TWI335778B - Printed circuit board and inspection method therefor - Google Patents

Printed circuit board and inspection method therefor Download PDF

Info

Publication number
TWI335778B
TWI335778B TW094127193A TW94127193A TWI335778B TW I335778 B TWI335778 B TW I335778B TW 094127193 A TW094127193 A TW 094127193A TW 94127193 A TW94127193 A TW 94127193A TW I335778 B TWI335778 B TW I335778B
Authority
TW
Taiwan
Prior art keywords
target
layer
electromagnetic wave
wave shielding
circuit board
Prior art date
Application number
TW094127193A
Other languages
English (en)
Chinese (zh)
Other versions
TW200614885A (en
Inventor
Kunihiko Azeyanagi
Hideya Yoshikawa
Hiroaki Inose
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200614885A publication Critical patent/TW200614885A/zh
Application granted granted Critical
Publication of TWI335778B publication Critical patent/TWI335778B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
TW094127193A 2004-08-27 2005-08-10 Printed circuit board and inspection method therefor TWI335778B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004248835A JP4463645B2 (ja) 2004-08-27 2004-08-27 プリント基板およびその検査方法

Publications (2)

Publication Number Publication Date
TW200614885A TW200614885A (en) 2006-05-01
TWI335778B true TWI335778B (en) 2011-01-01

Family

ID=35941431

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127193A TWI335778B (en) 2004-08-27 2005-08-10 Printed circuit board and inspection method therefor

Country Status (4)

Country Link
US (1) US7381903B2 (enExample)
JP (1) JP4463645B2 (enExample)
CN (1) CN1741705A (enExample)
TW (1) TWI335778B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101153887B (zh) * 2006-09-28 2010-12-15 比亚迪股份有限公司 一种可检测fpc冲偏的专用线路板及检测的方法
EP2650112B1 (en) 2006-11-03 2016-08-24 Trustees Of Tufts College Nanopatterned biopolymer optical device and method of manufacturing the same
CA2704768A1 (en) * 2006-11-03 2008-10-23 Trustees Of Tufts College Biopolymer sensor and method of manufacturing the same
US20100046902A1 (en) 2006-11-03 2010-02-25 Trustees Of Tufts College Biopolymer photonic crystals and method of manufacturing the same
US20100096763A1 (en) * 2006-11-03 2010-04-22 Trustees Of Tufts College Biopolymer optofluidic device and method of manufacturing the same
JP4837530B2 (ja) * 2006-11-14 2011-12-14 日本メクトロン株式会社 プリント配線板の検査用ターゲット
ATE510224T1 (de) * 2006-11-16 2011-06-15 Siemens Ag Sensorelement, vorrichtung und verfahren zur inspektion einer leiterbahnstruktur, herstellungsverfahren für sensorelement
EP2206017B1 (en) 2007-11-05 2019-02-20 Trustees Of Tufts College Fabrication of silk fibroin photonic structures by nanocontact imprinting
EP2307054A4 (en) * 2008-06-18 2013-02-06 Tufts College EDIBLE HOLOGRAPHIC SILK PRODUCTS
EP2396276B1 (en) 2009-02-12 2016-08-31 Trustees Of Tufts College Nanoimprinting of silk fibroin structures for biomedical and biophotonic applications
US9016875B2 (en) 2009-07-20 2015-04-28 Tufts University/Trustees Of Tufts College All-protein implantable, resorbable reflectors
WO2011026101A2 (en) 2009-08-31 2011-03-03 Trustees Of Tufts College Silk transistor devices
CN102065641B (zh) * 2009-11-17 2012-10-17 富葵精密组件(深圳)有限公司 电路板制作方法
CN102082980B (zh) * 2009-12-01 2015-04-15 昆山华扬电子有限公司 数字麦克风内嵌屏蔽印制板及其制作工艺
US9603243B2 (en) 2010-04-12 2017-03-21 Tufts University Silk electronic components
TWI386129B (zh) * 2010-10-25 2013-02-11 Zhen Ding Technology Co Ltd 電路板文字漏印之檢測方法
JP5421893B2 (ja) * 2010-12-20 2014-02-19 日東電工株式会社 配線回路基板の製造方法、配線回路基板集合体シートの製造方法、配線回路基板および配線回路基板集合体シート
US9208552B2 (en) * 2011-04-26 2015-12-08 Kla-Tencor Corporation Method and system for hybrid reticle inspection
WO2012162067A2 (en) 2011-05-21 2012-11-29 Macrogenics, Inc. Cd3-binding molecules capable of binding to human and non-human cd3
CN108846176B (zh) * 2018-05-30 2022-05-06 郑州云海信息技术有限公司 一种印刷电路板布线的检查方法、装置及电子设备
JP7417371B2 (ja) * 2019-07-12 2024-01-18 芝浦メカトロニクス株式会社 実装装置
CN115529714A (zh) * 2021-06-25 2022-12-27 全亿大科技（佛山）有限公司 线路板及制作方法
CN116475625B (zh) * 2023-04-14 2026-04-21 浙江大华技术股份有限公司 阻焊剂组合物及其阻焊膜和印制电路板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5672365A (en) * 1979-11-19 1981-06-16 Sharp Corp Inspection of short circuit of board
JPH0660686B2 (ja) 1983-10-05 1994-08-10 日産自動車株式会社 ロツクアツプ式自動変速機
JP2926922B2 (ja) 1990-07-17 1999-07-28 日本電気株式会社 印刷配線板
JPH0521923A (ja) 1990-12-04 1993-01-29 Nec Corp 印刷配線板
JPH05283888A (ja) * 1992-03-31 1993-10-29 Cmk Corp プリント配線板およびその製造方法
JP2001067077A (ja) * 1999-08-30 2001-03-16 Roland Corp プリント配線基板
JP2002158413A (ja) 2000-11-17 2002-05-31 Nec Saitama Ltd 印刷配線板

Also Published As

Publication number Publication date
CN1741705A (zh) 2006-03-01
US20060042822A1 (en) 2006-03-02
JP2006066715A (ja) 2006-03-09
US7381903B2 (en) 2008-06-03
JP4463645B2 (ja) 2010-05-19
TW200614885A (en) 2006-05-01

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees