TWI347243B - Solder alloy for bonding oxide - Google Patents

Solder alloy for bonding oxide

Info

Publication number
TWI347243B
TWI347243B TW095125607A TW95125607A TWI347243B TW I347243 B TWI347243 B TW I347243B TW 095125607 A TW095125607 A TW 095125607A TW 95125607 A TW95125607 A TW 95125607A TW I347243 B TWI347243 B TW I347243B
Authority
TW
Taiwan
Prior art keywords
solder alloy
bonding oxide
bonding
oxide
solder
Prior art date
Application number
TW095125607A
Other languages
English (en)
Other versions
TW200706298A (en
Inventor
Minoru Yamada
Nobuhiko Chiwata
Original Assignee
Sophia Product Co
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sophia Product Co, Hitachi Metals Ltd filed Critical Sophia Product Co
Publication of TW200706298A publication Critical patent/TW200706298A/zh
Application granted granted Critical
Publication of TWI347243B publication Critical patent/TWI347243B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/08—Joining glass to glass by processes other than fusing with the aid of intervening metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
TW095125607A 2005-07-14 2006-07-13 Solder alloy for bonding oxide TWI347243B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005233746 2005-07-14

Publications (2)

Publication Number Publication Date
TW200706298A TW200706298A (en) 2007-02-16
TWI347243B true TWI347243B (en) 2011-08-21

Family

ID=37637220

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125607A TWI347243B (en) 2005-07-14 2006-07-13 Solder alloy for bonding oxide

Country Status (6)

Country Link
US (2) US20090208363A1 (zh)
JP (1) JP4669877B2 (zh)
KR (1) KR100930348B1 (zh)
CN (1) CN101198436B (zh)
TW (1) TWI347243B (zh)
WO (1) WO2007007840A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5019179B2 (ja) 2007-03-29 2012-09-05 日立金属株式会社 はんだ合金およびそれを用いたガラス接合体
JP2008280232A (ja) * 2007-04-13 2008-11-20 Hitachi Metals Ltd 被接合体の接合部形成装置及びそれを用いたガラス基板の接合装置、並びに被接合体の接合部形成方法及びそれを用いたガラス基板の接合方法
CN101402514B (zh) * 2007-10-03 2011-09-07 日立金属株式会社 氧化物接合用焊料合金和使用了它的氧化物接合体
KR101173531B1 (ko) * 2009-05-25 2012-08-13 히타치 긴조쿠 가부시키가이샤 땜납 합금 및 이를 이용한 땜납 접합체
KR101108157B1 (ko) 2009-11-19 2012-01-31 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치
WO2012075724A1 (en) * 2010-12-10 2012-06-14 Luoyang Landglass Technology Co., Ltd. Vacuum glass component
JP5845481B2 (ja) * 2011-07-06 2016-01-20 有限会社ソフィアプロダクト 酸化物接合材及びこれを用いた接合体
CN103775469A (zh) * 2012-10-23 2014-05-07 浙江喜乐嘉电器有限公司 一种紧固件的防盗结构及恢复工具
JP2016141611A (ja) * 2015-02-04 2016-08-08 旭硝子株式会社 接合用組成物
JP6788337B2 (ja) 2015-10-16 2020-11-25 Ａｇｃ株式会社 接合用組成物
CN107540247A (zh) * 2017-09-07 2018-01-05 上海耀江实业有限公司 一种真空玻璃真空制作方法
WO2019093320A1 (ja) 2017-11-10 2019-05-16 日本板硝子株式会社 ガラスパネル
JPWO2019093326A1 (ja) * 2017-11-10 2020-11-26 日本板硝子株式会社 溶融金属供給装置、これを用いたガラスパネルの製法及びガラスパネル
CN115397786B (zh) * 2020-04-09 2024-02-20 业纳光学系统有限公司 将玻璃元件热稳定地接合到支撑元件的方法、生产光学装置的方法以及光学装置
CN114131239B (zh) * 2021-12-27 2023-02-28 浙江亚通新材料股份有限公司 一种汽车玻璃焊接用无铅焊料

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3416979A (en) * 1964-08-31 1968-12-17 Matsushita Electric Ind Co Ltd Method of making a variable capacitance silicon diode with hyper abrupt junction
US4965229A (en) * 1988-02-05 1990-10-23 Matsushita Electric Industrial Co., Ltd. Glass ceramic for coating metal substrate
JP2584911B2 (ja) * 1991-06-18 1997-02-26 富士通株式会社 ガラス−セラミック多層回路基板の製造方法
JPH0715101A (ja) * 1993-06-25 1995-01-17 Shinko Electric Ind Co Ltd 酸化物セラミック回路基板及びその製造方法
JP2000141078A (ja) 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2000119046A (ja) * 1998-10-09 2000-04-25 Nippon Sheet Glass Co Ltd ガラスパネルの周縁部封止構造
JP2001058287A (ja) * 1999-06-11 2001-03-06 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2001028287A (ja) 1999-07-13 2001-01-30 Shin Etsu Polymer Co Ltd 電気コネクタ
CN1185077C (zh) * 2000-05-08 2005-01-19 上海飞轮有色冶炼厂 一种低锡铅合金焊料及制作方法
JP2003211283A (ja) * 2002-01-22 2003-07-29 Japan Science & Technology Corp 鉛フリーはんだ材料
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
KR20030046383A (ko) * 2003-05-28 2003-06-12 김경연 납땜성이 우수한 고온용 무연땜납
JP2005125360A (ja) * 2003-10-23 2005-05-19 Matsushita Electric Ind Co Ltd 高温はんだ材料，高温はんだ材料評価方法および電気／電子機器ならびにはんだ接合構造体

Also Published As

Publication number Publication date
TW200706298A (en) 2007-02-16
US20100147926A1 (en) 2010-06-17
CN101198436A (zh) 2008-06-11
KR100930348B1 (ko) 2009-12-08
CN101198436B (zh) 2010-10-06
KR20080021080A (ko) 2008-03-06
WO2007007840A1 (ja) 2007-01-18
JPWO2007007840A1 (ja) 2009-01-29
US20090208363A1 (en) 2009-08-20
JP4669877B2 (ja) 2011-04-13

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MM4A Annulment or lapse of patent due to non-payment of fees