CN102130034B - 装载锁及使用其的装载锁腔室 - Google Patents

装载锁及使用其的装载锁腔室 Download PDF

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Publication number
CN102130034B
CN102130034B CN2011100057449A CN201110005744A CN102130034B CN 102130034 B CN102130034 B CN 102130034B CN 2011100057449 A CN2011100057449 A CN 2011100057449A CN 201110005744 A CN201110005744 A CN 201110005744A CN 102130034 B CN102130034 B CN 102130034B
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CN
China
Prior art keywords
support plate
substrate support
substrate
load lock
load
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011100057449A
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English (en)
Chinese (zh)
Other versions
CN102130034A (zh
Inventor
权永春
高富珍
崔宰旭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jusung Engineering Co Ltd
Original Assignee
Jusung Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jusung Engineering Co Ltd filed Critical Jusung Engineering Co Ltd
Publication of CN102130034A publication Critical patent/CN102130034A/zh
Application granted granted Critical
Publication of CN102130034B publication Critical patent/CN102130034B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2011100057449A 2003-11-12 2004-11-11 装载锁及使用其的装载锁腔室 Expired - Fee Related CN102130034B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2003-0079888 2003-11-12
KR20030079888 2003-11-12
KR1020040085638A KR101131417B1 (ko) 2003-11-12 2004-10-26 로드락 장치 및 이를 설치한 로드락 챔버
KR10-2004-0085638 2004-10-26

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2004100906510A Division CN1618716B (zh) 2003-11-12 2004-11-11 装载锁及使用其的装载锁腔室

Publications (2)

Publication Number Publication Date
CN102130034A CN102130034A (zh) 2011-07-20
CN102130034B true CN102130034B (zh) 2013-02-06

Family

ID=37245436

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011100057449A Expired - Fee Related CN102130034B (zh) 2003-11-12 2004-11-11 装载锁及使用其的装载锁腔室

Country Status (3)

Country Link
KR (1) KR101131417B1 (ko)
CN (1) CN102130034B (ko)
TW (1) TWI337165B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101296157B1 (ko) * 2006-09-11 2013-08-19 주성엔지니어링(주) 기판 가장자리의 증착을 방지하는 기판처리장치 및 이를이용한 기판처리방법
KR101411620B1 (ko) * 2007-02-16 2014-06-25 엘아이지에이디피 주식회사 평판표시소자 제조장치의 로드 락 챔버
CN113035752B (zh) * 2021-03-05 2022-11-11 上海广川科技有限公司 负载锁定装置及基片传片方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5056239A (en) * 1986-03-24 1991-10-15 Officine Di Cartigliano Vacuum drying machine for tanned skins, with multiple work surfaces
CN1195332A (zh) * 1995-07-06 1998-10-07 布鲁克斯自动化公司 用于基底携带装置和装载锁定装置的门驱动机构
US6375746B1 (en) * 1998-07-10 2002-04-23 Novellus Systems, Inc. Wafer processing architecture including load locks
US6688375B1 (en) * 1997-10-14 2004-02-10 Applied Materials, Inc. Vacuum processing system having improved substrate heating and cooling

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07257710A (ja) * 1994-03-18 1995-10-09 Sekisui Chem Co Ltd 自動生産ラインへの原材料供給方法
JPH09125248A (ja) * 1995-10-31 1997-05-13 Kokusai Electric Co Ltd ロードロック室
JP3966594B2 (ja) 1998-01-26 2007-08-29 東京エレクトロン株式会社 予備真空室およびそれを用いた真空処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5056239A (en) * 1986-03-24 1991-10-15 Officine Di Cartigliano Vacuum drying machine for tanned skins, with multiple work surfaces
CN1195332A (zh) * 1995-07-06 1998-10-07 布鲁克斯自动化公司 用于基底携带装置和装载锁定装置的门驱动机构
US6688375B1 (en) * 1997-10-14 2004-02-10 Applied Materials, Inc. Vacuum processing system having improved substrate heating and cooling
US6375746B1 (en) * 1998-07-10 2002-04-23 Novellus Systems, Inc. Wafer processing architecture including load locks

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平9-125248A 1997.05.13

Also Published As

Publication number Publication date
TWI337165B (en) 2011-02-11
TW200526490A (en) 2005-08-16
KR20050045821A (ko) 2005-05-17
KR101131417B1 (ko) 2012-04-03
CN102130034A (zh) 2011-07-20

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Granted publication date: 20130206

Termination date: 20201111