JP2011138128A - Apparatus for fabricating liquid crystal display device and method of fabricating the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for fabricating liquid crystal display device and a method of fabricating liquid crystal display device capable of drastically shortening the length of the whole apparatus and improving the investment efficiency by reducing an investment amount without separately disposing an ACF-attaching device. <P>SOLUTION: The apparatus for fabricating liquid crystal display device includes: an ACF cutting part 210 configured to cut an ACF 126; an ACF stripping part 220 for stripping the ACF from a base film 140 while preventing a TCP 130 to which the ACF is attached from releasing from a suction plate; a TCP feeding part 230 for feeding the TCP; an ACF attachment correcting part 250 for suppressing the error to the minimum when feeding the TCP in order to attach the ACF; an ACF attachment pre-inspecting part 260 which measures a punching size of the TCP and confirms the position of aligning key formed on the TCP with an image pickup element 264; an ACF attachment post-inspecting part 270 which attaches the ACF to the TCP and, thereafter, confirms the presence or absence of the ACF and the position of the aligning key with an image pickup element 274; and an index part 290 which vacuum sucks the TCP to which the ACF is attached and feeds the TCP to pad terminals on the lower substrate while rotating the TCP. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a liquid crystal display (LCD), and in particular, a tape carrier package (Tape Carrier) for manufacturing a liquid crystal display for electrically connecting a liquid crystal panel and a printed circuit board on which a drive circuit is mounted. Package; TCP) Alignment apparatus, and a liquid crystal display manufacturing apparatus and method using the same.

  In general, a liquid crystal display device always includes a liquid crystal panel formed by bonding a pair of substrates through a liquid crystal layer having optical anisotropy and polarization characteristics. Electric field generating electrodes are formed on the opposite surfaces of the substrate, respectively, and by changing the electric field between them, the alignment direction of the liquid crystal molecules is artificially adjusted, and the light transmittance changing at this time To display various images externally.

  In such a liquid crystal panel, a printed circuit board on which a gate driving circuit for outputting a scanning signal and a data driving circuit for outputting an image signal are mounted is connected by a tape carrier package (TCP).

  FIG. 12 is a perspective view schematically showing a general liquid crystal panel. As shown in FIG. 12, in a general liquid crystal panel 10, a lower array substrate 12 and an upper substrate 18 are bonded to each other through a liquid crystal layer (not shown), and an edge portion thereof is attached. One or more printed circuit boards 20 on which a gate driving circuit and a data driving circuit are mounted are connected by a plurality of tape carrier packages (TCP) 30.

  Hereinafter, it demonstrates in detail with reference to FIG. 13 which expands and shows the A section of FIG. In the normal liquid crystal panel 10, since the area of the array substrate 12 is larger than the area of the upper substrate 18, two adjacent edges of the array substrate 12 are exposed to the outside of the upper substrate 18, and there are gate lines or data respectively. A plurality of first pads 16 drawn from the line are arranged. Here, the plurality of first pads 16 are arranged at uniform fine intervals.

  A plurality of second pads 22 for outputting scanning signals or image signals are arranged along at least one edge of the printed circuit board 20, and the plurality of second pads 22 are also arranged at a uniform fine interval. Are arranged in

  Furthermore, a plurality of first and second contact pads 32 and 34 corresponding to the first and second pads 16 and 22 are arranged at the same fine interval at both end edges of the TCP 30 for connecting them. Has been. That is, as shown in the figure, the first and second contact pads 32 and 34 formed at both edge portions of the TCP 30 are in one-to-one correspondence with the first pad 16 of the liquid crystal panel 10 and the second pad 22 of the printed circuit board 20, respectively. Is connected correspondingly.

  As described above, the process of connecting the first and second contact pads 32 and 34 of the TCP 30 to the first pad 16 of the liquid crystal panel 10 and the second pad 22 of the printed circuit board 20 in a one-to-one correspondence is usually performed by TAB. (Tape Automated Bonding).

  14 is a cross-sectional view taken along line III-III in FIG. As shown in FIG. 14, the first contact pad 32 at one edge of the tape carrier package (TCP) 30 faces and overlaps the first pad 16 at one edge of the array substrate 12. An array conductive substrate (ACF) 26 is interposed, and then the heat tool 45 is slid by pushing along the outer surface of the edge of the TCP 30 with a predetermined heat tool 45 to apply heat and pressure to the array substrate. The 12 first pads 16 and the first contact pads 32 of the TCP 30 are connected.

  Although not shown, the connection between the second pad 22 of the printed circuit board 20 and the second contact pad 34 of the TCP 30 is similarly performed.

  Here, the anisotropic conductive film (ACF) 26 is a tape-like material in which particles of a conductive substance are dispersed and contained in a thermosetting resin. The conductive substance particles are pushed up and down to connect the first pads 16 and the first contact pads 32 in a one-to-one correspondence.

  Such a TAB method is used more frequently than the COG method. The COG method has the advantage that the effective area of the panel can be expanded, the process is relatively simple, and the drive circuit is directly mounted on the substrate, so that the structure is simple. This is because there is a problem that it is not easy to attach the drive circuit to the substrate as the resolution is increased.

  Hereinafter, a conventional TCP alignment apparatus using such a TAB method will be schematically described with reference to FIGS. FIG. 15 is a process flow diagram for explaining a TCP alignment process using a conventional TCP alignment apparatus. FIG. 16 is a plan view schematically showing that in the TCP alignment process using the conventional TCP alignment apparatus, the ACF attachment and the TCP supply are individually performed using different apparatuses.

  As shown in FIG. 15, in a TCP alignment process using a conventional TCP alignment device, as a first step (S10), an ACF sticking device (not shown) on a first pad (not shown) at one edge of the array substrate 12 is used. ACF 26 is pasted so as to intersect with each other using an unillustrated).

  Next, as a second step (S 12), a first contact pad (not shown) at one edge of the TCP 30 is overlapped with the first pad at one edge of the array substrate 12.

  Next, as the third step (S14) and the fourth step (S16), the heat and the heat tool are slid by pushing along the outer surface of the edge of the TCP 30 using a predetermined heat tool (not shown). Pressure is applied to connect the first pad of the array substrate 12 and the first contact pad of the TCP 30. At this time, the anisotropic conductive film (ACF) 26 is a tape-like material in which particles of a conductive substance are dispersed and contained in a thermosetting resin. The conductive material particles are pushed up and down to connect the first pad and the first contact pad in a one-to-one correspondence.

  Next, as a fifth step (S18), a misalignment inspection apparatus (not shown) is used to check whether the ACF 26 and the TCP 30 are in contact with each other in the TAB step and the first pad of the liquid crystal panel 10 and the first contact pad of the TCP 30 are in contact. ).

  However, the conventional TCP alignment apparatus using the TAB method has the following problems. The conventional TCP alignment apparatus using the TAB method further requires an apparatus for supplying a tape carrier package (TCP) and performing TAB in addition to an apparatus for attaching an anisotropic conductive film (ACF). In particular, a device for attaching the anisotropic conductive film (ACF) to the liquid crystal panel is separately configured, but this device occupies about 30% or more of the total length of the TCP alignment device.

  In addition, the ACF sticking device of the conventional TCP aligning device accounts for about 30% of the total cost of the TCP aligning device, which increases the manufacturing cost.

  Furthermore, the ACF sticking device and the TCP sticking device of the conventional TCP aligning device are separated, resulting in an increase in layout and an increase in investment.

  The present invention has been made to solve such problems of the prior art, and the length of the entire apparatus is dramatically reduced and the investment amount is reduced without separately providing an ACF sticking apparatus. It is an object of the present invention to provide a manufacturing apparatus and a manufacturing method of a liquid crystal display device that can improve investment efficiency.

  In order to achieve the above object, an apparatus for manufacturing a liquid crystal display device according to the present invention includes an ACF cutting portion for cutting an anisotropic conductive film (ACF) and a tape on which the anisotropic conductive film (ACF) is attached. An ACF peeling unit for peeling the anisotropic conductive film (ACF) from a base film, and a TCP supply unit for feeding the tape carrier package (TCP) while preventing the carrier package (TCP) from being detached from the suction plate The tape carrier package (TCP) includes an ACF sticking correction unit that minimizes an error when supplying the tape carrier package (TCP) to attach the anisotropic conductive film (ACF), and an image sensor. The punching size of the tape carrier package (TCP) is measured and the alignment key formed on the tape carrier package (TCP) is measured. After the ACF application inspection part for confirming the position of the (align key) and the anisotropic conductive film (ACF) are attached to the tape carrier package (TCP), the anisotropic conductive film ( The ACF post-ACF check section for checking the presence / absence of the ACF) and the position of the alignment key and the tape carrier package (TCP) to which the anisotropic conductive film (ACF) is attached are vacuum-sucked and rotated while the tape And an index part for supplying the carrier package (TCP) to the pad terminal of the lower substrate.

  According to another aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device comprising: preparing a liquid crystal panel including an upper substrate, a lower substrate, and a liquid crystal layer formed between the upper substrate and the lower substrate; Cutting an anisotropic conductive film (ACF) affixed thereon, supplying a tape carrier package (TCP) having a driving device for the liquid crystal panel, and on the tape carrier package (TCP) Affixing the anisotropic conductive film (ACF), peeling the anisotropic conductive film (ACF) from the base film, and affixing the anisotropic conductive film (ACF) on the lower substrate And affixing the attached tape carrier package (TCP).

  Further, the method of manufacturing a liquid crystal display device according to the present invention includes a step of preparing a liquid crystal panel including an upper substrate, a lower substrate, and a liquid crystal layer formed between the upper substrate and the lower substrate, and a base film. Cutting an anisotropic conductive film (ACF) affixed thereon, supplying a tape carrier package (TCP) having a driving device for the liquid crystal panel, and on the tape carrier package (TCP) Affixing the anisotropic conductive film (ACF), peeling the anisotropic conductive film (ACF) from the base film, and affixing the anisotropic conductive film (ACF) on the lower substrate And affixing the attached tape carrier package (TCP).

  The present invention has the following effects.

  In the manufacturing apparatus and manufacturing method of the liquid crystal display device according to the present invention, the ACF sticking apparatus that occupies 1/5 of the total length of the TCP alignment apparatus is integrated into the pre-TCP sticking apparatus without being separately configured, and the tape carrier package (TCP) is liquid crystal. By sticking directly to the panel, the length of the device can be dramatically shortened.

  Therefore, the manufacturing apparatus and manufacturing method of the liquid crystal display device according to the present invention integrates the ACF attaching function into the pre-TCP attaching apparatus without separately configuring the ACF attaching apparatus, and directly attaches the tape carrier package (TCP) to the liquid crystal panel. As a result, the length of the device can be remarkably shortened, and the clean room at the time of the liquid crystal display device module process can be utilized for other purposes without investment.

  The liquid crystal display manufacturing apparatus and manufacturing method according to the present invention can ensure quality and ease of setting by applying an auto-rotation type automatic correction structure to which a hinge is applied. That is, the anisotropic conductive film (ACF) can be precisely attached to the tape carrier package (TCP) by applying the correction structure when attaching the ACF.

  In the manufacturing apparatus and manufacturing method of the liquid crystal display device according to the present invention, an alignment key is formed on a tape carrier package (TCP) to which an anisotropic conductive film (ACF) is attached, and the anisotropy is obtained by an imaging device. The conductive film (ACF) can be accurately aligned corresponding to the alignment key formed on the tape carrier package (TCP).

  Furthermore, the manufacturing apparatus and manufacturing method of the liquid crystal display device according to the present invention can confirm the ACF attachment accuracy by confirming the state in which the tape carrier package (TCP) is cut, and the ACF can be attached by the image sensor. The presence or absence can be easily inspected.

It is the schematic which shows schematically the manufacturing apparatus of the liquid crystal display device by this invention. It is the schematic which shows the ACF cutting part of the manufacturing apparatus of the liquid crystal display device by this invention. It is the schematic which shows the ACF peeling part of the manufacturing apparatus of the liquid crystal display device by this invention. It is the schematic which shows ACF supply and a sticking part of the manufacturing apparatus of the liquid crystal display device by this invention. It is the schematic which shows the sticking tool part of the manufacturing apparatus of the liquid crystal display device by this invention. It is the schematic which shows the ACF sticking correction | amendment part of the manufacturing apparatus of the liquid crystal display device by this invention. It is the schematic which shows the inspection part before ACF sticking of the manufacturing apparatus of the liquid crystal display device by this invention. It is the schematic which shows the inspection part after ACF sticking of the manufacturing apparatus of the liquid crystal display device by this invention. It is the schematic which shows the camera for an ACF sticking before / after inspection, and an index part of the manufacturing apparatus of the liquid crystal display device by this invention. It is an alignment process flowchart for demonstrating the TCP alignment process of the manufacturing apparatus of the liquid crystal display device by this invention. It is a top view which shows schematically the affixing to the panel of TCP with which ACF was affixed in the TCP alignment process of the manufacturing apparatus of the liquid crystal display device by this invention. It is a perspective view which shows a general liquid crystal panel roughly. It is an expansion perspective view of the A section of FIG. It is the III-III sectional view taken on the line of FIG. It is a process flowchart for demonstrating the TCP alignment process using the conventional TCP alignment apparatus. FIG. 10 is a plan view schematically showing that in a TCP alignment process using a conventional TCP alignment apparatus, ACF attachment and TCP supply are individually performed using different apparatuses.

  Hereinafter, an apparatus for manufacturing a liquid crystal display device according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic view schematically showing an apparatus for manufacturing a liquid crystal display device according to the present invention. As shown in FIG. 1, a TCP alignment device 200, which is a liquid crystal display manufacturing apparatus according to the present invention, includes an ACF cutting unit 210, an ACF stripping unit 220, an ACF supply and pasting unit 230, a pasting tool unit 240, and an ACF pasting correction unit. 250, the inspection part 260 before ACF sticking (refer to Drawing 7), the inspection part 270 after ACF sticking (refer to Drawing 8), and index part 290 (refer to Drawing 9).

  Here, the ACF cutting unit 210 plays a role of ensuring quality and setting reliability by applying an autonomous rotation type automatic correction structure to which a hinge is applied.

  The ACF peeling unit 220 is a separator-type peeling device that prevents the tape carrier package (TCP) to which the anisotropic conductive film (ACF) is attached from being detached from the suction plate (not shown). .

  In addition, the ACF supply and pasting unit 230 and the pasting tool unit 240 can minimize errors when feeding the tape carrier package (TCP) to precisely paste the anisotropic conductive film (ACF). Apply structure.

  Further, the ACF sticking correction unit 250 moves the ACF supply and the sticking unit 230 by an error amount when the TCP punching accuracy and the TCP centering accuracy change, so that the precise sticking accuracy is maintained.

  The ACF pre-inspection inspection unit 260 includes an image sensor, for example, a camera. This camera measures the punching size of TCP and confirms the position of an alignment key (alignment key). Send to.

  The post-ACF inspection unit 270 includes an image sensor, for example, a camera. After the anisotropic conductive film (ACF) is attached to the tape carrier package (TCP), the anisotropic conductive film is used by the camera. Check whether (ACF) is applied and the position of the alignment key.

  The index unit 290 vacuum-sucks the tape carrier package (TCP) and rotates it by about 60 ° to supply the tape carrier package (TCP) to the pad terminal of the lower substrate.

  FIG. 2 is a schematic diagram illustrating an ACF cutting unit of a TCP alignment apparatus for manufacturing a liquid crystal display device according to the present invention. As shown in FIG. 2, the ACF cutting unit 210 according to the present invention secures quality and setting reliability by applying an auto-rotation type automatic correction structure to which a hinge is applied.

  Previously, the cutter was set based on the setting jig, but quality problems such as the anisotropic conductive film (ACF) not being cut or being cut more than necessary after being attached to the forward / reverse part occurred. It was.

  In order to improve such a problem, in the present invention, the setting of the cutter based on the setting jig is not different from the conventional method, but the structure of the board portion is changed as shown in FIG. That is, when the jig 212 advances and abuts against the board 214 to cut the anisotropic conductive film (ACF) on the base film (not shown; see 140 in FIG. 3), the board 214 is instantaneously moved. It is tilted about the hinge 216 and remains parallel to the cutter 218.

  The blade and the ACF are made parallel by finely rotating the board 214 supporting the ACF in accordance with the parallelism with the cutting edge of the cutter 218 that cuts the ACF. That is, when the cutter 218 that cuts the ACF moves forward to the board 214 on which the ACF is placed, the ACF is cut evenly when the cutter 218 and the board 214 are parallel to each other. Are fixed in a state where they are not parallel, the jig 212 for fixing the cutter 218 abuts on the board 214 that can rotate around the hinge 216, so that the parallelism can be achieved with the board 214 in contact with the surface of the jig 212. adjust. Therefore, the cutting setting, which has conventionally been repeated several times, can be completed in one time in the present invention.

  FIG. 3 is a schematic view showing an ACF peeling portion of a TCP alignment apparatus for manufacturing a liquid crystal display device according to the present invention. As shown in FIG. 3, the ACF peeling unit 220 of the TCP alignment device for manufacturing a liquid crystal display device according to the present invention moves forward or backward by a forward / backward moving part 224 and is separated from the base film 140 using the separator 226. This is a peeling device for peeling (ACF) 126 so that the tape carrier package (TCP) 130 to which the anisotropic conductive film (ACF) 126 is attached is not detached from the suction plate (not shown).

  That is, a process of peeling the ACF from the base film after the ACF on the base film is attached to the TCP together is necessary. At this time, when the ACF is peeled off from the base film, both the TCPs come off (this is because the adhesive force between the ACF and the base film is stronger than the adsorbing force of the equipment adsorbing the TCP). In order to prevent such a phenomenon, the TCP is pushed in a direction in which it is adsorbed by a small plate (not shown).

  Conventionally, the ACF and the base film are separated by a roller-type peeling portion. However, in the present invention, a method in which the anisotropic conductive film (ACF) 126 is directly and precisely attached to the tape carrier package (TCP) 130 is used. By applying the tape carrier package (TCP) 130 that is vacuum-sucked due to the force acting perpendicularly to the tape carrier package (TCP) generated at the moment of peeling depending on the roller type peeling portion, the tape carrier package (TCP) 130 may be detached. A separator type peeling device is applied.

  Moreover, the edge part of the separator 226 is processed into the pointed shape, and is round-processed so that the radius R may be set to about 0.2-3 mm.

  Therefore, there is an effect that the force applied in the vertical direction of the tape carrier package (TCP) 130 can be adjusted by changing the sharpness and angle of the ACF peeling portion according to the present invention.

  FIG. 4 is a schematic view showing an ACF supply and a pasting portion of a TCP alignment apparatus for manufacturing a liquid crystal display device according to the present invention. FIG. 5 is a schematic view showing a pasting tool portion of a TCP alignment device for manufacturing a liquid crystal display device according to the present invention.

  As shown in FIG. 4, the ACF supply and pasting unit 230 according to the present invention includes an ACF supply actuator 232 and an ACF supply gripper 234. The ACF supply actuator 232 supplies an anisotropic conductive film (ACF) to supply an ACF. The anisotropic conductive film (ACF) is supplied by a certain length in consideration of the accuracy of attaching the gripper 234 to the tape carrier package (TCP).

  Further, as shown in FIG. 5, the sticking tool portion 240 of the TCP aligning apparatus includes a tool tip 242 and sticks an anisotropic conductive film (ACF) to the tape carrier package (TCP). It plays a role of pressurizing at a constant pressure.

  FIG. 6 is a schematic diagram illustrating an ACF sticking correction unit of a TCP alignment device for manufacturing a liquid crystal display device according to the present invention.

  As shown in FIG. 6, the ACF sticking correction unit 250 of the TCP alignment device for manufacturing a liquid crystal display device according to the present invention moves the ACF supply and sticking unit 230 by an error amount when the TCP punching accuracy and the TCP centering accuracy change. In this way, precise pasting accuracy is maintained.

  In FIG. 6, reference numeral 252 denotes a servo motor, and reference numerals 254 and 258 denote LM motors, which indicate blocks on the LM rail that accurately guide linear motion. Reference numeral 256 denotes a nut.

  Conventionally, when an anisotropic conductive film (ACF) is attached to a liquid crystal panel, the attachment accuracy is ± 200 μm level and no additional correction device is required. However, the anisotropic conductive film (ACF) is a tape carrier package. In the case of the present invention that is directly attached to (TCP), an additional correction device is required on the Y axis with an attaching accuracy of ± 100 μm level. Here, the Y axis indicates the width direction (for example, 1 to 2 mm) of the ACF, and the direction perpendicular to the Y axis, that is, the direction in which the ACF is fed out is defined as the X axis.

  Further, in the present invention, before attaching the ACF, the edge / alignment mark of the tape carrier package (TCP) is recognized by the camera as the image pickup device, the size and the suction position are confirmed, and the position of the ACF is corrected. .

  Therefore, the specification is satisfied by recognizing and correcting in advance the abnormality in the pasting accuracy due to the TCP punching accuracy and the TCP supply accuracy.

  7 and 8 are schematic views illustrating an ACF pre- / post-inspection unit of the TCP alignment apparatus for manufacturing a liquid crystal display device according to the present invention.

FIG. 9 is a schematic view showing an ACF pre- / post-inspection camera and an index portion of a TCP alignment device for manufacturing a liquid crystal display device according to the present invention.

  As shown in FIG. 7, the ACF pre-inspection inspection unit 260 of the liquid crystal display device manufacturing TCP alignment apparatus according to the present invention measures the TCP punching size and confirms the alignment key position using the camera 264 as an image sensor. The information is sent to the ACF sticking correction unit.

  Further, the ACF post-inspection inspection unit 270 of the TCP alignment apparatus for manufacturing a liquid crystal display device according to the present invention confirms the position of the alignment key together with the presence / absence of the ACF as shown in FIGS. 8 and 9.

  Furthermore, the ACF post-inspection inspection unit 270 according to the present invention recognizes the TCP edge / alignment mark necessary for error correction in the Y-axis direction by the camera 274 in order to achieve ACF attachment accuracy within ± 100 μm. To do. Here, the Y axis indicates the width direction (for example, 1 to 2 mm) of the ACF, and the direction perpendicular to the Y axis, that is, the direction in which the ACF is fed out is defined as the X axis.

  The ACF pre-attachment inspection unit 260 according to the present invention recognizes the TCP edge / alignment mark by the camera 264 and confirms the size and suction position and corrects the ACF position before attaching the ACF. Here, reference numeral 262 is a servo motor, and 272 is a cylinder.

  Therefore, the ACF application accuracy can be improved by the cameras 264 and 274 of the ACF application before and after inspection units 260 and 270 according to the present invention, the quality determination of the ACF application is easy, and the defective TCP can be selected. .

  As shown in FIG. 9, the index unit 290 according to the present invention vacuum-sucks the tape carrier package (TCP) to which the anisotropic conductive film (ACF) is attached, and rotates the tape carrier package (TCP) by about 60 °. TCP) is supplied to a pad terminal provided on the lower substrate of the liquid crystal panel.

  Hereinafter, a liquid crystal display device manufacturing method using the liquid crystal display device manufacturing apparatus according to the present invention configured as described above will be described in detail with reference to the accompanying drawings.

  FIG. 10 is an alignment process flow chart for explaining a TCP alignment process using the TCP alignment apparatus for manufacturing a liquid crystal display device according to the present invention. FIG. 11 is a plan view schematically showing the attachment of the TCP with the ACF attached thereto in the TCP alignment process using the TCP alignment apparatus for manufacturing a liquid crystal display device according to the present invention.

  First, although not shown, a plurality of thin film transistors and pad terminals for supplying signals to the thin film transistors are formed on the lower substrate 102.

  Next, although not shown, a black matrix that blocks light and a color filter that transmits light and realizes an image are formed on the upper substrate 108.

  Next, the lower substrate 102 and the upper substrate 108 are bonded so that liquid crystal (not shown) is included between the lower substrate 102 and the upper substrate 108, whereby the liquid crystal panel 100 shown in FIG. 11 is manufactured.

  Next, as shown in FIGS. 10 and 11, the driving element of the liquid crystal panel 100 is attached, and an alignment mark (not shown) for assisting the attachment of the anisotropic conductive film (ACF) 126 is formed. A tape carrier package (TCP) 130 is supplied.

  Next, the anisotropic conductive film (ACF) 126 is aligned on the tape carrier package (TCP) 130 so as to correspond to the alignment mark by a camera (not shown), and the anisotropic conductive film (ACF) 126 is aligned. Is affixed on a tape carrier package (TCP) 130. At this time, the punching size of the tape carrier package (TCP) 130 is measured and the position of the alignment key is confirmed using the ACF pre-inspection inspection unit 260 shown in FIG. 7, and the information is obtained from the ACF sticking correction unit 250 shown in FIG. Send to. In other words, the punching size of the tape carrier package (TCP) 130 is measured by the camera 264 provided in the ACF pre-inspection inspection unit 260 and the position of the alignment key is confirmed. If misalignment occurs, before attaching the ACF, the camera 264 recognizes the edge / alignment mark of the TCP 130, confirms the size and suction position, and corrects the ACF position. Here, the width of the anisotropic conductive film (ACF) 126 attached on the tape carrier package (TCP) 130 is preferably narrower than the width of the tape carrier package (TCP) 130.

  Next, after the anisotropic conductive film (ACF) 126 is attached to the tape carrier package (TCP) 130, the ACF attachment accuracy is increased by the camera 274 provided in the post-ACF attachment inspection unit 270 shown in FIG. In order to realize within ± 100 μm, the TCP edge / alignment mark necessary for error correction in the Y-axis direction is recognized.

  Therefore, the ACF application accuracy can be improved by the cameras 264 and 274 of the ACF application before and after inspection units 260 and 270 according to the present invention, the quality determination of the ACF application is easy, and the defective TCP can be selected. .

  Next, the tape carrier package (TCP) 130 to which the anisotropic conductive film (ACF) 126 is attached in this manner is bonded to a pad terminal (not shown) of the lower substrate 102. At this time, the tape carrier package (TCP) 130 to which the anisotropic conductive film (ACF) 126 is attached is vacuum-sucked by the index portion 290 shown in FIG. 9 and rotated by about 60 ° to rotate the tape carrier package (TCP ) 130 is supplied to the pad terminal of the lower substrate 102 (S110).

  Next, heat and pressure are applied by sliding along the outer surface of the edge of the tape carrier package (TCP) 130 with a predetermined heat tool (not shown) (S112, S114), The pad terminal of the substrate 102 and the contact pad (not shown) of the tape carrier package (TCP) 130 are connected. Here, the anisotropic conductive film (ACF) 126 is a tape-like material in which particles of a conductive substance are dispersed and contained in a thermosetting resin. The conductive material particles are pushed up and down to connect the pad terminals of the lower substrate 102 and the contact pads of the tape carrier package (TCP) 130 in a one-to-one correspondence.

  Next, a tape carrier package (TCP) 130 to which the anisotropic conductive film (ACF) 126 is attached in the TAB process is applied to the pad terminal of the liquid crystal panel 100 and the tape carrier by a misalignment inspection device (not shown). By inspecting whether the contact pads of the package (TCP) 130 are in proper contact (S116), the tape carrier package (TCP) bonding process is completed.

  As described above, the manufacturing apparatus and the manufacturing method of the liquid crystal display device according to the present invention integrates the ACF sticking apparatus that occupies 1/5 of the total length of the TCP aligning apparatus into the pre-TCP sticking apparatus without separately configuring the tape carrier. By directly attaching the package (TCP) to the liquid crystal panel, the length of the device can be dramatically reduced.

  Therefore, the manufacturing apparatus and manufacturing method of the liquid crystal display device according to the present invention integrates the ACF sticking function into the pre-TCP sticking device without separately configuring the ACF sticking device, and directly sticks the tape carrier package (TCP) to the liquid crystal panel. As a result, the length of the device can be dramatically reduced, and the clean room at the time of the liquid crystal display device module process can be utilized for other purposes without investment.

  In addition, the manufacturing apparatus and the manufacturing method of the liquid crystal display device according to the present invention can ensure quality and ease of setting by applying an auto-rotation type automatic correction structure in which a hinge is applied to the ACF cutting portion. That is, the anisotropic conductive film (ACF) can be precisely attached to the tape carrier package (TCP) by applying the correction structure when attaching the ACF.

  Furthermore, in the manufacturing apparatus and manufacturing method of the liquid crystal display device according to the present invention, an alignment key is formed on a tape carrier package (TCP) to which an anisotropic conductive film (ACF) is attached, and the anisotropic element is formed by an imaging device. The conductive film (ACF) can be accurately aligned corresponding to the alignment key formed on the tape carrier package (TCP).

  Furthermore, the manufacturing apparatus and manufacturing method of the liquid crystal display device according to the present invention can confirm the ACF attachment accuracy by confirming the state in which the tape carrier package (TCP) is cut, and the ACF can be attached by the image sensor. The presence or absence can be easily inspected.

  The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those who have ordinary knowledge in the technical field to which the present invention belongs can be used without changing the technical idea and essential features of the present invention. It will be understood that it can be implemented in other specific forms.

  Therefore, the embodiments described above are provided so that those having ordinary knowledge in the technical field to which the present invention pertains can understand the technical significance of the invention. It should be understood that the invention is not limited thereto, and the invention is defined only by the claims.

100 Liquid crystal panel 102 Lower substrate 108 Upper substrate 126 Anisotropic conductive film (ACF)
130 Tape Carrier Package (TCP)
200 TCP alignment device 210 ACF cutting unit 220 ACF stripping unit 230 ACF supply and pasting unit (TCP supply unit)
240 Affixing tool part 250 ACF sticking correction part 260 ACF pre-pasting inspection part 264 Camera 270 ACF post-sticking inspection part 274 Camera 290 Index part

Claims (17)

An ACF cutting part for cutting the anisotropic conductive film (ACF);
A tape carrier package (TCP) to which the anisotropic conductive film (ACF) is attached is prevented from being detached from the suction plate, and an ACF peeling portion for peeling the anisotropic conductive film (ACF) from a base film; ,
A TCP supply unit for supplying the tape carrier package (TCP);
An ACF sticking correction unit that minimizes an error when supplying the tape carrier package (TCP) to stick the anisotropic conductive film (ACF);
An ACF pre-inspection inspection unit that measures a punching size of the tape carrier package (TCP) by an image sensor and confirms a position of an alignment key (alignment key) formed on the tape carrier package (TCP);
After attaching the anisotropic conductive film (ACF) to the tape carrier package (TCP), and after attaching the ACF to confirm the presence / absence of the anisotropic conductive film (ACF) and the position of the alignment key by an image sensor An inspection department;
Liquid crystal including an index part that vacuum-sucks the tape carrier package (TCP) to which the anisotropic conductive film (ACF) is attached and supplies the tape carrier package (TCP) to the pad terminal of the lower substrate while rotating. Display device manufacturing equipment. The ACF cutting part is
A cutter that moves to cut the anisotropic conductive film (ACF);
The apparatus for manufacturing a liquid crystal display device according to claim 1, further comprising: a board that rotates about a hinge positioned in parallel with the cutter and abuts with the cutter. The ACF peeling portion is
A forward-reverse portion that moves forward or backward to the base film;
The apparatus for manufacturing a liquid crystal display device according to claim 1, further comprising a separator that moves forward or backward by the forward / backward moving part and peels the anisotropic conductive film (ACF) from the base film. The TCP supply unit
A TCP supply gripper for gripping the tape carrier package (TCP) with a defined length;
The apparatus for manufacturing a liquid crystal display device according to claim 1, further comprising a TCP supply actuator that supplies the tape carrier package (TCP). 2. The liquid crystal display according to claim 1, further comprising a pasting tool portion including a tool tip that is pasted on the tape carrier package (TCP) and pressurized with a certain pressure to the anisotropic conductive film (ACF). Equipment manufacturing equipment. The image sensor of the inspection part before ACF attachment is:
The apparatus for manufacturing a liquid crystal display device according to claim 1, wherein the apparatus is used for measuring a punching size of the tape carrier package (TCP) and confirming a position of an alignment mark. The image sensor of the inspection part before ACF attachment is:
2. The apparatus for manufacturing a liquid crystal display device according to claim 1, wherein the apparatus is used for recognizing an edge / alignment mark of the tape carrier package (TCP) necessary for correcting an error. Preparing a liquid crystal panel comprising an upper substrate, a lower substrate, and a liquid crystal layer formed between the upper substrate and the lower substrate;
Cutting the anisotropic conductive film (ACF) affixed on the base film;
Supplying a tape carrier package (TCP) including the liquid crystal panel driving device;
Affixing the anisotropic conductive film (ACF) on the tape carrier package (TCP);
Peeling the anisotropic conductive film (ACF) from the base film;
And a step of attaching a tape carrier package (TCP) having the anisotropic conductive film (ACF) attached to the lower substrate. Measuring the punching size of the tape carrier package (TCP) with an image sensor and confirming the position of the alignment mark on the tape carrier package (TCP);
The liquid crystal display using a TCP alignment device according to claim 8, further comprising a step of adjusting a position of an alignment mark with respect to the anisotropic conductive film (ACF) according to a result of the measurement process. Device manufacturing method. After attaching the anisotropic conductive film (ACF) on the tape carrier package (TCP), measuring the position of the anisotropic conductive film (ACF) and confirming the position of the alignment mark is further included. The manufacturing method of the liquid crystal display device using the TCP alignment apparatus of Claim 9 characterized by the above-mentioned. The step of attaching the tape carrier package (TCP) in which the anisotropic conductive film (ACF) is attached on the lower substrate,
The liquid crystal display using a TCP alignment device according to claim 8, further comprising a step of moving a tape carrier package (TCP) having the anisotropic conductive film (ACF) attached to the lower substrate side. Device manufacturing method. The step of moving the tape carrier package (TCP) having the anisotropic conductive film (ACF) attached to the lower substrate side,
The liquid crystal display device using the TCP alignment device according to claim 11, further comprising: adsorbing the tape carrier package (TCP) to which the anisotropic conductive film (ACF) is attached by an adsorbing device. Production method. A method of manufacturing a liquid crystal display device using the device of claim 1,
Preparing a liquid crystal panel comprising an upper substrate, a lower substrate, and a liquid crystal layer formed between the upper substrate and the lower substrate;
Cutting the anisotropic conductive film (ACF) affixed on the base film;
Supplying a tape carrier package (TCP) including the liquid crystal panel driving device;
Affixing the anisotropic conductive film (ACF) on the tape carrier package (TCP);
Peeling the anisotropic conductive film (ACF) from the base film;
And a step of attaching a tape carrier package (TCP) on which the anisotropic conductive film (ACF) is attached to the lower substrate. Before affixing the anisotropic conductive film (ACF) on the tape carrier package (TCP), the punching size of the tape carrier package (TCP) is measured by an image sensor, and the tape carrier package (TCP) Checking the position of the alignment mark of
The method of manufacturing a liquid crystal display device according to claim 13, further comprising: adjusting a position of the alignment mark with respect to the anisotropic conductive film (ACF) according to a result of the measurement process. After attaching the anisotropic conductive film (ACF) on the tape carrier package (TCP), measuring the position of the anisotropic conductive film (ACF) and confirming the position of the alignment mark is further included. The method for manufacturing a liquid crystal display device according to claim 14, further comprising: The step of attaching the tape carrier package (TCP) in which the anisotropic conductive film (ACF) is attached on the lower substrate,
14. The method of manufacturing a liquid crystal display device according to claim 13, further comprising a step of moving a tape carrier package (TCP) having the anisotropic conductive film (ACF) attached to the lower substrate side. The step of moving the tape carrier package (TCP) having the anisotropic conductive film (ACF) attached to the lower substrate side,
The method of manufacturing a liquid crystal display device according to claim 16, further comprising: adsorbing the tape carrier package (TCP) to which the anisotropic conductive film (ACF) is attached by an adsorbing device.

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