TWI338539B - - Google Patents
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- Publication number
- TWI338539B TWI338539B TW93131579A TW93131579A TWI338539B TW I338539 B TWI338539 B TW I338539B TW 93131579 A TW93131579 A TW 93131579A TW 93131579 A TW93131579 A TW 93131579A TW I338539 B TWI338539 B TW I338539B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- circuit board
- thickness
- flexible circuit
- flexible
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 34
- 239000011889 copper foil Substances 0.000 claims description 28
- 238000007747 plating Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 14
- 239000010410 layer Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000011229 interlayer Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 238000005553 drilling Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000005098 hot rolling Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 150000004060 quinone imines Chemical class 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- -1 quinone imide Chemical class 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003377882A JP2005142387A (ja) | 2003-11-07 | 2003-11-07 | 可撓性回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200518645A TW200518645A (en) | 2005-06-01 |
| TWI338539B true TWI338539B (https=) | 2011-03-01 |
Family
ID=34688453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093131579A TW200518645A (en) | 2003-11-07 | 2004-10-18 | Flexible electric circuit board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2005142387A (https=) |
| CN (1) | CN1615068B (https=) |
| TW (1) | TW200518645A (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4751187B2 (ja) * | 2005-11-30 | 2011-08-17 | 株式会社東芝 | 配線基板の製造方法 |
| US8026903B2 (en) * | 2007-01-03 | 2011-09-27 | Apple Inc. | Double-sided touch sensitive panel and flex circuit bonding |
| TW201037105A (en) * | 2009-03-23 | 2010-10-16 | Nippon Mining Co | Double layered flexible board, and copper electrolytic liquid for making the same |
| KR101318051B1 (ko) * | 2010-04-30 | 2013-10-14 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 플렉시블 배선판용 적층체 |
-
2003
- 2003-11-07 JP JP2003377882A patent/JP2005142387A/ja active Pending
-
2004
- 2004-10-18 TW TW093131579A patent/TW200518645A/zh not_active IP Right Cessation
- 2004-11-05 CN CN 200410092236 patent/CN1615068B/zh not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| TW200518645A (en) | 2005-06-01 |
| CN1615068A (zh) | 2005-05-11 |
| JP2005142387A (ja) | 2005-06-02 |
| CN1615068B (zh) | 2010-05-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |