TWI358427B - - Google Patents
Download PDFInfo
- Publication number
- TWI358427B TWI358427B TW96109989A TW96109989A TWI358427B TW I358427 B TWI358427 B TW I358427B TW 96109989 A TW96109989 A TW 96109989A TW 96109989 A TW96109989 A TW 96109989A TW I358427 B TWI358427 B TW I358427B
- Authority
- TW
- Taiwan
- Prior art keywords
- cerium oxide
- decane
- film
- composition
- forming
- Prior art date
Links
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 36
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 36
- 239000000203 mixture Substances 0.000 claims description 25
- 150000001875 compounds Chemical class 0.000 claims description 15
- 238000006297 dehydration reaction Methods 0.000 claims description 10
- 230000018044 dehydration Effects 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 9
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 125000000962 organic group Chemical group 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 36
- 238000000576 coating method Methods 0.000 description 23
- 239000011248 coating agent Substances 0.000 description 22
- 238000010438 heat treatment Methods 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 9
- -1 fluorenyl trimethoxy decane Chemical compound 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 6
- 239000003377 acid catalyst Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- QMOWYWSHERGNQQ-UHFFFAOYSA-N N=C=O.CCCCCCCCCC Chemical compound N=C=O.CCCCCCCCCC QMOWYWSHERGNQQ-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001354 calcination Methods 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- OTGGHZUEAWMAAK-UHFFFAOYSA-N (1,1-dimethoxy-1-phenyldecan-2-yl)benzene Chemical compound C1(=CC=CC=C1)C(C(OC)(OC)C1=CC=CC=C1)CCCCCCCC OTGGHZUEAWMAAK-UHFFFAOYSA-N 0.000 description 1
- WJMXTYZCTXTFJM-UHFFFAOYSA-N 1,1,1,2-tetraethoxydecane Chemical compound C(C)OC(C(OCC)(OCC)OCC)CCCCCCCC WJMXTYZCTXTFJM-UHFFFAOYSA-N 0.000 description 1
- IMSVBNQVZVQSND-UHFFFAOYSA-N 1,5-bis(sulfanyl)pentan-3-one Chemical compound SCCC(=O)CCS IMSVBNQVZVQSND-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- GNIJLZHYBVVHMA-UHFFFAOYSA-N 1-decoxypropan-2-ol Chemical compound CCCCCCCCCCOCC(C)O GNIJLZHYBVVHMA-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- GCZWJRLXIPVNLU-UHFFFAOYSA-N 2,2-dimethoxy-3-methylundecane Chemical compound CC(C(OC)(OC)C)CCCCCCCC GCZWJRLXIPVNLU-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- JJCSHDJYJIBTNM-UHFFFAOYSA-N 3,3-diethoxydodecane Chemical compound CCCCCCCCCC(CC)(OCC)OCC JJCSHDJYJIBTNM-UHFFFAOYSA-N 0.000 description 1
- IIEWMRPKJCXTAD-UHFFFAOYSA-N 3-(trimethoxymethyl)undecane Chemical compound C(C)C(C(OC)(OC)OC)CCCCCCCC IIEWMRPKJCXTAD-UHFFFAOYSA-N 0.000 description 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 1
- KJZBSJXXYPVALB-UHFFFAOYSA-N 3-methoxy-3-sulfanylbutan-1-ol Chemical compound SC(CCO)(C)OC KJZBSJXXYPVALB-UHFFFAOYSA-N 0.000 description 1
- OXBHXROMEWUKII-UHFFFAOYSA-N 4-ethyltridecane Chemical compound CCCCCCCCCC(CC)CCC OXBHXROMEWUKII-UHFFFAOYSA-N 0.000 description 1
- HUGOGZMJMUFUBH-UHFFFAOYSA-N C(C)(=O)O.SOS Chemical class C(C)(=O)O.SOS HUGOGZMJMUFUBH-UHFFFAOYSA-N 0.000 description 1
- IXQBMTJJADIMOS-UHFFFAOYSA-N C(C)(=O)OC(COCCCCCCCCCC)C Chemical compound C(C)(=O)OC(COCCCCCCCCCC)C IXQBMTJJADIMOS-UHFFFAOYSA-N 0.000 description 1
- QNGUFVBAHBNZGW-UHFFFAOYSA-N C(C)C(C(OC)(OC)CC)CCCCCCCC Chemical compound C(C)C(C(OC)(OC)CC)CCCCCCCC QNGUFVBAHBNZGW-UHFFFAOYSA-N 0.000 description 1
- UEYMLSDWUUKDND-UHFFFAOYSA-N C(C)C(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound C(C)C(C(OCC)(OCC)OCC)CCCCCCCC UEYMLSDWUUKDND-UHFFFAOYSA-N 0.000 description 1
- GFPKWPNBGJZRKK-UHFFFAOYSA-N C(C)C(C(OCCC)(OCCC)CC)CCCCCCCC Chemical compound C(C)C(C(OCCC)(OCCC)CC)CCCCCCCC GFPKWPNBGJZRKK-UHFFFAOYSA-N 0.000 description 1
- XSOACBZRHGOSSP-UHFFFAOYSA-N C(C)C(C(OCCC)(OCCC)OCCC)CCCCCCCC Chemical compound C(C)C(C(OCCC)(OCCC)OCCC)CCCCCCCC XSOACBZRHGOSSP-UHFFFAOYSA-N 0.000 description 1
- AEPHJJCJSZQPJB-UHFFFAOYSA-N C(C)C(CCCCCCCCCOC)(CC)CC Chemical compound C(C)C(CCCCCCCCCOC)(CC)CC AEPHJJCJSZQPJB-UHFFFAOYSA-N 0.000 description 1
- ZTQDAIKZKAWDNI-UHFFFAOYSA-N C(C)C(CCCCCCCCCOCC)(CC)CC Chemical compound C(C)C(CCCCCCCCCOCC)(CC)CC ZTQDAIKZKAWDNI-UHFFFAOYSA-N 0.000 description 1
- GJWYKQLEZDZADW-UHFFFAOYSA-N C(C)NN.C(C(C)O)O Chemical compound C(C)NN.C(C(C)O)O GJWYKQLEZDZADW-UHFFFAOYSA-N 0.000 description 1
- XRQHDBIOJKXINQ-UHFFFAOYSA-N C(C)OC(CCCCCCCCC)(OCC)OCC.C1=CC=CC=2C3=CC=CC=C3CC12 Chemical compound C(C)OC(CCCCCCCCC)(OCC)OCC.C1=CC=CC=2C3=CC=CC=C3CC12 XRQHDBIOJKXINQ-UHFFFAOYSA-N 0.000 description 1
- OFTCDOQQZMYUJW-UHFFFAOYSA-N C(CC)C(C(OC)(OC)CCC)CCCCCCCC Chemical compound C(CC)C(C(OC)(OC)CCC)CCCCCCCC OFTCDOQQZMYUJW-UHFFFAOYSA-N 0.000 description 1
- ZYICQNMJAGPXKS-UHFFFAOYSA-N C(CC)C(C(OCC)(OCC)CCC)CCCCCCCC Chemical compound C(CC)C(C(OCC)(OCC)CCC)CCCCCCCC ZYICQNMJAGPXKS-UHFFFAOYSA-N 0.000 description 1
- XRNDMACZMJPCRX-UHFFFAOYSA-N C(CC)C(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound C(CC)C(C(OCC)(OCC)OCC)CCCCCCCC XRNDMACZMJPCRX-UHFFFAOYSA-N 0.000 description 1
- IDRQCNMLBGDDJS-UHFFFAOYSA-N C(CC)C(C(OCCC)(OCCC)CCC)CCCCCCCC Chemical compound C(CC)C(C(OCCC)(OCCC)CCC)CCCCCCCC IDRQCNMLBGDDJS-UHFFFAOYSA-N 0.000 description 1
- OCYWWJFUSMCSCH-UHFFFAOYSA-N C(CC)C(CCCCCCCCCOC)(CCC)CCC Chemical compound C(CC)C(CCCCCCCCCOC)(CCC)CCC OCYWWJFUSMCSCH-UHFFFAOYSA-N 0.000 description 1
- XBUCAILUHNASOA-UHFFFAOYSA-N C(CC)C(CCCCCCCCCOCC)(CCC)CCC Chemical compound C(CC)C(CCCCCCCCCOCC)(CCC)CCC XBUCAILUHNASOA-UHFFFAOYSA-N 0.000 description 1
- COLVMTCDAXARQQ-UHFFFAOYSA-N C(CC)NN.C(C(C)O)O Chemical compound C(CC)NN.C(C(C)O)O COLVMTCDAXARQQ-UHFFFAOYSA-N 0.000 description 1
- IDFYSNKHPHQPJK-UHFFFAOYSA-N C(CCCCCCCCC)C(C(OCCC)(OCCC)OCCC)CCCCCCCC Chemical compound C(CCCCCCCCC)C(C(OCCC)(OCCC)OCCC)CCCCCCCC IDFYSNKHPHQPJK-UHFFFAOYSA-N 0.000 description 1
- STJBWPMXSJHEFV-UHFFFAOYSA-N C1(=CC=CC=C1)C(C(OCC)(OCC)C1=CC=CC=C1)CCCCCCCC Chemical compound C1(=CC=CC=C1)C(C(OCC)(OCC)C1=CC=CC=C1)CCCCCCCC STJBWPMXSJHEFV-UHFFFAOYSA-N 0.000 description 1
- WMAZOIVUIWQRKU-UHFFFAOYSA-N C1(=CC=CC=C1)C(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound C1(=CC=CC=C1)C(C(OCC)(OCC)OCC)CCCCCCCC WMAZOIVUIWQRKU-UHFFFAOYSA-N 0.000 description 1
- RFQJUXFODPAHQH-UHFFFAOYSA-N C1(=CC=CC=C1)C(CCCCCCCCCOC)(C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)C(CCCCCCCCCOC)(C1=CC=CC=C1)C1=CC=CC=C1 RFQJUXFODPAHQH-UHFFFAOYSA-N 0.000 description 1
- SOKCRYXJCGOICF-UHFFFAOYSA-N C1(=CC=CC=C1)C(CCCCCCCCCOCC)(C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)C(CCCCCCCCCOCC)(C1=CC=CC=C1)C1=CC=CC=C1 SOKCRYXJCGOICF-UHFFFAOYSA-N 0.000 description 1
- LNEJJQMNHUGXDW-UHFFFAOYSA-N CC(C(OCC)(OCC)C)CCCCCCCC Chemical compound CC(C(OCC)(OCC)C)CCCCCCCC LNEJJQMNHUGXDW-UHFFFAOYSA-N 0.000 description 1
- AGXZVGXBNXCJMA-UHFFFAOYSA-N CC(C(OCCC)(OCCC)C)CCCCCCCC Chemical compound CC(C(OCCC)(OCCC)C)CCCCCCCC AGXZVGXBNXCJMA-UHFFFAOYSA-N 0.000 description 1
- ICLWANDVDRTPBG-UHFFFAOYSA-N CC(CCCCCCCCCOCC)(C)C Chemical compound CC(CCCCCCCCCOCC)(C)C ICLWANDVDRTPBG-UHFFFAOYSA-N 0.000 description 1
- JVNGBOZHOKVQOO-UHFFFAOYSA-N CC(CCCCCCCCCOCCC)(C)C Chemical compound CC(CCCCCCCCCOCCC)(C)C JVNGBOZHOKVQOO-UHFFFAOYSA-N 0.000 description 1
- KDWQGVIRHOTQHB-UHFFFAOYSA-N CC(CCCCCCCCCOCCCCCCCCCC)(C)C Chemical compound CC(CCCCCCCCCOCCCCCCCCCC)(C)C KDWQGVIRHOTQHB-UHFFFAOYSA-N 0.000 description 1
- 101100328518 Caenorhabditis elegans cnt-1 gene Proteins 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- 229930182558 Sterol Natural products 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical group O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical group CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- NYGSPCGCXLLSCZ-UHFFFAOYSA-N oct-1-ene-1,3-dione Chemical compound CCCCCC(=O)C=C=O NYGSPCGCXLLSCZ-UHFFFAOYSA-N 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003304 ruthenium compounds Chemical class 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 150000003432 sterols Chemical class 0.000 description 1
- 235000003702 sterols Nutrition 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- ZDPHROOEEOARMN-UHFFFAOYSA-N undecanoic acid Chemical compound CCCCCCCCCCC(O)=O ZDPHROOEEOARMN-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Paints Or Removers (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006083733A JP2007254678A (ja) | 2006-03-24 | 2006-03-24 | シリカ系被膜形成用組成物およびシリカ系被膜 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200745265A TW200745265A (en) | 2007-12-16 |
| TWI358427B true TWI358427B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2012-02-21 |
Family
ID=38541187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096109989A TW200745265A (en) | 2006-03-24 | 2007-03-22 | Composition for forming silica coating and silica coating |
Country Status (3)
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5991846B2 (ja) * | 2012-04-24 | 2016-09-14 | 東京応化工業株式会社 | 膜形成用組成物、拡散剤組成物、膜形成用組成物の製造方法、及び拡散剤組成物の製造方法 |
| JP6013150B2 (ja) * | 2012-11-22 | 2016-10-25 | メルクパフォーマンスマテリアルズマニュファクチャリング合同会社 | ポジ型感光性シロキサン組成物の製造方法 |
| JP2015052101A (ja) * | 2013-08-06 | 2015-03-19 | 東京応化工業株式会社 | 膜形成用材料 |
| JP6533443B2 (ja) * | 2014-10-03 | 2019-06-19 | 東京応化工業株式会社 | 半導体基板の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58216194A (ja) * | 1982-06-10 | 1983-12-15 | Matsumoto Seiyaku Kogyo Kk | シリケ−ト組成物 |
| JPH0762122B2 (ja) * | 1986-09-09 | 1995-07-05 | 松本製薬工業株式会社 | 耐熱絶縁塗料組成物 |
| JPH0715084B2 (ja) * | 1986-10-27 | 1995-02-22 | 松本製薬工業株式会社 | 表面処理方法 |
| JPH0499029A (ja) * | 1990-08-07 | 1992-03-31 | Nec Corp | 絶縁膜の形成方法 |
| JP3702842B2 (ja) * | 2001-12-04 | 2005-10-05 | 日立化成工業株式会社 | シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品 |
| JPWO2003087228A1 (ja) * | 2002-04-12 | 2005-08-18 | Ａｚエレクトロニックマテリアルズ株式会社 | ケイ素含有共重合ポリマー組成物、溶剤可溶性架橋ケイ素含有共重合ポリマー及びこれらの硬化物 |
-
2006
- 2006-03-24 JP JP2006083733A patent/JP2007254678A/ja active Pending
-
2007
- 2007-03-22 TW TW096109989A patent/TW200745265A/zh unknown
- 2007-03-23 WO PCT/JP2007/056090 patent/WO2007111270A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007254678A (ja) | 2007-10-04 |
| WO2007111270A1 (ja) | 2007-10-04 |
| TW200745265A (en) | 2007-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5529912B2 (ja) | シャロートレンチアイソレーション膜のためのアミノシラン | |
| JP4021131B2 (ja) | 低誘電率シリカ系被膜形成用塗布液および低誘電率シリカ系被膜付基板 | |
| TWI431040B (zh) | Organic silicon dioxide film and method for forming the same, composition for forming insulating film of semiconductor device and manufacturing method thereof, and wiring structure | |
| WO1997035939A1 (fr) | Fluide pour realiser un revetement de silice a permittivite basse et substrat portant ce revetement a permittivite basse | |
| WO1999055789A1 (fr) | Liquide de revetement utilise pour former un film a base de silice presentant une faible constante dielectrique et substrat sur lequel est couche un film a faible constante dielectrique | |
| TWI358427B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPH11340219A (ja) | シリカ系被膜及びその形成方法 | |
| TWI308164B (en) | Laminate, method for preparing the composition for film formation, and method for forming insulating film | |
| TWI234787B (en) | Silica-based coating film on substrate and coating solution therefor | |
| JP4139710B2 (ja) | 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜、及び半導体装置 | |
| WO2016167892A1 (en) | Polysiloxane formulations and coatings for optoelectronic applications | |
| TW201927945A (zh) | 用於形成二氧化矽層的組合物、二氧化矽層以及電子裝置 | |
| JP4162060B2 (ja) | 低誘電率シリカ系被膜形成用塗布液および低誘電率被膜付基材 | |
| JPH11340220A (ja) | シリカ系被膜形成用塗布液及びその製造方法 | |
| TWI358431B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPH03188179A (ja) | シリカ系被膜形成用塗布液，半導体基板の製造法および半導体デバイス | |
| JP4257141B2 (ja) | 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜、及び半導体装置 | |
| JP2004307693A (ja) | 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜、及び半導体装置 | |
| JPH06181201A (ja) | 半導体装置の絶縁膜およびその絶縁膜形成用塗布液 | |
| US20040253462A1 (en) | Composition, methods for forming low-permittivity film using the composition, low-permittivity film, and electronic part having the low-permittivity film | |
| CN107129757A (zh) | 用于形成二氧化硅层的组成物、二氧化硅层及其制造方法以及包含二氧化硅层的电子装置 | |
| JPH0819380B2 (ja) | 厚膜絶縁体形成用組成物の製造方法 | |
| TW201035258A (en) | Application liquid and method for formation of a silica-based coating film using the application liquid | |
| JPH04108881A (ja) | シリカ系被膜形成用塗布液およびシリカ系被膜の製造法 | |
| JP2008260939A (ja) | 低誘電率シリカ系被膜形成用塗布液 |