TWI357649B - - Google Patents

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Publication number
TWI357649B
TWI357649B TW097110926A TW97110926A TWI357649B TW I357649 B TWI357649 B TW I357649B TW 097110926 A TW097110926 A TW 097110926A TW 97110926 A TW97110926 A TW 97110926A TW I357649 B TWI357649 B TW I357649B
Authority
TW
Taiwan
Prior art keywords
forming
light
emitting diode
metal
substrate
Prior art date
Application number
TW097110926A
Other languages
English (en)
Chinese (zh)
Other versions
TW200921879A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW200921879A publication Critical patent/TW200921879A/zh
Application granted granted Critical
Publication of TWI357649B publication Critical patent/TWI357649B/zh

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  • Led Device Packages (AREA)
TW097110926A 2007-11-15 2008-03-27 Manufacturing method of light emitting diode package substrate TW200921879A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US99639107P 2007-11-15 2007-11-15

Publications (2)

Publication Number Publication Date
TW200921879A TW200921879A (en) 2009-05-16
TWI357649B true TWI357649B (enExample) 2012-02-01

Family

ID=40710960

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097110926A TW200921879A (en) 2007-11-15 2008-03-27 Manufacturing method of light emitting diode package substrate

Country Status (2)

Country Link
CN (1) CN101436639B (enExample)
TW (1) TW200921879A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102034905B (zh) * 2009-09-30 2013-02-13 陈一璋 发光二极管散热基板及其制作方法
TWI420711B (zh) * 2010-01-15 2013-12-21 Everlight Electronics Co Ltd 發光二極體封裝及其製作方法
US9627304B2 (en) * 2013-10-17 2017-04-18 Osram Opto Semiconductors Gmbh Method of producing a large number of support apparatus which can be surface-mounted, arrangement of a large number of support apparatus which can be surface-mounted, and support apparatus which can be surface-mounted
CN108336207B (zh) * 2018-01-05 2019-07-23 佛山市国星半导体技术有限公司 一种高可靠性led芯片及其制作方法
CN114430001B (zh) * 2022-01-10 2025-02-18 深圳Tcl新技术有限公司 玻璃基板加工方法及显示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1251566A1 (en) * 2001-04-19 2002-10-23 United Test Center Inc. Low profile optically-sensitive semiconductor package
CN1474462A (zh) * 2002-08-06 2004-02-11 ά 表面黏着发光二极管的封装结构及其制造方法
CN100388483C (zh) * 2005-06-10 2008-05-14 宋柏霖 复合发光二极管封装结构

Also Published As

Publication number Publication date
TW200921879A (en) 2009-05-16
CN101436639B (zh) 2010-06-02
CN101436639A (zh) 2009-05-20

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MM4A Annulment or lapse of patent due to non-payment of fees