TWI359207B - - Google Patents
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- TWI359207B TWI359207B TW95118393A TW95118393A TWI359207B TW I359207 B TWI359207 B TW I359207B TW 95118393 A TW95118393 A TW 95118393A TW 95118393 A TW95118393 A TW 95118393A TW I359207 B TWI359207 B TW I359207B
- Authority
- TW
- Taiwan
- Prior art keywords
- compound
- acid
- water
- ethoxy
- methylethoxy
- Prior art date
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- -1 carboxylic acid compound Chemical class 0.000 claims description 86
- 150000001875 compounds Chemical class 0.000 claims description 52
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 239000000126 substance Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 27
- 239000013589 supplement Substances 0.000 claims description 22
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 15
- 238000004381 surface treatment Methods 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 11
- 230000004907 flux Effects 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 150000002923 oximes Chemical class 0.000 claims description 3
- 206010036790 Productive cough Diseases 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- 210000003802 sputum Anatomy 0.000 claims description 2
- 208000024794 sputum Diseases 0.000 claims description 2
- 125000004429 atom Chemical group 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 92
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Chemical compound CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 46
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 45
- 229910000679 solder Inorganic materials 0.000 description 39
- 235000011054 acetic acid Nutrition 0.000 description 34
- 239000002253 acid Substances 0.000 description 24
- 235000019260 propionic acid Nutrition 0.000 description 23
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- 229910052802 copper Inorganic materials 0.000 description 19
- 239000010949 copper Substances 0.000 description 19
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 18
- 238000012360 testing method Methods 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 14
- 210000003296 saliva Anatomy 0.000 description 12
- 238000005476 soldering Methods 0.000 description 11
- 239000002904 solvent Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 230000005496 eutectics Effects 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Substances OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000000052 vinegar Substances 0.000 description 6
- 235000021419 vinegar Nutrition 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- JRXXEXVXTFEBIY-UHFFFAOYSA-N 3-ethoxypropanoic acid Chemical compound CCOCCC(O)=O JRXXEXVXTFEBIY-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000002674 ointment Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 3
- OWVMFLLVLFONOO-UHFFFAOYSA-N 3-butoxypropanoic acid Chemical compound CCCCOCCC(O)=O OWVMFLLVLFONOO-UHFFFAOYSA-N 0.000 description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- 229940126062 Compound A Drugs 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- YZGQDNOIGFBYKF-UHFFFAOYSA-N Ethoxyacetic acid Chemical compound CCOCC(O)=O YZGQDNOIGFBYKF-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 235000015429 Mirabilis expansa Nutrition 0.000 description 3
- 244000294411 Mirabilis expansa Species 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 150000001242 acetic acid derivatives Chemical class 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 3
- 235000019253 formic acid Nutrition 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 3
- 235000013536 miso Nutrition 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- 230000007928 solubilization Effects 0.000 description 3
- 238000005063 solubilization Methods 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 150000003752 zinc compounds Chemical class 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- FYRBJJHCFFXENF-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]acetic acid Chemical compound CCOCCOCCOCC(O)=O FYRBJJHCFFXENF-UHFFFAOYSA-N 0.000 description 2
- SGUYGLMQEOSQTH-UHFFFAOYSA-N 2-propoxyacetic acid Chemical compound CCCOCC(O)=O SGUYGLMQEOSQTH-UHFFFAOYSA-N 0.000 description 2
- YZLDXPLNKWTMOO-UHFFFAOYSA-N 3-propoxypropanoic acid Chemical compound CCCOCCC(O)=O YZLDXPLNKWTMOO-UHFFFAOYSA-N 0.000 description 2
- CPHGOBGXZQKCKI-UHFFFAOYSA-N 4,5-diphenyl-1h-imidazole Chemical compound N1C=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 CPHGOBGXZQKCKI-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229930182558 Sterol Natural products 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000005605 benzo group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 150000007942 carboxylates Chemical class 0.000 description 2
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 description 2
- JNGZXGGOCLZBFB-IVCQMTBJSA-N compound E Chemical compound N([C@@H](C)C(=O)N[C@@H]1C(N(C)C2=CC=CC=C2C(C=2C=CC=CC=2)=N1)=O)C(=O)CC1=CC(F)=CC(F)=C1 JNGZXGGOCLZBFB-IVCQMTBJSA-N 0.000 description 2
- 150000001880 copper compounds Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- NTTOTNSKUYCDAV-UHFFFAOYSA-N potassium hydride Chemical compound [KH] NTTOTNSKUYCDAV-UHFFFAOYSA-N 0.000 description 2
- 229910000105 potassium hydride Inorganic materials 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- QDRKDTQENPPHOJ-UHFFFAOYSA-N sodium ethoxide Chemical compound [Na+].CC[O-] QDRKDTQENPPHOJ-UHFFFAOYSA-N 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 235000003702 sterols Nutrition 0.000 description 2
- WEZYFYMYMKUAHY-UHFFFAOYSA-N tert-butyl 2,4-dibenzylpiperazine-1-carboxylate Chemical compound C1C(CC=2C=CC=CC=2)N(C(=O)OC(C)(C)C)CCN1CC1=CC=CC=C1 WEZYFYMYMKUAHY-UHFFFAOYSA-N 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- LVLQKFRSMSHJIE-UHFFFAOYSA-N (2-ethoxyethoxy)acetic acid Chemical compound CCOCCOCC(O)=O LVLQKFRSMSHJIE-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- KKKDZZRICRFGSD-UHFFFAOYSA-N 1-benzylimidazole Chemical compound C1=CN=CN1CC1=CC=CC=C1 KKKDZZRICRFGSD-UHFFFAOYSA-N 0.000 description 1
- YPDNYTJCMSLJPZ-UHFFFAOYSA-N 1-dodecyl-2-methylindole Chemical compound C1=CC=C2N(CCCCCCCCCCCC)C(C)=CC2=C1 YPDNYTJCMSLJPZ-UHFFFAOYSA-N 0.000 description 1
- SEULWJSKCVACTH-UHFFFAOYSA-N 1-phenylimidazole Chemical compound C1=NC=CN1C1=CC=CC=C1 SEULWJSKCVACTH-UHFFFAOYSA-N 0.000 description 1
- VVZRKVYGKNFTRR-UHFFFAOYSA-N 12h-benzo[a]xanthene Chemical compound C1=CC=CC2=C3CC4=CC=CC=C4OC3=CC=C21 VVZRKVYGKNFTRR-UHFFFAOYSA-N 0.000 description 1
- CXYVKXKWSPEULT-UHFFFAOYSA-N 1h-imidazol-1-ium-4-thiolate Chemical compound SC1=CNC=N1 CXYVKXKWSPEULT-UHFFFAOYSA-N 0.000 description 1
- HGUFODBRKLSHSI-UHFFFAOYSA-N 2,3,7,8-tetrachloro-dibenzo-p-dioxin Chemical compound O1C2=CC(Cl)=C(Cl)C=C2OC2=C1C=C(Cl)C(Cl)=C2 HGUFODBRKLSHSI-UHFFFAOYSA-N 0.000 description 1
- ZUTDFFRCHGNSPG-UHFFFAOYSA-N 2-(1-methoxypropan-2-yloxy)propanoic acid Chemical compound COCC(C)OC(C)C(O)=O ZUTDFFRCHGNSPG-UHFFFAOYSA-N 0.000 description 1
- XVOUVHUXQCZKEZ-UHFFFAOYSA-N 2-(1-propoxypropan-2-yloxy)acetic acid Chemical compound CCCOCC(C)OCC(O)=O XVOUVHUXQCZKEZ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- CLLLODNOQBVIMS-UHFFFAOYSA-N 2-(2-methoxyethoxy)acetic acid Chemical compound COCCOCC(O)=O CLLLODNOQBVIMS-UHFFFAOYSA-N 0.000 description 1
- JIXHYWCLUOGIMM-UHFFFAOYSA-N 2-(2-methoxyethoxy)propanoic acid Chemical compound COCCOC(C)C(O)=O JIXHYWCLUOGIMM-UHFFFAOYSA-N 0.000 description 1
- RJZXMJIGAJFDRS-UHFFFAOYSA-N 2-(2-methylpropoxy)acetic acid Chemical compound CC(C)COCC(O)=O RJZXMJIGAJFDRS-UHFFFAOYSA-N 0.000 description 1
- WHONSTMWVPUOEI-UHFFFAOYSA-N 2-(2-propan-2-yloxyethoxy)acetic acid Chemical compound CC(C)OCCOCC(O)=O WHONSTMWVPUOEI-UHFFFAOYSA-N 0.000 description 1
- ZHBMRWPFBZGOII-UHFFFAOYSA-N 2-(2-propoxyethoxy)acetic acid Chemical compound CCCOCCOCC(O)=O ZHBMRWPFBZGOII-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XZXYQEHISUMZAT-UHFFFAOYSA-N 2-[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CC1=CC=C(O)C(CC=2C(=CC=C(C)C=2)O)=C1 XZXYQEHISUMZAT-UHFFFAOYSA-N 0.000 description 1
- YHBWXWLDOKIVCJ-UHFFFAOYSA-N 2-[2-(2-methoxyethoxy)ethoxy]acetic acid Chemical compound COCCOCCOCC(O)=O YHBWXWLDOKIVCJ-UHFFFAOYSA-N 0.000 description 1
- ICUQKOOCTBJFHS-UHFFFAOYSA-N 2-[2-(2-methoxyethoxy)ethoxy]propanoic acid Chemical compound COCCOCCOC(C)C(O)=O ICUQKOOCTBJFHS-UHFFFAOYSA-N 0.000 description 1
- SQSTUYGYUQYUIH-UHFFFAOYSA-N 2-[2-(2-methylpropoxy)ethoxy]acetic acid Chemical compound CC(C)COCCOCC(O)=O SQSTUYGYUQYUIH-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C59/00—Compounds having carboxyl groups bound to acyclic carbon atoms and containing any of the groups OH, O—metal, —CHO, keto, ether, groups, groups, or groups
- C07C59/40—Unsaturated compounds
- C07C59/58—Unsaturated compounds containing ether groups, groups, groups, or groups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
九、發明說明: •【發明所屬之技術領域】 •本發明係關於在構成印刷佈線板之電路部之金屬製導 •電部表Φ進行電子零㈣之焊接時所使㈣水溶性預焊 劑及其利用。 【先前技術】 近來,印刷佈線板之安裝方法多採用可提高安裝密度之 表面安裝。此等表面安裝方法,可分為以軟膏狀焊料來接 合晶片零件之雙面表面安裝、組合用軟膏狀焊料的晶片零 件之表面女裝與分立零件之通孔(thr〇Ugh h〇 1 e)安裝 等。於任一安裝方法中,由於印刷佈線板須進行複數次之 知接,母次皆須曝露於高溫下而承受嚴苛的熱經歷。 其結果’由於印刷佈線板之構成電路部之金屬製導電部 的銅、銅合金與銀等之金屬表面係藉由加熱而促進氧化膜 之形成,故無法良好保持該導電部表面之焊接性。 φ 為保護此等印刷佈線板之金屬製導電部免於空氣氧 化’係廣泛進行使用表面處理劑在該導電部表面形成化成 皮膜之處理’但要求金屬製導電部即使承受複數次的熱經 歷後化成皮膜亦不會劣化,而可保護金屬製導電部,藉此 保持良好的焊接性。 由於咪唑化合物具有優異的造膜性,作為此等表面處理 劑已提案有各種含有咪唑化合物之水溶性預焊劑。例如, 於專利文獻1〜4中,作為前述σ米°坐化合物,已揭示有:2 ~ Ί 烧基咪唑般之2-烷基咪唑化合物;2-苯基。米β坐、2- 326\專利說明書(補件)\95-09\95118393 5 1359207 笨基4-甲基咪。坐般之2-芳基咪嗤化合物;2_壬基笨并咪 唑般之2-烷基笨并咪唑化合物;2_(4_氯苯基曱基)苯并 •米°坐般之2-芳虎基苯并咪嗤化合物。 然而’由於咪唑化合物通常為水難溶性,故須使用形成 其水溶性鹽之有機酸或無機酸作為可溶化劑使其溶解於 水中。 ' 近$來,廣泛地使用兼具有使咪唑化合物溶解於水之優 異性能、與使咪唑化合物之造膜性發揮之優異性能的蟻酸 與醋酸作為可溶化劑,惟,此等酸化合物揮發性高,且有 刺激性臭味,故使水溶性預焊劑中之酸濃度降低,導致咪 唑化合物析出、或作業環境惡化的問題。 又,於前述進行焊接時’係廣泛地使用錫_鉛之共晶焊 料而近年來人們顧慮到該焊料合金中所含有的鉛對人體 之有害性,故要求使用不含鉛之焊料。 _ 因此檢时了各種無鉛焊料,例如提案有以錫為基礎金 #屬’添加了銀、鋅、絲、銦、錄、銅等金屬之無錯 且一部分已被實用化。 習知之錫-鉛系共晶焊料,對金屬製導電部的銅、銅合 金、銀等之金屬表面有優異的濕潤性,可對金屬強 合,故可得到高可靠性。 相對於此’無鉛焊料與以往的錫_錯焊料相比,由 金屬表面之濕潤性差,故焊接性差,會產生孔隙等之拯人 不良’且接合強度亦較低。 ° 因此,於使用無料料時,必須選擇焊接性更佳之焊料 326傳利說明書(補件)\95·09\95118393 6 1359207 合^及適於無鉛焊料之焊劑(flux),而對於為了金屬製導 ^部的銅、鋼合金或銀等金屬表面之氧化防止所使用=水 4 !·生預烊劑,亦要求改善與無鉛焊料之濕潤性以達到焊接 性良好之作用.。 /又,無錯烊料多為熔點較«,焊接溫度與習知之錫, =共晶焊料相比高出20〜5G。⑽程度,故亦期盼對該水i 比預烊劑形成具有優異耐熱性之化成皮膜。 [專利文獻1]曰本專利特公昭46_17〇46號公報 [專利文獻2]日本專利特開平4_2〇6681號公報 專利文獻3]曰本專利特開平5_254〇7號公報 [專利文獻4]日本專利特開平5,186888號公報 【發明内容】 (發明所欲解決之問題) 欠ί:明為鑑於上述情況而形成者,其目的在於提供一種 ::性預焊劑,係使味哇化合物溶解於水 2 =發揮輪合物具有之優異造膜性的低揮:性可 之^ ’並提供使别述水溶性預辉劑與金屬製導電邱接觸 之金屬製導電部的表面處理方法。 4電錢觸 又一目的在於,提供將前述水 線板之電路部的金屬製導與構成印刷佈 提供於使金屬梦導雷邱矣/ 接觸之印刷佈線板;及 後’再進行焊接之焊接方法。 ㈣ (解決問題之手段) 本發明者等⑽決料問H再^進行檢討 326^#_W(補件)\95-09\95118393 ? 1359207 $發現:碳數為4〜16之以化學式丨的通式表示之羧酸化 合物係具有使咪唑化合物可溶化於水中之優異性能及使 咪唑化合物之優異造膜性得以發揮之性能,遂完成本發 明。 [化學式1] ^-O^CH^CH-oA-fcH^cooH 、 R2 Jm (式中,R1為碳數1〜4之直鏈狀或分枝狀之烷基,R2為氫 原子或曱基;m為〇〜3之整數,η為1或2)。 亦即,第1發明為一種水溶性預焊劑,其含有咪唑化合 物、與碳數為4〜16之以化學式1的通式表示之羧酸化= 曰又,第2發明為一種水溶性預焊劑,係含有q 〇i〜i〇重 量%比例之咪唑化合物,含有〇.卜5〇重量%比例之前述羧 酸化合物。 第3發明為一種金屬製導電部之表面處理方法,其特徵 在於,係使與第1或第2發明之水溶性預焊劑接觸。 第4發明為一種印刷佈線板,其特徵在於,係 導電部的表面使第i或第2發明之水溶性預焊劑接觸。 第5發明為一種焊接方法,其特徵在於,係於金屬製導 表面使P或第2發明之水溶性預焊劑接觸後再進 (發明效果) 32轉利說明書(補件)\95-09\95118393 !359207 本發明之水溶性預焊劑,由於含有低揮發 物作為㈣化合物之可溶化劑,故水溶性預焊 化劑的濃度可保持安定,且不會產生臭味。又 :各 酸或醋酸作為可溶化劑的情況相比,將可麵 ^ 所具有的優異造膜性。 r坐化口物 本發明之表面處理方法,由於可在金屬製導電部表 /成化成皮膜,故可防止金屬製導電部表面之氧化 於使用本發明之印刷佈線板的情況,金屬製導電部與 子零件之接合可藉由焊接而確實地進行。 、 =據本發明之焊接方法,*於可防止金屬製導電部表面 之氧化,故可達成良好的焊接性。 【實施方式】 以下針對本發明詳細地說明。 適於本發明之實施的咪錢合物並無特別限制,可例示 如:院基味嗤化合物、芳基咪嗤化合物、芳燒基味嗤化合 物、烧基苯并咪〇坐化合物、芳基苯并味唾化合物、和芳院 基苯并味°坐化合物。 前述烷基咪嗤化合物可舉例如··卜癸基咪唑 基咪 唑、2-十一烧基㈣、2—十七烧基味唾、2_乙基+甲土基 味唾、2一十一基_4_甲基㈣、4 一甲基味唾 2-環己基咪唑等。 卞土矿生 前述芳基咪唑化合物可舉例如:卜苯基咪唑、 唑、2-甲苯甲醯基咪唑、2_(4一氣 本土* 鼠本基)咪唑、2-苯基_4_ f基咪唑、2-苯基+ ¥基咪唑、2_笨基+ ¥基味唑、2,4_ 326傳利說明書(補件)\95-〇9\95118393 9 1359207 二苯基咪嗤、2,4-二苯基_5_甲基味峻、2—苯基—4(34_ 二氣苯基)咪峡、2_苯基-4-(2,4-二氯苯基)_5—甲基咪 唑、2-(2,4-二氯苯基)-4-笨基_5_曱基咪唑、4_苯美味 ί Γ5壬ί其4:笨練坐、4—苯基—5销唾、2-‘ 甲卞基味吐、2-(1·萘基)味唾、2仆萘基)傳 亂本基)-5-甲基味嗤、2_苯基_4_(2 一萘基)口米唾、2 二苯基咪唑、2-(2,4-二氣苯基)_4,5_二笨基咪唑、’2_’(ι ;基)-4,5 —二笨㈣唾、2-(卜比絲)-4,5-二苯基咪嗤 等。 #前述芳烷基咪唑化合物可舉例如:卜苄基咪唑、1 氣苯基)甲基_2_甲基咪唑、"基咪唑、2_节基美 咪唾、2-(2-苯基乙基)咪唾、2_(5_苯基戊基)味唾、2—土 甲基_4,5-二¥㈣唾、卜(24 一二氣苯 唾、2-U-萘基)甲基_4 一甲基咪唾等。 ,基味 f述院基苯㈣哇化合物可舉例如:1-十二烧基_2_甲 基本开咪唑、2_丙基苯并味唾、2_戊基 苯并味嗤、2-壬基苯并味唾'2-十七炫基苯并心、!基 己基-5-甲基苯并咪„坐、2_戊基_5,6―二氣苯并㈣、2_(卜 乙基戊基)苯并咪嗤、2—(2,4士三甲基戊基)苯并味唾、 2-環己基苯并咪唾、2_(5—環己基戊基) 基甲基苯并㈣、2ι胺基乙基)苯并味峻、22,2_伸本乙氧 ㈣'2_(硫醇甲基)苯并㈣、2_戍基硫醇苯并 前述芳基苯并味唾化合物可舉例如:卜苯基苯并^坐、 326\專利說明書(補件)\95-〇9\95118393 ' 氣苯基)苯并味-笨 V萃基)-5-氣笨.,^本基—5,6 —二甲基笨并味唾、2 — (1 — • 虱本开咪唑、5-苯基苯并咋唑、9 〇 •苯等之芳基苯并味錢2 —…比咬基) 唑、本I味唾化合物可舉例如:卜苄基苯并咪 溴苯幻^其Γ '、坐、2一(4一氣苯基)曱基苯并味唾、2-(4-唾、2土-(3 、2—(2,4 一二氣苯基)甲基苯并咪 • 5 6_ 一氯苯—:本基)甲基苯并味°坐、2~對甲苯基甲基 ,一虱本开咪唑、1-烯丙基-2-(4-氣苯基)甲美笨舁畔 基乙基)苯并味…_苯基丙基二= 味唑、2-(卜萘基)甲基苯并咪唑、2_(2 —苯基 二开:米:坐、2 —(苄基硫醇基)苯并咪唑、2_(2-苄基硫醇乙 基)苯开咪唑等。 # u 此等咪唾化合物係於水溶性預焊劑中可含有〇 〇卜1〇 重量%之比例,以〇·卜5重量%之比例為佳。咪唑化合物之 =有比例若少於G.Q1重量%,卿成於㈣表面之化成皮 膜居度變薄,而無法充分防止金屬表面的氧化。又,味嗤 化口物之含有比例若多於1G重量%,則用於得到適於焊接 條件之所要膜厚之表面處理的控制變得困難。 於本發明之實施中,於使味唾化合物可溶化(水溶液化) 以調製水溶性預焊劑時,可溶化劑係使用以前述化學式i 之通式表示之碳數為4〜16之羧酸化合物。 依據本發明者等之理解,藉由使該羧酸化合物作成為使 烷氧基(π-ο-)與羧基甲基(_CH2C00H)或羧基乙基 32价專利說明書(補件)\95·09\95118393 11 U59207 (:C^ ς則可提W錢合物之可溶化性能,故m以卜3為更 4出於該缓酸化合物為甲氧基酷酸,有報 口^出’此物質於活體内不易代謝,會造成翠丸萎縮 致畸形,而不宜使用於商業上。 以化學式1的通式表示之碳數4〜16之羧酸化合物中, 於4 i時之以化學<2表示之碳數4〜15之缓酸化合物, 可依據於「油化學,第32卷,118頁(1 983年)」所記載 的方法合成。亦即,如化學式3之反應式所示般,使過剩 的醇化合物和既定莫耳的金屬鈉反應’然後,加入金屬鈉 的〇. 5仡莫耳之單氣醋酸,加熱使其反應。於反應終了 後將過剩的醇化合物減壓餾除,加入中和所需之必要量 的鹽S文’以趟等萃取。將萃取液之醚等減壓餾除,對濃縮 液進行減壓蒸餾,可得到該羧酸化合物。 [化學式2]
-OHs-COOH 尺 〇 f CH2 CH Ο ·' (式中’ Rl為碳數1〜4之直鏈狀或分枝狀之烷基,R2為氫 原子或曱基;m為〇〜3之整數。) 32轉_月書(補件)\95.5118393 1359207 [化學式3]
(式中’ R1為碳數丨〜4之直鏈狀或分枝狀之烷基,R2為氫 原子或曱基;m為〇〜3之整數。) 月|J述以化學式2表示之m為〇時之缓酸化合物為:乙氧 基@曰1、丙氧基醋酸、異丙氧基醋酸、丁氧基醋酸、異丁 氧基醋酸、第二丁氧基醋酸、第三丁氧基醋酸。” 同樣地,於m為1且R2為氫原子時之羧酸化合物為: 2-(2-甲氧基乙氧基)醋酸、2_(2_乙氧基乙氧基)醋酸、 2-(2-丙氧基乙氧基)醋酸、2_(2_異丙氧基乙氧基)醋酸、 丁氧基乙氧基)醋酸、2_(2_異丁氧基乙氧基)醋酸、 2-(2-第二丁氧基乙氧基)醋酸、2_(2_第三丁氧基乙氧基) 同樣地,於m為2且R2為氫原子時之羧酸化合物為: 2 [2 (2-甲氧基乙氧基)乙氧基]醋酸、2一[2一(2_乙氧其乙 氧基)乙氧基]醋酸、2-[2-(2-丙氧基乙氧基)乙氧基]醋 酸、2-[2-(2-異丙氧基乙氧基)乙氧基]醋酸、2_[2_(2Θ_ 丁氧基乙氧基)乙氧基]醋酸、2-[2-(2-異丁氧基乙氧基) 乙氧基]醋酸、2-[2-(2-第二丁氧基乙氧基)乙氧基]醋" 326\專利說明書(補件)\95·〇9\95118393 13 1359207 酸、2-[2-(2-第三丁氧基乙氧基)乙氧基]醋酸。 . 同樣地’於m為3且R2為氫原子時之羧酸化合物為: 2-{2-[2-(2-曱氧基乙氧基)乙氧基]乙氧基丨醋酸、 ’ 2一丨2_[2 — (2-乙氧基乙氧基)乙氧基]乙氧基}醋酸、 2_{2-[2-(2-丙氧基乙氧基)乙氧基]乙氧基丨醋酸、 2-2-(2-異丙氧基乙氧基)乙氧基]乙氧基丨醋酸、 2-{2-[2-(2-丁氧基乙氧基)乙氧基]乙氧基丨醋酸、 癱2_{2-[2·(2-異丁氧基乙氧基)乙氧基]乙氧基}醋酸、 2-{2-[2-(2-第二丁氧基乙氧基)乙氧基]乙氧基}醋酸、 2-{2-[2-(2-第三丁氧基乙氧基)乙氧基]乙氧基}醋酸。 同樣地,於m為1且R2為甲基時之羧酸化合物為:2_(2_ 甲氧基-1-曱基乙氧基)醋酸、2_(2_乙氧基_丨_曱基乙氧基) 醋酸、2-(2-丙氧基-1-甲基乙氧基)醋酸、2_(2_異丙氧基 -1-曱基乙氧基)醋酸、2一(2一丁氧基一丨―甲基乙氧基)醋 酸、2-(2-異丁氧基—丨_甲基乙氧基)醋酸、2_(2_第二丁氧 #基-l-甲基乙氧基)醋酸、2_(2_第三丁氧基_丨〜甲基乙氧基) 醋酸。 同樣地,於m為2且R2為甲基時之羧酸化合物為: 2-[2_(2-甲氧基―丨一甲基乙氧基)_卜甲基乙氧基]醋酸、 2-[2-(2-乙氧基一丨―甲基乙氧基)一卜甲基乙氧基]醋酸' 、2-[2-(2-丙氧基_丨-曱基乙氧基)_卜甲基乙氧基]醋酸、 2-[2-(2-異丙氧基-丨_甲基乙氧基)_卜 •酸、印普丁氧基-卜甲基乙氧基)+甲基醋 酸、2-[2-(2-異丁氧基-! 一甲基乙氧基)+甲基乙氧基] 32轉利說明書(補件)\95-09\95118393 14 1359207 醋l 2 [2-(2-第二丁氧基-卜甲基乙氧基)_卜甲基乙氧 基]醋酸、2-[2-(2-第三丁氧基一卜甲基乙氧基M一甲美乙 氧基]醋酸。 1 同樣地,於出為3且R2為甲基時之缓酸化合物為: 2 一{2 一 [2二(2—甲氧基一1-甲基乙氧基)-1-曱基乙氧基]-卜 甲基乙氧基}醋酸、2_{2-[2_(2_乙氧基+曱基乙氧 基)1甲基乙氧基]-1-甲基乙氧基丨醋酸、2_丨2_[2_(2一 丙氧基-1-甲基乙氧基)_卜甲基乙氧基卜卜甲基乙氧基丨 醋酸、2-{2-[2-(2-異丙氧基+甲基乙氧基)+曱基乙氧 卜甲基乙敦基}醋酸、2_{2一[2_(2_丁氧基_卜甲基乙 氧基)1甲基乙氧基]-卜甲基乙氧基丨醋酸、2_{2_[2_(2— ^ 丁氧基-卜曱基乙氧基)+甲基乙氧基]+甲基 ,酸、2令[2普第二丁氧基+甲基乙氧基)+曱基乙 基]-1-甲基乙氧基}醋酸、2_{2_[2_(2_第三丁氧基+ 甲基乙氧基)-1-甲基乙氧基]—卜甲基乙氧基}醋酸。 x化予式1之通式表不之碳數4〜16之羧酸化合物中,η 為2時之以化學式4表示之碳數4〜16之缓酸化合物,可 :據二 J. Am. Chem. Soc.,第 70 卷,1333 頁(1948 年)」 所記載之以氰乙謎化合物作為原料的方法予以合成。 斗前述氰乙㈣合物可依據「英國專利第54號公報」 ,美國專利第2280792號公報」巾所記載的方法予以合 成。 =即,如化學式5之反應式所示般,在乙醇鈉等之驗觸 媒存在下使醇化合物與丙烯腈反應,中和後進行減壓蒸顧 15 326V專利說明書(補件)\95·09\95118393 1359207 合成氣乙鱗化合物,再使相同氣乙謎化合物在鹽酸等強酸 . 之水溶液中加熱反應,將反應混合物濃縮,將析出的氯化 ' 銨等之銨鹽濾除,將濾液減壓蒸餾,可得到該當之叛酸化 • 合物。 [化學式4]
CH2"^~C〇〇H
[化學式5] CH—0 t CH2= CH 一CN NaOC2H5 (cat.) ^
C式中’ R為碳數1〜4之直鏈狀或分枝狀之烷基,R2為氫 原子或甲基;m為〇〜3之整數。) 月'J述以化學式4表示之m為〇時之羧酸化合物為·· 3一 乙氧基丙酸、3-丙氧基丙酸、3_異丙氧基丙酸、3_ 丁氧基 丙酸、3-異丁氧基丙酸、3_第二丁氧基丙酸、3_第三丁氧 基丙酸。 326\^^IJ|^Bg^(^f/j:)\95-〇9\95118393 lfi 1359207 同樣地,於m為1且R2為氫原子時之羧酸化合物為: ;3-(2-甲氧基乙氧基)丙酸、3-(2-乙氧基乙氧基)丙酸、 • 3-(2-丙氧基乙氧基)丙酸、3_(2_異丙氧基乙氧基)丙酸、 • 3-(2-丁氧基乙氧基)丙酸、3 — (2_異丁氧基乙氧基)丙酸、 3-(2-第一丁氧基乙氧基)丙酸、3_(2_第三丁氧基乙氧基) 丙酸。 同樣地,於m為2且R2為氫原子時之羧酸化合物為: 3-[2-(2-甲氧基乙氧基)乙氧基]丙酸、3_[2_(2_乙氧基乙 •氧基)乙氧基]丙酸、3-[2-(2-丙氧基乙氧基)乙氧基]丙 酸、3-[2-(2-異丙氧基乙氧基)乙氧基]丙酸、3_[2_(2_ 丁氧基乙氧基)乙氧基]丙酸、3-[2-(2-異丁氧基乙氧基) 乙氧基]丙酸、3-[2-(2-第二丁氧基乙氧基)乙氧基]丙 酸、3-[2-(2-第三丁氧基乙氧基)乙氧基]丙酸。 同樣地’於m為3且R2為氫原子時之羧酸化合物為: 3-{2-[2-(2-甲氧基乙氧基)乙氧基]乙氧基}丙酸、 鲁3-{2-[2-(2-乙氧基乙氧基)乙氧基]乙氧基}丙酸、 3-{ 2-[ 2-(2-丙氧基乙氧基)乙氧基]乙氧基丨丙酸、 3-{2-[2-(2-異丙氧基乙氧基)乙氧基]乙氧基}丙酸、 3-{2-[ 2-(2-丁氧基乙氧基)乙氧基]乙氧基丨丙酸、 3-{2-[2-(2-異丁氧基乙氧基)乙氧基]乙氧基丨丙酸、 3-{2-[2-(2-第二丁氧基乙氧基)乙氧基]乙氧基丨丙酸、 3-{2-[2-(2-第三丁氧基乙氧基)乙氧基]乙氧基丨丙酸。 同樣地’於m為1且R2為甲基時之羧酸化合物為:3_(2_ 甲氧基-1-甲基乙氧基)丙酸、3-(2-乙氧基-1-甲基乙氧基) 326\專利說明書(補件)\95-09\95118393 17 1359207 丙酸、3-(2-丙氧基-1-甲基乙氧基)丙酸、3_(2_異丙氧基 -1-甲基乙氧基)丙酸、3一(2一丁氧基+甲基乙氧基)丙 酸、3-(2-異丁氧基-1-甲基乙氧基)丙酸、3 (2_第二丁氧 基-卜甲基乙氧基)丙酸、3-(2一第三丁氧基_卜甲基乙氧基) 丙酸。 同樣地,於m為2且R2為甲基時之羧酸化合物為: 3-[2-(2-曱氧基-1-甲基乙氧基)一卜甲基乙氧基]丙酸、 3-[2-(2-乙氧基-1-甲基乙氧基)一卜甲基乙氧基]丙酸、 3-[2-(2-丙氧基-1-甲基乙氧基)_卜甲基乙氧基]丙酸、 3-[2-(2-異丙氧基-卜甲基乙氧基)—卜曱基乙氧基]丙 酸、3-[2-(2-丁氧基-1-甲基乙氧基)_卜甲基乙氧基]丙. 酸、3-[2-(2-異丁氧基-卜甲基乙氧基)+甲基乙氧基] 丙酸、3-[2-(2-第二丁氧基+甲基乙氧基)甲基乙氧 基]丙酸、3-[2-(2-第三丁氧基―丨一甲基乙氧基)_卜曱基乙 氣基]丙酸。 同樣地,於ni為3且R2為甲基時之羧酸化合物為: 3-{2-[2-(2-甲氧基+甲基乙氧基)_卜甲基乙氧基]―卜 曱基乙氧基}丙酸、3-{2-[2-(2-乙氧基4一甲基乙氧 基)-1-甲基乙氧基]-1-曱基乙氧基丨丙酸、3_丨2_[2_(2_ 丙氧基+甲基乙氧基)-1_甲基乙氧基]+曱基乙氧基} 丙酸、3-{2-[2-(2-異丙氧基-卜甲基乙氧基)_卜甲基乙氧 基]-1-甲基乙氧基}丙酸、3-{2-[2-(2-丁氧基-1-甲基乙 氧基)-卜曱基乙氧基]-1-曱基乙氧基丨丙酸、3_丨2_[2_(1 異丁氧基-卜甲基乙氧基)+甲基乙氧基]+甲基乙氧基} 326胃 # 說明書(補件)\95·09\95118393 is 1359207 丙酉义、3-丨2-[2-(2-第二丁氧基-卜?基乙氧基)_卜甲基乙 氧基]-卜甲基乙氧基}丙酸、3_{2七_(2_第三丁氧基+ 甲基乙氧基M-甲基乙氧基]一卜甲基乙氧基}丙酸。 此等㈣化合物,於水溶性預焊劑中宜含有0卜5〇重 請比例’以含有"0重量%的比例為佳。幾酸化合物 之含有比例若少於(M重量%,難法使㈣化合物充分 地可冷化’又’右多於5〇重量%,羧酸化合物之藥劑成本 會增加,故非良好。 1於實施本發明時,視需要亦可與該㈣化合物併用習知 的有機酸、無機酸或有機溶劑作為可溶化劑。 此時所使用之代表性有機酸可舉例如:蟻酸、醋酸、丙 酸、丁酸、乙酸酸、丙_酸、乙醯乙酸、乙酿丙酸、庚酸、 :酸、癸酸、月桂酸,乙酸、甘油酸、乳酸、丙烯酸、 苯甲酸、對硝基苯曱酸、對曱苯石黃酸、水揚酸、苦味酸、 草酸、玻ί白酸、順丁烯二酸、反丁稀二酸、酒石酸、己二 酸等;無機酸可舉例如:鹽酸、罐酸、硫酸、破酸等。一 又,有機溶劑可舉出··與水可自由混合之甲醇、乙醇、 異丙㈣之低_或丙_、Ν,Ν_二甲基甲醯胺、乙二醇等。 本發明之水溶性預焊劑中,為了加速在金屬製導電部表 面之化成皮膜的形成逮度,可添加銅化合物,又導 形成之化成皮膜的耐熱性更提高,亦可添加鋅化合物。 前述銅化合物之代表去盔.細^ 考為.醋I銅、氯化亞銅、氣化銅、 漠化亞銅、漠化銅、峨化銅、氫氧化銅、•銅、硫酸銅、 石肖酸銅等;又,前述鋅化合物之代表者可舉出:氧化鋅、 326\* 利說明書(補件)\95-09\95118393 19 =:、+醋酸鋅、草酸鋅、乳酸鋅、檸檬酸鋅、硫酸鋅、 。’、〜酸鋅等;任一者於水溶性預焊劑中宜以◦ 01〜10 :故含有比例添加’以0 02〜5重量%之含有比例添加 马隹0 於使用此等鋼化合物或鋅化合物的情況,較佳為在水溶 十預焊劑中添加氨或單乙醇胺、二乙醇胺、三乙醇胺等之 ,類等之具有緩衝作㈣物質以使水溶性預焊劑的p Η穩
=本發明之水溶性預焊劑中,為了更提高化成皮膜之形 ^度及該皮膜之耐純,可添加_素化合物使含有比例 士為0.00H重量%’以〇·〇卜〇 5重量%之含有比例為佳。 #素化合物可舉例如:氟化納、敦化鉀、敦化銨、氯化鋼、 乳化鉀、氯化銨、溴化納、漠化鉀、漠傾、碘化納、班 化鉀、碘化銨等。 >、 於使用本發明之水溶性預焊劑進行印刷佈線板的金屬 φ 4電部表面之處理時之條件,以水溶性預焊劑的液溫為 10~7(rc、接觸時間為1秒〜10分為佳。接觸方法可舉例 如浸潰、喷霧、塗佈等方法。 又,於施行本發明之表面處理後,於化成皮膜上藉由熱 塑性樹脂形成雙重構造,可更加提高耐熱性。 .亦即,可於金屬料電部的表面上生成化成皮膜後,將 由松香、松香酯等之松香衍生物、格烯樹脂、萜烯苯酚樹 月旨等之㈣樹脂衍生物、芳香族煙樹腊、腊肪族煙樹脂等 之烴樹脂或此等之混合物所構成的耐熱性優異 傳利說明書(補件)\95-09\95】18393 20 1359207 $月曰,溶解於甲笨、醋酸乙酯、異丙醇等溶劑中,並將該 '奋液以輥塗機均勻地塗佈於化成皮膜上使膜厚成為卜30 .A"1的厚度’而形成化成皮膜與熱塑性樹脂之雙重構造。 本發明之焊接方法,可適用於:使印刷佈線板流經裝有 已加熱熔融的液體狀焊料之焊料槽上,於電子零件與印刷 佈線板的接合部進行焊接之流動法;或事先於印刷佈線板 上以糊狀之軟膏狀焊料依電路圖案進行印刷,再將電子零 件女裝於其上,將印刷佈線板加熱使焊料溶融而進行焊接 •之迴焊法等。 適用於本發明之焊接的焊料,除了習知所使用的錫-鉛 合金之共晶焊料之外,尚可舉例如:Sn-Ag-Cu系、Sn-Ag-Bi 系、Sn-Bi 系、Sn-Ag-Bi-Ιπ 系、Sn-Zn 系、Sn-Cu 系等之 無鉛焊料。 ' [實施例] 以下,針對本發明藉由實施例及比較例具體地加以說 鲁明’惟,本發明並非限定於此等。 又,於實施例及比較例中使用之咪唑化合物、鲮酸化合 物以及評估試驗方法係如下述。 ° [p米唾化合物] 木2-十一烷基咪唑(四國化成工業公司製,商品名「ciiz」) *2-苯基咪唑(四國化成工業公司製,商品名「2pz」)」 *2-苯基-4-甲基咪唑(四國化成工業公司製,商品^ 「2P4MZ」) *2-苯基-4-(3,4-二氯苯基)咪唑(依照曰本專利特開 326\專利說明書(補件)\95-09\95118393 21 1359207 2005-104878號公報中所記載的方法合成) *2-苯基-4-(2-萘基)-5_曱基咪唑(依照參考例^的方法 合成) ' *2-苯基-4-(2-萘基)咪唑(依照參考例2的方法合成) *2-苄基-4-甲基咪唑(p〇ly 〇rganix&司製) *2_壬基苯并咪唑(SIGMA-ALDRICH公司製,試藥) *2-(4-氣苯基f基)苯并咪唑(依據「Science 〇f
Synthesis,第12卷,529頁(2002年)」中記載之方 成) 。 *2-(1-萘基)曱基苯并咪唑(依據「Bi〇chemicai
Pharmacology,第36卷,463頁(1987年)」中記載的方 法合成) [參考例1 ] <2-笨基-4-(2-萘基)-5-甲基咪唾之合成方法〉 使苯并月米鹽酸鹽與等莫耳之甲醇鈉於 氩呋喃溶液於不超過3(TC下滴入,再加入等莫耳之曱醇 納,進行1小時加熱迴流。將溶劑減壓館除後,對殘渣進 行水洗,以乙醯腈進行再結晶,得到灰藍色結晶。 [參考例2] <2-苯基-4-(2-萘基)味唾之合成方法〉 使苯并肺鹽酸鹽與等莫耳之甲醇納於四氮咬d南中加轨 迴流1小時’冷卻後’使等莫耳之n2_乙醯基萘之四 氮咬喃溶液於不超過3(TC下滴入,再加入等莫耳之曱醇 326^利說明書(補件)\95-09\95118393 22 1359207 鈉,進行1小時加熱迴流。將溶劑減壓餾除後,對殘渣進 行水洗’以乙醯腈進行再結晶,得到灰藍色結晶。 [羧酸化合物] 木2-乙氧基醋酸(SIGMA_ALDRICH公司製之試藥,略記為化 合物A) *2-(2-甲氧基乙氧基)醋酸(略記為化合物b) *2 [2-(2-乙氧基乙氧基)乙氧基]醋酸(略記為化合物〇 *2一{2-[2-(2-乙氧基乙氧基)乙氧基]乙氧基丨醋酸(略記 為化合物D) 一(2-甲氧基—ι_甲基乙氧基)醋酸(略記為化合物E) —[2-(2-丙氧基-1_甲基乙氧基)_1_甲基乙氧基]醋酸 (略記為化合物F) {2-[2-(2-丁氧基-1-曱基乙氧基)_;[_甲基乙氧基]_卜 T基乙氧基}醋酸(略記為化合物G) 乙氧基丙酸(略記為化合物H) W (2-甲氧基乙氧基)丙酸(略記為化合物I) 3 (2甲氧基-1-甲基乙氧基)丙酸(略記為化合物】) [2 (2 -曱氧基乙氧基)乙氧基]丙酸(略記為化合物κ) {2 [2-(2-乙氧基乙氧基)乙氧基]乙氧基丨丙酸(略記 為化合物L) 化合物B〜G係依據「油化學,第32卷,118頁(1983年)」 中記载的方法合成。 」 化 5 物 Η〜L 係依據「J. Am. Chem. Soc·,第 70 卷,1333 頁(1948年)」、與「英國專利第544421號公報」及/或「美 326^專利說明書(補件)\95-09\95118393 23 1359207 國專利第2280792號公報」中記載的方法合成。 又,化合物A〜L的構造式係如表1所示。
326\專利說明書(補件)\95-09\95118393 24 1359207 [表1] 化含物A C2H5—〇—CHjCOOH 化合物B CH3 ·—〇—CH2 ^ CH ^ Ο ——OHjGOOH 1 Η 化合物C 化合物D 〇2Η5—O CH 2 — CH — 〇 -^-CH^COOH 化合物E ch3 — 0—CH2—CH—o—ch2cooh 1 ch3 化合物F Π-Ο3Η7——CH —〇 -X—CHjOOOH \ / 2 化合物G η-〇4Η9—〇^CHa—CH —〇 -VcH^COOH \ CHS /3 化合物Η CaHs—〇—CH2CH2COOH 化合物! CH3 —〇一CH2 —CH —〇 —CHaCH 之COOH H 化含物J CH3 OH2 *~CH —〇 CH2OH2COOH k 化合物Κ ch3-o-^-ch2 — CH — 0 -^-CH2CH2COOH 化含物1· C^Hs—〇-AcH2 — CH — 0 -yCH2CH2CO〇H \ H /3 326傳利說明書(補件)\95·09\95118393 25 ^59207 [參考例3] 〈咪唑化合物之可溶化試驗〉 將2笨基(3, 4-二氯苯基)咪嗤〇 、容 :使用之输合物2,後,測定加入離子交換=呈中 化Sint的水量⑷。此水量愈多,則判定具有幾酸 化口物之咪唑化合物的可溶化性能越優異。 侍到之試驗結果係如表2〜4所示般,可認定藉由作成為 使烷氧基(F-O-)與羧甲基(_CH2C〇〇h)或羧乙基(_C2H4C〇〇h) 以伸烷基醚鏈(-CHAHWq-O-)鍵結之化學構造,可提高咪 唾化合物之可溶化性能。 [表2] 羧酸化合物 水之添加量(ml) 2-乙氧基醋酸 3. 3 化合物C 3. 6 [表3] 羧酸化合物 水之添加量(m 1) 2-正丙氧基醋酸 2. 8 化合物F 3. 0 [表4] 羧酸化合物 水之添加量(ml) 2-正丁氧基醋酸 1.0 化合物G 2.0 326V# 利說明書 ί 補件 >\95·〇9\95118393 1359207 [焊料上昇性評估] 使用有内徑0.80麗的銅通孔3〇〇孔之12〇随(長)χ 150πππ(寬)X i.6mm(厚)的玻璃環氧樹脂製之印刷佈線板 作為試驗片。對此試驗片進行脫脂、軟㈣及水洗後,於 保持於既定液溫的水溶性預桿射浸潰既定時間,然後進 行水洗、乾燥,在銅表面上形成厚度約〇1〇遣 化成皮膜。 對施行此表面處理之試驗片,用紅外線迴焊 裝置(製品名·· MULTI-PR〇-3〇6,Vetr〇nix公司製)進行3 次波峰溫度為2飢之迴焊加熱,然後,用流動式焊接裝 置(輸送帶速度:l.〇m/分)進行烊接。 又,使用之焊料為具有63錫_37錯(重量%)之組成的錫 -鉛糸共晶焊料(商品名:H63A’千住金屬工業公司製), t進行焊接時所使用的焊劑為】S-64MSS(弘輝製)。又, 焊料溫度係設定為240Ϊ。 曰二料=行了前述表面處理之試驗片,以與錫_錯系共 況同樣地使用無錯焊料進行焊接…使用之 焊料(商具錫I G銀l 5銅(重量%)之組成的無錯 =商;广H7。5「EC0S0l_」,千住金屬工業公司… 焊/^接時所使用的焊劑為叫-09(弘輝製)。又,迴 度為24代’焊料溫度亦設^為2肌。 域部二接之者試)Γ/計測焊料上昇到銅通孔的上部區 比例《) 的通孔數,求4對全通孔數⑽孔)的 326\專利說日月書(補件卿養51Ϊ S393 1359207 知料對銅㈣之濕潤性愈大,㈣之焊料 孔内並容易上昇至上部區域部分。亦即,對全通 料上昇到上部區域部分的通孔數之比例愈大 料對銅之濕潤性越優良,焊接性良好。 疋為烊 [焊料擴展性之評估試驗] ^吏用5〇mm(長)x 5〇mm(寬)χ 12_(厚)的玻璃環 脂j之印刷佈線板(電路圖案係形成為由銅绪所構成 ,寬O.SGmm、長20咖的電路部以1()随間隔沿寬方向形 成1〇條)作為試驗片。對此試驗片進行脫脂、軟姓刻及^ 洗後’於保持於既定液溫的水溶性預焊劑中浸潰既定時 間’然後進行水洗、乾燥,在銅表面上形成厚度約 〇. 10〜0. 50/z m的化成皮臈。 對施行此表面處理之試驗片,用紅外線迴焊裝置(製口 名:MULTI-PRO-306 ’ Vetronix公司製)進行i次波峰^ 度為24代之迴焊加熱,然後,使用開口徑1.2咖、厚Γ50 “的金屬遮罩在銅電路部中央印刷錫-料軟膏狀焊 料^以前㈣件進行迴焊域,進行料。又,使用 =糸軟貧狀焊料係由63錫_37鉛(重量%)所構成 的共晶焊料(商品名:0Ζ-63 一 33〇ίΜ〇_1〇 公司製)。 系 又,對施行前述表面處理之試驗片,以與錫_錯系軟膏 狀焊料的情關樣地使用無料、軟膏狀焊料進行焊接。 又,所使狀無“軟膏料料為由96 5錫_3()銀1 £ 銅(重量«所構成的組成之無鉛焊料(商品名: 〃 326\專利說明書(補件)\95-〇9\95118393 28 1359207 M705-221BM5-42-11,千住金屬工業公司製)。又,軟膏炚 焊料之於印刷前及印刷後施行之迴焊加熱,其波峰溫声> 設定為245。(:。 μ X係 對得到之試驗片,測定在銅電路部表面濕潤擴展之 的長度(mm)。 * 此長度愈大,則判定為焊料濕潤性優越、焊接性 [實施例1 ] 义° μ 十
為可溶化劑:酸::二化:物?:乙氧基错酸作 後二氨水調整為。Η3.7,調製載的組成 的水溶性料财6G秒,於溫度調整為㈣ 焊料上昇性及焊料擴展 行水洗乾燥,測定 [實施例2〜16] 、 。4 #測試結果示於表5。 • 以與實施例1同樣地調勢成矣 預焊劑,以表5所記載的、表5所屺载的組成之水溶性 估試驗。得到之試驗結果,理條件施行表面處理,實施評 不於表5。 32轉利說明書(補件账_5118393 29 1359207 辑- ο ψ ο g.c it Ν 001 001 lr-c bL·— in CSJ 〇
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〔^)EI^IWIW (-S-^T实玟 ® w^ $ 1359207 =據表5及表6所示之試驗結果,可續認得知:使 處理為二Γ化'之化合物A〜L之水溶性預焊劑施行表面3 再使用共晶焊料或無鉛焊料進行焊接時之 焊料擴展性,將不拘於咪唑化合物的種類,與使用: 文或醋:作為可溶化劑的情況相比有顯著的改善效果。 ^實施例中調製的水溶性預焊劑為無臭者,而比較例 的水洛性預焊_有因㈣或蟻酸之揮 刺激性味道。 &㈣有 >上述係料定的實施形態對本發明詳細說明 ==之精神與範圍下可作各種變更及變形,此= =而、係不言而嘴者。又,本申請案係依據2〇〇5年5 日提出申請之日本專利申請(特願2〇 祕年…日提出申請之日本專利申請(特願279) 2005-355985)者,於此援用其全部内容。 (產業上之可利用性) 物==:=1二於t有低揮發性的㈣化合 化劑的濃度可保持安定且不會產生臭味。又二:: 或醋酸作為可溶化劑的情況相比,可發揮咪。坐化合物所且 有的優異造膜性。 厅^ 依據本發明之表面處理方法,由於可在金屬製導 面形成化成皮膜,故可防止金屬製導電部表面之氧化。、 子=二SI?佈線板的情況,金屬製導電部與電 子零仵之接合可藉由焊接而確實進行。 326\專利說明書(補件)\95-09\95118393 33 1359207 依據本發明之焊接方法,由於可防止金屬製導電部表面 之氧化,故可達成良好的焊接性。
326\專利說明書(補件)\95-09\95118393 34
Claims (1)
1359207 十、申請專利範圍: 與:炭數生預焊劑’其特徵在於’含有㈣化合物 [化學式1]〜之以化學式1的通式表示之叛酸化合物; ;CH2-)pj-COOH R1-〇-/-CH2 —CH—Ο R2 為氫 (式中H碳數卜4之直鏈狀或分枝狀之烧基, 原子或甲基;4 〇〜3之整數,〇為!或2)。 2. 如申請專利範圍第丨項之水溶性預焊劑,其中 〇·〇卜10重量%比例之味唾化合物,含有^卜㈤ 例之羧酸化合物。 比 3. —種金屬製導電部之表面處理方法,其 與申請專利範圍第!或2項之水溶性預谭劑接觸/’係 4. -種印刷佈線板,其特徵在於,係對金屬製導電 表面’使申請專利範圍第i A 2項之水溶性預焊劑接觸: 5. -種焊接方法,其特徵在於,係於金屬製導電部 =使曰申請專利範圍第!或2項之水溶性預焊劑接觸後再 32鳟利說明書(補件)\95-09\95118393 35
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KR (1) | KR101180280B1 (zh) |
CN (1) | CN101228000B (zh) |
BR (1) | BRPI0610168B1 (zh) |
HK (1) | HK1120464A1 (zh) |
TW (1) | TW200706694A (zh) |
WO (1) | WO2006126551A1 (zh) |
Families Citing this family (13)
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JP2009057596A (ja) * | 2007-08-31 | 2009-03-19 | Shikoku Chem Corp | 金めっき皮膜の封孔処理剤およびその利用 |
JP5301218B2 (ja) * | 2008-08-25 | 2013-09-25 | 四国化成工業株式会社 | 銅または銅合金の表面処理剤及びその利用 |
US8263177B2 (en) * | 2009-03-27 | 2012-09-11 | Kesheng Feng | Organic polymer coating for protection against creep corrosion |
EP2440024B1 (en) * | 2009-06-01 | 2014-03-12 | Sumitomo Electric Industries, Ltd. | Connection method |
JP5457814B2 (ja) * | 2009-12-17 | 2014-04-02 | コーア株式会社 | 電子部品の実装構造 |
CN102766874A (zh) * | 2012-08-20 | 2012-11-07 | 合肥奥福表面处理科技有限公司 | Osp铜面保护剂 |
EP3075735B1 (en) * | 2013-11-25 | 2020-09-23 | Shikoku Chemicals Corporation | Glycolurils having functional group and use thereof |
CN104470202B (zh) * | 2014-12-31 | 2017-10-24 | 上海创功通讯技术有限公司 | 用于移动终端的印刷电路板及其焊盘表面处理方法 |
US11021430B2 (en) | 2016-04-05 | 2021-06-01 | Moresco Corporation | Oxa acid compound |
CN109843293A (zh) * | 2016-08-26 | 2019-06-04 | 百时美施贵宝公司 | 吲哚胺2,3-双加氧酶的抑制剂及其使用方法 |
JP7053247B2 (ja) * | 2017-12-21 | 2022-04-12 | 東京応化工業株式会社 | 表面処理液、表面処理方法、及びパターン倒れの抑制方法 |
JP6916731B2 (ja) | 2017-12-28 | 2021-08-11 | 東京応化工業株式会社 | 基板の撥水化方法、表面処理剤、及び基板表面を洗浄液により洗浄する際の有機パターン又は無機パターンの倒れを抑制する方法 |
CN114932335B (zh) * | 2022-05-13 | 2024-03-26 | 深圳市荣昌科技有限公司 | 一种大功率led封装用水溶性固晶锡膏及其制备方法 |
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US3801573A (en) * | 1971-08-24 | 1974-04-02 | Hoffmann La Roche | Substituted aminospirothiazines |
US4631139A (en) * | 1985-08-08 | 1986-12-23 | Texaco Inc. | Corrosion inhibiting metal working fluid |
CN1017324B (zh) * | 1989-05-09 | 1992-07-08 | 化学工业部晨光化工研究院一分院 | 一种印制线路板软钎焊用钎剂 |
JPH04206681A (ja) | 1990-11-30 | 1992-07-28 | Hitachi Ltd | 印刷配線板の表面処理方法及び印刷配線板 |
JP2575242B2 (ja) | 1991-07-17 | 1997-01-22 | タムラ化研株式会社 | プリント配線板用表面保護剤 |
JP3112744B2 (ja) | 1991-09-12 | 2000-11-27 | タムラ化研株式会社 | プリント配線板用表面保護剤 |
JPH09176524A (ja) | 1995-12-25 | 1997-07-08 | Tamura Kaken Kk | 水溶性プリフラックス、プリント回路基板及びプリント回路基板の金属の表面処理方法 |
US5985043A (en) * | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
EP1796446B1 (en) * | 1996-11-20 | 2011-05-11 | Ibiden Co., Ltd. | Printed circuit board |
AU731838B2 (en) * | 1997-03-14 | 2001-04-05 | Otsuka Pharmaceutical Co., Ltd. | Novel pyrimidine derivative |
ATE315886T1 (de) * | 1999-07-08 | 2006-02-15 | Sunstar Engineering Inc | Unterfüllmaterial für halbleitergehäuse |
WO2002058108A2 (en) * | 2000-11-14 | 2002-07-25 | Henkel Loctite Corporation | Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith |
US20030111519A1 (en) * | 2001-09-04 | 2003-06-19 | 3M Innovative Properties Company | Fluxing compositions |
JP2005068530A (ja) * | 2003-08-28 | 2005-03-17 | Tamura Kaken Co Ltd | 表面処理剤、プリント回路基板およびプリント回路基板の金属の表面処理方法 |
JP3952410B2 (ja) | 2004-02-10 | 2007-08-01 | タムラ化研株式会社 | 金属の表面処理剤、プリント回路基板およびプリント回路基板の金属の表面処理方法 |
US7213739B2 (en) * | 2004-04-02 | 2007-05-08 | Fry's Metals, Inc. | Underfill fluxing curative |
EP1753728B1 (en) * | 2004-06-10 | 2012-12-19 | Shikoku Chemicals Corporation | Phenylnaphthylimidazoles for use on copper surfaces during soldering |
JP4546163B2 (ja) * | 2004-06-10 | 2010-09-15 | 四国化成工業株式会社 | 銅または銅合金の表面処理剤及び半田付け方法 |
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Also Published As
Publication number | Publication date |
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US20080318070A1 (en) | 2008-12-25 |
EP1886759B1 (en) | 2016-10-05 |
WO2006126551A1 (ja) | 2006-11-30 |
TW200706694A (en) | 2007-02-16 |
CN101228000A (zh) | 2008-07-23 |
KR101180280B1 (ko) | 2012-09-07 |
BRPI0610168B1 (pt) | 2015-03-10 |
EP1886759A4 (en) | 2010-04-28 |
CN101228000B (zh) | 2010-06-09 |
KR20080021610A (ko) | 2008-03-07 |
JP4883996B2 (ja) | 2012-02-22 |
US7754105B2 (en) | 2010-07-13 |
BRPI0610168A2 (pt) | 2010-06-01 |
EP1886759A1 (en) | 2008-02-13 |
JP2007000928A (ja) | 2007-01-11 |
HK1120464A1 (en) | 2009-04-03 |
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