TW200518645A - Flexible electric circuit board - Google Patents

Flexible electric circuit board

Info

Publication number
TW200518645A
TW200518645A TW093131579A TW93131579A TW200518645A TW 200518645 A TW200518645 A TW 200518645A TW 093131579 A TW093131579 A TW 093131579A TW 93131579 A TW93131579 A TW 93131579A TW 200518645 A TW200518645 A TW 200518645A
Authority
TW
Taiwan
Prior art keywords
circuit board
thickness
flexible
copper
opposite sides
Prior art date
Application number
TW093131579A
Other languages
English (en)
Other versions
TWI338539B (zh
Inventor
Shiro Akama
Tatsuhiko Oshiro
Keizo Toyama
Takahisa Akatsuka
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200518645A publication Critical patent/TW200518645A/zh
Application granted granted Critical
Publication of TWI338539B publication Critical patent/TWI338539B/zh

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW093131579A 2003-11-07 2004-10-18 Flexible electric circuit board TW200518645A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003377882A JP2005142387A (ja) 2003-11-07 2003-11-07 可撓性回路基板

Publications (2)

Publication Number Publication Date
TW200518645A true TW200518645A (en) 2005-06-01
TWI338539B TWI338539B (zh) 2011-03-01

Family

ID=34688453

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093131579A TW200518645A (en) 2003-11-07 2004-10-18 Flexible electric circuit board

Country Status (3)

Country Link
JP (1) JP2005142387A (zh)
CN (1) CN1615068B (zh)
TW (1) TW200518645A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4751187B2 (ja) * 2005-11-30 2011-08-17 株式会社東芝 配線基板の製造方法
US8026903B2 (en) * 2007-01-03 2011-09-27 Apple Inc. Double-sided touch sensitive panel and flex circuit bonding
TW201037105A (en) * 2009-03-23 2010-10-16 Nippon Mining Co Double layered flexible board, and copper electrolytic liquid for making the same
CN102753733B (zh) * 2010-04-30 2015-11-25 吉坤日矿日石金属株式会社 挠性布线板用层压体

Also Published As

Publication number Publication date
TWI338539B (zh) 2011-03-01
JP2005142387A (ja) 2005-06-02
CN1615068A (zh) 2005-05-11
CN1615068B (zh) 2010-05-26

Similar Documents

Publication Publication Date Title
TW200742540A (en) Metal base circuit board, led, and led light source unit
TW200733842A (en) Multilayer printed wiring board and method for producing the same
EP2346310A3 (en) Multilayer wiring circuit board
WO2009037939A1 (ja) プリント配線板及びその製造方法
TW200638813A (en) Flexible printed wiring board, multilayer flexible printed wiring board and portable telephone terminal using the multilayer flexible printed wiring board
TW200702161A (en) Copper-clad laminated board
TW200746933A (en) Substrate for flexible wiring and method for producing the same
WO2003074268A1 (en) Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
TW200624001A (en) Printed wiring board and manufacturing method therefor
TW200731908A (en) Multilayer printed wiring board and method for manufacturing same
TW200709739A (en) Hinge board and method for producing the same
TW200740330A (en) Printed circuit board and manufacturing method thereof
TW200629446A (en) Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate
SG153797A1 (en) Circuit board
EP1615488A3 (fr) Assemblage électronique à drain thermique notamment pour module de commande de lampe à décharge de projecteurs de véhicule automobile
TW201913835A (zh) 軟硬結合板及其製作方法
TW200516127A (en) Multilayer anisotropy conductive adhesive and connecting structure using thereof
MY143173A (en) Compact power semiconductor module having a connecting device
MY124850A (en) Substrate adhesion enhancement to film
TW200715919A (en) Dual-layered flexible circuit board
TW200746967A (en) Conductor-clad laminate, wiring circuit board, and processes for producing the same
WO2009075079A1 (ja) 回路板、回路板の製造方法およびカバーレイフィルム
TW200420203A (en) Multilayer board and its manufacturing method
AU2003293314A1 (en) Printed board comprising at least one stiff area and at least one flexible area, and method for the production of stiff-flexible printed boards
TWI771461B (zh) 印刷電路板