TWI337165B - Load lock and load lock chamber using the same - Google Patents

Load lock and load lock chamber using the same Download PDF

Info

Publication number
TWI337165B
TWI337165B TW093134534A TW93134534A TWI337165B TW I337165 B TWI337165 B TW I337165B TW 093134534 A TW093134534 A TW 093134534A TW 93134534 A TW93134534 A TW 93134534A TW I337165 B TWI337165 B TW I337165B
Authority
TW
Taiwan
Prior art keywords
substrate
substrate support
support plate
space
plates
Prior art date
Application number
TW093134534A
Other languages
English (en)
Chinese (zh)
Other versions
TW200526490A (en
Inventor
Yong Chun Quan
Bu Jin Ko
Jae-Wook Choi
Original Assignee
Jusung Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jusung Eng Co Ltd filed Critical Jusung Eng Co Ltd
Publication of TW200526490A publication Critical patent/TW200526490A/zh
Application granted granted Critical
Publication of TWI337165B publication Critical patent/TWI337165B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093134534A 2003-11-12 2004-11-11 Load lock and load lock chamber using the same TWI337165B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20030079888 2003-11-12
KR1020040085638A KR101131417B1 (ko) 2003-11-12 2004-10-26 로드락 장치 및 이를 설치한 로드락 챔버

Publications (2)

Publication Number Publication Date
TW200526490A TW200526490A (en) 2005-08-16
TWI337165B true TWI337165B (en) 2011-02-11

Family

ID=37245436

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093134534A TWI337165B (en) 2003-11-12 2004-11-11 Load lock and load lock chamber using the same

Country Status (3)

Country Link
KR (1) KR101131417B1 (ko)
CN (1) CN102130034B (ko)
TW (1) TWI337165B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101296157B1 (ko) * 2006-09-11 2013-08-19 주성엔지니어링(주) 기판 가장자리의 증착을 방지하는 기판처리장치 및 이를이용한 기판처리방법
KR101411620B1 (ko) * 2007-02-16 2014-06-25 엘아이지에이디피 주식회사 평판표시소자 제조장치의 로드 락 챔버
CN113035752B (zh) * 2021-03-05 2022-11-11 上海广川科技有限公司 负载锁定装置及基片传片方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1204265B (it) * 1986-03-24 1989-03-01 Cartigliano Off Spa Macchina essicatrice sottovuoto a piu' piani di lavoro per pelli conciate
JPH07257710A (ja) * 1994-03-18 1995-10-09 Sekisui Chem Co Ltd 自動生産ラインへの原材料供給方法
TW278200B (en) * 1995-07-06 1996-06-11 Brooks Automation Inc Door drive mechanisms for substrate carrier and load lock
JPH09125248A (ja) * 1995-10-31 1997-05-13 Kokusai Electric Co Ltd ロードロック室
US6688375B1 (en) * 1997-10-14 2004-02-10 Applied Materials, Inc. Vacuum processing system having improved substrate heating and cooling
JP3966594B2 (ja) 1998-01-26 2007-08-29 東京エレクトロン株式会社 予備真空室およびそれを用いた真空処理装置
US6375746B1 (en) 1998-07-10 2002-04-23 Novellus Systems, Inc. Wafer processing architecture including load locks

Also Published As

Publication number Publication date
TW200526490A (en) 2005-08-16
CN102130034B (zh) 2013-02-06
KR20050045821A (ko) 2005-05-17
KR101131417B1 (ko) 2012-04-03
CN102130034A (zh) 2011-07-20

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