JP4463645B2 - プリント基板およびその検査方法 - Google Patents

プリント基板およびその検査方法 Download PDF

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Publication number
JP4463645B2
JP4463645B2 JP2004248835A JP2004248835A JP4463645B2 JP 4463645 B2 JP4463645 B2 JP 4463645B2 JP 2004248835 A JP2004248835 A JP 2004248835A JP 2004248835 A JP2004248835 A JP 2004248835A JP 4463645 B2 JP4463645 B2 JP 4463645B2
Authority
JP
Japan
Prior art keywords
target
circuit board
printed circuit
conductive layer
solder resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004248835A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006066715A (ja
JP2006066715A5 (enExample
Inventor
柳 邦 彦 畔
川 英 哉 吉
瀬 裕 昭 猪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP2004248835A priority Critical patent/JP4463645B2/ja
Priority to TW094127193A priority patent/TWI335778B/zh
Priority to US11/208,884 priority patent/US7381903B2/en
Priority to CNA2005100915868A priority patent/CN1741705A/zh
Publication of JP2006066715A publication Critical patent/JP2006066715A/ja
Publication of JP2006066715A5 publication Critical patent/JP2006066715A5/ja
Application granted granted Critical
Publication of JP4463645B2 publication Critical patent/JP4463645B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
JP2004248835A 2004-08-27 2004-08-27 プリント基板およびその検査方法 Expired - Fee Related JP4463645B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004248835A JP4463645B2 (ja) 2004-08-27 2004-08-27 プリント基板およびその検査方法
TW094127193A TWI335778B (en) 2004-08-27 2005-08-10 Printed circuit board and inspection method therefor
US11/208,884 US7381903B2 (en) 2004-08-27 2005-08-23 Printed circuit board and inspection method therefor
CNA2005100915868A CN1741705A (zh) 2004-08-27 2005-08-26 印制电路板及其检查方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004248835A JP4463645B2 (ja) 2004-08-27 2004-08-27 プリント基板およびその検査方法

Publications (3)

Publication Number Publication Date
JP2006066715A JP2006066715A (ja) 2006-03-09
JP2006066715A5 JP2006066715A5 (enExample) 2007-03-15
JP4463645B2 true JP4463645B2 (ja) 2010-05-19

Family

ID=35941431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004248835A Expired - Fee Related JP4463645B2 (ja) 2004-08-27 2004-08-27 プリント基板およびその検査方法

Country Status (4)

Country Link
US (1) US7381903B2 (enExample)
JP (1) JP4463645B2 (enExample)
CN (1) CN1741705A (enExample)
TW (1) TWI335778B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101153887B (zh) * 2006-09-28 2010-12-15 比亚迪股份有限公司 一种可检测fpc冲偏的专用线路板及检测的方法
EP2650112B1 (en) 2006-11-03 2016-08-24 Trustees Of Tufts College Nanopatterned biopolymer optical device and method of manufacturing the same
CA2704768A1 (en) * 2006-11-03 2008-10-23 Trustees Of Tufts College Biopolymer sensor and method of manufacturing the same
US20100046902A1 (en) 2006-11-03 2010-02-25 Trustees Of Tufts College Biopolymer photonic crystals and method of manufacturing the same
US20100096763A1 (en) * 2006-11-03 2010-04-22 Trustees Of Tufts College Biopolymer optofluidic device and method of manufacturing the same
JP4837530B2 (ja) * 2006-11-14 2011-12-14 日本メクトロン株式会社 プリント配線板の検査用ターゲット
ATE510224T1 (de) * 2006-11-16 2011-06-15 Siemens Ag Sensorelement, vorrichtung und verfahren zur inspektion einer leiterbahnstruktur, herstellungsverfahren für sensorelement
EP2206017B1 (en) 2007-11-05 2019-02-20 Trustees Of Tufts College Fabrication of silk fibroin photonic structures by nanocontact imprinting
EP2307054A4 (en) * 2008-06-18 2013-02-06 Tufts College EDIBLE HOLOGRAPHIC SILK PRODUCTS
EP2396276B1 (en) 2009-02-12 2016-08-31 Trustees Of Tufts College Nanoimprinting of silk fibroin structures for biomedical and biophotonic applications
US9016875B2 (en) 2009-07-20 2015-04-28 Tufts University/Trustees Of Tufts College All-protein implantable, resorbable reflectors
WO2011026101A2 (en) 2009-08-31 2011-03-03 Trustees Of Tufts College Silk transistor devices
CN102065641B (zh) * 2009-11-17 2012-10-17 富葵精密组件(深圳)有限公司 电路板制作方法
CN102082980B (zh) * 2009-12-01 2015-04-15 昆山华扬电子有限公司 数字麦克风内嵌屏蔽印制板及其制作工艺
US9603243B2 (en) 2010-04-12 2017-03-21 Tufts University Silk electronic components
TWI386129B (zh) * 2010-10-25 2013-02-11 Zhen Ding Technology Co Ltd 電路板文字漏印之檢測方法
JP5421893B2 (ja) * 2010-12-20 2014-02-19 日東電工株式会社 配線回路基板の製造方法、配線回路基板集合体シートの製造方法、配線回路基板および配線回路基板集合体シート
US9208552B2 (en) * 2011-04-26 2015-12-08 Kla-Tencor Corporation Method and system for hybrid reticle inspection
WO2012162067A2 (en) 2011-05-21 2012-11-29 Macrogenics, Inc. Cd3-binding molecules capable of binding to human and non-human cd3
CN108846176B (zh) * 2018-05-30 2022-05-06 郑州云海信息技术有限公司 一种印刷电路板布线的检查方法、装置及电子设备
JP7417371B2 (ja) * 2019-07-12 2024-01-18 芝浦メカトロニクス株式会社 実装装置
CN115529714A (zh) * 2021-06-25 2022-12-27 全亿大科技（佛山）有限公司 线路板及制作方法
CN116475625B (zh) * 2023-04-14 2026-04-21 浙江大华技术股份有限公司 阻焊剂组合物及其阻焊膜和印制电路板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5672365A (en) * 1979-11-19 1981-06-16 Sharp Corp Inspection of short circuit of board
JPH0660686B2 (ja) 1983-10-05 1994-08-10 日産自動車株式会社 ロツクアツプ式自動変速機
JP2926922B2 (ja) 1990-07-17 1999-07-28 日本電気株式会社 印刷配線板
JPH0521923A (ja) 1990-12-04 1993-01-29 Nec Corp 印刷配線板
JPH05283888A (ja) * 1992-03-31 1993-10-29 Cmk Corp プリント配線板およびその製造方法
JP2001067077A (ja) * 1999-08-30 2001-03-16 Roland Corp プリント配線基板
JP2002158413A (ja) 2000-11-17 2002-05-31 Nec Saitama Ltd 印刷配線板

Also Published As

Publication number Publication date
CN1741705A (zh) 2006-03-01
US20060042822A1 (en) 2006-03-02
JP2006066715A (ja) 2006-03-09
US7381903B2 (en) 2008-06-03
TWI335778B (en) 2011-01-01
TW200614885A (en) 2006-05-01

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