TWI327110B - - Google Patents

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Publication number
TWI327110B
TWI327110B TW96110890A TW96110890A TWI327110B TW I327110 B TWI327110 B TW I327110B TW 96110890 A TW96110890 A TW 96110890A TW 96110890 A TW96110890 A TW 96110890A TW I327110 B TWI327110 B TW I327110B
Authority
TW
Taiwan
Prior art keywords
screen
nozzle
printing
template
solder paste
Prior art date
Application number
TW96110890A
Other languages
English (en)
Chinese (zh)
Other versions
TW200800614A (en
Inventor
Norio Gouko
Toshihisa Taniguchi
Atsushi Sakaida
Yuji Tuduki
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of TW200800614A publication Critical patent/TW200800614A/zh
Application granted granted Critical
Publication of TWI327110B publication Critical patent/TWI327110B/zh

Links

Landscapes

  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW96110890A 2006-06-08 2007-03-28 Screen printing apparatus and its printing method TW200800614A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006159977A JP4682924B2 (ja) 2006-06-08 2006-06-08 スクリーン印刷方法

Publications (2)

Publication Number Publication Date
TW200800614A TW200800614A (en) 2008-01-01
TWI327110B true TWI327110B (enExample) 2010-07-11

Family

ID=38927127

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96110890A TW200800614A (en) 2006-06-08 2007-03-28 Screen printing apparatus and its printing method

Country Status (2)

Country Link
JP (1) JP4682924B2 (enExample)
TW (1) TW200800614A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472404B (zh) * 2011-07-15 2015-02-11 日立先端科技儀器股份有限公司 2-axis drive mechanism and wafer bonding machine

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101575288B1 (ko) 2009-11-23 2015-12-10 한화테크윈 주식회사 스크린 프린터 및 이를 사용한 스크린 프린팅 방법
TWI413469B (zh) * 2011-11-16 2013-10-21 Wistron Corp 塗佈裝置及其錫膏印刷機
KR101356562B1 (ko) * 2013-10-24 2014-01-29 유원근 솔더 펌프용 헤드장치
US11273632B2 (en) * 2018-03-12 2022-03-15 Panasonic Intellectual Property Management Co., Ltd. Screen printing apparatus, mask cleaner, and blade
CN113650406B (zh) * 2021-08-18 2023-03-28 东莞市诺正电子有限公司 一种用于集成电路对pcb电路板生产后双面丝印字符的设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1142762A (ja) * 1997-07-29 1999-02-16 Fujitsu Ltd スキージ装置、半田ペースト印刷方法、及び半田ペースト印刷装置
JP4322340B2 (ja) * 1999-01-21 2009-08-26 株式会社日立ハイテクインスツルメンツ スクリーン印刷機
JP4330720B2 (ja) * 1999-08-27 2009-09-16 ヤマハ発動機株式会社 スクリーン印刷機の印刷剤供給装置
JP3811592B2 (ja) * 2000-04-24 2006-08-23 松下電器産業株式会社 粘性材料供給方法
JP3848868B2 (ja) * 2001-11-13 2006-11-22 株式会社 日立インダストリイズ スクリーン印刷機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472404B (zh) * 2011-07-15 2015-02-11 日立先端科技儀器股份有限公司 2-axis drive mechanism and wafer bonding machine

Also Published As

Publication number Publication date
TW200800614A (en) 2008-01-01
JP2007326308A (ja) 2007-12-20
JP4682924B2 (ja) 2011-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees