TWI338186B - - Google Patents

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Publication number
TWI338186B
TWI338186B TW092102638A TW92102638A TWI338186B TW I338186 B TWI338186 B TW I338186B TW 092102638 A TW092102638 A TW 092102638A TW 92102638 A TW92102638 A TW 92102638A TW I338186 B TWI338186 B TW I338186B
Authority
TW
Taiwan
Prior art keywords
layer
photovoltaic device
substrate
protective layer
film
Prior art date
Application number
TW092102638A
Other languages
English (en)
Chinese (zh)
Other versions
TW200401944A (en
Inventor
Takashi Miyazawa
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200401944A publication Critical patent/TW200401944A/zh
Application granted granted Critical
Publication of TWI338186B publication Critical patent/TWI338186B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Thin Film Transistor (AREA)
TW092102638A 2002-02-01 2003-01-30 Circuit substrate, electro-optical device and electronic appliances TW200401944A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002026132 2002-02-01
JP2003022022A JP2003316296A (ja) 2002-02-01 2003-01-30 回路基板、電気光学装置、電子機器

Publications (2)

Publication Number Publication Date
TW200401944A TW200401944A (en) 2004-02-01
TWI338186B true TWI338186B (enExample) 2011-03-01

Family

ID=26625676

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092102638A TW200401944A (en) 2002-02-01 2003-01-30 Circuit substrate, electro-optical device and electronic appliances

Country Status (6)

Country Link
US (2) US20030214042A1 (enExample)
EP (1) EP1333497A3 (enExample)
JP (1) JP2003316296A (enExample)
KR (1) KR100508296B1 (enExample)
CN (1) CN1268000C (enExample)
TW (1) TW200401944A (enExample)

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US8053159B2 (en) 2003-11-18 2011-11-08 Honeywell International Inc. Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
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KR101052960B1 (ko) * 2004-04-29 2011-07-29 엘지디스플레이 주식회사 반투과형 폴리실리콘 액정표시소자 제조방법
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US20080157065A1 (en) * 2004-08-03 2008-07-03 Ahila Krishnamoorthy Compositions, layers and films for optoelectronic devices, methods of production and uses thereof
US8901268B2 (en) 2004-08-03 2014-12-02 Ahila Krishnamoorthy Compositions, layers and films for optoelectronic devices, methods of production and uses thereof
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JP4967116B2 (ja) * 2005-08-23 2012-07-04 国立大学法人東北大学 多層回路基板及び電子機器
JP4994727B2 (ja) * 2005-09-08 2012-08-08 株式会社リコー 有機トランジスタアクティブ基板とその製造方法および該有機トランジスタアクティブ基板を用いた電気泳動ディスプレイ
KR100703157B1 (ko) 2005-09-15 2007-04-06 삼성전자주식회사 표시 장치
JP4428345B2 (ja) * 2006-02-03 2010-03-10 セイコーエプソン株式会社 光ヘッドおよび画像形成装置
KR100746163B1 (ko) * 2006-02-06 2007-08-06 삼성전자주식회사 디스플레이장치 및 그 제조방법
JP4542051B2 (ja) * 2006-02-22 2010-09-08 エヌ・ティ・ティ・アドバンステクノロジ株式会社 多孔質膜の形成方法
JP5128085B2 (ja) * 2006-06-06 2013-01-23 三菱電機株式会社 薄膜トランジスタ装置およびその製造方法
KR101269227B1 (ko) 2006-06-29 2013-05-30 엘지디스플레이 주식회사 유기전계 발광소자와 그 제조방법
US8642246B2 (en) 2007-02-26 2014-02-04 Honeywell International Inc. Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
JP5320753B2 (ja) * 2008-01-29 2013-10-23 セイコーエプソン株式会社 電気泳動表示装置
JP5378420B2 (ja) * 2008-02-25 2013-12-25 ハネウェル・インターナショナル・インコーポレーテッド 加工可能な無機及び有機ポリマー配合物、それらの製造方法及び使用
TWI555205B (zh) 2010-11-05 2016-10-21 半導體能源研究所股份有限公司 半導體裝置及半導體裝置的製造方法
JP6015389B2 (ja) * 2012-11-30 2016-10-26 株式会社リコー 電界効果型トランジスタ、表示素子、画像表示装置、及びシステム
US9960280B2 (en) * 2013-12-26 2018-05-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6451875B2 (ja) * 2018-01-04 2019-01-16 株式会社リコー 電界効果型トランジスタ、表示素子、画像表示装置、及びシステム
JP6787386B2 (ja) * 2018-12-12 2020-11-18 株式会社リコー 絶縁膜形成用塗布液
CN112071915B (zh) * 2019-06-10 2025-07-22 堺显示器制品株式会社 薄膜晶体管及其制造方法以及显示装置
US11217664B2 (en) * 2020-02-11 2022-01-04 Nanya Technology Corporation Semiconductor device with porous dielectric structure
US20210249310A1 (en) * 2020-02-11 2021-08-12 Nanya Technology Corporation Semiconductor device with porous dielectric structure and method for fabricating the same
DE102021107615A1 (de) * 2021-03-25 2022-09-29 Ottobock Se & Co. Kgaa Verfahren zum Herstellen eines dreidimensionalen Erzeugnisses
CN114203750A (zh) * 2021-12-07 2022-03-18 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法

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Also Published As

Publication number Publication date
JP2003316296A (ja) 2003-11-07
EP1333497A3 (en) 2005-01-05
KR100508296B1 (ko) 2005-08-17
US20030214042A1 (en) 2003-11-20
CN1435804A (zh) 2003-08-13
TW200401944A (en) 2004-02-01
CN1268000C (zh) 2006-08-02
EP1333497A2 (en) 2003-08-06
KR20030066417A (ko) 2003-08-09
US20090026942A1 (en) 2009-01-29

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