TWI342055B - Wire loop, semiconductor device having same and wire bonding method - Google Patents
Wire loop, semiconductor device having same and wire bonding method Download PDFInfo
- Publication number
- TWI342055B TWI342055B TW095100024A TW95100024A TWI342055B TW I342055 B TWI342055 B TW I342055B TW 095100024 A TW095100024 A TW 095100024A TW 95100024 A TW95100024 A TW 95100024A TW I342055 B TWI342055 B TW I342055B
- Authority
- TW
- Taiwan
- Prior art keywords
- wire
- ball
- capillary
- joint
- bonding
- Prior art date
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K2101/32—Wires
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Description
丄 J 九、發明說明: 【發明所屬之技術領域】 第~~接合點和第二接合點 之線環、以及具有線環結 本發明係關於經由導線連接 之打線接合方法、具有某種形狀 合於其中之半導體元件。 【先前技術】 γ9Α圖或第9B圖所示,習知於半導體元件之以 • 進行用來將連接至導線架(⑻“_的半 片2之焊塾2a或第-接合點A經由導線3連接至導 '•泉=之引腳la或第二接合點z的打線。典型地,連^ ,點A和第二接合點Z之導線3之線環(W i r e丨〇 0 p) 大包括分別如第9A圖及帛9B_所示之梯形及三角形, 係分別揭示於例如美國專利第6,咖,_號或日本專利 申請案早期公開第2000-277558號公報。 一具有第9A圖所示之梯形形狀之線環係經由如第1〇圖 •所不之步驟順序來形成。首先,於第i 〇圖之步驟⑷,將 ’、有導線3通過其中的毛細管(capi Uary)4予以降下,而 將業已形成於導線3之梢端部的球30接合至晶片2的焊墊 或第一接合點Λ。然後,於第1 〇圖之步驟(b)中’在輪 送導線3的同時將毛細管4垂直升高至b點。隨後,第j 〇 圖之步驟(c)中,將毛細管4以與第二接合點z之相反方向 水平移動至C點。 動 通常此種將毛細管4以與第二接合點Z相反之方向移 之每作稱作為「反向操作(reverse operation)」。結果, 317764 導線3於A點與。點 *其傾斜部之上端藉由毛細泣刀小成為傾斜,且導線3係於 被輸送的A點與c點間之| 下、形成有肯曲部3 a。如此 焊墊2a與彎曲部3a 導;線3之部分係對應於頸部H (或 部Η。 之今線3部分)的高度,並將構成頸 接著於第10圖之步驟 將毛細管4垂直升言5 h . ,在輸送導線3的同時, 中,再度進行毛細管4之^ =後’於第1G圖之步驟⑷ 第二接合點Z之相反方向予二即將毛細管4以與 反向操作結果,導線3右另 ㈣至E點。由於此種 部,且_3b係形成於_3之傾斜部;^傾斜 干之料線3之傾斜部將構成具有如第^圖所 部分)。隨後’於第丨。圖之步驟⑴,將毛細管4垂::3高 至F占俾以對應於第9A圖所示線環之長傾斜部S (或介 ,於響曲部3b與引腳13間之導線3部分)的長度輸送導線 3。隨後,將毛細管4經由位置f,及h而下降至第二接合 點Z,並將導線3接合至第二接合點z或引腳la。 具有第9B圖所示三角形線環係經由如第丨〗圖所示之 一系列步驟而形成。因具有三角形形狀的線環不似前文說 明的梯形線環,前者並未設置上底部(L),故於形成三角形 線環時,並未進行第圖之步驟(d)和步驟(e)的第二反向 %作。因此於此種情況下,只於第丨丨圖之步驟(d)進行與 第I 0圖之步驟(d)、(6)及(f,f,及h除外)相對應的步驟。 317764 (§) 1342055 e: 更具體而言,第U圖之步驟⑷、㈦及(c)係與 步驟(a)、(b)及(c)相同,於第u圖步驟(c)之第—"之 作之後,於第U圖之步驟⑷,在輪送導線3的^向, 毛細:4垂直升高至Ffi。隨後於第^圖之”; 毛細當4以類似第〗〇圖之步驟⑴之方式透過位 知 移動’結果將導線3接合至第二接合點z或引胳p “: 但於前述技術中,因線環包括具有稍大的高度 H’故線環變高,因而線環變不穩定 / 無毛細管反向操作之情況下為了讓其頸部Η高度 讓頸部Η高度降至某個程度或以下,頸部η在拖…= ★導線=將其適當設置時容易受損,制在於導線夕 弟一接合點Α垂直延伸。 ’、处 因此,已提出多項技術來解決前述問題。舉例 吳國J利申請公開案第2_/〇丨〇4477號或曰本專利卜 =夕2_-1 72477號公報揭示—種經由導線而連接月第 :點和弟二接合點之線環,其中將該接合至第= 點之球的頂部連同部分導線進行軋扁。 。 具,此種形狀之線環可形成為具有低延伸狀態 ,線環’該線環穩定且形狀保持能力強勁。不僅 ==距離的線環,連具有長打線距離的線環也可f =有=伸狀態的穩定線環。此外,如此所形成的線 3= 持能力,其可忍受從外部施加於該線環 等衝ί:!?此’該線!對衝擊具有絕佳吸震功能,該 方、打線接合至弟二接合點期間經由毛細管接觸 317764 7 055 或發射超音波所造成的振動、導線的振動、於模製材料等 T出期間經由模製材料流所產生的外力,結果可有效防止 導線的f曲或傾m有效防止線環頸部的斷裂。 但於美國專利申請公開案第2004/〇1〇4477號揭示之 因部分導線及接合球頂部係藉於第-接合點的毛 ::乾扁,因此第-接合點可能受損。料,已經於第一 突出。當導線受到細微影響,之相反方向部分 曰且、·泉%方向相對於半導體晶 觸邊緣為傾斜時’導線之突出部可與相鄰接合點之導線接 【發明内容】 者。本發明係有鑑於前文說明之先前技術之問題點而研創 因此,本發明之目的係提供— 合至第1 ;&人Μ ϋ & 、種田不错由毛細管於接 f 1接“占料線與球形成軋扁 恶且為穩定的線環,該 有低延伸狀 本發明之另-目的;=頸部幾乎不會損傷。 半導體元件。 疋'、’重具有線環結合於其中之 本發明之又另一目 接合方法。 iTk供一種可形成該線環之打線 根據本發明之~~個能 含:連接m合點和E /心供—種線環。該線環包 接合至該第-接合點的接°點間之導線;該導線包括: 部延伸至該第二接h^、與該球相鄰的料、及從該頸 、主部;其中’該頸部包括凸部, 317764 上設有焊墊2a,焊墊2a 常形成為大體上三角形接合點A。導線3之線環通 塾2a或第一接合點八之^’且係包括具有球30接合至焊 之引聊la或第二接合、。H,以及具有接合至導線架1 S。頸部Η及主部之—端之主部或大致上傾斜部 種實施例之架構係約形成之彎曲部3A而連接。此 於該呈触忠a/,丄 。*知半導體元件之架構相同。但 & 4具收貫施例中,頸部 1A圖及第1B圖所示,凸,^凸部(η·—)1],如第 向,從該接合球30斜向向^、於朝向弟-接合點Z之方 30之頂部所形成,如第伸。頸部H之凸部h係由球 ^ A , ^ 弟3圖所示,當球3〇接合至第一接 口 .站A上吟,該球3〇之頂 已經形成。 、。卩已經進入毛細管4的開口,且 王nf 9B 知三角形線環之高度相比,由於線 設有㈣如此朝向第二接合點z傾斜,故可 可將線度之頊部H’而頸部“會受損。因此, 厚度縮:具有低延伸狀態’結果導致半導體元件10 圖所現在+考第2圖及第4圖,說明獲得苐1A圖及第1B 二不之丰導體元件10之根據本發明的打線接合方法之 =例1第2圖顯示毛細管4之移動路徑卜及藉由打線 而連接至第-接合點A及第二接合點Z的線環之完成 :先於第4圖之步驟⑷中,將毛細管4降下,同時開 乂失緊導線3以及鬆開導線3的夾具(未圖示),俾使 317764 12 成 泉3销端之球30接合至第一接八 3〇之頂部進入毛1 # m。此時,球 七細官4的開口,且因毛%營 形。如此變形的球如如v 乇、.田g 4的開口而變 ....p. ^ ^ , 3〇 刀形成線環頸部H的凸部 於弟4圖之步驟r h、士 止 1丨1洛仅, ’ ^輪送導線3的同時’將毛如其/ 斜向向上移動5赴D ,, J τ时七細官4 ···’ ,俾使凸部h朝向第二接合# z < f 以及於凸部h形成彎 ★广.,·.占Z傾斜, 中,當輸送導線3的 d方;第4圖之步驟⑷ 該點C可視需要而選定。 Ϊ直升问至點C,
隨後,於第4 FI + T 合點Z之方向水平移動::(1)二::毛,:朝向第二接 間的導線3部分形成為傾斜,且;導,::二與:π 形成彎曲部32。坎後^二之此部分的頂部 …、设方;弟4圖之步驟(e)中,去隹一 送導線3的同時,脾主今一 JY田進步輸 將毛細管4垂直升高至點D,兮跦n 視需要來選定。 门王^ D忒點D可 隨後於第4圖之+ _ f i . . νΛ(ί)中,將毛細管4朝向第二接合 .·.,之方向水平移動至點D卜結果 間之導線3部分形μ· Μ U兵點D1 頂泮形成彎曲部33。铁接# @ @ 、 道娉Ί + π 士 …、伎方;第4圖之步驟(g)中,當輸送 、"宁’將毛細管4垂直升高至點E 要而選定。 .·,5 ϋ j怳而 於第4圖之步驟⑻中,進行毛細管4之反 作,亦即毛細管4以與第_ s 、弟一接&點z之相反方向大體上水 = 將毛細管4從點£移動至點F而於導線3 七成⑼部3Β。隨後’於第4圖之步驟⑴_,當輸送導 317764 13 m •線3的同時,將毛細管4垂首并古c •點G。Θ此,長度與帛2圖 ^點G ’可視需要選定 的導線3已由毛細管4輸^不相之傾斜主部S相對應 隨後,以前述習知方法之相 ⑴,將毛細管4降下至第二接合/式進订第4圖之步驟 至第二接合點2。 以便將導線3接合 於第4圖之步驟(1〇中,進行毛细 導線3形成彎曲部3ββ該步驟下二之反向操作而於 >細管4如同第5Α圖所示之 /私取代,可將毛 此於導線3形成f曲部3β。^^向降下至關,藉 步驟⑴及步驟⑴之相同方式將毛細管4以第4圖之 情況下,將毛細管4沿第5β : :便形成線環。此種 成線環。 13不之移動路徑Ρ移動來形 於第4圖之步驟⑴中,將毛細 高至點G。該步驟可以下列步驟s,: Ί兄明垂直升 ,〇’)所示輸送導線3時,可 w 6A 11之步驟 . J將毛細管斜向升高至鞔Γ 交將毛細管4降下至第二接合 ;’,·,、 之相同方式將導線3接合至第二技人便以弟4圖之步驟⑴ 將毛細管H R ~ 妾D點Z。此種情況下, 二:第⑽圖所示移動路徑P來形成線環。 牵父it的是,毛細管4係其认— 點Z々;車垃妗 土方;第—接合點A與第二接合 以内: 定’而組構成為可於〇至500汽frs u内且於超過360痄于a於+ υυ U木犯圍 向移動向上,或°此外’經由將毛細管4斜 ,, 済毛、·田官4向上移動然後水平移動, 此由將毛細管4向十㈣ …、彳久斜向问下和勤’可形成各 14 317764 ⑧ 丄342055 個彎曲部31、32、33及3β。 如前文所述’於第4圖之步驟㈦中將毛細管4斜向向 上移動會造成與接合球;3 〇 _ ’ ° υ之了貝。卩相鄰的凸部h傾斜,存并 可提供其中頭部Η維持於較低产 …’曰b 環。此外,由於複個數f曲;:延伸狀態之線 線環頭部Η與主部8的所係形成於連接 耵所形成的考曲部3A上、或 =曲近的複數位置,故可形成具有低延伸狀態之 > 也不二:㈣"或頸部H造成任何損傷,以及毛細 ^也W於卜接合點_導線及/或接合球上留下任何 幸扁。己唬。於所完成的線環中, μ T x Ύ 4 曲 β 31、32 及 33 個別 八有尺寸棱小的彎曲記號於導線3上。 二實=現:止頸部Η受損所需的頸部11高度,於第 =Γ 線環為12°微米幻3〇微米,而於前 述根據本發明之實施例 φ 至7 fm半_ “部Η之高度為6 5微米 至70彳政未。根據美國專 所示技術”❹開*弟2_/01。4477號 > 曰毛〜而形成軋扁記號或軋為部分於導線及 方;弟一接合點之接合球上车 變成50微米或以下。…線%中’頸部之高度可 於前述實施例中,形成變曲部31、3 別係於第4圖之牛BWk、 , H木作刀 — & 之步钟(b)、步驟(〇至(d)及步驟(〇至(〇 仃-人此種形成操作可重複少於或多於三次,以於導 線之複數位置視需要形 、
〜成禝數弓曲部。舉例言之,如第7A ' 圖所示,兩個彎曲部31及32係形成於導線3 之連㈣"與主部5所形成之彎曲部W上,或於所形成 !5 317764 ⑧ 的所彎曲部3A附近。此種情況下 及步驟(d)所進行之操作。 各弟4圖步驟(c) 0⑭此方式’㈣可於複數位置穩定地彎曲邻:士 # 、,泉環之凸部可形诸盍目+ 弓曲。ί5。果, 成為具匀比習知低延伸觖能 高的強度,因此可形成位置穩…伸狀_之強度更 線環。 〜疋有強力形狀保持能力的 开/成方、^線3之傾斜主部$上银 將導線3接合至第二接合 Μβ係配置成當 於前述實施例中,導~ 3守15防止主部S向上擴張。 個彎曲沙部S於其令間位置只設有-弓曲。P 3B。然而,可於導 s ^ 線3的傾斜主部S之中間位置 數位置、及/或於接 彎曲邻。π# Q π 弟一接口點2的位置設置複個數 、弟8圖所示線環之實 3Β1及3Β2係設置於導 、幻中其令兩個考曲部 夺、.果d之傾斜主部s上。 由前文說明可知,於柝 i# Μ ^ ^ .. 、根據本發明之打線接合方法中, 運接亚通過第一接合 μ右搞社 ·、” ’、弟—接合點間的線環於其頸部上 叹有傾斜凸部,藉此盥 太八叫 ,、白知具有低延伸狀態之線環相比, 本设明之線環可降低頸 古 几邱 L 低員°卩回度’且提供具有增強的強度之 巴。丨。此種結構可描徂s.— 徒仏彳€、疋且可形成不會對頸部造成任何 Μ之具有低延伸狀態的線環。 錄由…、已”’玉參考附圖特別說明本發明之較佳實施例至某 種私度,但鑑於前 a 乂议不有多項修改及變化係屬可能。因 Λ…了解方、k附之申請專利範圍之範圍以内,可以特定 :明之方式以外之方式來實施本發明。 【圖式簡單說明】 317764 1342055 此等及其它本發明之目的以及本發明之多項伴隨之優 點經由參照後文詳細說明連同附圖—起考慮將更為明瞭. 其中: μ ’ 第1Α圖為正視圖’顯示於根據本發明之半導體元件 中’線環之實施例之形狀;
第1Β圖為放大片段視圖,顯示第u圖中由 所圈出的部分; ’ H 第2圖為示意放大圖’顯示形成具有第u圖及㈣ 圖所示形狀的線環之毛細管移動路徑; 第3圖為說明圖,顯示藉由球頂部所 球於球接合時進入毛細管開口; 〕凸4 ’该 第4圖為示意圖,藉由例子顯示根據本 ',·《 5毛細管移動之各步驟之導線形狀; 方法’ 第5A圖為示意圖,顯示根據第4 結合毛細管移動之各步驟之導線形狀;$ U之修改’ 丨第5Β圖為示意正視圖,顯示根據第μ 形成線環之毛細管的移動路徑; ®之各步驟來 第6Α圖為示意圖,顯示根據第4圖所 修改,彳士人主☆ μ扣知 y、方法之另一項 又一、··。口毛細官移動之各步驟之導線形狀; 乃負 ,第68圖為示意正視圖’顯示根據第6A、圃” 形成線環之毛細管的移動路徑; '〜各步驟來 第7A圖為正視圖,顯示於根據本發 中,線環之另一實施例之形狀; 月〜+導體元件 第7B圖為放大片段视圖, U 4不HA圆中由兩點鏈線 317764 17 1342055 所圈出之部分; η㈣正視圖,_示於根#本 中,線環之另一實施例之形狀; .,體&件 ^弟9Α圖及第9]Β圖為正視圖,顯示分別 用形之習知線環; /、有梯形和」 第〗〇圖為示意圖,顯示結合毛細管 圖:示之梯形線環之各步驟中之線環形?如第 第11圖為示意圖,顯示姓入 及 9:圖所示之三角形線環之各;二:二動來形戍如第 【主要TL件符號說明】 "衣形狀。
la 2a 3a 3A 4 30 A C D F G h P 引腳 焊墊 彎曲部 彎曲部 毛細管 球 第一接合點 點 ··«〇 點 點 凸部 移動路徑 第二接合點 1 導線架 2 半導體晶片 3 導線 3b 彎曲部 3B 彎曲部 φ10 半導體元件 31 ~· 3 3幫’曲部 B 點 C1 點 E 點 f 1-2位置 Η 頸部 L 上底部、主部 S 長傾斜部、主部
Claims (1)
1342055 第95100024號專利申請案 100年1月28曰修正替換頁 十、申請專利範圍: 1. 一種線環,包含:連接第一接合點和第二接合點 導線, 該導線包括:接合至該第一接合點的球、盥該球 相鄰的頸部、及從該頸部延伸至該第二接合點的主 部; ★其中,該頸部包括凸部,該凸部係從該接合球於 朝第二接合點之方向斜向朝上延伸,且該凸部係由該 球之頂部形成,it球於球接纟日夺已進入毛細管之 且已成形, 該凸部係具有較該導線之直徑為大之直徑。 2. 如申請專利錢第丨項之線環,其中,該導線包括至 少一個形成於該頸部或該主部的彎曲呓號。 3. ^申請專利範圍第2項之線環,其/該導線包括於 該續部與該主部間的彎曲部;及 複數個f曲s己號形成於該彎曲部上或於 部附近。 4. =打線接合方法,係使用毛細管將導線接合於第一 驟^點與第二接合點間,該打線接合方法包含下列步 將形成於該導線之梢端的球接合至該第一接合 該Ϊ線形成凸部’該凸部係具有較該導線之直 之直徑且係從該接合球延伸,該凸部係由已進 入1細管的開口之該球之頂部形成;及 接於該球之接合後’傾斜料線之該凸部以斜 317764(修正版) 19 第 95100024 向地從該接合球向上姑 點,該凸部係由該球凸部而朝向該第二接合 至該第一接合點· 形成’而於該球接合 且該球已經成形/球已經進入該毛細管的該開口 二申:專利範圍第4項之打線接合方法,其 一 毛細管斜向朝上移動,或經由將該毛 =上移動然後水平移動,或經由將該毛: 移動然後朝斜下方孩& 门上 之部分料線從㈣部所延伸 丨刀上形成至少—個彎曲部。 f申請專利範圍第5項之打線接合方法,其中,該凸 = :由將該毛細管斜向朝上移動而完成,且 匕括於該導線之凸部上形成彎曲部。 3 = Ϊ合方法,係使用毛細管將導線接合於第-驟^ 一接合點間,該打線接合方法包含下列步 ⑷將形成於該導線梢端之球接合至 =於料、㈣成凸部,該凸料具有㈣導線接之。 之越且係從該接合球延伸,該凸部係由已進 細官的開口之該球之頂部形成; (b)緊接於該球之接合後,於朝該第二接合點 細管斜向朝上移動,藉此使於該球接合至該 之上Γ時已經進入該毛細管之該開口的該導線 之該凸部朝該第二接合點之方向斜向朝上延伸, · 隨後將該毛細管垂直移動及水平㈣ 仃續控制,藉此於從該第—部分延伸之該導線至第二 317764(修正版) 20 Ι3Λ2055 =5100024號專利申請案 部分上形成至少一個彎曲部;以及匕-〜 (d)隨後,當從該毛細管輸逆兮道& 毛細管水平地且垂直地移進將該 真然後將該導線接合至該第二接二。订 :(申b);專Γ圍第7項之打線接合方法,其中,於^ :⑻中’係於該導線之第一部分上形成另 曲 .二:::利範圍第7項之打線接合方*,其中,步驟 鲁⑷^由將該毛細管斜向朝上移動,或經由將該毛細 官向上移動然後水平移動,或經由將該毛細管向上移 動然後斜向朝下移動來進行。 10.如申請專利範圍帛9項之打線接合方法,其中,步驟 (c)係重複進行以於$導線之第二部分上形成複數個 彎曲部。 Π.如申請專利範圍第9項之打線接合方法,其中,大型 彎曲部係於步驟(d)形成於該導線之第一部分與第二 • 部分間,該至少一個彎曲部係設置於該導線之一個位 置上’使上述至少一個彎曲部位於所形成之彎曲部上 或所形成的彎曲部附近’作為彎曲記號。 12. —種半導體元件,該半導體元件包含: 第一接合點; 第二接合點;及 導線’接合至該第一接合點及該第二接合點以連 接該第一接合點與該第二接合點間,該導線包括:接 合至該第一接合點的球、與該球相鄰的頸部、及從該 21 317764(修正版) 13.42055 第95100024號專利申請案 100年1月28日修正替換苜 頸部延伸至該第二接合點的主部; ~ 其中’該頸部包括凸部,該凸部係從該接合球朝 第二接合點之方向斜向朝上延伸,且該凸部係由該球 之頂部而形成,該球係於球接合時已進入毛細管之開 口且已成形, 該凸部係具有較該導線之直徑為大之直徑。 13.如申請專利範圍第12項之半導體元件,其中,該導 線包括至少一個形成於該頸部或該主部的彎曲記號。 馨14.如申請專利範圍第13項之半導體元件,其中,該導 線包括:於該頸部與該主部間的彎曲部;及 複數個彎曲記號形成於該彎曲部上或於該彎曲 部附近。
22 317764(修正版)
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