TWI347167B - Circuit module - Google Patents

Circuit module

Info

Publication number
TWI347167B
TWI347167B TW097136416A TW97136416A TWI347167B TW I347167 B TWI347167 B TW I347167B TW 097136416 A TW097136416 A TW 097136416A TW 97136416 A TW97136416 A TW 97136416A TW I347167 B TWI347167 B TW I347167B
Authority
TW
Taiwan
Prior art keywords
circuit module
module
circuit
Prior art date
Application number
TW097136416A
Other languages
English (en)
Other versions
TW200915971A (en
Inventor
Hideyuki Sakamoto
Hidefumi Saito
Yasuhiro Koike
Masao Tsukizawa
Original Assignee
Sanyo Electric Co
Sanyo Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co, Sanyo Semiconductor Co Ltd filed Critical Sanyo Electric Co
Publication of TW200915971A publication Critical patent/TW200915971A/zh
Application granted granted Critical
Publication of TWI347167B publication Critical patent/TWI347167B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Inverter Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
TW097136416A 2007-09-27 2008-09-23 Circuit module TWI347167B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007252203A JP4969388B2 (ja) 2007-09-27 2007-09-27 回路モジュール

Publications (2)

Publication Number Publication Date
TW200915971A TW200915971A (en) 2009-04-01
TWI347167B true TWI347167B (en) 2011-08-11

Family

ID=40508042

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097136416A TWI347167B (en) 2007-09-27 2008-09-23 Circuit module

Country Status (4)

Country Link
US (1) US8169784B2 (zh)
JP (1) JP4969388B2 (zh)
CN (1) CN101399260B (zh)
TW (1) TWI347167B (zh)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4934559B2 (ja) * 2007-09-27 2012-05-16 オンセミコンダクター・トレーディング・リミテッド 回路装置およびその製造方法
JP2009081325A (ja) * 2007-09-27 2009-04-16 Sanyo Electric Co Ltd 回路装置
TW200915970A (en) * 2007-09-27 2009-04-01 Sanyo Electric Co Circuit device, circuit module and outdoor equipment
TWI402952B (zh) * 2007-09-27 2013-07-21 Sanyo Electric Co 電路裝置及其製造方法
JP5486820B2 (ja) * 2009-02-09 2014-05-07 矢崎総業株式会社 混成回路の基板実装構造
KR101067138B1 (ko) 2010-02-03 2011-09-22 삼성전기주식회사 파워 모듈 및 그 제조방법
KR101067190B1 (ko) * 2010-02-03 2011-09-22 삼성전기주식회사 파워 패키지 모듈 및 그 제조방법
JP2012079914A (ja) * 2010-10-01 2012-04-19 Mitsubishi Electric Corp パワーモジュールおよびその製造方法
KR101204187B1 (ko) 2010-11-02 2012-11-23 삼성전기주식회사 소성 접합을 이용한 파워 모듈 및 그 제조 방법
KR101194456B1 (ko) * 2010-11-05 2012-10-24 삼성전기주식회사 방열기판 및 그 제조방법
JP5338830B2 (ja) * 2011-03-15 2013-11-13 株式会社豊田自動織機 半導体装置
JP5633496B2 (ja) * 2011-09-29 2014-12-03 三菱電機株式会社 半導体装置及びその製造方法
US9165852B2 (en) * 2011-10-07 2015-10-20 Fuji Electric Co., Ltd. Mounting structure for printed circuit board, and semiconductor device using such structure
JP5661183B2 (ja) * 2012-02-13 2015-01-28 パナソニックＩｐマネジメント株式会社 半導体装置およびその製造方法
KR20140002330A (ko) * 2012-06-29 2014-01-08 삼성전기주식회사 중첩 모듈 패키지 및 그 제조 방법
KR101443972B1 (ko) * 2012-10-31 2014-09-23 삼성전기주식회사 일체형 전력 반도체 모듈
IN2013MU01205A (zh) * 2013-03-28 2015-04-10 Control Tech Ltd
US9398682B2 (en) 2013-03-28 2016-07-19 Control Techniques Limited Devices and methods for cooling components on a PCB
CN104604346B (zh) * 2013-08-30 2016-04-20 新电元工业株式会社 电气设备及其制造方法、以及电气设备的设计方法
FR3018013B1 (fr) * 2014-02-26 2018-01-12 Valeo Equipements Electriques Moteur Ensemble electronique pour machine electrique tournante pour vehicule automobile
DE102014007443A1 (de) * 2014-05-21 2015-11-26 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Elektrische Baugruppe für ein Kraftfahrzeug und Verfahren zur Montage einer solchen elektrischen Baugruppe
US10477724B2 (en) * 2015-03-09 2019-11-12 Datalogic IP Tech, S.r.l. Efficient heat exchange systems and methods
US9652008B2 (en) * 2015-04-02 2017-05-16 Det International Holding Limited Power module
JP6478818B2 (ja) * 2015-06-02 2019-03-06 三菱電機株式会社 車載用電子制御装置及びその製造方法
JP2017028174A (ja) * 2015-07-24 2017-02-02 サンケン電気株式会社 半導体装置
DE102015224422A1 (de) * 2015-12-07 2017-06-08 Robert Bosch Gmbh Elektronische Schaltungseinheit
US20170365826A1 (en) * 2016-06-20 2017-12-21 Black & Decker Inc. Battery packs and methods for manufacturing battery packs
JP7055800B2 (ja) * 2016-11-17 2022-04-18 エルジー イノテック カンパニー リミテッド 直流－直流コンバータ
CN109858107A (zh) * 2019-01-14 2019-06-07 北京交通大学 一种变流装置散热器堵塞程度评估方法及装置
JP6960984B2 (ja) * 2019-12-26 2021-11-05 三菱電機株式会社 電子装置及びその絶縁部材
WO2022041098A1 (zh) * 2020-08-28 2022-03-03 威刚科技股份有限公司 控制器装置
CN112864112A (zh) * 2021-01-19 2021-05-28 安徽安晶半导体有限公司 一种绝缘型大功率半导体模块

Family Cites Families (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222659A (ja) * 1986-03-24 1987-09-30 Sharp Corp 電力半導体装置
JPH01233795A (ja) * 1988-03-15 1989-09-19 Mitsubishi Electric Corp 混成集績回路
US5105322A (en) * 1990-06-29 1992-04-14 Digital Equipment Corporation Transverse positioner for read/write head
JP2705368B2 (ja) * 1991-05-31 1998-01-28 株式会社デンソー 電子装置
US5586388A (en) * 1991-05-31 1996-12-24 Nippondenso Co., Ltd. Method for producing multi-board electronic device
JP2814776B2 (ja) * 1991-05-31 1998-10-27 株式会社デンソー 電子装置
US5646827A (en) * 1991-05-31 1997-07-08 Nippondenso Co., Ltd. Electronic device having a plurality of circuit boards arranged therein
DE69227066T2 (de) * 1991-05-31 1999-06-10 Denso Corp., Kariya, Aichi Elektronische Vorrichtung
JP2936855B2 (ja) * 1991-12-26 1999-08-23 富士電機株式会社 電力用半導体装置
JP2854757B2 (ja) * 1992-06-17 1999-02-03 三菱電機株式会社 半導体パワーモジュール
JP2956363B2 (ja) * 1992-07-24 1999-10-04 富士電機株式会社 パワー半導体装置
JPH06283639A (ja) * 1993-03-25 1994-10-07 Sanyo Electric Co Ltd 混成集積回路
JPH07297575A (ja) * 1994-04-21 1995-11-10 Mitsubishi Electric Corp パワーモジュール装置
US5694294A (en) * 1995-01-27 1997-12-02 Hitachi, Ltd. Portable computer with fan moving air from a first space created between a keyboard and a first circuit board and a second space created between the first circuit board and a second circuit board
JP2725637B2 (ja) * 1995-05-31 1998-03-11 日本電気株式会社 電子回路装置およびその製造方法
JP3396566B2 (ja) * 1995-10-25 2003-04-14 三菱電機株式会社 半導体装置
DE19607226A1 (de) * 1996-02-27 1997-09-04 Metabowerke Kg Akku-Ladegerät für Elektrohandwerkzeuge
US5777846A (en) * 1996-05-30 1998-07-07 Northern Telecom Limited Circuit packs and circuit pack and shelf assemblies
JPH1069933A (ja) * 1996-08-29 1998-03-10 Amp Japan Ltd コネクタ接続装置およびそのコンタクト保持構造
JPH10229288A (ja) 1997-02-13 1998-08-25 Sansha Electric Mfg Co Ltd 電力半導体装置
JPH11121666A (ja) * 1997-10-20 1999-04-30 Fujitsu Ltd マルチチップモジュールの冷却装置
US6147869A (en) * 1997-11-24 2000-11-14 International Rectifier Corp. Adaptable planar module
TW470873B (en) * 1998-01-02 2002-01-01 Delta Electronics Inc Miniaturization of power supply system of portable computer by improving heat dissipation
US5995380A (en) * 1998-05-12 1999-11-30 Lear Automotive Dearborn, Inc. Electric junction box for an automotive vehicle
JPH11354955A (ja) * 1998-06-11 1999-12-24 Mitsubishi Electric Corp 電子機器の冷却構造
JP3521785B2 (ja) * 1999-02-05 2004-04-19 株式会社日立製作所 樹脂封止した半導体装置
JP2000228491A (ja) 1999-02-09 2000-08-15 Toshiba Corp 半導体モジュール及び電力変換装置
JP3547333B2 (ja) * 1999-02-22 2004-07-28 株式会社日立産機システム 電力変換装置
JP2000323878A (ja) * 1999-05-12 2000-11-24 Matsushita Electric Ind Co Ltd 電子機器の冷却構造
KR100319117B1 (ko) * 1999-06-30 2002-01-04 김순택 플라즈마 디스플레이 패널 장치
JP4114902B2 (ja) * 1999-07-12 2008-07-09 日本インター株式会社 複合半導体装置
US6166908A (en) * 1999-10-01 2000-12-26 Intel Corporation Integrated circuit cartridge
US6303860B1 (en) * 1999-11-30 2001-10-16 Bombardier Motor Corporation Of America Bladder insert for encapsulant displacement
JP2001189416A (ja) * 1999-12-28 2001-07-10 Mitsubishi Electric Corp パワーモジュール
JP4027558B2 (ja) * 2000-03-03 2007-12-26 三菱電機株式会社 パワーモジュール
US6350949B1 (en) * 2000-06-23 2002-02-26 Tyco Electronics Corp Sealed power distribution module
JP2002058134A (ja) * 2000-08-09 2002-02-22 Auto Network Gijutsu Kenkyusho:Kk 電子制御ユニットの搭載構造
JP4218193B2 (ja) * 2000-08-24 2009-02-04 三菱電機株式会社 パワーモジュール
JP4151209B2 (ja) * 2000-08-29 2008-09-17 三菱電機株式会社 電力用半導体装置
US6958535B2 (en) * 2000-09-22 2005-10-25 Matsushita Electric Industrial Co., Ltd. Thermal conductive substrate and semiconductor module using the same
DE10232566B4 (de) * 2001-07-23 2015-11-12 Fuji Electric Co., Ltd. Halbleiterbauteil
JP4064741B2 (ja) * 2002-06-25 2008-03-19 株式会社日立製作所 半導体装置
JP2004063604A (ja) * 2002-07-26 2004-02-26 Hitachi Home & Life Solutions Inc パワーモジュール及びこのパワーモジュールを用いた冷蔵庫
DE10239512A1 (de) * 2002-08-28 2004-03-11 Minebea Co. Ltd., A Japanese Corporation Anordnung zur Unterbringung der Leistungs- und Steuerelektronik eines Elektromotors
SG104348A1 (en) * 2002-11-21 2004-06-21 Inst Of Microelectronics Apparatus and method for fluid-based cooling of heat-generating devices
US6801430B1 (en) * 2003-05-09 2004-10-05 Intel Corporation Actuation membrane to reduce an ambient temperature of heat generating device
PL193094B1 (pl) * 2004-11-15 2007-01-31 Adb Polska Sp Urządzenie elektroniczne z płytą montażową z obwodami drukowanymi i płyta montażowa z obwodami drukowanymi
US7218517B2 (en) * 2004-12-07 2007-05-15 International Business Machines Corporation Cooling apparatus for vertically stacked printed circuit boards
JP4475160B2 (ja) * 2005-04-13 2010-06-09 株式会社デンソー 電子装置の製造方法
US7589978B1 (en) * 2005-04-27 2009-09-15 Flextronics Ap, Llc Air inlet diffuser
JP4769973B2 (ja) 2005-07-28 2011-09-07 オンセミコンダクター・トレーディング・リミテッド 回路装置
KR101203466B1 (ko) * 2006-04-20 2012-11-21 페어차일드코리아반도체 주식회사 전력 시스템 모듈 및 그 제조 방법
US7839655B2 (en) * 2006-05-22 2010-11-23 Continental Automotive Systems Us, Inc. Peg and hole press fit plastic housing
JP4325687B2 (ja) * 2007-02-23 2009-09-02 株式会社デンソー 電子装置
TWI402952B (zh) * 2007-09-27 2013-07-21 Sanyo Electric Co 電路裝置及其製造方法
TW200915970A (en) * 2007-09-27 2009-04-01 Sanyo Electric Co Circuit device, circuit module and outdoor equipment
JP4934559B2 (ja) * 2007-09-27 2012-05-16 オンセミコンダクター・トレーディング・リミテッド 回路装置およびその製造方法
JP2009081325A (ja) * 2007-09-27 2009-04-16 Sanyo Electric Co Ltd 回路装置

Also Published As

Publication number Publication date
CN101399260B (zh) 2012-05-02
TW200915971A (en) 2009-04-01
US20090086442A1 (en) 2009-04-02
US8169784B2 (en) 2012-05-01
JP2009088000A (ja) 2009-04-23
JP4969388B2 (ja) 2012-07-04
CN101399260A (zh) 2009-04-01

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