TWI358250B - - Google Patents
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- Publication number
- TWI358250B TWI358250B TW96127062A TW96127062A TWI358250B TW I358250 B TWI358250 B TW I358250B TW 96127062 A TW96127062 A TW 96127062A TW 96127062 A TW96127062 A TW 96127062A TW I358250 B TWI358250 B TW I358250B
- Authority
- TW
- Taiwan
- Prior art keywords
- printing
- template
- scraping
- side wall
- solder paste
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 description 144
- 238000007790 scraping Methods 0.000 description 78
- 230000004907 flux Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
- Printing Methods (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006289925A JP4853229B2 (ja) | 2006-10-25 | 2006-10-25 | はんだ印刷方法及びはんだ印刷ヘッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200820861A TW200820861A (en) | 2008-05-01 |
| TWI358250B true TWI358250B (enExample) | 2012-02-11 |
Family
ID=39439024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96127062A TW200820861A (en) | 2006-10-25 | 2007-07-25 | Solder printing method and solder printing head |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4853229B2 (enExample) |
| TW (1) | TW200820861A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101038774B1 (ko) * | 2008-10-29 | 2011-06-03 | 삼성전기주식회사 | 잉크젯 헤드 및 이를 이용한 인쇄방법 |
| CN103101293A (zh) * | 2013-02-04 | 2013-05-15 | 宏茂光电（苏州）有限公司 | 光扩散片用防溅印刷机 |
| JP6790373B2 (ja) * | 2016-02-05 | 2020-11-25 | 富士電機株式会社 | 印刷装置、印刷用工具および印刷方法 |
| CN119255500B (zh) * | 2024-08-29 | 2025-11-28 | 广东新昇电业科技股份有限公司 | 一种pcba板自动上锡装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03193347A (ja) * | 1989-12-22 | 1991-08-23 | Oki Electric Ind Co Ltd | 印刷装置用スキージホルダ構造 |
| JP3685097B2 (ja) * | 2001-07-12 | 2005-08-17 | 松下電器産業株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
| JP3593595B2 (ja) * | 2001-09-11 | 2004-11-24 | 株式会社 日立インダストリイズ | 印刷ヘッド及び該印刷ヘッドを用いた印刷方法 |
| JP2004017374A (ja) * | 2002-06-13 | 2004-01-22 | Matsushita Electric Ind Co Ltd | 導電性ペースト充填用スキージ、導電性ペースト充填方法及び装置 |
| JP4258267B2 (ja) * | 2003-05-09 | 2009-04-30 | 株式会社日立プラントテクノロジー | クリームはんだ印刷機 |
-
2006
- 2006-10-25 JP JP2006289925A patent/JP4853229B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-25 TW TW96127062A patent/TW200820861A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200820861A (en) | 2008-05-01 |
| JP2008105255A (ja) | 2008-05-08 |
| JP4853229B2 (ja) | 2012-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |