JP2009099837A5 - - Google Patents

Download PDF

Info

Publication number
JP2009099837A5
JP2009099837A5 JP2007271152A JP2007271152A JP2009099837A5 JP 2009099837 A5 JP2009099837 A5 JP 2009099837A5 JP 2007271152 A JP2007271152 A JP 2007271152A JP 2007271152 A JP2007271152 A JP 2007271152A JP 2009099837 A5 JP2009099837 A5 JP 2009099837A5
Authority
JP
Japan
Prior art keywords
flexible
wiring board
bending
flexible wiring
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007271152A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009099837A (ja
JP5119852B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007271152A priority Critical patent/JP5119852B2/ja
Priority claimed from JP2007271152A external-priority patent/JP5119852B2/ja
Publication of JP2009099837A publication Critical patent/JP2009099837A/ja
Publication of JP2009099837A5 publication Critical patent/JP2009099837A5/ja
Application granted granted Critical
Publication of JP5119852B2 publication Critical patent/JP5119852B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007271152A 2007-10-18 2007-10-18 フレキシブル配線基板 Active JP5119852B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007271152A JP5119852B2 (ja) 2007-10-18 2007-10-18 フレキシブル配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007271152A JP5119852B2 (ja) 2007-10-18 2007-10-18 フレキシブル配線基板

Publications (3)

Publication Number Publication Date
JP2009099837A JP2009099837A (ja) 2009-05-07
JP2009099837A5 true JP2009099837A5 (enExample) 2010-10-14
JP5119852B2 JP5119852B2 (ja) 2013-01-16

Family

ID=40702542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007271152A Active JP5119852B2 (ja) 2007-10-18 2007-10-18 フレキシブル配線基板

Country Status (1)

Country Link
JP (1) JP5119852B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6244745B2 (ja) * 2013-08-29 2017-12-13 日本精機株式会社 フレキシブルプリント基板
WO2020044439A1 (ja) * 2018-08-28 2020-03-05 シャープ株式会社 表示装置
CN114126196B (zh) * 2021-11-26 2024-06-21 昆山国显光电有限公司 柔性电路板和显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0351863U (enExample) * 1989-09-27 1991-05-20
JPH058975U (ja) * 1991-07-17 1993-02-05 株式会社田村電機製作所 プリント基板
JP3082364B2 (ja) * 1991-10-15 2000-08-28 イビデン株式会社 プリント基板の製造方法
JPH0541171U (ja) * 1991-11-06 1993-06-01 オリンパス光学工業株式会社 フレキシブルプリント基板

Similar Documents

Publication Publication Date Title
US12080910B2 (en) Wiring material and battery module
CN103514996B (zh) 复合式软性电路排线
JP5818516B2 (ja) コネクタ接続部を有するフレキシブルプリント配線基板
EP0193156B1 (en) Flexible cable and method of manufacturing thereof
CN111512706B (zh) 电子电路基板以及电子电路装置
CN101160016A (zh) 布线电路基板
KR20180025271A (ko) 실드 플랫 케이블
US8779292B2 (en) Substrate and substrate bonding device using the same
JP2002118339A (ja) 配線基板及び配線基板製造方法
JP5119852B2 (ja) フレキシブル配線基板
US6538871B2 (en) Connecting structure of flat circuit member with reinforced connection boundary
CN101316476A (zh) 配线电路基板
JP2009099837A5 (enExample)
CN105578732B (zh) 软硬结合板及终端
CN105430896B (zh) 柔性电路板及移动终端
US5250757A (en) Printed wiring board having a connecting terminal
JP3374630B2 (ja) フラットケーブル
JP2009212018A (ja) 多層ｆｆｃの接続構造
CN105555020A (zh) 软硬结合板及终端
US12376221B2 (en) Circuit board and method of manufacturing circuit board
JP2006179192A (ja) フレキシブルフラットケーブルの接続構造
JP3124813U (ja) フレキシブルフラットケーブル
JP2008166496A (ja) フレキシブル配線基板
JP2005136182A (ja) 可撓配線板
CN120584551A (zh) 电路基板