TWI338539B - - Google Patents

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Publication number
TWI338539B
TWI338539B TW93131579A TW93131579A TWI338539B TW I338539 B TWI338539 B TW I338539B TW 93131579 A TW93131579 A TW 93131579A TW 93131579 A TW93131579 A TW 93131579A TW I338539 B TWI338539 B TW I338539B
Authority
TW
Taiwan
Prior art keywords
copper foil
circuit board
thickness
flexible circuit
flexible
Prior art date
Application number
TW93131579A
Other languages
English (en)
Chinese (zh)
Other versions
TW200518645A (en
Inventor
Shiro Akama
Tatsuhiko Oshiro
Keizo Toyama
Takahisa Akatsuka
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200518645A publication Critical patent/TW200518645A/zh
Application granted granted Critical
Publication of TWI338539B publication Critical patent/TWI338539B/zh

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW093131579A 2003-11-07 2004-10-18 Flexible electric circuit board TW200518645A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003377882A JP2005142387A (ja) 2003-11-07 2003-11-07 可撓性回路基板

Publications (2)

Publication Number Publication Date
TW200518645A TW200518645A (en) 2005-06-01
TWI338539B true TWI338539B (ja) 2011-03-01

Family

ID=34688453

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093131579A TW200518645A (en) 2003-11-07 2004-10-18 Flexible electric circuit board

Country Status (3)

Country Link
JP (1) JP2005142387A (ja)
CN (1) CN1615068B (ja)
TW (1) TW200518645A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4751187B2 (ja) * 2005-11-30 2011-08-17 株式会社東芝 配線基板の製造方法
US8026903B2 (en) * 2007-01-03 2011-09-27 Apple Inc. Double-sided touch sensitive panel and flex circuit bonding
TW201037105A (en) * 2009-03-23 2010-10-16 Nippon Mining Co Double layered flexible board, and copper electrolytic liquid for making the same
CN102753733B (zh) * 2010-04-30 2015-11-25 吉坤日矿日石金属株式会社 挠性布线板用层压体

Also Published As

Publication number Publication date
JP2005142387A (ja) 2005-06-02
CN1615068A (zh) 2005-05-11
TW200518645A (en) 2005-06-01
CN1615068B (zh) 2010-05-26

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