TWI358767B - Plasma for resist removal and facet control of und - Google Patents

Plasma for resist removal and facet control of und Download PDF

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Publication number
TWI358767B
TWI358767B TW096137171A TW96137171A TWI358767B TW I358767 B TWI358767 B TW I358767B TW 096137171 A TW096137171 A TW 096137171A TW 96137171 A TW96137171 A TW 96137171A TW I358767 B TWI358767 B TW I358767B
Authority
TW
Taiwan
Prior art keywords
und
plasma
resist removal
facet control
facet
Prior art date
Application number
TW096137171A
Other languages
English (en)
Other versions
TW200836257A (en
Inventor
Yifeng Zhou
Siyi Li
Terry Leung
Michael D Armacost
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200836257A publication Critical patent/TW200836257A/zh
Application granted granted Critical
Publication of TWI358767B publication Critical patent/TWI358767B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32697—Electrostatic control
    • H01J37/32706—Polarising the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Chemical Vapour Deposition (AREA)

Description

1358767 而使被激發的氣體提供下層介電質特徵的邊緣琢面高度， 其中下層介電質特徵的邊緣琢面高度爲介電質特徵的高度 的約10 % ;以及 (iii )所述氣體排放裝置能從所述腔排出所述製 程氣體。
1 1、如申請專利範圍第1 0項所述的裝置，其中，所述 程式碼包含運行所述氣體激發器以設置所述第一偏壓的功 率級別與所述第二偏壓的功率級別的比率小於1 1的指令。 1 2、如申請專利範圍第1 0項所述的裝置，其中，所述 程式碼包含運行所述氣體激發器以設置所述第一偏壓和所 述第二偏壓的至少其中之一的功率級別從5 0到1 000瓦的 指令。
1 3、如申請專利範圍第1 0項所述的裝置，其中，所述 程式碼包含運行所述氣體激發器以設置第一頻率約爲 13.6MHz並且第二頻率爲2MHz的指令。 1 4、如申請專利範圍第1 0項所述的裝置，其中，所述 程式碼包含運行所述氣體分佈器以提供一包含 CO、02、 N2、H2與H20中的一種或多種的製程氣體的指令。 31
TW096137171A 2006-10-31 2007-10-03 Plasma for resist removal and facet control of und TWI358767B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/555,017 US7758763B2 (en) 2006-10-31 2006-10-31 Plasma for resist removal and facet control of underlying features

Publications (2)

Publication Number Publication Date
TW200836257A TW200836257A (en) 2008-09-01
TWI358767B true TWI358767B (en) 2012-02-21

Family

ID=39330774

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096137171A TWI358767B (en) 2006-10-31 2007-10-03 Plasma for resist removal and facet control of und

Country Status (6)

Country Link
US (1) US7758763B2 (zh)
EP (1) EP1942377A3 (zh)
JP (1) JP4800287B2 (zh)
KR (1) KR100947678B1 (zh)
CN (1) CN101174108A (zh)
TW (1) TWI358767B (zh)

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US7758763B2 (en) 2006-10-31 2010-07-20 Applied Materials, Inc. Plasma for resist removal and facet control of underlying features
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US7637269B1 (en) * 2009-07-29 2009-12-29 Tokyo Electron Limited Low damage method for ashing a substrate using CO2/CO-based process

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Also Published As

Publication number Publication date
US7758763B2 (en) 2010-07-20
JP2008124460A (ja) 2008-05-29
CN101174108A (zh) 2008-05-07
TW200836257A (en) 2008-09-01
EP1942377A2 (en) 2008-07-09
KR20080039215A (ko) 2008-05-07
EP1942377A3 (en) 2009-11-25
KR100947678B1 (ko) 2010-03-16
JP4800287B2 (ja) 2011-10-26
US20080102645A1 (en) 2008-05-01

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