TW200526490A - Load lock and load lock chamber using the same - Google Patents

Load lock and load lock chamber using the same Download PDF

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Publication number
TW200526490A
TW200526490A TW093134534A TW93134534A TW200526490A TW 200526490 A TW200526490 A TW 200526490A TW 093134534 A TW093134534 A TW 093134534A TW 93134534 A TW93134534 A TW 93134534A TW 200526490 A TW200526490 A TW 200526490A
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TW
Taiwan
Prior art keywords
substrate
support plate
substrate support
plate
load
Prior art date
Application number
TW093134534A
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Chinese (zh)
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TWI337165B (en
Inventor
Yong-Chun Quan
Bu-Jin Ko
Jae-Wook Choi
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Jusung Eng Co Ltd
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Publication of TW200526490A publication Critical patent/TW200526490A/en
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Publication of TWI337165B publication Critical patent/TWI337165B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Disclosed herein is a load lock to be on standby after loading a plurality of substrates in cooperation with a transfer means adapted to transfer the substrates form process chambers in turn. The present invention provides the load lock which increases the transfer rate thereof to efficiently transfer the substrates to the process chambers or the exterior, and a load lock chamber using the load lock. According to the present invention, the load lock includes a plurality of substrate support panels which support the substrates thereon, are movable vertically, and are spaced apart from each other by a distance that is greater than the thickness of the substrate, and drive units for vertically moving at least one of the substrate support panels.

Description

200526490 九、發明說明： 【發明所屬之技術領域】 本發明大體上係關於承載室，其用於與被調整以轉移基 板之轉移構件協作，將複數個基板加載至處理室或自其卸 載，該基板諸如半導體、液晶顯示器（LCD)或有機發光顯 不器（OLED)，且更具體而言，係關於承載室及使用其之 承載;，其可增大基板轉移速率且向處理室有效率地轉移 基板。 【先前技術】 圖la為包括一承載室的通常多艙型基板處理設備之示意 性平面圖。此設備包括在其中心之轉移室！。一或兩個‘ 載艙2或1〇2輕接至轉移室！。此設備亦包括複數個處理室 3。將轉移單元4安裝於轉移室1中。即，沿處理室i周圍提 供複數個處理室3及-或兩個承歸2。處理室3用於處理 基板’其中在處理室3中執行包括薄膜沈積、基板加熱過 私、基板冷卻難過料半導體製造處理。 其内具有單個狹槽之單槽承 理設備中之習知承載室。載^用作用於-般基板處 ^承餘2包括一與轉移室1連通之第-問門及與外部大 氣連通之第二閘Η，由此對基板進行加載或卸载。一 早疋被耦接至承載艙2以將空氣泵出或泵入 ，、 在承載請創造出真空環境或大 單2_’ =此 :載室之-閘門周圍的側面。此時空氣排=不= 為打開的。隨後驅動轉移構件以使用臂件將基板加載 97273.doc 200526490 於提供於承餘內之狹槽^接著轉移構件之料自承載 臉2退出。在間門關閉後’自承載驗_出空氣，因此在承 載搶2内形成真空。當承裁驗2的内部到達贼真空能階 時，開啓與轉移室!連通之間門，且轉移單元4自承载驗2 將基板卸載且制f件將基板轉移至預定處理[相反， 當需要自處理室向外部轉移基板時，以相反的次序執行上 述操作。 若承載室之基板加载或卸载速率比處理室之基板處理速 率It則處理至被空著、或必須處於待用狀態同時在基板 處理完成《完成之基板儲存於其中。當存在複數個處理 室或^在薄膜處理中處理時間很短時，此類情況經常發 生。藉由增加承載室之數目可解決此等問題。然而大量承 載室使基板處理設備之整體尺寸增大。圖lb為沿圖la之承 載擒102的線π-π剖切所得之剖視圖。如圖lb所示，儘管 增大了狹槽之數目以在承載搶中支撲複數個基板，但在此 等狹槽之間必須產生用於容納機械臂及基板的在此艙中的 空間以加載/卸載基板’因此增大了承載驗之尺寸。此外 隨著艘内空間增大’將空氣栗出艘花費更長的時間，因此 浪費能量且降低生產率。 【發明内容】 因此構想本發明以解決先前技術之上述問題。本發明之 一目的在於提供承載室及使用其之承載艙，其可增大其上 加載複數個基板並處於待用狀態之承載室的基板轉移速 率，因此有效地將基板轉移至處理室或外部。 97273.doc 200526490 本發明之另一 目的在於提供承载室及承載艙，將其設計200526490 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates generally to a load-bearing chamber, which is used to cooperate with a transfer member adjusted to transfer a substrate, and load or unload a plurality of substrates into a processing chamber. A substrate such as a semiconductor, a liquid crystal display (LCD), or an organic light emitting display (OLED), and more specifically, about a carrying chamber and a carrier using the same; it can increase a substrate transfer rate and efficiently to a processing chamber Transfer the substrate. [Prior Art] FIG. 1A is a schematic plan view of a general multi-cavity substrate processing apparatus including a load-bearing chamber. This equipment includes a transfer room in its center! . One or two ‘carriage compartments 2 or 102 are lightly connected to the transfer room! . This equipment also includes a number of processing chambers 3. The transfer unit 4 is installed in the transfer chamber 1. That is, a plurality of processing chambers 3 and / or two inheritances 2 are provided around the processing chamber i. The processing chamber 3 is used to process a substrate ', wherein a semiconductor manufacturing process including thin film deposition, substrate heating, and substrate cooling is performed in the processing chamber 3. A conventional load-bearing chamber in a single-slot processing facility having a single slot therein. The load ^ is used for a general substrate. The load 2 includes a first gate connected to the transfer chamber 1 and a second gate connected to the outside air, thereby loading or unloading the substrate. As soon as it is coupled to the load compartment 2 to pump air in or out, please create a vacuum environment or a large load in the load 2_ ’= this: the side of the load chamber-around the gate. At this time the air exhaust = no = is open. Subsequently, the transfer member is driven to load the substrate with the arm member 97273.doc 200526490 in the slot provided in the balance ^ Then the material of the transfer member is withdrawn from the bearing face 2. After the door is closed, the air is self-examined, so a vacuum is formed in the load compartment 2. When the interior of the acceptance test 2 reaches the thief vacuum level, open the door to the transfer chamber! And the transfer unit 4 unloads the substrate from the self-support inspection 2 and transfers the substrate to the predetermined processing [conversely, when needed When transferring the substrate from the processing chamber to the outside, the above operations are performed in the reverse order. If the substrate loading or unloading rate in the carrier chamber is higher than the substrate processing rate It in the processing chamber, it is processed until it is empty or must be in a standby state while the substrate processing is completed. The completed substrate is stored in it. Such situations often occur when there are multiple processing chambers or when the processing time is short in thin film processing. These problems can be solved by increasing the number of load cells. However, the large number of load cells increases the overall size of the substrate processing equipment. FIG. 1b is a cross-sectional view taken along line π-π of the load trap 102 of FIG. As shown in FIG. Lb, although the number of slots is increased to support a plurality of substrates in the load-bearing grab, a space in this compartment for housing the robotic arm and the substrate must be created between these slots. Loading / unloading the substrate 'therefore increases the size of the load inspection. In addition, as the space inside the vessel increases, it takes longer to pump out the air, thus wasting energy and reducing productivity. SUMMARY OF THE INVENTION Accordingly, the present invention is conceived to solve the above problems of the prior art. An object of the present invention is to provide a load-bearing chamber and a load-bearing compartment using the same, which can increase the substrate transfer rate of the load-bearing chamber on which a plurality of substrates are loaded and in a standby state, thereby effectively transferring the substrates to a processing chamber or outside . 97273.doc 200526490 Another object of the present invention is to provide a load-bearing chamber and a load-bearing cabin, and design them

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外殼中；一第二基板支撐板， < +赞阳的一態樣，提供一種承 一第一基板支撐板，其安裝於該 板’其置放於第一基板支撐板之 上而與第一基板支樓板間隔開；及一驅動單元，以便垂直 移動第一及第二基板支撐板中之至少一者，因此在第一及 第二基板支撐板之間產生空間以便加載或卸載基板。 較佳地，第一及第二基板支撐板中之一者為固定的，且 第一及第二基板支撐板中之另一者耦接至驅動單元且向上 或向下移動’因此產生用於加載或卸載基板之空間。 更佳地，驅動單元耦接至第一及第二基板支撐板中每一 者’第一基板支撐板向上移動且第二基板支撐板向下移動 以產生用於加載或卸載基板之空間。 承載室可進一步包含基板支撐突起部，其上安放基板且 其提供於第一及第二基板支撐板中每一者上以具有將基板 對準之功能。 此外，承載室可進一步包含：一基板進給單元以向第一 及第二基板支撐板中每一者加載基板或自其卸載基板；及 一或多個凹入部件，其提供於第一及第二基板支撐板中每 一者上以允許基板進給單元移動。 更佳地，第一及第二基板支撐板中每一者包含一冷卻及 97273.doc 200526490 /或加熱單元。 根據本發明之另一態樣，提供一承載室，其包含：一外 设，一第一基板支撐板，其安裝於該外殼中；一第二基板 支撐板，其置放於第一基板支撐板上而與第一基板支撐板 間隔開；一第三基板支撐板，其置放於第二基板支撐板上 而與第二基板支撐板間隔開；及一驅動單元，其垂直移動 第一至第三基板支撐板中之至少一者，因此在第一及第二 基板支撐板之間或第二及第三基板支撐板之間產生用於加 載或卸載基板之空間。 較佳地，第一基板支撐板為固定的，且驅動單元包含分 別_接至第二及第三基板支撐板之第一及第二驅動單元， 第一及弟二驅動單元向上移動以在第一與第二基板支撑板 之間及第二與第三基板支撐板之間產生用於加載或卸載基 板之空間。 更佳地’驅動單元包含一氣壓缸。 而且’第一至第三基板支撐板中每一者可包含一冷卻及 /或加熱單元。 更佳地，第一基板支撐板為固定的，且驅動單元水平移 動以便選擇性地垂直移動第二及第三基板支撐板中之一 者。 更佳地，第一基板支撐板小於第二基板支撐板，且第二 基板支撐板小於第三基板支撐板，以便提供用於容納驅動 單元之空間，該驅動單元耦接於外殼内壁周圍之預定位置 處0 97273.doc 200526490 承載室可進一步包含基板支撐突起部，其上安放基板且 其提供於第一至第三基板支撐板中每一者上以具有將基板 對準之功能。 根據本發明之另一態樣，提供一種驅動承載室之方法， 該承載室包含：一外殼；一第一基板支撐板，其安裝於該 外殼中；一第二基板支撐板，其置放於第一基板支撐板上 而與第一基板支撐板間隔開；及一驅動單元，以垂直移動 第一及第二基板支撐板中之至少一者。該方法包含以下步 驟：藉由將第一及第二基板支撐板向上或向下移動，在第 或第二基板支撐板上產生用於加載或卸載基板之空間； 及向第一或第二基板支撐板加載基板或自其卸載基板。 根據本發明之另一態樣，提供一種驅動承載室之方法， 該承載室包含··一外殼；一第一基板支撐板，其安裝於該 外Λ又中，一第一基板支撐板，其置放於第一基板支撐板上 而與第一基板支撐板間隔開；一第三基板支撐板，其置放 於第二基板支撐板上而與第二基板支撐板間隔開；及一驅 動單元，以垂直移動第一至第三基板支撐板中之至少一 者。該方法包含以下步驟··藉由垂直移動第一至第三基板 支撐板中之一者，在第一至第三基板支撐板上產生用於加 載或卸載基板之空間；及向第一至第三基板支撐板中之至 少一者加載基板或自其卸載基板。 根據本發明之另一態樣，提供一承載室，其包含：複數 個基板支撐板，其以大於基板厚度之預定間隔彼此間隔 開’各基板支撐板垂直移動且在其上表面支撐基板；及一 97273.doc -10- 200526490 驅動單元，其用於垂直移動基板支撐板中之至少一者。 【實施方式】 下文將參照隨附圖式詳盡地描述本發明之較佳實施例。 然而本發明並非意欲限制於下列實施例且在申請專利範圍 所界定的本發明之範疇内可進行各種改變及修飾。包括較 佳實施例僅為了協助理解本發明。貫穿不同圖式使用相同 的參考數字來指示相同或相似的組件。 包括根據本發明之承載艙的基板處理設備具有與圖“相 同之構造。類似地，在轉移室丨之中心提供轉移單元4，該 轉移室耦接安裝於承載艙2之側壁。藉由耦接至轉移單元4 之臂件，將加載於提供於承載艙内之基板支撐板上的基板 轉移至處理室，或在饋送至外部之前，將基板自處理室轉 移至基板支撐板。建構臂件使得諸如基板之待轉移物件被 加載於臂件的端部。建構臂件以使用真空夾盤或靜電夾盤 來及取及擡升基板，或間單地將基板置放於臂件之端部， 或在以真空夾盤或靜電夾盤固持基板時將基板擡升及移動 至另一位置。 圖2a及2b為沿圖1 a之承載艙2的線π _ ϋ剖切所得之剖視 圖，以示意性說明其中安裝根據本發明之承載室的艙，其 中承載室在加載兩塊基板後處於待用狀態。參考圖2&及 2b，根據本發明之承載艙包括一外殼；一第一基板支撐板 20，其安裝於該外殼中；一第二基板支撐板21，其置放於 第一基板支撐板20上並以預定間隔與第一基板支撐板2〇間 隔開；及一驅動單元25，以垂直移動第一及第二基板支撐 97273.doc 200526490 板20及21中之至少一者，因此在第一及第二基板支撐板20 及21之間產生用於加載或卸載基板之空間。 第一及第二基板支撐板20及21進一步分別包括基板支撐 突起部20a及21a。基板支撐突起部20a及21 a用於將基板對 準且保護所加載之基板。此外可包括一基板進給單元（未 圖示）及一或多個凹入部件（未圖示）。在此狀況下，基板進 給單元用於向第一及第二基板支撐板20及21中每一者加載 基板或自其卸載基板。在第一及第二基板支撐板2〇及21中 每一者上提供凹入部件以允許基板進給單元移動。此外第 一及第二基板支撐板2〇及21中每一者可進一步包括一冷卻 單元（未圖示）或一加熱單元（未圖示）。 因此，為了根據如圖lb所示之先前技術使用兩塊基板支 撐板20及21來加載或卸載兩塊基板，相鄰基板必須以預定 距離d彼此間隔開。因此承載艙2之全高丁丨不可避免地相應 於距離2d而增大。然而，根據本發明，如圖。及沘所示， 兩塊基板支撐板中之至少一者可移動，因此產生了用於加 載基板之充分距離d。因此承載艙2之全高T2可相應於距離 d而減小。可以各種方式驅動如上述建構之承載室。 作為一實例，將說明第一及第二基板支撐板2〇及21中之 一者為固定的狀況。假定第—基板支樓板2〇固定，第二基 板支撐板21由驅動單元25向上移動以向第一基板支揮板如 加載基板或自其卸載基板，因此產生了用於加載或卸载基 板之空間。接著由基板進給單元向第—基板支樓板2〇加載 基板或自其卸載基板。同時，當使用者需要向第二基板支 97273.doc -12- 200526490 撐板21加載基板或自其卸載基板時，由驅動單元25向下移 動第二基板支撐板21，因此產生用於加載或卸載基板之空 間。隨後由基板進給單元向第二基板支撐板21加載基板或 自其卸載基板。 此外將4田述第一及第一基板支撲板20及21為不固定之狀 况。在此狀況下，當需要向第一基板支撐板2〇加載基板或 自其卸載基板時，由驅動單元25向下移動第一基板支撐板 20且向上移動第二基板支撐板21。其後，向第一基板支撐 板20加載基板或自其卸載基板。接著若需要向第二基板支 撐板21加載基板或自其卸載基板，第二基板支撐板21向下 移動以便向第二基板支撐板加載基板或自其卸載基板。 虽然，本發明可包括複數個基板支撐板而不限於兩塊基 板支撐板。參考圖3以下將描述具有三塊基板支撐板之承 载艙。 圖3為沿圖la之承載艙2的線π_π剖切所得之剖視圖， 以說明其中安裝根據本發明之承載室的艙，其中承載室在 加載複數個基板後處於待用狀態。承載室安裝於承載艙2 中，此承載室在加載了待依次轉移至處理室之基板或待轉 移至外部之基板後處於待用狀態。承载艙2被密封且抽氣 以自其排出空氣，因此於其内形成真空。提供三塊基板支 撐板20、2丨及22，作為用於在艙内加載或卸載複數個基板 之基板支撐板。基板支撐板20、21及22以預定距離彼此間 隔開且在承載艙2中可垂直移動。按需要，將冷卻或加熱 單元安裝至基板支撐板20至22中每一者以冷卻或加熱承載 97273.doc -13- 200526490 餘中之基板。此外提供用於分別與轉移室！及承載艙外部 連通之閉門（未圖示），其在加载或卸載基板時開啓或關 閉舉例而5 ’可在圖3之前側及後側提供各別閘門。當 向外袖載基板或自其卸載基板時，與轉移室^連通之間 門關閉，且與外部連通之閉門開啓，使得承載搶2的内部 處於大氣麼力。另一方面，當向轉移室！加載基板或自其 却載基板時，與外部連通之閘門_且接著將空氣果出承 載艙2以在承載艙2中形成真空，且隨後與運載室4連通之 閉門開啓。作為垂直移動基板支撐板之驅動單元的一實 例，使用氣麼虹25。將氣屋紅25提供於基板支推板2〇、21 及22之相對端。在各基板支撐板上提供之氣壓缸可獨立操 作，因此允許基板支撐板以預定間隔彼此間隔開。在此狀 況下，較佳為下部基板支撐板2〇固定。當加載或卸载基板 打β亥構•產生用於在其上置放基板之基板支撐板上方容 納臂件之端部的預定空間。由於其上加載或卸載基板之基 板支撐板上方需要預定空間，所以當下部基板支撐板2〇固 定時承載艙2之高度最小化。因此安裝氣壓缸乃以垂直移 動中間基板支撲板21及上部基板支撲板2 2，但不移動下部 基板支撐板20。氣壓缸25可耦接至承載艙2的外部或内 °氣壓缸25穿過中間基板支撑板21的孔以搞接至上部基 板支樓板2 2。 圖4為一透視圖，其展示（例如藉由臂件29)向圖3之中間 基板支撐板21加載基板37或自其卸載基板37的狀態。在中 間基板支撐板21上提供複數個基板支撐突起部27，且在基 97273.doc -14- 200526490 板支撐突起部27上安放基板37以便支撐基板37。因此允許 將基板37穩定地加載至中間基板支撐板21上，從而防止基 板37由於與中間基板支撐板21直接接觸而變髒。為使用臂 件29向基板支撐突起部27加載基板37或自其卸載基板37， 中間基板支撐板21其上必須具有預定空間以允許臂件29平 滑地自基板與中間基板支撐板21之間移動或移動至基板與 中間基板支撐板21之間。為產生預定空間，可在基板支撐 板2 1上提供彼此平行之凹入部件3 〇以允許臂件2 9向前及向 後移動。舉例而言，如圖4所示，當由臂件29加載或卸載 基板37時，各凹入部件3〇延伸而開口於基板支撐板之前端 及/或後端。在此狀況下，在基板被置放於臂件29之端部 且插入承載室中後，基板被定位在基板支撐板21上方。而 後，臂件29向下移動，使得基板安放於基板支撐突起部27 上。臂件29之端部安置在基板支撐板的凹入部件3〇中。因 此當臂件29退出時，僅臂件29可移動而基板靜止。在基板 支撐板21上提供之凹入部件3〇增大了在加載或卸載基板時 _ 基板與基板支撐板之間的臂件29之端部的垂直移動距離， 因此允許減小基板支撐板之間的間隔。由於減小了基板支 撐板之間的間隔，所以可減小承載艙之體積，或在相同體 積之驗中可提供更多的基板支撐板。若臂件29藉由鎖扣基 板37之上部部分之周邊部分來轉移基板37，則無需凹入部 件30 〇 圖5 a展不了基板支樓板之另一實例，且說明了藉由臂件 29向圖2之中間基板支撑板21加載基板_自其卸載基板 97273.doc -15· 200526490 37的狀態。圖5b為沿圖5a之線IVB-IVB剖切所得的中間基 板支樓板之側面剖視圖，且其中省略了臂件。如圖5a及5b 所示，在各基板支#板上可進一步提供突出部26以產生預 定距離，以便當向基板支撐板加載基板時可允許基板支撐 板以大於基板厚度之距離彼此間隔開。意即，突出部26用 於產生預定空間，由此防止基板與其正上方之基板支撐板 相干擾。此外，當向基板支撐板2 1加載基板時，突出部26 亦藉由使基板與各突出部26之側表面接觸來對準基板。此 外可在圖4的各基板支撐板之外部周邊部分提供突出部 26。此外在基板支撐板21上提供基板支撐突出部27，且基 板37安放於基板支撐突出部27上以便支撐基板37，因此允 許將基板37穩定地加載至中間基板支撐板21上，且防止基 板37由於與基板支撐板2丨直接接觸而變髒。在此狀況下， 在待垂直移動之基板支撐板21上提供基板支撐突出部以， 因此允許基板被平滑地加載或卸載。意即，當將基板”置 放於臂件29之端部且向基板支撐板以加載或自其卸載時， 基板支撐突出部27向上移動超過臂件29之厚度，因此（例 如）允终臂件29在將基板37置放於基板支撐突出部”上之 後退出。在臂件29退出後，基板支撐突出部27向下移動以 "f至八初始位置。同時，在臂件Μ藉由鎖扣基板W之上 2 P刀之周邊部》來轉移基板37的狀況下，*需基板支撐In the housing; a second substrate support plate, < + Zanyang in one aspect, provides a first substrate support plate, which is mounted on the plate, which is placed on the first substrate support plate, and A substrate supporting floor is spaced apart; and a driving unit for vertically moving at least one of the first and second substrate supporting plates, thereby creating a space between the first and second substrate supporting plates for loading or unloading the substrate. Preferably, one of the first and second substrate supporting plates is fixed, and the other of the first and second substrate supporting plates is coupled to the driving unit and moves up or down, thus generating a Space for loading or unloading substrates. More preferably, the driving unit is coupled to each of the first and second substrate supporting plates. The first substrate supporting plate moves upward and the second substrate supporting plate moves downward to create a space for loading or unloading a substrate. The carrying chamber may further include a substrate supporting protrusion on which the substrate is placed and provided on each of the first and second substrate supporting plates to have a function of aligning the substrate. In addition, the loading chamber may further include: a substrate feeding unit to load or unload substrates from each of the first and second substrate supporting plates; and one or more recessed parts provided on the first and second substrate supporting plates. Each of the second substrate supporting plates is supported to allow the substrate feeding unit to move. More preferably, each of the first and second substrate support plates includes a cooling and cooling unit. According to another aspect of the present invention, a load-bearing chamber is provided, which includes: an external device, a first substrate support plate, which is installed in the housing; and a second substrate support plate, which is placed on the first substrate support. Spaced apart from the first substrate support plate; a third substrate support plate which is placed on the second substrate support plate and spaced from the second substrate support plate; and a drive unit which vertically moves the first to At least one of the third substrate supporting plates thus creates a space for loading or unloading a substrate between the first and second substrate supporting plates or between the second and third substrate supporting plates. Preferably, the first substrate supporting plate is fixed, and the driving unit includes first and second driving units connected to the second and third substrate supporting plates, respectively. The first and second driving units move upward to move the Spaces are created between the first and second substrate support plates and between the second and third substrate support plates for loading or unloading substrates. More preferably, the drive unit includes a pneumatic cylinder. And each of the 'first to third substrate supporting plates may include a cooling and / or heating unit. More preferably, the first substrate supporting plate is fixed, and the driving unit moves horizontally to selectively move one of the second and third substrate supporting plates vertically. More preferably, the first substrate supporting plate is smaller than the second substrate supporting plate, and the second substrate supporting plate is smaller than the third substrate supporting plate, so as to provide a space for accommodating a driving unit that is coupled to a predetermined periphery of the inner wall of the housing. The location 0 97273.doc 200526490 may further include a substrate supporting protrusion on which the substrate is mounted and which is provided on each of the first to third substrate supporting plates to have a function of aligning the substrate. According to another aspect of the present invention, a method for driving a load-bearing chamber is provided. The load-bearing chamber includes: a housing; a first substrate supporting plate installed in the housing; and a second substrate supporting plate placed on The first substrate supporting plate is spaced apart from the first substrate supporting plate; and a driving unit for vertically moving at least one of the first and second substrate supporting plates. The method includes the steps of: creating a space for loading or unloading a substrate on the first or second substrate supporting plate by moving the first and second substrate supporting plates upward or downward; and moving the first or second substrate supporting plate toward the first or second substrate. The support plate loads or unloads a substrate from it. According to another aspect of the present invention, a method for driving a load-bearing chamber is provided. The load-bearing chamber includes a housing; a first substrate support plate mounted on the outer substrate; a first substrate support plate, Placed on the first substrate support plate and spaced from the first substrate support plate; a third substrate support plate, placed on the second substrate support plate and spaced from the second substrate support plate; and a drive unit To vertically move at least one of the first to third substrate supporting plates. The method includes the following steps: by moving one of the first to third substrate supporting plates vertically, creating a space for loading or unloading a substrate on the first to third substrate supporting plates; and At least one of the three substrate supporting plates is loaded with or unloaded from the substrate. According to another aspect of the present invention, there is provided a load-bearing chamber including: a plurality of substrate support plates spaced apart from each other at a predetermined interval greater than the thickness of the substrate, 'each substrate support plate moves vertically and supports the substrate on its upper surface; and A 97273.doc -10- 200526490 driving unit for vertically moving at least one of the substrate supporting plates. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not intended to be limited to the following examples and various changes and modifications can be made within the scope of the present invention as defined by the scope of the patent application. The preferred embodiments are included only to assist in understanding the invention. The use of the same reference numbers throughout the different drawings indicates the same or similar components. The substrate processing apparatus including the carrier compartment according to the present invention has the same configuration as in the figure. Similarly, a transfer unit 4 is provided in the center of the transfer chamber 丨, which is coupled to the side wall of the carrier compartment 2. By coupling The arm piece to the transfer unit 4 transfers the substrate loaded on the substrate support plate provided in the load compartment to the processing chamber, or transfers the substrate from the processing chamber to the substrate support plate before feeding to the outside. The construction of the arm piece makes An object to be transferred, such as a substrate, is loaded on the end of the arm. Construct the arm to use a vacuum chuck or electrostatic chuck to lift and lift the substrate, or place the substrate on the end of the arm, Or lift and move the substrate to another position while holding the substrate with a vacuum chuck or an electrostatic chuck. Figures 2a and 2b are cross-sectional views taken along the line π _ 承载 of the load-carrying compartment 2 of Figure 1a to show Description The cabin in which the load-bearing chamber according to the present invention is installed, wherein the load-bearing chamber is in a standby state after loading two substrates. With reference to Figures 2 & 2b, the load-bearing cabin according to the present invention includes a housing; a first substrate support plate 20 It is installed in the housing; a second substrate supporting plate 21 is placed on the first substrate supporting plate 20 and is spaced apart from the first substrate supporting plate 20 at a predetermined interval; and a driving unit 25 is moved vertically The first and second substrate supports 97273.doc 200526490 at least one of the plates 20 and 21, so a space for loading or unloading a substrate is created between the first and second substrate supporting plates 20 and 21. The two substrate supporting plates 20 and 21 further include substrate supporting protrusions 20a and 21a, respectively. The substrate supporting protrusions 20a and 21a are used to align the substrate and protect the loaded substrate. In addition, a substrate feeding unit (not shown) may be included. (Shown) and one or more recessed parts (not shown). In this state, the substrate feeding unit is used to load or unload substrates to and from each of the first and second substrate support plates 20 and 21. Recessed parts are provided on each of the first and second substrate support plates 20 and 21 to allow the substrate feeding unit to move. In addition, each of the first and second substrate support plates 20 and 21 may be further Includes a cooling unit (not shown) or Heating unit (not shown). Therefore, in order to load or unload two substrates using two substrate support plates 20 and 21 according to the prior art shown in FIG. 1b, adjacent substrates must be spaced apart from each other by a predetermined distance d. Therefore The full height D of the load compartment 2 inevitably increases corresponding to the distance 2d. However, according to the present invention, as shown in Figs. And。, at least one of the two substrate supporting plates is movable, so that the The sufficient distance d of the substrate is loaded. Therefore, the total height T2 of the load compartment 2 can be reduced corresponding to the distance d. The load chamber constructed as described above can be driven in various ways. As an example, the first and second substrate support plates 2 will be explained. And one of 21 is a fixed state. Assuming that the first substrate supporting floor 20 is fixed, the second substrate supporting plate 21 is moved upward by the driving unit 25 to support the substrate such as loading a substrate or unloading a substrate therefrom, Space is thus created for loading or unloading the substrate. Then, the substrate feeding unit loads or unloads the substrate to the first substrate supporting floor 20. At the same time, when the user needs to load or unload the substrate to or from the second substrate support 97273.doc -12- 200526490 support plate 21, the drive unit 25 moves the second substrate support plate 21 downwards, thus generating a load for loading or unloading the substrate. Space for unloading the substrate. Then, the substrate is fed to or unloaded from the second substrate support plate 21 by the substrate feeding unit. In addition, the first and first substrate supporting flaps 20 and 21 of the four fields are not fixed. In this case, when a substrate needs to be loaded on or unloaded from the first substrate supporting plate 20, the driving unit 25 moves the first substrate supporting plate 20 downward and moves the second substrate supporting plate 21 upward. Thereafter, a substrate is loaded on or unloaded from the first substrate supporting plate 20. Then, if a substrate needs to be loaded on or unloaded from the second substrate supporting plate 21, the second substrate supporting plate 21 is moved downward to load or unload the substrate from the second substrate supporting plate. However, the present invention may include a plurality of substrate supporting plates and is not limited to two substrate supporting plates. With reference to Fig. 3, a carrier compartment having three substrate supporting plates will be described below. Fig. 3 is a cross-sectional view taken along the line π_π of the load compartment 2 of Fig. 1a to illustrate the compartment in which the load compartment according to the present invention is installed, wherein the load compartment is in a standby state after loading a plurality of substrates. The load-bearing chamber is installed in the load-bearing compartment 2. This load-bearing chamber is in a standby state after being loaded with a substrate to be sequentially transferred to a processing chamber or a substrate to be transferred to the outside. The load compartment 2 is sealed and evacuated to exhaust air therefrom, so that a vacuum is formed therein. Three substrate supporting plates 20, 2 and 22 are provided as substrate supporting plates for loading or unloading a plurality of substrates in the cabin. The substrate supporting plates 20, 21, and 22 are spaced apart from each other by a predetermined distance and are vertically movable in the load compartment 2. As needed, a cooling or heating unit is mounted to each of the substrate supporting plates 20 to 22 to cool or heat the substrates that are 97273.doc -13-200526490 remaining. Also available for separate and transfer rooms! A closed door (not shown) communicating with the outside of the load-bearing compartment, which is opened or closed when loading or unloading a substrate, and 5 'can provide separate gates on the front and rear sides of FIG. When the substrate is loaded or unloaded from the sleeve, the door communicating with the transfer chamber ^ is closed, and the closed door communicating with the outside is opened, so that the interior of the load-bearing 2 is at atmospheric force. On the other hand, when moving to the transfer room! When a substrate is loaded or a substrate is loaded therefrom, a gate that communicates with the outside_ and then leaves air out of the load compartment 2 to form a vacuum in the load compartment 2, and then a closed door that communicates with the load compartment 4 opens. As an example of a drive unit that vertically moves a substrate support plate, the gas-macro 25 is used. The gas house red 25 is provided at the opposite ends of the substrate supporting plates 20, 21 and 22. The pneumatic cylinders provided on each substrate supporting plate can be operated independently, thus allowing the substrate supporting plates to be spaced apart from each other at a predetermined interval. In this case, the lower substrate supporting plate 20 is preferably fixed. When a substrate is loaded or unloaded, a beta structure is generated. A predetermined space for receiving the end of the arm member above the substrate support plate on which the substrate is placed is generated. Since a predetermined space is required above the substrate support plate on which the substrate is loaded or unloaded, the height of the load-carrying compartment 2 is minimized when the lower substrate support plate 20 is fixed. Therefore, the pneumatic cylinder is installed so that the intermediate substrate supporting flap 21 and the upper substrate supporting flap 22 are vertically moved, but the lower substrate supporting plate 20 is not moved. The pneumatic cylinder 25 may be coupled to the outside or the inside of the load compartment 2 through a hole of the intermediate substrate supporting plate 21 to be connected to the upper substrate supporting plate 22. FIG. 4 is a perspective view showing a state in which the substrate 37 is loaded on or unloaded from the intermediate substrate support plate 21 of FIG. 3 (for example, by the arm member 29). A plurality of substrate supporting protrusions 27 are provided on the intermediate substrate supporting plate 21, and a substrate 37 is placed on the substrate supporting protrusions 27 on the base 97273.doc -14-200526490 to support the substrate 37. Therefore, the substrate 37 is allowed to be stably loaded on the intermediate substrate supporting plate 21, thereby preventing the substrate 37 from becoming dirty due to direct contact with the intermediate substrate supporting plate 21. In order to load or unload the substrate 37 to or from the substrate supporting protrusion 27 using the arm member 29, the intermediate substrate supporting plate 21 must have a predetermined space thereon to allow the arm member 29 to smoothly move between the substrate and the intermediate substrate supporting plate 21. Or it moves between the substrate and the intermediate substrate support plate 21. In order to create a predetermined space, recessed parts 3 0 parallel to each other may be provided on the substrate supporting plate 21 to allow the arm members 29 to move forward and backward. For example, as shown in FIG. 4, when the substrate 37 is loaded or unloaded by the arm member 29, each of the concave members 30 is extended to open at the front end and / or the rear end of the substrate support plate. In this state, after the substrate is placed at the end of the arm member 29 and inserted into the bearing chamber, the substrate is positioned above the substrate support plate 21. Then, the arm member 29 is moved downward, so that the substrate is placed on the substrate supporting protrusion 27. The end of the arm member 29 is set in the recessed part 30 of the substrate supporting plate. Therefore, when the arm member 29 is withdrawn, only the arm member 29 is movable and the substrate is stationary. The recessed part 30 provided on the substrate support plate 21 increases the vertical moving distance of the end of the arm member 29 between the substrate and the substrate support plate when loading or unloading the substrate, and thus allows the substrate support plate to be reduced. Interval. Since the space between the substrate support plates is reduced, the volume of the load compartment can be reduced, or more substrate support plates can be provided in the same volume test. If the arm member 29 transfers the base plate 37 by the peripheral portion of the upper part of the buckle base plate 37, there is no need for a recessed member 30. Fig. 5a does not show another example of the base plate support slab, and illustrates that the arm member 29 The intermediate substrate supporting plate 21 in FIG. 2 is in a state of loading the substrate_unloading the substrate from it 97273.doc -15 · 200526490 37. Fig. 5b is a side cross-sectional view of the intermediate base plate support slab cut along the line IVB-IVB in Fig. 5a, and the arm members are omitted. As shown in Figs. 5a and 5b, protrusions 26 may be further provided on each substrate support plate to generate a predetermined distance so that the substrate support plates may be spaced apart from each other by a distance greater than the thickness of the substrate when the substrate is loaded onto the substrate support plate. That is, the protruding portion 26 is used to create a predetermined space, thereby preventing the substrate from interfering with the substrate supporting plate directly above it. In addition, when the substrate is loaded on the substrate supporting plate 21, the protruding portions 26 are also aligned by bringing the substrate into contact with the side surface of each protruding portion 26. In addition, a protruding portion 26 may be provided on an outer peripheral portion of each substrate supporting plate in FIG. In addition, a substrate support protrusion 27 is provided on the substrate support plate 21, and the substrate 37 is placed on the substrate support protrusion 27 to support the substrate 37, so that the substrate 37 is stably loaded on the intermediate substrate support plate 21 and the substrate 37 is prevented Dirty due to direct contact with the substrate support plate 2 丨. In this case, a substrate supporting protrusion is provided on the substrate supporting plate 21 to be vertically moved, thereby allowing the substrate to be smoothly loaded or unloaded. That is, when the substrate is placed at the end of the arm member 29 and is loaded or unloaded from the substrate support plate, the substrate support protrusion 27 moves upward beyond the thickness of the arm member 29, and thus, for example, allows the end arm The member 29 is ejected after the substrate 37 is placed on the substrate supporting protrusion. After the arm member 29 is withdrawn, the substrate supporting protrusion 27 is moved downward to " f to eight initial positions. At the same time, under the condition that the arm member M transfers the substrate 37 by the peripheral portion of the 2 P knife above the locking substrate W, the substrate support is required *

、出P 27的垂直移動結構。圖6a至6c為沿圖5a之IVB-IVB 線剖切所得的承.4会 f戰龍之』視圖。以下將參照圖^至心來描 述根據本發明的承載室之操作。 97273.doc -16- 200526490 如圖6a所示，當向上部基板支撐板22加載基板37或自其 卸載基板37時，驅動耦接至中間及上部基板支撐板21及22 之氣壓缸’以向下移動中間及上部基板支撐板21及22。因 此在上部基板支撐板22及艙之間產生預定空間，使得藉由 轉移單元（未圖示）及臂件可向上部基板支撐板22加載基板 37或自其卸载基板37。如圖6b所示，當向中間基板支撐板 21加載基板37或自其卸載基板37時，僅上部基板支撐板22 藉由麵接至上部基板支撐板22之氣壓缸向上移動。在此狀 況下，在上部基板支撐板22及中間基板支撐板21之間產生 預定空間’使得藉由轉移單元及臂件向中間基板支撐板2 i 加載基板3 7或自其卸載基板37。相似地，如圖6c所示，當 向下部基板支撐板20加載基板37或自其卸載基板37時，中 間基板支撐板21及上部基板支撐板22向上移動，使得在中 間基板支撐板21及下部基板支撐板2〇之間產生預定空 間。在此狀況下，儘管在各基板支撐板上未提供突出部 26，但是藉由耦接至基板支撐板之氣壓缸可在相鄰基板支 撐板之間保持預定間隔。 圖7a及7b中展示了一用於垂直移動基板支撐板之單元的 另一實例。如在圖式中所示，在艙的底部上提供氣壓缸45 以在基板支撐板之徑向上選擇性地或替代性地移動至一基 板支撐板。在此狀況下，必須在中間及下部基板支撐板2 i 及20上提供突出部26。即，由於上部及中間基板支撐板以 及22中之至少一者不由氣壓缸45支撐，所以需要突出部％ 以允許相鄰基板支撐板保持預定間隔。舉例而言，如圖& 97273.doc -17- 200526490 所示，當向下部基板支撐板20加載基板或自其卸載基板 時，氣壓缸45於中間基板支撐板21的下表面之下方移動而 耦接至其下表面（或根據基板支撐板21之特徵，耦接至側 表面），從而向上移動中間及上部基板支撐板21及22。由 此提供了用於向下部基板支撐板20加載基板或自其卸載基 板之空間。在此狀況下，上部基板支撐板22之下表面與在 中間基板支撐板21上提供之突出部26接觸，使得中間基板 支撐板21支撐上部基板支撐板22。因此中間基板支撐板21 與上部基板支撐板22—起向上移動。同時，如圖7b所示， 當向中間基板支撐板21加載基板3 7或自其卸載基板3 7時， 驅動氣壓缸使得上部及中間基板支撐板22及2丨分別由在中 間及下部基板支撐板21及20上提供之突出部26所支撐，且 接著氣壓缸最大程度地退出。其後，氣壓缸45於上部基板 支撐板22之下表面移動而耦接至其下表面，因此向上移動 上部基板支撐板22。此時中間基板支撐板21由下部基板支 撐板20上之突出部26支撐。 以下將描述驅動具有三塊基板支撐板2〇至22的承載室之 方法。驅動承載室之方法不限於以下說明，但根據基板支 撐板之固定狀態及基板支撐板與驅動單元之耦接狀態，各 種方法為可能的。 畜基板支撐板20至22中之一者（例如第一基板支撐板2〇) 為固疋的，第二及第三基板支撐板21及22向上移動以向第 一基板支撐板20加載基板或自其卸載基板。藉由第二及第 二基板支撐板21及22之向上移動，使在艙2之内壁與第三 97273.doc -18- 200526490 基板支撐板22之間的空間及在第二及第三基板支撐板21及 22之間的空間最小化，而在第一及第二基板支撐板2〇及2 i 之間的空間最大化，因此產生用於加載基板或卸載基板之 空間。接著，由基板進給單元向第一基板支撐板20加載基 板或自其卸載基板。另一方面，當向第二基板支撐板21加 載基板或自其卸載基板時，第二基板支撐板21向下移動以 使在第一及第二基板支撐板20及21之間的空間最小化，且 第二基板支撐板22向上移動以使在第三基板支撐板22與艙 的内壁之間的空間最小化，因此使第二及第三基板支撐板 21及22之間的空間最大化，且由此產生用於加載或卸載基 板之空間。在該狀況下，向第二基板支撐板21加載基板或 自其卸載基板。此外，當向第三基板支撐板22加載基板或 自其卸載基板時，第二及第三基板支撐板21及22向下移動 以使第一至第三基板支撐板20至22之間的空間最小化且使 第三基板支撐板22與艙内壁之間的空間最大化。在此狀況 下，向第三基板支撐板22加載基板或自其卸載基板。 此外^第一至第二基板支撐板20至22均不固定時，允 許第一基板支撐板20垂直移動，由此產生了用於加載或卸 載基板之充分空間。 本發明不限於上述說明，處理室之數目及承載㈣基板 支撐板之數目可根據處理條件而改變。隨著基板支撐板數 目的私大’提尚了基板處理能力。然而應在基板支撐板之 間保持預定間隔’使得承载艙的體積不可避免地增大，經 由其加載或卸載基板之閘門的尺寸增A。此外用於驅祕 97273.doc -19- 200526490 板支樓板之驅動單元變得複雜。因此考慮上述因素應適當 選擇基板支撐板之數目。 如上所述，儘管在承騎内提供了額外基板支樓板以加 載複數個基板，但本發明最小化了用於域或卸載基板的 承載艙之空間’因此獲得了較小的承载艙。因此本發明允 許在較小的承餘内容納大量基板，且縮短了在承載擒内 形成真空所需之泵吸及排氣時間’因此提高了生產率且節 約了能量。， P 27 vertical movement structure. Figures 6a to 6c are views of the bearing. 4hui f war dragon's section taken along the IVB-IVB line of Figure 5a. The operation of the bearing chamber according to the present invention will be described below with reference to FIGS. 97273.doc -16- 200526490 As shown in Fig. 6a, when the substrate 37 is loaded on or unloaded from the upper substrate support plate 22, the pneumatic cylinders coupled to the middle and upper substrate support plates 21 and 22 are driven to the The middle and upper substrate supporting plates 21 and 22 are moved downward. Therefore, a predetermined space is created between the upper substrate support plate 22 and the compartment, so that the substrate 37 can be loaded on or unloaded from the upper substrate support plate 22 by the transfer unit (not shown) and the arm member. As shown in FIG. 6b, when the substrate 37 is loaded on or unloaded from the intermediate substrate support plate 21, only the upper substrate support plate 22 is moved upward by a pneumatic cylinder connected to the upper substrate support plate 22. In this case, a predetermined space is created between the upper substrate support plate 22 and the intermediate substrate support plate 21 'so that the substrate 37 is loaded on or unloaded from the intermediate substrate support plate 2 i by the transfer unit and the arm member. Similarly, as shown in FIG. 6c, when the substrate 37 is loaded on or unloaded from the lower substrate support plate 20, the intermediate substrate support plate 21 and the upper substrate support plate 22 are moved upward, so that the intermediate substrate support plate 21 and the lower portion A predetermined space is generated between the substrate supporting plates 20. In this case, although the protrusions 26 are not provided on each substrate support plate, a predetermined interval can be maintained between adjacent substrate support plates by a pneumatic cylinder coupled to the substrate support plates. 7a and 7b show another example of a unit for vertically moving a substrate support plate. As shown in the drawings, a pneumatic cylinder 45 is provided on the bottom of the cabin to selectively or alternatively move to a base plate supporting plate in the radial direction of the base plate supporting plate. In this case, it is necessary to provide the protrusions 26 on the intermediate and lower substrate supporting plates 2 i and 20. That is, since at least one of the upper and middle substrate supporting plates and 22 is not supported by the pneumatic cylinder 45, the protrusion% is required to allow adjacent substrate supporting plates to maintain a predetermined interval. For example, as shown in & 97273.doc -17- 200526490, when a substrate is loaded on or unloaded from the lower substrate support plate 20, the pneumatic cylinder 45 moves below the lower surface of the intermediate substrate support plate 21 and Is coupled to its lower surface (or to the side surface according to the characteristics of the substrate support plate 21), thereby moving the middle and upper substrate support plates 21 and 22 upward. Thereby, a space is provided for loading or unloading a substrate to or from the lower substrate support plate 20. In this state, the lower surface of the upper substrate supporting plate 22 is in contact with the projections 26 provided on the intermediate substrate supporting plate 21 so that the intermediate substrate supporting plate 21 supports the upper substrate supporting plate 22. Therefore, the intermediate substrate supporting plate 21 and the upper substrate supporting plate 22 move upward together. Meanwhile, as shown in FIG. 7b, when the substrate 37 is loaded or unloaded from the intermediate substrate supporting plate 21, the pneumatic cylinder is driven so that the upper and intermediate substrate supporting plates 22 and 2 are supported by the intermediate and lower substrates, respectively. The projections 26 provided on the plates 21 and 20 are supported, and then the pneumatic cylinder is withdrawn to the maximum extent. Thereafter, the pneumatic cylinder 45 moves on the lower surface of the upper substrate supporting plate 22 to be coupled to the lower surface thereof, and thus moves the upper substrate supporting plate 22 upward. At this time, the intermediate substrate supporting plate 21 is supported by the protruding portion 26 on the lower substrate supporting plate 20. A method of driving a load cell having three substrate support plates 20 to 22 will be described below. The method of driving the load-bearing chamber is not limited to the following description, but various methods are possible depending on the fixed state of the substrate support plate and the coupling state of the substrate support plate and the drive unit. One of the substrate supporting plates 20 to 22 (for example, the first substrate supporting plate 20) is fixed, and the second and third substrate supporting plates 21 and 22 are moved upward to load the substrate to the first substrate supporting plate 20 or Unload the substrate from it. By the upward movement of the second and second substrate support plates 21 and 22, the space between the inner wall of the compartment 2 and the third 97273.doc -18-200526490 substrate support plate 22 and the second and third substrate supports The space between the plates 21 and 22 is minimized, and the space between the first and second substrate support plates 20 and 2 i is maximized, thus creating a space for loading or unloading a substrate. Next, a substrate is loaded onto or unloaded from the first substrate supporting plate 20 by the substrate feeding unit. On the other hand, when a substrate is loaded onto or unloaded from the second substrate supporting plate 21, the second substrate supporting plate 21 is moved downward to minimize a space between the first and second substrate supporting plates 20 and 21. And the second substrate support plate 22 is moved upward to minimize the space between the third substrate support plate 22 and the inner wall of the cabin, and therefore the space between the second and third substrate support plates 21 and 22 is maximized, And this creates a space for loading or unloading the substrate. In this state, a substrate is loaded on or unloaded from the second substrate support plate 21. In addition, when a substrate is loaded onto or unloaded from the third substrate supporting plate 22, the second and third substrate supporting plates 21 and 22 are moved downward to make a space between the first to third substrate supporting plates 20 to 22 The space between the third substrate support plate 22 and the inner wall of the cabin is minimized and maximized. In this state, a substrate is loaded on or unloaded from the third substrate supporting plate 22. In addition, when the first to second substrate supporting plates 20 to 22 are not fixed, the first substrate supporting plate 20 is allowed to move vertically, thereby creating a sufficient space for loading or unloading the substrate. The present invention is not limited to the above description, and the number of processing chambers and the number of supporting plates supporting the substrate can be changed according to the processing conditions. With the number of substrate support plates, the private university's has improved the substrate processing capacity. However, a predetermined interval ′ should be maintained between the substrate support plates so that the volume of the load-bearing compartment is inevitably increased, and the size of the gate through which the substrate is loaded or unloaded is increased by A. In addition, the drive unit used to drive the secret 97273.doc -19- 200526490 slab floor has become complicated. Therefore, considering the above factors, the number of substrate supporting plates should be appropriately selected. As described above, although an additional base plate slab is provided in the mount for loading a plurality of base plates, the present invention minimizes the space of the load compartment for field or unloading the base plate 'and thus obtains a smaller load compartment. Therefore, the present invention allows a large number of substrates to be accommodated in a small balance, and shortens the pumping and exhausting time required to form a vacuum in the load trap, thereby increasing productivity and saving energy.

【圖式簡單說明】 圖la及lb為習知基板處理設備之示意圖； 圖2a及2b為根據本發明之承载室的示意性側面剖視圖，· 圖3為根據本發明之承載室的示意性側面剖視圖； 圖4為展示根據本發明之承載室的中間基板支撐板的一 實例之透視圖； 圖5a為展示根據本發明之承載室的中間基板支撐板的另 一實例之俯視平面圖； 圖5b為沿圖5a之線IVB-IVB剖切所得的中間基板支撐板 之側面剖視圖； 圖6a至6c為沿圖5a之線IVB_IVB剖切所得的承載艙之側 面d視圖，其說明在將基板加載至上部、中間及下部基板 支撐板中每一者上或自其卸載了基板時，基板及基板支撐 板之位置；且 圖7a及7b為根據本發明之承載艙的側面剖視圖，其中採 用了驅動各基板支樓板的驅動單元之另一實例。 97273.doc -20- 200526490 【主要元件符號說明】 1 轉移室 2, 102 承載艙 3 處理室 4 轉移單元 20 第一基板支撐板 21 第二基板支撐板 20a，21a 基板支撐突起部 22 上部基板支撐板 25 驅動單元/氣壓缸 26 突出部 27 基板支撐突起部 29 臂件 30 凹入部件 37 基板 45 氣壓缸 97273.doc -21 -[Schematic description] Figures 1a and 1b are schematic diagrams of conventional substrate processing equipment; Figures 2a and 2b are schematic side cross-sectional views of a bearing chamber according to the present invention, and Figure 3 is a schematic side view of a bearing chamber according to the present invention Sectional view; Figure 4 is a perspective view showing an example of an intermediate substrate support plate of a load-bearing chamber according to the present invention; Figure 5a is a top plan view showing another example of an intermediate substrate support plate of a load-bearing chamber according to the present invention; Figure 5b is A side cross-sectional view of the intermediate substrate support plate cut along the line IVB-IVB in FIG. 5a; FIGS. 6a to 6c are side d views of the load compartment taken along the line IVB_IVB in FIG. , And the position of the substrate and the substrate support plate when each of the middle, lower and lower substrate support plates are on or offloaded from it; and Figs. 7a and 7b are side sectional views of a load-carrying cabin according to the present invention, in which the driving substrates are used Another example of a drive unit for a branch floor. 97273.doc -20- 200526490 [Description of main component symbols] 1 Transfer chamber 2, 102 Load compartment 3 Processing chamber 4 Transfer unit 20 First substrate support plate 21 Second substrate support plate 20a, 21a Substrate support protrusion 22 Upper substrate support Plate 25 Drive unit / pneumatic cylinder 26 Projection 27 Substrate support projection 29 Arm piece 30 Recessed part 37 Substrate 45 Pneumatic cylinder 97273.doc -21-

Claims (1)

200526490 十、申請專利範圍： 1 · 一種承載室，其包含： 一外殼； 一第一基板支撐板，其安裝於該外殼中； 一第一基板支撐板，其置放於該第一基板支撐板上方 而與該第一基板支樓板間隔開；及 一驅動單心其垂直移動該第-基板支撐板及該第二 基板支撐板中之至少—者，從而產生-在該第-基板支 撐板及該第二基板支撐板之間的m以便加载或卸載 —基板。 2.如請求…之承載室’其中該第一基板支撐板及該第二 基板支撐板中之-者為固定的，且該第—基板支揮板及 該第二基板支撐板中之另一者耦接至該驅動單元且向上 或向下移動，從而產生用於加載或卸載該基板之該 間〇 3· 4. 5. 月求員1之承载室，其中該驅動單元福接至該第一基 板支撐板及㈣二基板支撐板中每—者，該第—基板支 撐板向上移動且該第二基板支撐板向下移動以產生用於 加載或卸載該基板之該空間。 、 如4求項1之承載室，其進一步包含： > ρ基板支撐突出部，該基板安放於其上，且其提供於 该第一基板支撐板及該第二基板支撐板中每一者上以具 有一將該基板對準之功能。 /、 如请求項1之承載室，其進一步包含： 97273.doc 200526490 一基板進給單元，其向該第一基板支撐板及該第二基 板支撐板中母一者加載基板或自其卸載基板；及 一或多個凹入部件，其提供於該第一基板支撐板及該 第一基板支撐板中每一者上以允許該基板進給單元移 動。 6.如請求項匕承载室，其中該第一基板支撐板及該第二 基板支撐板中每一者包含一冷卻及/或加熱單元。 7· —種承載室，其包含·· 一外殼； 一第一基板支撐板，其安裝於該外殼中； 一第二基板支撐板，其置放於該第一基板支撐板上方 而與該第一基板支撐板間隔開； 一第三基板支撐板，其置放於該第二基板支撐板上方 而與該第二基板支撐板間隔開；及 一驅動單元，其垂直移動該等第一至第三基板支撐板 中之至少一者，從而在該第一基板支撐板及該第二基板 支撐板之間或在該第二基板支撐板及該第三基板支撐板 之間產生一用於加載或卸載一基板之空間。 8·如請求項7之承載室，其中該第一基板支撐板為固定 的，且該驅動單元包含分別耦接至該第二基板支撐板及 该第二基板支撐板之第一及第二驅動單元，該等第一及 第二驅動單元向上移動以分別在該第一基板支撐板與該 第二基板支撐板之間及該第二基板支撐板與該第三基板 支撐板之間產生用於加載或卸載該基板之該空間。 97273.doc -2 - 200526490 如請求項 缸。 9. 10 11, 12, 13. 14. 或7之承載室，其中該驅動單元包含一氣壓 .如請求項7夕？ m 中每_者勺八承载室，其中該等第-至第三基板支撐板 匕含一冷卻及/或加熱單元。 如請求項7 > & i 的，且之承載室，其中該第一基板支撐板為固定 、 驅動單元水平移動以便選擇性地垂直移動該第 -=板支撐板及該第三基板支撐板中之一者。 ^ 承载至，其中該第一基板支撐板小於該第 。土板支撐板，且該第二基板支撐板小於該第三基板支 ，板’以便提供-用於容納該驅動單元之空間，該驅動 單兀耦接至一在該外殼之一内壁周圍的位置處。 士口月求項7之承载室，其進一步包含·· 二p基板支撐突出部，該基板安放於其上，且其提供於 等第至第二基板支撐板中每一者上以具有一對準該 基板之功能。 :種驅動一承載室之方法，該承載室包含：一外殼；一 第一基板支撐板，其安裝於該外殼中；一第二基板支撐 板，其置放於該第一基板支撐板上方而與該第一基板支 撐板間隔開，·及-驅動單元，其垂直移動該第—基板支 撐板及該第二基板支撐板中之至少—者，該方法包含·· 藉由向上或向下移動該第一基板支撐板及該第二基板 支撐板中至）一者’在泫第一基板支撐板或該第二基板 支撑板上方產生一用於加載或卸載一基板之空間；及 向該第一基板支撐板或該第二基板支撐板加載該基板 97273.doc 200526490 或自其卸載該基板。 15·:種驅動—承載室之方法，該承載室包含：-外殼；-第基板支撐板，其安裝於該外殼—帛：基板支樓 板’其置放於該第-基板支撐板上方而與該第一基板支 撐板間開’-第二基板支撐板，其置放於該第二基板 支撐板上方而與該第二基板支撐板間隔開；及一驅動單 凡，其垂直移動該等第一至第三基板支撐板中之至少一 者，該方法包含： 藉由垂直移動該等第一至第三基板支撐板中之一者， 在該等第一至第三基板支撐板中之一者上方產生一用於 加載或卸載一基板之空間；及 向該等第一至第三基板支撐板中之至少一者加載該基 板或自其卸載該基板。 16· —種承載室，其包含·· 複數個基板支撐板，其以一大於一基板之一厚度的間 彼此間隔開，該等基板支撑板中每一者垂直移動且在 其上表面上支撐該基板；及 一驅動單元，其用於垂直移動該等基板支撐板中之至 少一者。 97273.doc -4-200526490 10. Scope of patent application: 1 · A load-bearing chamber, comprising: a housing; a first substrate support plate, which is installed in the housing; a first substrate support plate, which is placed on the first substrate support plate Above and spaced from the first substrate supporting floor; and a driving single core which vertically moves at least one of the first substrate supporting plate and the second substrate supporting plate, thereby generating-in the first substrate supporting plate and The second substrate supports m between the plates for loading or unloading the substrate. 2. If requested, one of the first substrate support plate and the second substrate support plate is fixed, and the other one of the first substrate support plate and the second substrate support plate The driver is coupled to the driving unit and moves up or down, so as to generate the loading room for loading or unloading the substrate. 3. 5. 5. The room for the job seeker 1, wherein the driving unit is connected to the first For each of a substrate support plate and a second substrate support plate, the first substrate support plate moves upward and the second substrate support plate moves downward to create the space for loading or unloading the substrate. The load bearing chamber of claim 4, further comprising: > ρ substrate supporting protrusion, the substrate is placed thereon, and it is provided on each of the first substrate supporting plate and the second substrate supporting plate The upper electrode has a function of aligning the substrate. /. The load-bearing room of claim 1, further comprising: 97273.doc 200526490 a substrate feeding unit that loads or unloads a substrate to or from the first substrate support plate and the second substrate support plate. And one or more recessed members provided on each of the first substrate supporting plate and the first substrate supporting plate to allow the substrate feeding unit to move. 6. The carrier of claim 4, wherein each of the first substrate support plate and the second substrate support plate includes a cooling and / or heating unit. 7. A load-bearing chamber comprising a casing; a first substrate supporting plate installed in the casing; a second substrate supporting plate disposed above the first substrate supporting plate and connected to the first substrate supporting plate A substrate support plate is spaced apart; a third substrate support plate is placed above the second substrate support plate and spaced apart from the second substrate support plate; and a drive unit that vertically moves the first to the first At least one of the three substrate supporting plates, so that a load or load is generated between the first substrate supporting plate and the second substrate supporting plate or between the second substrate supporting plate and the third substrate supporting plate. Space for unloading a substrate. 8. The bearing room of claim 7, wherein the first substrate support plate is fixed, and the driving unit includes first and second drives respectively coupled to the second substrate support plate and the second substrate support plate. Unit, the first and second driving units are moved upward to generate a space between the first substrate support plate and the second substrate support plate and between the second substrate support plate and the third substrate support plate, respectively. Load or unload the space of the substrate. 97273.doc -2-200526490 As requested item Cylinder. 9. 10 11, 12, 13. 14. or 7, the load bearing chamber, wherein the drive unit contains a pressure. For example, if the item 7 is requested? Each of m is a load-bearing chamber, wherein the first to third substrate supporting plates include a cooling and / or heating unit. As in claim 7 > & i, and a load-bearing chamber, wherein the first substrate support plate is fixed, the driving unit moves horizontally to selectively move the-= plate support plate and the third substrate support plate vertically. One of them. ^ Loaded to, where the first substrate support plate is smaller than the first. A soil plate supporting plate, and the second substrate supporting plate is smaller than the third substrate supporting plate, so as to provide a space for accommodating the driving unit, the driving unit is coupled to a position around an inner wall of the casing Office. The bearing room of Shikouyue Qiuqiu item 7, further comprising ... two p-substrate support protrusions, the substrate is placed thereon, and it is provided on each of the second to second substrate support plates to have a pair The function of the substrate. A method for driving a load-bearing chamber, the load-bearing chamber including: a housing; a first substrate support plate installed in the housing; a second substrate support plate placed above the first substrate support plate and Spaced apart from the first substrate support plate, and a drive unit that vertically moves at least one of the first substrate support plate and the second substrate support plate, the method includes ... by moving up or down One of the first substrate support plate and the second substrate support plate) creates a space for loading or unloading a substrate above the first substrate support plate or the second substrate support plate; and toward the first A substrate support plate or the second substrate support plate loads the substrate 97273.doc 200526490 or unloads the substrate therefrom. 15 ·: A method for driving a load-bearing chamber, the load-bearing chamber including:-a casing;-a first substrate supporting plate, which is mounted on the casing-帛: a substrate supporting floor plate, which is placed above the first-substrate supporting plate and The first substrate support plate is separated from each other'-the second substrate support plate, which is placed above the second substrate support plate and spaced from the second substrate support plate; and a driving unit, which moves the first At least one of the first to third substrate support plates, the method includes: by moving one of the first to third substrate support plates vertically, one of the first to third substrate support plates A space is created above the one for loading or unloading a substrate; and the substrate is loaded or unloaded from at least one of the first to third substrate supporting plates. 16. A load-bearing chamber comprising a plurality of substrate support plates spaced apart from one another by a thickness greater than one of the substrates, each of the substrate support plates moving vertically and supporting on its upper surface The substrate; and a driving unit for vertically moving at least one of the substrate supporting plates. 97273.doc -4-
TW093134534A 2003-11-12 2004-11-11 Load lock and load lock chamber using the same TWI337165B (en)

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KR101296157B1 (en) * 2006-09-11 2013-08-19 주성엔지니어링(주) Substrate processing apparatus preventing film deposition at substrate edge and substrate processing method using the same
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TW278200B (en) * 1995-07-06 1996-06-11 Brooks Automation Inc Door drive mechanisms for substrate carrier and load lock
JPH09125248A (en) * 1995-10-31 1997-05-13 Kokusai Electric Co Ltd Load locking chamber
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