CN1741705A - 印制电路板及其检查方法 - Google Patents

印制电路板及其检查方法 Download PDF

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Publication number
CN1741705A
CN1741705A CNA2005100915868A CN200510091586A CN1741705A CN 1741705 A CN1741705 A CN 1741705A CN A2005100915868 A CNA2005100915868 A CN A2005100915868A CN 200510091586 A CN200510091586 A CN 200510091586A CN 1741705 A CN1741705 A CN 1741705A
Authority
CN
China
Prior art keywords
target
circuit board
printed circuit
aforementioned
solder resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005100915868A
Other languages
English (en)
Chinese (zh)
Inventor
畔柳邦彦
吉川英哉
猪濑裕昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Publication of CN1741705A publication Critical patent/CN1741705A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
CNA2005100915868A 2004-08-27 2005-08-26 印制电路板及其检查方法 Pending CN1741705A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004248835A JP4463645B2 (ja) 2004-08-27 2004-08-27 プリント基板およびその検査方法
JP248835/04 2004-08-27

Publications (1)

Publication Number Publication Date
CN1741705A true CN1741705A (zh) 2006-03-01

Family

ID=35941431

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005100915868A Pending CN1741705A (zh) 2004-08-27 2005-08-26 印制电路板及其检查方法

Country Status (4)

Country Link
US (1) US7381903B2 (enExample)
JP (1) JP4463645B2 (enExample)
CN (1) CN1741705A (enExample)
TW (1) TWI335778B (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101153887B (zh) * 2006-09-28 2010-12-15 比亚迪股份有限公司 一种可检测fpc冲偏的专用线路板及检测的方法
CN101184364B (zh) * 2006-11-14 2011-04-20 日本梅克特隆株式会社 印刷电路板的检查用靶
CN102082980A (zh) * 2009-12-01 2011-06-01 昆山华扬电子有限公司 数字麦克风内嵌屏蔽印制板及其制作工艺
CN101432632B (zh) * 2006-11-16 2012-01-11 西门子公司 用于检查印制电路结构的传感器、装置和方法以及传感器的加工方法
CN108846176A (zh) * 2018-05-30 2018-11-20 郑州云海信息技术有限公司 一种印刷电路板布线的检查方法、装置及电子设备
CN116475625A (zh) * 2023-04-14 2023-07-25 浙江大华技术股份有限公司 阻焊剂组合物及其阻焊膜和印制电路板

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100046902A1 (en) * 2006-11-03 2010-02-25 Trustees Of Tufts College Biopolymer photonic crystals and method of manufacturing the same
EP2101975A2 (en) * 2006-11-03 2009-09-23 Trustees of Tufts College Biopolymer sensor and method of manufacturing the same
US8574461B2 (en) 2006-11-03 2013-11-05 Tufts University Electroactive biopolymer optical and electro-optical devices and method of manufacturing the same
US9969134B2 (en) 2006-11-03 2018-05-15 Trustees Of Tufts College Nanopatterned biopolymer optical device and method of manufacturing the same
EP2206017B1 (en) 2007-11-05 2019-02-20 Trustees Of Tufts College Fabrication of silk fibroin photonic structures by nanocontact imprinting
EP2307054A4 (en) * 2008-06-18 2013-02-06 Tufts College EDIBLE HOLOGRAPHIC SILK PRODUCTS
EP2396276B1 (en) 2009-02-12 2016-08-31 Trustees Of Tufts College Nanoimprinting of silk fibroin structures for biomedical and biophotonic applications
CA2803833A1 (en) 2009-07-20 2011-04-21 Tufts University/Trustees Of Tufts College All-protein implantable, resorbable reflectors
EP2474054A4 (en) 2009-08-31 2013-03-13 Tufts University Trustees Of Tufts College SILK TRANSISTOR DEVICES
CN102065641B (zh) * 2009-11-17 2012-10-17 富葵精密组件(深圳)有限公司 电路板制作方法
JP2013533754A (ja) * 2010-04-12 2013-08-29 タフツ・ユニバーシティ 絹電子部品
TWI386129B (zh) * 2010-10-25 2013-02-11 Zhen Ding Technology Co Ltd 電路板文字漏印之檢測方法
JP5421893B2 (ja) * 2010-12-20 2014-02-19 日東電工株式会社 配線回路基板の製造方法、配線回路基板集合体シートの製造方法、配線回路基板および配線回路基板集合体シート
US9208552B2 (en) * 2011-04-26 2015-12-08 Kla-Tencor Corporation Method and system for hybrid reticle inspection
US9587021B2 (en) 2011-05-21 2017-03-07 Macrogenics, Inc. CD3-binding molecules capable of binding to human and non-human CD3
JP7417371B2 (ja) * 2019-07-12 2024-01-18 芝浦メカトロニクス株式会社 実装装置
CN115529714A (zh) * 2021-06-25 2022-12-27 全亿大科技（佛山）有限公司 线路板及制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5672365A (en) * 1979-11-19 1981-06-16 Sharp Corp Inspection of short circuit of board
JPH0660686B2 (ja) 1983-10-05 1994-08-10 日産自動車株式会社 ロツクアツプ式自動変速機
JP2926922B2 (ja) 1990-07-17 1999-07-28 日本電気株式会社 印刷配線板
JPH0521923A (ja) 1990-12-04 1993-01-29 Nec Corp 印刷配線板
JPH05283888A (ja) * 1992-03-31 1993-10-29 Cmk Corp プリント配線板およびその製造方法
JP2001067077A (ja) * 1999-08-30 2001-03-16 Roland Corp プリント配線基板
JP2002158413A (ja) 2000-11-17 2002-05-31 Nec Saitama Ltd 印刷配線板

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101153887B (zh) * 2006-09-28 2010-12-15 比亚迪股份有限公司 一种可检测fpc冲偏的专用线路板及检测的方法
CN101184364B (zh) * 2006-11-14 2011-04-20 日本梅克特隆株式会社 印刷电路板的检查用靶
CN101432632B (zh) * 2006-11-16 2012-01-11 西门子公司 用于检查印制电路结构的传感器、装置和方法以及传感器的加工方法
CN102082980A (zh) * 2009-12-01 2011-06-01 昆山华扬电子有限公司 数字麦克风内嵌屏蔽印制板及其制作工艺
CN102082980B (zh) * 2009-12-01 2015-04-15 昆山华扬电子有限公司 数字麦克风内嵌屏蔽印制板及其制作工艺
CN108846176A (zh) * 2018-05-30 2018-11-20 郑州云海信息技术有限公司 一种印刷电路板布线的检查方法、装置及电子设备
CN108846176B (zh) * 2018-05-30 2022-05-06 郑州云海信息技术有限公司 一种印刷电路板布线的检查方法、装置及电子设备
CN116475625A (zh) * 2023-04-14 2023-07-25 浙江大华技术股份有限公司 阻焊剂组合物及其阻焊膜和印制电路板

Also Published As

Publication number Publication date
JP4463645B2 (ja) 2010-05-19
JP2006066715A (ja) 2006-03-09
US7381903B2 (en) 2008-06-03
TW200614885A (en) 2006-05-01
US20060042822A1 (en) 2006-03-02
TWI335778B (en) 2011-01-01

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Application publication date: 20060301