a state in which the deaeration process of the first substrate 8 and the second substrate 9 is completed). In this step, the cutting means 14 cuts the first substrate 8 between the first bonding region and the second bonding region of the first substrate 8 to obtain a cut piece 8a. The cut piece 8 a is sucked and held on the holding plate 15 of the first holding means 12.

  Further, in synchronization with the cutting of the first substrate 8, the sealing agent is applied so as to surround the bonding region on the second substrate 9 by the sealing agent application means 32. When the application is completed, the second substrate 9 is transported to a predetermined position below the liquid crystal dropping means 33, and the liquid crystal dropping means 33 drops the liquid crystal substance into the bonding region surrounded by the sealing agent. After completion of the dropping of the liquid crystal substance, the second substrate 9 is transported so that the bonding region in which the liquid crystal layer is formed as the upper layer of the second substrate 9 is placed on the planar top portion 43c of the bonding stage 35. . At this time, using the CCD cameras 41 and 42, adjustment may be made so that the bonding region is positioned on the planar top portion 43.

  In the step shown in FIG. 4A (b), the linear motion guide 21 is operated, the arm 22 is moved in the direction opposite to the transport direction of the first substrate 8, and the holding hand 25 attached to the tip portion thereof is the holding plate. 15 is located above the vertical direction.

  4A (c), the vertical robot 24 attached to the arm 22 is operated, the holding hand 25 is lowered until the lower surface thereof contacts the upper surface of the holding plate 15, and the holding plate 15 is sucked by the holding hand 25. Hold.

  In the step shown in FIG. 4B (d), the arm 22 is moved in the transport direction of the first substrate 8 with the holding hand 25 sucking and holding the holding plate 15, and the holding plate 15 is moved in the vertical direction of the bonding stage 35. Position on top.

  In the step shown in FIG. 4B (e), the vertical moving robot 24 is operated to lower the holding hand 25, and the cutting piece 8a that the holding hand 25 sucks and holds via the holding plate 15 is placed on the bonding stage 35. Two substrates 9 are brought close to each other. In this state, the coarse alignment CCD camera 41 photographs the coarse alignment alignment marks 8y and 9y applied to the cut piece 8a and the second substrate 9, and performs coarse alignment based on the images. Coarse alignment includes forward / reverse movement of the arm 22 in the transfer direction of the first substrate 8, rotation of the arm 22, and forward / reverse movement of the second transfer means 4 in a direction perpendicular to the transfer direction of the second substrate 9 (second The movement of the substrate 9 in the width direction) is performed in combination.

  In the step shown in FIG. 4B (f), the holding hand 25 is further lowered to bring the surface of the cut piece 8a and the surface of the second substrate 9 and the liquid crystal layer into contact with each other. In this state, the fine alignment CCD camera 42 photographs the fine alignment alignment marks 8z and 9z applied to the cut piece 8a and the second substrate 9, and fine alignment is performed based on the images. The fine alignment is performed in the same manner as the coarse alignment.

  In the step shown in FIG. 4C (g), the holding hand 25 is further lowered, and the cut piece 8a and the second substrate 9 are pressed and bonded together to manufacture the liquid crystal display device 37. At this time, in consideration of the fact that columnar protrusions having a predetermined height are formed in the bonding region of the second substrate 9 and that the gap length between the substrates is determined as a design value, for example, a predetermined value obtained by a preliminary experiment or the like. It is desirable to pressurize at a pressure of Note that when the holding hand 25 includes a pressure sensor that detects the pressure applied to the cut piece 8a, the pressure is automatically adjusted from the detected value. Further, if necessary, gap length measuring means such as a laser displacement meter may be provided to manage the gap length more precisely.

  In this pressurized state, the ultraviolet irradiation means 34 moves vertically below the bonding stage 35 and irradiates the laminated body of the cut piece 8 a and the second substrate 9 through the light transmissive window member 44. . This cures the sealant between both substrates. When the time necessary for curing elapses, the irradiation of ultraviolet rays is stopped, and at the same time, the holding hand 25 is raised, and the holding and pressing of the cut piece 8a by the holding plate 15 are released. The ultraviolet irradiation means 34 moves in the direction opposite to the conveyance direction of the second substrate 9, and correspondingly, the CCD cameras 41 and 42 return to the position below the bonding stage 35 in the vertical direction. During this time, the sealing agent and the liquid crystal substance are mounted on the subsequent bonding area of the second substrate 9 by the sealing agent applying means 32 and the liquid crystal dropping means 33. Further, the end of the second substrate 9 is cut by the cutting device 39.

  In the step shown in FIG. 4C (h), the holding hand 25 is raised in the vertical direction while the holding plate 15 is sucked and held, and the holding plate 17 is moved by the pushers 19 and 20, and the holding plate 15 is moved to the position shown in FIG. Move horizontally to an existing position. At this time, since the holding plate 17 holds the first substrate 8 by suction, the first substrate 8 is pulled out from the first substrate roll 10 as the holding plate 17 moves horizontally. Therefore, in FIG. 4A (a), the first substrate 8 on which the bonding region is formed is present vertically below the position where the holding plate 17 is present.

  In the step shown in FIG. 4C (i), the holding hand 25 is moved vertically upward of the holding plate 17 in FIG. 4A (a) and then lowered to the position of the holding plate 17 in FIG. 4A (a). 15 is released and the holding plate 15 is placed on the rails 18a and 18b. The holding plate 15 sucks and holds the first substrate 8 existing below the vertical direction. The holding hand 25 returns to the position shown in FIG. 4A (a).

  Apart from this, in the second transport means 4, the fragments of the second substrate 9 cut between the transport rollers 38 b and 38 c by the cutting means 39 are transported by the transport rollers 38 c and 38 d to the stocker 40. Be contained. Here, since the initial state in which the manufacturing apparatus 1 is in operation is shown, it is a fragment of the second substrate 9 that is first accommodated in the stocker 40. However, when the above steps are repeatedly performed, the liquid crystal display device 37 sequentially moves to the stocker 40. Is housed in.

  In the manufacturing apparatus 1, the liquid crystal display device 37 can be continuously manufactured by repeatedly executing the above operation.

It is a perspective view which shows typically the structure of the liquid crystal display device manufacturing apparatus which is 1st Embodiment of this invention. It is sectional drawing which shows typically the structure of the principal part of the liquid crystal display device manufacturing apparatus shown in FIG. It is a top view which shows the position of the alignment mark for alignment attached | subjected to two board | substrates used for bonding. It is principal part sectional drawing explaining each operation | movement of the liquid crystal display device manufacturing apparatus shown in FIG. It is principal part sectional drawing explaining each operation | movement of the liquid crystal display device manufacturing apparatus shown in FIG. It is principal part sectional drawing explaining each operation | movement of the liquid crystal display device manufacturing apparatus shown in FIG. It is a systematic diagram which shows typically the structure of the liquid crystal display device manufacturing apparatus of patent document 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Liquid crystal display device manufacturing apparatus 2 Board | substrate cutting means 3 1st conveyance means 4 2nd conveyance means 5 Positioning means 6 Substrate sticking means 7 Chamber 7a Chamber bottom face 8 1st board | substrate 8a Cutting piece 8x, 9x Bonding area 8y, 9y Coarse alignment mark 8z, 9z Fine alignment mark 9 Second substrate 10 First substrate roll 10a Support roller 11 Tension roller 12 First holding means 13 Second holding means 14, 39 Cutting means 15, 17 Holding plate 16a, 16b, 18a, 18b Rail 19, 20 Pusher 21 Linear motion guide 22 Arm 23 Rotary stage 24 Vertical motion robot 24a Vertical motion robot body 24b Telescopic rod 25 Holding hand 30 Second substrate roll 30a Support roller 31 Tension roller 32 Sealant Application means 32a 33a Small syringe 32b, 33b Dispenser 32c, 33c Support 33 Liquid crystal dropping means 34 Ultraviolet irradiation means 35 Bonding stage 37 Liquid crystal display device 38a, 38b, 38c, 38d Conveying roller 40 Stocker 41 Coarse alignment CCD camera 42 Fine alignment CCD camera 43a Peripheral portion 43b Protruding portion 43c Planar top portion 43d Through hole 44 Light transmissive window member 45 Seal member 46 Plate-like support member 47 Support member

Claims (9)

A liquid crystal display device that continuously bonds a sheet-like first substrate having a pattern formed thereon and a sheet-like second substrate having a pattern corresponding to the pattern of the first substrate continuously formed In the manufacturing equipment of
First transport means for transporting the first substrate to a bonding position with the second substrate;
Second transport means for transporting the second substrate to a bonding position with the first substrate;
A substrate cutting means for cutting the first substrate and / or the second substrate for each predetermined pattern formed on the first substrate or the second substrate before bonding the first substrate and the second substrate;
An alignment means for aligning both the first substrate and the second substrate in accordance with a pattern formed on the both before bonding the first substrate and the second substrate;
An apparatus for manufacturing a liquid crystal display device, comprising: substrate adhering means for adhering a first substrate and a second substrate. The first transport means
First holding means for holding a first bonding region of the first substrate with the second substrate;
Second holding means for holding a second bonding area following the first bonding area of the first substrate held by the first holding means, and the substrate cutting means,
First cutting the first substrate between the first bonding area of the first substrate held by the first holding means and the second bonding area of the first substrate held by the second holding means. 2. The apparatus for manufacturing a liquid crystal display device according to claim 1, further comprising substrate cutting means. In the bonding area of the first substrate surface or the second substrate surface,
3. The apparatus for manufacturing a liquid crystal display device according to claim 1, further comprising liquid crystal layer forming means for placing a liquid crystal substance. The substrate sticking means is
A pressure-resistant container capable of sealing the inside, and bonding the first substrate and the second substrate in the interior;
Pressure reducing means for reducing the pressure inside the pressure resistant container,
The apparatus for manufacturing a liquid crystal display device according to claim 1, wherein the first substrate and the second substrate are bonded together in a reduced pressure state. A pressure-resistant housing that houses at least the first substrate and / or the second substrate;
Housing pressure reducing means for bringing the pressure-resistant housing inside into the same pressure-reduced state as the first substrate and the second substrate are bonded together,
The first substrate and / or the second substrate is
5. The apparatus for manufacturing a liquid crystal display device according to claim 4, wherein the liquid crystal display device is placed in the same reduced pressure state as the first substrate and the second substrate are bonded to each other.   The first substrate, the second substrate, the first transport unit, the second transport unit, the substrate cutting unit, the alignment unit, and the substrate sticking unit are housed in a pressure-resistant housing and placed in a reduced pressure state. Item 6. A manufacturing apparatus for a liquid crystal display device according to Item 5.   7. The liquid crystal display according to claim 1, wherein the transport direction of the first substrate by the first transport means and the transport direction of the second substrate by the second transport means are opposite directions. Equipment manufacturing equipment. A liquid crystal display device that continuously bonds a sheet-like first substrate having a pattern formed thereon and a sheet-like second substrate having a pattern corresponding to the pattern of the first substrate continuously formed In the manufacturing method of
Holding a first bonding region of the first substrate with the second substrate;
Holding a second bonding area following the first bonding area of the first substrate;
Cutting the first substrate between the first bonding region and the second bonding region of the first substrate;
Transporting the cut piece of the first substrate to the bonding position with the second substrate;
Transporting the second substrate to a bonding position with the cut piece of the first substrate;
A step of aligning the cut piece of the first substrate and the second substrate according to the pattern formed on the cut piece of the first substrate and the second substrate;
The manufacturing method of the liquid crystal display device characterized by including the process of bonding the cut piece of a 1st board | substrate, and a 2nd board | substrate. A liquid crystal display device manufactured by the method for manufacturing a liquid crystal display device according to claim 8.

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