CN100530640C - 集成电路组合件 - Google Patents

集成电路组合件 Download PDF

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Publication number
CN100530640C
CN100530640C CNB2003801092161A CN200380109216A CN100530640C CN 100530640 C CN100530640 C CN 100530640C CN B2003801092161 A CNB2003801092161 A CN B2003801092161A CN 200380109216 A CN200380109216 A CN 200380109216A CN 100530640 C CN100530640 C CN 100530640C
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China
Prior art keywords
trace
circuit die
substrate
circuit
sub
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Expired - Fee Related
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CNB2003801092161A
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English (en)
Chinese (zh)
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CN1742372A (zh
Inventor
伊戈尔·K·汉德罗斯
本杰明·N·埃尔德里奇
查尔斯·A·米勒
A·尼古拉斯·斯珀克
加里·W·格鲁比
加埃唐·L·马蒂厄
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FormFactor Inc
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FormFactor Inc
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

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  • General Physics & Mathematics (AREA)
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  • Structure Of Printed Boards (AREA)
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TWI339435B (en) 2011-03-21
US20040113250A1 (en) 2004-06-17
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AU2003299608A1 (en) 2004-07-09
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US7550842B2 (en) 2009-06-23
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