TWI341566B - Bump structure, method of forming bump structure, and semiconductor apparatus using the same - Google Patents
Bump structure, method of forming bump structure, and semiconductor apparatus using the sameInfo
- Publication number
- TWI341566B TWI341566B TW096115056A TW96115056A TWI341566B TW I341566 B TWI341566 B TW I341566B TW 096115056 A TW096115056 A TW 096115056A TW 96115056 A TW96115056 A TW 96115056A TW I341566 B TWI341566 B TW I341566B
- Authority
- TW
- Taiwan
- Prior art keywords
- bump structure
- same
- semiconductor apparatus
- forming
- forming bump
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
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- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13012—Shape in top view
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
- H01L2224/13017—Shape in side view being non uniform along the bump connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16104—Disposition relative to the bonding area, e.g. bond pad
- H01L2224/16106—Disposition relative to the bonding area, e.g. bond pad the bump connector connecting one bonding area to at least two respective bonding areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00013—Fully indexed content
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006127813A JP4216295B2 (ja) | 2006-05-01 | 2006-05-01 | バンプ構造およびその形成方法、ならびにそれを用いた半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200809993A TW200809993A (en) | 2008-02-16 |
TWI341566B true TWI341566B (en) | 2011-05-01 |
Family
ID=38647582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096115056A TWI341566B (en) | 2006-05-01 | 2007-04-27 | Bump structure, method of forming bump structure, and semiconductor apparatus using the same |
Country Status (5)
Country | Link |
---|---|
US (1) | US7683484B2 (zh) |
JP (1) | JP4216295B2 (zh) |
KR (1) | KR100884520B1 (zh) |
CN (1) | CN101068012A (zh) |
TW (1) | TWI341566B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI384603B (zh) | 2009-02-17 | 2013-02-01 | Advanced Semiconductor Eng | 基板結構及應用其之封裝結構 |
US8008785B2 (en) | 2009-12-22 | 2011-08-30 | Tessera Research Llc | Microelectronic assembly with joined bond elements having lowered inductance |
US9082763B2 (en) * | 2012-03-15 | 2015-07-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Joint structure for substrates and methods of forming |
KR101977391B1 (ko) | 2018-05-31 | 2019-08-28 | 주식회사 동부아이씨티 | 열영상 기반의 교통 신호 제어 방법 및 장치 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0429389A (ja) | 1990-05-24 | 1992-01-31 | Hitachi Chem Co Ltd | フレキシブルプリント配線板 |
JPH0529389A (ja) | 1991-07-22 | 1993-02-05 | Sharp Corp | 半導体素子の接続構造 |
JP3259377B2 (ja) | 1992-11-06 | 2002-02-25 | ソニー株式会社 | 半導体装置 |
JP2735022B2 (ja) | 1995-03-22 | 1998-04-02 | 日本電気株式会社 | バンプ製造方法 |
US5842628A (en) | 1995-04-10 | 1998-12-01 | Fujitsu Limited | Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method |
US6225143B1 (en) * | 1998-06-03 | 2001-05-01 | Lsi Logic Corporation | Flip-chip integrated circuit routing to I/O devices |
JP2000311915A (ja) | 1998-10-14 | 2000-11-07 | Texas Instr Inc <Ti> | 半導体デバイス及びボンディング方法 |
JP2001176908A (ja) | 1999-12-17 | 2001-06-29 | Matsushita Electronics Industry Corp | 半導体装置の製造方法 |
JP2001189338A (ja) | 1999-12-28 | 2001-07-10 | Fujitsu Ltd | 半導体装置、半導体装置の製造方法及び試験方法 |
JP2002076048A (ja) | 2000-09-05 | 2002-03-15 | Sony Corp | フリップチップ接続によるバンプの配置方法 |
JP3913134B2 (ja) | 2002-08-08 | 2007-05-09 | 株式会社カイジョー | バンプの形成方法及びバンプ |
JP2002329742A (ja) | 2001-05-07 | 2002-11-15 | Mitsubishi Electric Corp | 半導体装置 |
US7229906B2 (en) * | 2002-09-19 | 2007-06-12 | Kulicke And Soffa Industries, Inc. | Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine |
TWI221664B (en) * | 2002-11-07 | 2004-10-01 | Via Tech Inc | Structure of chip package and process thereof |
JP2004172477A (ja) * | 2002-11-21 | 2004-06-17 | Kaijo Corp | ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置 |
JP3854232B2 (ja) | 2003-02-17 | 2006-12-06 | 株式会社新川 | バンプ形成方法及びワイヤボンディング方法 |
US6815836B2 (en) * | 2003-03-24 | 2004-11-09 | Texas Instruments Incorporated | Wire bonding for thin semiconductor package |
US20050133928A1 (en) * | 2003-12-19 | 2005-06-23 | Howard Gregory E. | Wire loop grid array package |
-
2006
- 2006-05-01 JP JP2006127813A patent/JP4216295B2/ja not_active Expired - Fee Related
-
2007
- 2007-04-24 US US11/790,143 patent/US7683484B2/en not_active Expired - Fee Related
- 2007-04-27 TW TW096115056A patent/TWI341566B/zh not_active IP Right Cessation
- 2007-04-30 KR KR1020070042092A patent/KR100884520B1/ko not_active IP Right Cessation
- 2007-04-30 CN CNA200710102380XA patent/CN101068012A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US20070252272A1 (en) | 2007-11-01 |
KR100884520B1 (ko) | 2009-02-18 |
JP2007300000A (ja) | 2007-11-15 |
CN101068012A (zh) | 2007-11-07 |
KR20070106935A (ko) | 2007-11-06 |
JP4216295B2 (ja) | 2009-01-28 |
TW200809993A (en) | 2008-02-16 |
US7683484B2 (en) | 2010-03-23 |
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Legal Events
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MM4A | Annulment or lapse of patent due to non-payment of fees |