TWI347348B - Anisotropic conductive adhesive and connecting method of electrodes using the same - Google Patents
Anisotropic conductive adhesive and connecting method of electrodes using the sameInfo
- Publication number
- TWI347348B TWI347348B TW095107393A TW95107393A TWI347348B TW I347348 B TWI347348 B TW I347348B TW 095107393 A TW095107393 A TW 095107393A TW 95107393 A TW95107393 A TW 95107393A TW I347348 B TWI347348 B TW I347348B
- Authority
- TW
- Taiwan
- Prior art keywords
- electrodes
- same
- conductive adhesive
- anisotropic conductive
- connecting method
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
- Adhesive Tapes (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005060290 | 2005-03-04 |
Publications (2)
Publication Number | Publication Date |
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TW200632068A TW200632068A (en) | 2006-09-16 |
TWI347348B true TWI347348B (en) | 2011-08-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW095107393A TWI347348B (en) | 2005-03-04 | 2006-03-06 | Anisotropic conductive adhesive and connecting method of electrodes using the same |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4891895B2 (ja) |
KR (1) | KR101298829B1 (ja) |
CN (2) | CN102277096A (ja) |
HK (1) | HK1116511A1 (ja) |
TW (1) | TWI347348B (ja) |
WO (1) | WO2006093315A1 (ja) |
Cited By (1)
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TWI571376B (zh) * | 2012-05-30 | 2017-02-21 | 日本寫真印刷股份有限公司 | 射出成形品與其製造方法、及電子機器 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100608533B1 (ko) | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
KR100888404B1 (ko) * | 2007-06-22 | 2009-03-13 | 삼성전기주식회사 | 도전성 페이스트와 이를 이용한 인쇄회로기판 및 그제조방법 |
KR20090054198A (ko) * | 2007-11-26 | 2009-05-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 점착 시트의 제조방법 및 이에 의한 점착 시트 |
JP5083076B2 (ja) * | 2008-07-09 | 2012-11-28 | 株式会社デンソー | 電子装置の製造方法 |
KR101615797B1 (ko) * | 2008-07-11 | 2016-04-26 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 |
JP5402804B2 (ja) * | 2010-04-12 | 2014-01-29 | デクセリアルズ株式会社 | 発光装置の製造方法 |
JP5695881B2 (ja) * | 2010-10-28 | 2015-04-08 | デクセリアルズ株式会社 | 電子部品の接続方法及び接続構造体 |
CN103079343B (zh) * | 2011-10-26 | 2017-12-05 | 日立化成株式会社 | 电路零件 |
JPWO2013171918A1 (ja) * | 2012-05-15 | 2016-01-07 | 京セラ株式会社 | 圧電アクチュエータ、圧電振動装置および携帯端末 |
JP6151412B2 (ja) * | 2012-09-18 | 2017-06-21 | デクセリアルズ株式会社 | 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法 |
JP5972844B2 (ja) * | 2012-09-18 | 2016-08-17 | デクセリアルズ株式会社 | 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法 |
CN103013370B (zh) * | 2012-12-14 | 2014-12-10 | 京东方科技集团股份有限公司 | 一种各向异性导电胶膜及电子装置 |
JP6289831B2 (ja) * | 2013-07-29 | 2018-03-07 | デクセリアルズ株式会社 | 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法 |
CN204130702U (zh) * | 2014-05-23 | 2015-01-28 | 西安中兴新软件有限责任公司 | 连接agps模块和主板的部件及无线接入终端 |
JP2016072239A (ja) * | 2014-09-30 | 2016-05-09 | デクセリアルズ株式会社 | 異方性導電フィルム、及び接続方法 |
DE102015112967A1 (de) * | 2015-08-06 | 2017-02-09 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement |
KR102520709B1 (ko) * | 2016-04-19 | 2023-04-12 | 삼성디스플레이 주식회사 | 인쇄회로기판용 보호테이프 및 이를 구비하는 디스플레이 장치 |
KR102126679B1 (ko) * | 2016-08-18 | 2020-06-25 | 주식회사 엘지화학 | 그물구조 전도체의 제조방법 |
KR101800367B1 (ko) | 2016-08-24 | 2017-11-28 | 한국기계연구원 | 마이크로 소자 전사방법 및 마이크로 소자 전사방법으로 제조된 마이크로 소자 기판 |
CN108574158B (zh) * | 2017-03-14 | 2020-10-09 | 群创光电股份有限公司 | 显示装置及其制造方法 |
DE102017210704A1 (de) * | 2017-06-26 | 2018-12-27 | Siemens Aktiengesellschaft | Elektrische Baugruppe und Verfahren zu deren Herstellung |
TW201910126A (zh) * | 2017-08-16 | 2019-03-16 | 日商Dic股份有限公司 | 接著帶與接著方法 |
JP7085919B2 (ja) * | 2018-06-29 | 2022-06-17 | リンテック株式会社 | 実装装置および実装方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51109936A (en) * | 1975-03-25 | 1976-09-29 | Suwa Seikosha Kk | Dodenihoseiomotsu setsuchakuzai |
JPS51114439A (en) * | 1975-04-02 | 1976-10-08 | Seiko Epson Corp | An adhesive having anisotropic electroconductivity |
JPS51135938A (en) * | 1975-05-21 | 1976-11-25 | Seiko Epson Corp | Anisotropic electroconductive adhesive |
DE69942824D1 (de) * | 1998-08-28 | 2010-11-18 | Panasonic Corp | Leitfähige paste, diese verwendende elektrisch leitfähige struktur, elektrisches bauteil, modul, leiterplatte, verfahren zum elektrischen verbinden, verfahren zur herstellung von einer leiterplatte he |
JP3650546B2 (ja) * | 1998-08-28 | 2005-05-18 | 松下電器産業株式会社 | 導電性ペースト、およびそれを用いた導電性構造、セラミック電子部品、電子部品、実装体、回路基板、電気的接続方法、回路基板の製造方法、及びセラミック電子部品の製造方法 |
JP3748095B2 (ja) * | 1999-03-10 | 2006-02-22 | 東洋紡績株式会社 | 導電性ペースト |
JP2001107019A (ja) * | 1999-10-07 | 2001-04-17 | Matsushita Electric Ind Co Ltd | 発泡性ペースト、電子部品実装体および電子部品剥離方法 |
-
2006
- 2006-03-06 WO PCT/JP2006/304278 patent/WO2006093315A1/ja active Search and Examination
- 2006-03-06 CN CN2011101543567A patent/CN102277096A/zh active Pending
- 2006-03-06 TW TW095107393A patent/TWI347348B/zh not_active IP Right Cessation
- 2006-03-06 JP JP2007506049A patent/JP4891895B2/ja not_active Expired - Fee Related
- 2006-03-06 CN CN200680007085XA patent/CN101146885B/zh not_active Expired - Fee Related
- 2006-03-06 KR KR1020077020124A patent/KR101298829B1/ko not_active IP Right Cessation
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- 2008-06-24 HK HK08107013.0A patent/HK1116511A1/xx not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI571376B (zh) * | 2012-05-30 | 2017-02-21 | 日本寫真印刷股份有限公司 | 射出成形品與其製造方法、及電子機器 |
Also Published As
Publication number | Publication date |
---|---|
CN101146885A (zh) | 2008-03-19 |
JP4891895B2 (ja) | 2012-03-07 |
KR101298829B1 (ko) | 2013-08-23 |
KR20070116808A (ko) | 2007-12-11 |
TW200632068A (en) | 2006-09-16 |
CN101146885B (zh) | 2012-09-05 |
WO2006093315A1 (ja) | 2006-09-08 |
HK1116511A1 (en) | 2008-12-24 |
JPWO2006093315A1 (ja) | 2008-08-07 |
CN102277096A (zh) | 2011-12-14 |
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