CN1615068B - 挠性电路板 - Google Patents
挠性电路板 Download PDFInfo
- Publication number
- CN1615068B CN1615068B CN 200410092236 CN200410092236A CN1615068B CN 1615068 B CN1615068 B CN 1615068B CN 200410092236 CN200410092236 CN 200410092236 CN 200410092236 A CN200410092236 A CN 200410092236A CN 1615068 B CN1615068 B CN 1615068B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible
- thickness
- copper foil
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000011889 copper foil Substances 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 11
- 239000011229 interlayer Substances 0.000 claims abstract description 9
- 238000009713 electroplating Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000012790 adhesive layer Substances 0.000 claims abstract 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000007767 bonding agent Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 238000007747 plating Methods 0.000 description 10
- 238000009413 insulation Methods 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005253 cladding Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000004087 circulation Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP377882/2003 | 2003-11-07 | ||
| JP2003377882A JP2005142387A (ja) | 2003-11-07 | 2003-11-07 | 可撓性回路基板 |
| JP377882/03 | 2003-11-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1615068A CN1615068A (zh) | 2005-05-11 |
| CN1615068B true CN1615068B (zh) | 2010-05-26 |
Family
ID=34688453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410092236 Expired - Lifetime CN1615068B (zh) | 2003-11-07 | 2004-11-05 | 挠性电路板 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2005142387A (https=) |
| CN (1) | CN1615068B (https=) |
| TW (1) | TW200518645A (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4751187B2 (ja) * | 2005-11-30 | 2011-08-17 | 株式会社東芝 | 配線基板の製造方法 |
| US8026903B2 (en) * | 2007-01-03 | 2011-09-27 | Apple Inc. | Double-sided touch sensitive panel and flex circuit bonding |
| TW201037105A (en) * | 2009-03-23 | 2010-10-16 | Nippon Mining Co | Double layered flexible board, and copper electrolytic liquid for making the same |
| KR101318051B1 (ko) * | 2010-04-30 | 2013-10-14 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 플렉시블 배선판용 적층체 |
-
2003
- 2003-11-07 JP JP2003377882A patent/JP2005142387A/ja active Pending
-
2004
- 2004-10-18 TW TW093131579A patent/TW200518645A/zh not_active IP Right Cessation
- 2004-11-05 CN CN 200410092236 patent/CN1615068B/zh not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| TW200518645A (en) | 2005-06-01 |
| CN1615068A (zh) | 2005-05-11 |
| JP2005142387A (ja) | 2005-06-02 |
| TWI338539B (https=) | 2011-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100526 |
|
| CX01 | Expiry of patent term |