TWI339435B - Integrated circuit assembly - Google Patents

Integrated circuit assembly Download PDF

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Publication number
TWI339435B
TWI339435B TW92135250A TW92135250A TWI339435B TW I339435 B TWI339435 B TW I339435B TW 92135250 A TW92135250 A TW 92135250A TW 92135250 A TW92135250 A TW 92135250A TW I339435 B TWI339435 B TW I339435B
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TW
Taiwan
Prior art keywords
die
combination
stitches
substrate
dies
Prior art date
Application number
TW92135250A
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English (en)
Chinese (zh)
Other versions
TW200425462A (en
Inventor
Igor Y Khandros
Benjamin N Eldridge
Charles A Miller
A Nicholas Sporck
Gary W Grube
Gaetan L Mathieu
Original Assignee
Formfactor Inc
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Application filed by Formfactor Inc filed Critical Formfactor Inc
Publication of TW200425462A publication Critical patent/TW200425462A/zh
Application granted granted Critical
Publication of TWI339435B publication Critical patent/TWI339435B/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
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    • H01L23/13Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • H01L23/49503Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
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TW92135250A 2002-12-12 2003-12-12 Integrated circuit assembly TWI339435B (en)

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KR20050085561A (ko) 2005-08-29
US20040113250A1 (en) 2004-06-17
CN1742372A (zh) 2006-03-01
US7550842B2 (en) 2009-06-23
KR101062260B1 (ko) 2011-09-06
EP1573815A1 (en) 2005-09-14
WO2004055895A1 (en) 2004-07-01
CN100530640C (zh) 2009-08-19
JP2006510224A (ja) 2006-03-23
JP4452627B2 (ja) 2010-04-21
TW200425462A (en) 2004-11-16
AU2003299608A1 (en) 2004-07-09

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