TWI347152B - - Google Patents

Info

Publication number
TWI347152B
TWI347152B TW092123116A TW92123116A TWI347152B TW I347152 B TWI347152 B TW I347152B TW 092123116 A TW092123116 A TW 092123116A TW 92123116 A TW92123116 A TW 92123116A TW I347152 B TWI347152 B TW I347152B
Authority
TW
Taiwan
Application number
TW092123116A
Other versions
TW200404484A (en
Inventor
Nakaoka Tadao
Suzuki Akitoshi
Otsuka Hideo
Kimijima Hisao
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW200404484A publication Critical patent/TW200404484A/zh
Application granted granted Critical
Publication of TWI347152B publication Critical patent/TWI347152B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12785—Group IIB metal-base component
    • Y10T428/12792—Zn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Metal Rolling (AREA)
  • Conductive Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
TW092123116A 2002-09-02 2003-08-22 Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board TW200404484A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002256666 2002-09-02

Publications (2)

Publication Number Publication Date
TW200404484A TW200404484A (en) 2004-03-16
TWI347152B true TWI347152B (zh) 2011-08-11

Family

ID=31492699

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092123116A TW200404484A (en) 2002-09-02 2003-08-22 Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board

Country Status (5)

Country Link
US (1) US7172818B2 (zh)
EP (1) EP1394291A3 (zh)
KR (1) KR101007580B1 (zh)
CN (1) CN100353819C (zh)
TW (1) TW200404484A (zh)

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KR100559933B1 (ko) * 2002-11-29 2006-03-13 엘에스전선 주식회사 저조도 동박의 전해연마방법 및 전해연마장치와 동박
WO2004070087A1 (ja) * 2003-02-04 2004-08-19 Furukawa Circuit Foil Co., Ltd 複合銅箔、その製造方法及び該複合銅箔を用いた高周波伝送回路
TW200500199A (en) * 2003-02-12 2005-01-01 Furukawa Circuit Foil Copper foil for fine patterned printed circuits and method of production of same
KR101065758B1 (ko) * 2003-02-27 2011-09-19 후루카와 덴키 고교 가부시키가이샤 전자파 실드용 동박, 그 제조방법 및 전자파 실드체
TW200535259A (en) * 2004-02-06 2005-11-01 Furukawa Circuit Foil Treated copper foil and circuit board
JP4448751B2 (ja) * 2004-09-30 2010-04-14 株式会社オーディオテクニカ コンデンサマイクロホン
WO2006068000A1 (ja) * 2004-12-22 2006-06-29 Nippon Steel Chemical Co., Ltd. Ｃｏｆ基板用積層体及びその製造方法並びにこのｃｏｆ基板用積層体を用いて形成したｃｏｆフィルムキャリアテープ
TWI396779B (zh) * 2005-02-21 2013-05-21 Copper foil and its manufacturing method, and flexible printed circuit board
KR100649755B1 (ko) * 2005-11-07 2006-11-27 삼성전기주식회사 박막 커패시터 내장된 인쇄회로기판 및 그 제조방법
TW200735317A (en) * 2006-03-14 2007-09-16 Novatek Microelectronics Corp Tape
US20080142249A1 (en) * 2006-12-13 2008-06-19 International Business Machines Corporation Selective surface roughness for high speed signaling
KR101289803B1 (ko) * 2008-05-16 2013-07-26 삼성테크윈 주식회사 회로 기판 및 그 제조 방법
US9201015B2 (en) 2011-07-14 2015-12-01 International Business Machines Corporation Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component
CN103929874B (zh) * 2014-04-09 2017-04-19 中国科学院微电子研究所 一种pcb线路板铜线路加工方法
JP6479254B2 (ja) * 2016-09-12 2019-03-06 古河電気工業株式会社 銅箔およびこれを有する銅張積層板
CN108930050A (zh) * 2017-05-26 2018-12-04 湖南省正源储能材料与器件研究所 一种锂离子电池负极集流体用超薄电子铜箔的制备方法
JP6895936B2 (ja) 2018-09-28 2021-06-30 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及び回路基板
CN110868799A (zh) * 2019-11-15 2020-03-06 江苏上达电子有限公司 一种透明cof设计方法
CN113737238B (zh) * 2021-10-11 2023-04-11 中色奥博特铜铝业有限公司 一种超低轮廓度压延铜箔表面粗化处理方法
CN114914165A (zh) * 2022-05-06 2022-08-16 北京燕东微电子科技有限公司 监测晶圆腐蚀液更换周期的方法

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Also Published As

Publication number Publication date
KR101007580B1 (ko) 2011-01-14
TW200404484A (en) 2004-03-16
EP1394291A2 (en) 2004-03-03
EP1394291A3 (en) 2006-11-22
CN100353819C (zh) 2007-12-05
CN1491073A (zh) 2004-04-21
US20040043242A1 (en) 2004-03-04
KR20040020824A (ko) 2004-03-09
US7172818B2 (en) 2007-02-06

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MM4A Annulment or lapse of patent due to non-payment of fees