TWI358250B - - Google Patents
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- TWI358250B TWI358250B TW96127062A TW96127062A TWI358250B TW I358250 B TWI358250 B TW I358250B TW 96127062 A TW96127062 A TW 96127062A TW 96127062 A TW96127062 A TW 96127062A TW I358250 B TWI358250 B TW I358250B
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Description
1358250 九、發明說明 【發明所屬之技術領域】 本發明是關於焊錫印刷方法及焊錫印刷頭，藉由對於 載置於工件上的印刷模板供給焊錫膏，來將焊錫膏充塡到 模板孔。 【先前技術】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder printing method and a solder print head for charging a solder paste to a template hole by supplying a solder paste to a printing template placed on a workpiece. [Prior Art]
習知的焊錫印刷機，例如在第12圖所揭示的構造。 在該焊錫印刷機1 1，工件W以夾具1 3所保持，網版模板 Μ是隔介著模板上下驅動部15而保持著，印刷頭17是隔 介著印刷頭水平驅動部1 9與印刷頭上下驅動部20所保持 著。配合印刷圖案而開設有孔部的網版模板Μ是載置於 工件W上’藉由印刷頭17將焊錫膏Ρ充塡於模板的孔 部，以模板的孔圖案來將焊錫轉印到工件。 近年來伴隨著半導體的高功能化、高積體化的趨勢， 即使是用來形成封裝基板的焊錫凸塊的焊錫印刷機，都要 求印刷凸塊要更加細微化。伴隨著該凸塊的細微化，模板 孔也細微化，而焊錫膏爲了防止滴流情形而逐漸高黏度 化，所以對於模板孔的充塡力或充塡量的精度的要求也逐 漸嚴格化。 以往所使用的橡皮刮板型印刷頭2 1，如第1 3圖（a)所 示，橡皮刮板25是傾斜而安裝於印刷頭主體23，在該橡 皮刮板25與模板Μ之間保持著焊錫膏P，藉由使橡皮刮 板25在模板Μ上朝水平方向移動，將焊錫膏Ρ充塡於模 -5- 1358250 板孔Η，並且以橡皮刮板前端來將模板Μ上的焊錫膏刮 除。可是，會因爲橡皮刮板的伸入而將焊錫刮出、或如第 13圖（b)所示，焊錫膏朝橡皮刮板的橫方向流動而造成充 塡壓力不足的問題。因此，近年來是以可機械式控制平均 的印刷壓力的密閉型印刷頭3 1爲主流。 該密閉型印刷頭31，如第14圖所示，是以活塞3 5 來將充塡於壓缸33內的焊錫膏Ρ予以加壓，壓力不會擴 散而能確實地將焊錫膏充塡到模板孔Η。可是，在該密閉 型印刷頭31，會有焊錫膏凝固在噴嘴前端而導致印刷不 良的問題。 焊錫膏Ρ，是固體的焊錫粒子37與助焊劑39溶劑的 混合物，如第15圖（a)所示，焊錫粒子37之間充滿了助 焊劑39所以具有流動性。於是，維持著流動性，焊錫膏 P充塡到模板孔Η，在除去模板後，印刷上的焊錫膏41 是載置於工件上。在橡皮刮板型印刷頭，因爲焊錫膏的翻 動造成攪拌運動，而維持焊錫膏的流動性，可是在密閉型 印刷頭31，噴嘴前端附近的焊錫，即使加壓也只有微量 的印刷量流動，只有液體的助焊劑成分從噴嘴與模板的緊 貼面或模板與工件的間隙流出。因此，如第1 5圖（b)所 示，失去助焊劑成分的焊錫膏，其焊錫粒子彼此凝結、黏 著。黏著的焊錫膏即使加壓其流動性也很低，印刷時很難 充塡到模板孔，而成爲產生印刷焊錫的缺口 43的不良的 原因。相對於這種狀態，在以往的焊錫印刷機，其對應方 法是定期將噴嘴前端的黏著焊錫膏予以廢棄，而今後伴隨 1358250 著凸塊的細微化’需要考慮焊錫膏更高功能化而材料成本 上昇的因素，而需要更節省資源的方法。 作爲這種密閉型印刷頭，另外如專利文獻丨所揭示的 構造。 [專利文獻1]日本特開2006 — 264007 【發明內容】 [發明欲解決的課題] 本發明其課題是要解決上述問題，要提供一種焊錫印 刷頭，能防止在噴嘴前端部產生焊錫膏黏著的情形。 [用以解決課題的手段]A conventional solder printing machine, such as the one disclosed in Fig. 12. In the solder printer 1, the workpiece W is held by the jig 13 and the screen template is held by the template upper and lower drive unit 15, and the print head 17 is interposed between the print head horizontal drive unit 19 and the printing. The head upper and lower drive unit 20 is held. A screen template having a hole portion in cooperation with the printing pattern is placed on the workpiece W. The solder paste is filled in the hole portion of the template by the printing head 17, and the solder is transferred to the workpiece by the hole pattern of the template. . In recent years, with the trend toward high functionality and high integration of semiconductors, even solder presses for forming solder bumps of package substrates have to be made more compact. Along with the miniaturization of the bumps, the template holes are also fined, and the solder paste is gradually highly viscous in order to prevent dripping, so that the requirements for the filling power of the template holes or the accuracy of the filling amount are gradually tightened. The squeegee type print head 2 1 used in the past is as shown in Fig. 3 (a), and the squeegee 25 is attached to the print head main body 23 obliquely, and is held between the squeegee 25 and the template Μ. Solder paste P, by moving the squeegee 25 on the template 朝 horizontally, filling the solder paste into the -5-5-1358250 plate hole, and soldering the template 以 on the front end of the squeegee Cream scraping. However, the solder is scraped off due to the insertion of the squeegee, or as shown in Fig. 13(b), the solder paste flows in the lateral direction of the squeegee, causing a problem of insufficient charging pressure. Therefore, in recent years, the sealed type print head 31 which can mechanically control the average printing pressure has been the mainstream. As shown in Fig. 14, the sealed type print head 31 pressurizes the solder paste which is filled in the pressure cylinder 33 by the piston 35, and the pressure is not diffused, so that the solder paste can be reliably filled. Template hole Η. However, in the sealed type print head 31, there is a problem that the solder paste is solidified at the tip end of the nozzle, resulting in poor printing. The solder paste is a mixture of the solid solder particles 37 and the flux 39 solvent. As shown in Fig. 15(a), the solder particles 37 are filled with the flux 39 so as to have fluidity. Thus, the fluidity is maintained, and the solder paste P is filled into the template hole, and after the template is removed, the printed solder paste 41 is placed on the workpiece. In the squeegee type printing head, since the stirring motion of the solder paste is performed to maintain the fluidity of the solder paste, the solder in the vicinity of the nozzle tip of the sealed type print head 31 flows only a small amount of printing even when pressurized. Only the flux component of the liquid flows out from the contact surface of the nozzle and the template or the gap between the template and the workpiece. Therefore, as shown in Fig. 15(b), the solder paste which has lost the flux component is condensed and adhered to each other. The adhesive solder paste has a low fluidity even under pressure, and it is difficult to fill the template holes during printing, which is a cause of defects in the printed solder. In contrast to this state, in the conventional solder printing machine, the corresponding method is to periodically discard the adhesive solder paste at the tip of the nozzle, and in the future, with the miniaturization of the bumps of 1358250, it is necessary to consider the higher functionalization of the solder paste and the material cost. The rising factor requires a more resource-saving approach. As such a sealed type print head, there is another configuration as disclosed in the patent document. [Patent Document 1] JP-A-2006-264007 [Disclosure] [Problem to be Solved by the Invention] An object of the present invention is to solve the above problems, and to provide a solder print head capable of preventing solder paste from sticking to a tip end portion of a nozzle. situation. [Means to solve the problem]
爲了解決上述課題，是將具有模板孔（H)的模板（M)載 置於工件（W)上’藉由將焊錫膏（P)供給到該模板（M)上， 將上述焊錫膏（P)充塡到上述模板孔（H)，之印刷方法，使 用印刷頭（51、91、101)，該印刷頭（51、91、101)設置有 水平剖面大致矩形的噴嘴（65、93)，該噴嘴（65、93)，是 藉由：具有：移動於上述模板（M)上面部，並且從移動方 向前方起越朝向後方越接近上述模板（M)上面部的印刷用 傾斜面（69)、及在其前端形成的印刷用邊緣（69a)，之印刷 用側壁（67);具有：在印刷用傾斜面（69)的移動方向前 方’從後方越朝前方越接近上述模板（M)面的刮除用傾斜 面（73)、及在其前端形成的刮除用邊緣（73 a)，之刮除用側 壁（7 1);以及將上述印刷用側壁（67)與上述刮除用側壁（71) 1358250In order to solve the above problem, a template (M) having a template hole (H) is placed on a workpiece (W). The solder paste (P) is supplied by supplying a solder paste (P) onto the template (M). a printing method (51, 91, 101) is used to fill the template hole (H), and the printing head (51, 91, 101) is provided with nozzles (65, 93) having a substantially horizontal cross section. The nozzle (65, 93) has a printing inclined surface (69) that moves to the upper surface of the template (M) and approaches the upper surface of the template (M) toward the rear from the front in the moving direction. And a printing edge (69a) formed at the front end thereof, the printing side wall (67); and having a front side in the moving direction of the printing inclined surface (69) closer to the front side of the template (M) from the rear toward the front a scraping surface (73) for scraping, a scraping edge (73a) formed at a front end thereof, a scraping side wall (71), and the printing side wall (67) and the scraping side wall (71) 1358250
從兩側夾入的側壁（75、95)，所形成；將上述焊錫膏（P)供 給到在上述兩側壁（75 ' 95)之間而以上述印刷用傾斜面 (69)與上述模板（M)所夾著的空間，滴下到模板（M)上的焊 錫膏（P)，沒有同時接觸上述印刷用側壁（67)與上述刮除用 側壁（7 1)而成爲產生有間隙的未充塡狀態，在該狀態，藉 由使上述印刷頭（51、91、101)朝前方移動，上述焊錫膏 (P)不會從上述兩側壁（75、95)溢出，將上述焊錫膏（P)朝 向上述模板（M)按壓而充塡到上述模板孔（H)。 爲了解決上述課題，是將具有模板孔（H)的模板（M)載 置於工件（W)上，藉由將焊錫膏（P)供給到該模板（M)上， 將上述焊錫膏（P)充塡到上述模板孔（H)，之印刷頭（51、 91、101)，是具備有水平剖面大致矩形的噴嘴（65、93)， 該噴嘴（65、93)，是藉由：具有：移動於上述模板（M)上 面部，並且從移動方向前方起越朝向後方越接近上述模板 (M)上面部的印刷用傾斜面（69)、及在其前端形成的印刷 用邊緣（69a)，之印刷用側壁（67);具有：在印刷用傾斜面 (6 9)的移動方向前方，從後方越朝前方越接近上述模板（M) 面的刮除用傾斜面（73)、及在其前端形成的刮除用邊緣 (73a)，之刮除用側壁（71);以及將上述印刷用側壁（67)與 上述刮除用側壁（71)從兩側夾入的側壁（75、95)，所形 成；將上述焊錫膏（P)供給到在上述兩側壁（75、95)之間而 以上述印刷用傾斜面（69)與上述模板（M)所夾著的空間， 滴下到模板（M)上的焊錫膏（P)，沒有同時接觸上述印刷用 側壁（67)與上述刮除用側壁（71)而成爲產生有間隙的未充 -8 - 1358250 塡狀態，在該狀態，藉由使上述印刷頭朝前方移動，上述 焊錫膏（P)不會從上述兩側壁（75、95)溢出，將上述焊錫膏 (P)朝向上述模板（M)按壓而充塡到上述模板孔（H)。 藉由該手段，焊錫膏（P)，沿著印刷用傾斜面（69)流 動，沒有進入模板孔（H)的焊錫膏（P)會循環。結果，助焊 劑流出的焊錫膏（P)，與剩餘的焊錫膏混合攪拌，讓助焊 劑的混合比率維持正常，而能防止焊錫膏的黏著。Forming sidewalls (75, 95) sandwiched from both sides; supplying the solder paste (P) between the two side walls (75'95) and the above-mentioned printing inclined surface (69) and the template ( In the space sandwiched by M), the solder paste (P) dropped onto the template (M) does not simultaneously contact the printing side wall (67) and the scraping side wall (71), and becomes a gap-free unfilled portion. In the state of the crucible, the solder paste (P) does not overflow from the both side walls (75, 95) by moving the print heads (51, 91, 101) forward, and the solder paste (P) The template hole (H) is filled toward the template (M). In order to solve the above problem, a template (M) having a template hole (H) is placed on a workpiece (W), and the solder paste (P) is supplied onto the template (M) to apply the solder paste (P). The print head (51, 91, 101) is filled with the template hole (H), and is provided with nozzles (65, 93) having a substantially rectangular cross section, and the nozzles (65, 93) are: : an inclined surface (69) for printing on the upper surface of the template (M) and a printing edge (69a) formed at the front end of the template (M) toward the rear from the front side in the moving direction a side wall (67) for printing, having a scraping inclined surface (73) that is closer to the front side of the template (M) from the rear toward the front in the moving direction of the inclined surface for printing (69), and a scraping edge (73a) formed at a front end thereof, a side wall (71) for scraping, and a side wall (75, 95) for sandwiching the printing side wall (67) and the scraping side wall (71) from both sides The solder paste (P) is supplied between the two side walls (75, 95) and the inclined surface for printing (69) The solder paste (P) dropped onto the template (M) in the space sandwiched by the template (M) does not simultaneously contact the printing side wall (67) and the scraping side wall (71) to cause a gap. In the state of 未-8 - 1358250 ,, in this state, the solder paste (P) does not overflow from the both side walls (75, 95) by moving the print head forward, and the solder paste (P) is oriented The template (M) is pressed and filled into the template hole (H). By this means, the solder paste (P) flows along the inclined surface (69) for printing, and the solder paste (P) which does not enter the template hole (H) circulates. As a result, the solder paste (P) flowing out of the flux is mixed and stirred with the remaining solder paste, so that the mixing ratio of the flux is maintained normal, and the adhesion of the solder paste can be prevented.
爲了解決上述課題，在上述印刷用傾斜面（69)的移動 方向前方，設置：從後方起越朝向前方越接近模板（M)面 的刮除用傾斜面（73)，當朝前方移動時，藉由上述印刷用 傾斜面（69)將焊錫膏（P)充塡於上述模板孔（M)，並且當朝 後方移動時，藉由上述刮除用傾斜面（73)將殘留於模板（M) 面上的焊錫膏（P)予以刮除。藉由該手段，在焊錫刮除步 驟’與上述方法同樣地，焊錫膏（P)會沿著刮除用傾斜面 (73)流動循環。結果，助焊劑流出的焊錫膏（p)，與剩餘的 焊錫膏混合攪拌，讓助焊劑的混合比率維持正常，而能防 止焊錫膏的黏著。 爲了解決上述課題，在上述印刷用傾斜面（69)與上述 刮除用傾斜面（73)之間’具備有：用來供給焊錫膏（p)的焊 錫膏供給裝置（5 7)，且具備有：用來使上述印刷用傾斜面 (6 9)、上述刮除用傾斜面（73)、焊錫膏供給裝置（57)朝上 述移動方向移動的驅動裝置（55)。於是，能將焊錫膏正確 地供給到預定的位置，而能容易且正確地移動印刷頭。 爲了解決上述課題，採用可朝前後方向擺動的手段， -9- 1358250 該手段，當朝前方移動時，使上述印刷用傾斜面（69)的印 刷用邊緣（6 9 a)接觸於上述模板（M)，並且使上述刮除用傾 斜面（73)的刮除用邊緣（73 a)從上述模板（M)分離，當朝後 方移動時’使上述刮除用邊緣（73a)接觸於上述模板（M)， 並且使上述印刷用邊緣（69a)從上述模板（M)分離》於是， 可防止在印刷步驟時，焊錫膏附著在刮除用邊緣（73a)、 及在刮除步驟時，焊錫膏附著在印刷用邊緣（69a)。於 是，能防止在下一步驟附著於邊緣的焊錫再附著於模板， 而能防止印刷不良的情形》 爲了解決上述課題，採用將上述印刷用傾斜面（69)與 上述刮除用傾斜面（73)配設成可上下移動的手段，該手 段，當朝前方移動時，使上述印刷用傾斜面（69)的印刷用 邊緣（69a)接觸於上述模板（M)，並且使上述刮除用傾斜面 (73)的刮除用邊緣（73a)從上述模板（M)分離，當朝後方移 動時，使上述刮除用邊緣（73 a)接觸於上述模板（M)，並且 使上述印刷用邊緣（69a)從上述模板（M)分離》可防止在往 前通路的印刷步驟時，焊錫膏附著在刮除用邊緣（73a)、 及當回復通路的刮除步驟時，焊錫膏附著在印刷用邊緣 (69 a)，而能不需要對於附著的焊錫膏的清洗作業。 爲了解決上述課題，上述印刷用傾斜面（69)，相對於 上述模板（M)面爲15°〜30°，上述刮除用傾斜面（73)，相 對於上述模板（M)爲45°〜60°。於是，針對上述印刷用傾 斜面（69)，能有效地產生對於模板孔（H)的按壓力，並且 能促進焊錫膏的循環，針對上述刮除用傾斜面（73)，能有 -10- 1358250 效地進行焊錫膏的刮除，並且促進焊錫膏的循環。 而上述各方法的括弧中的圖號，是表示與後述實施方 式所記載的具體手段的對應關係的一個例子。 【實施方式】 以下，針對本發明的實施方式，參照第1圖〜第11 圖來說明。In order to solve the problem, the scraping inclined surface (73) which is closer to the front side of the template (M) toward the front from the rear is provided in front of the moving direction of the printing inclined surface (69), and when moving forward, The solder paste (P) is filled in the template hole (M) by the printing inclined surface (69), and remains in the template (M) by the above-mentioned scraping inclined surface (73) when moving backward. The solder paste (P) on the surface is scraped off. By this means, in the solder scraping step ', as in the above-described method, the solder paste (P) flows and circulates along the scraping inclined surface (73). As a result, the solder paste (p) flowing out of the flux is mixed and stirred with the remaining solder paste, so that the flux mixing ratio is maintained normal, and the adhesion of the solder paste can be prevented. In order to solve the problem, the soldering paste supply device (57) for supplying the solder paste (p) is provided between the inclined surface for printing (69) and the inclined surface for scraping (73), and is provided with There is a drive device (55) for moving the inclined surface for printing (69), the inclined surface for scraping (73), and the solder paste supply device (57) in the moving direction. Thus, the solder paste can be correctly supplied to a predetermined position, and the print head can be easily and correctly moved. In order to solve the above problem, a means for swinging in the front-rear direction, -9 - 1358250 is used, and when moving forward, the printing edge (69 a) of the printing inclined surface (69) is brought into contact with the template ( M), and separating the scraping edge (73a) of the scraping inclined surface (73) from the template (M), and moving the scraping edge (73a) to the template when moving backward (M), and separating the printing edge (69a) from the template (M), thereby preventing solder paste from adhering to the blade edge (73a) during the printing step and soldering during the blade step The paste adheres to the edge of printing (69a). Therefore, it is possible to prevent the solder adhered to the edge in the next step from adhering to the template, and it is possible to prevent the printing failure. In order to solve the above problem, the inclined surface for printing (69) and the inclined surface for scraping (73) are used. And a means for moving up and down, the means for contacting the printing edge (69a) of the printing inclined surface (69) with the template (M) and moving the scraping inclined surface when moving forward The scraping edge (73a) of (73) is separated from the template (M), and when moving backward, the scraping edge (73a) is brought into contact with the template (M), and the printing edge is made ( 69a) Separating from the above-mentioned template (M) prevents the solder paste from adhering to the edge for scraping (73a) and the step of scraping the return path when the printing step of the forward path is applied, and the solder paste adheres to the edge of printing (69 a), and it is not necessary to clean the attached solder paste. In order to solve the above problem, the printing inclined surface (69) is 15° to 30° with respect to the template (M) surface, and the scraping inclined surface (73) is 45° with respect to the template (M). 60°. Therefore, with respect to the above-described inclined surface for printing (69), the pressing force for the template hole (H) can be efficiently generated, and the circulation of the solder paste can be promoted. For the above-mentioned inclined surface for scraping (73), there can be -10- 1358250 Effectively removes solder paste and promotes solder paste circulation. The figure numbers in parentheses in the above respective methods are examples showing the correspondence relationship with the specific means described in the embodiment described later. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to Figs. 1 to 11 .
第1圖（a)、（b)，是本發明的第一實施方式的顯示 圖。在該圖中，圖號5 1是顯示焊錫印刷頭。該焊錫印刷 頭51，具有框架53。在該框架53，連結著由油壓缸所構 成的往復驅動裝置55，框架53是朝水平方向往復移動。 在框架53的上側，設置有焊錫膏供給裝置57。該焊錫膏 供給裝置57，具有：藉由從空氣供給部59所供給的空氣 壓力而作動的空氣氣缸61、以及藉由該空氣氣缸61所驅 動的焊錫膏供給壓缸63。在焊錫膏供給壓缸63，充塡著 焊錫膏P，藉由以空氣壓缸63所驅動的活塞而被擠出到 後述的噴嘴內。 在框架53的下側，設置有如第2圖（a)、（b)所示的水 平剖面略矩形的噴嘴65。該噴嘴65，在焊錫膏充塡步驟 的行進方向後側具有印刷用側壁67。在該印刷用側壁67 的下端，具有：在焊錫膏充塡步驟的從行進方向的前側起 越朝後側越接近模板面的印刷用傾斜面69，在其前端形 成有印刷用邊緣69a。該印刷用傾斜面69的傾斜角度a， 爲了對模板施加印刷壓力，而相對於模板面爲15°〜30°。 -11 - 1358250 該噴嘴65，在焊錫膏充塡步驟的行進方向前側，具有刮 除用側壁71。在該刮除用側壁71的下端，具有：在焊錫 膏充塡步驟的從行進方向的後側起越朝前側越接近模板面 的刮除用傾斜面73，在其前端形成有刮除用邊緣73a。該 刮除用傾斜面73，是將模板上殘留的焊錫膏在模板上刮 掉，所以相對於模板面的角度B爲45°〜60°。 在該印刷用側壁67與刮除用側壁7 1的移動方向的兩 側，分別設置有：將該印刷用側壁67的兩端與刮除用側 壁7 1的兩端予以連結的噴嘴側壁75。而該噴嘴側壁的下 端的側壁邊緣77，是形成爲：與印刷用邊緣69a或刮除 用邊緣73a爲相同高度位置。 另一方面，在工件載置台79上載置著工件W，在該 工件W的上面部載置著模板Μ。 噴嘴65，使其印刷用邊緣69a、刮除用邊緣73a、側 壁邊緣77，一邊接觸於模板Μ上面部一邊朝水平方向移 動。 針對使用該印刷頭51而在工件上進行印刷的步驟來 加以說明。 首先’如第3圖所示’使焊錫印刷頭5 1位於模板μ 的沒有印刷圖案的端部Ma，使焊錫膏供給裝置57作動。 使焊錫膏P落下供給到：模板Μ的以印刷用側壁6 7、刮 除用側壁7 1、噴嘴側壁7 5所包圍的空間。此時的焊錫膏 的供給，如第3圖所示，滴下到摸板Μ的焊錫膏並沒有 同時接觸到印刷用側壁ό 7與刮除用側壁7 1，而成爲產生 •12- 1358250 有間隙的未充塡狀態〃 接著，如第4圖所示使往復驅動裝置55驅動，使焊 錫印刷頭5 1移動於模板Μ上。則在印刷用傾斜面69與 模板Μ之間的焊錫膏Ρ，藉由印刷用傾斜面69對其施加 印刷壓力81，對焊錫膏Ρ施加朝向模板孔的按壓力83, 將其充塡到模板孔Η(印刷步驟）。Figs. 1(a) and 1(b) are views showing a first embodiment of the present invention. In the figure, Figure 51 shows the solder print head. This solder print head 51 has a frame 53. In the frame 53, a reciprocating drive 55 composed of a hydraulic cylinder is coupled, and the frame 53 reciprocates in the horizontal direction. On the upper side of the frame 53, a solder paste supply device 57 is provided. The solder paste supply device 57 includes an air cylinder 61 that is actuated by the air pressure supplied from the air supply unit 59, and a solder paste supply cylinder 63 that is driven by the air cylinder 61. The solder paste supply cylinder 63 is filled with the solder paste P, and is extruded into a nozzle to be described later by a piston driven by the air cylinder 63. On the lower side of the frame 53, a nozzle 65 having a horizontally rectangular shape as shown in Figs. 2(a) and 2(b) is provided. The nozzle 65 has a printing side wall 67 on the rear side in the traveling direction of the solder paste charging step. In the lower end of the printing side wall 67, the printing inclined surface 69 which is closer to the template surface toward the rear side in the solder paste filling step from the front side in the traveling direction is formed, and the printing edge 69a is formed at the tip end. The inclination angle a of the inclined surface 69 for printing is 15 to 30 degrees with respect to the template surface in order to apply printing pressure to the stencil. -11 - 1358250 This nozzle 65 has a side wall 71 for scraping on the front side in the traveling direction of the solder paste filling step. The lower end of the scraping side wall 71 has a scraping inclined surface 73 that approaches the template surface toward the front side in the solder paste filling step from the rear side in the traveling direction, and a scraping edge is formed at the tip end thereof. 73a. The scraping surface 73 for scraping scrapes off the solder paste remaining on the stencil, so that the angle B with respect to the stencil surface is 45 to 60. On both sides of the printing side wall 67 and the wiping side wall 7 in the moving direction, nozzle side walls 75 for connecting both ends of the printing side wall 67 and both ends of the scraping side wall 71 are provided. The side wall edge 77 of the lower end of the nozzle side wall is formed to have the same height position as the printing edge 69a or the scraping edge 73a. On the other hand, the workpiece W is placed on the workpiece mounting table 79, and the template 载 is placed on the upper surface of the workpiece W. The nozzle 65 has its printing edge 69a, the scraping edge 73a, and the side wall edge 77 moved in the horizontal direction while coming into contact with the upper surface of the template. The step of printing on the workpiece using the print head 51 will be described. First, as shown in Fig. 3, the solder print head 51 is placed at the end portion Ma of the template μ having no print pattern, and the solder paste supply device 57 is actuated. The solder paste P is dropped and supplied to a space surrounded by the printing side wall 67, the scraping side wall 71, and the nozzle side wall 75. At this time, the supply of the solder paste is as shown in Fig. 3, and the solder paste dropped onto the pattern 没有 does not simultaneously contact the side wall ό 7 for printing and the side wall 7 for the squeegee, and becomes a gap of 12-1358250. The unfilled state 〃 Next, as shown in Fig. 4, the reciprocating drive unit 55 is driven to move the solder print head 51 to the template stack. Then, the solder paste Μ between the printing inclined surface 69 and the template Ρ is applied with a printing pressure 81 by the inclined surface 69 for printing, and a pressing force 83 toward the stencil hole is applied to the solder paste to fill the template. Holes (printing step).
接著，如第5圖所示，使焊錫印刷頭51在模板Μ上 朝相反方向移動。則模板Μ上的焊錫膏Ρ，會被刮除用傾 斜面73所擠壓而朝水平方向移動，並且充塡在模板孔Η 的焊錫膏Ρ以模板厚度予以刮除（刮除步驟）。藉由反覆進 行該動作，來實施焊錫印刷。由於反覆進行印刷會消耗焊 錫膏Ρ，所以如第3圖所示，定期用焊錫膏供給裝置57 來供給焊錫膏Ρ。 如上述，當供給焊錫膏Ρ時，如第3圖所示，滴下到 模板Μ的焊錫膏Ρ，不會同時接觸到印刷用側壁67與刮 除用側壁7 1 »則在第4圖所示的印刷步驟，噴嘴內部的 焊錫膏，雖然被印刷用傾斜面69與噴嘴側壁75所限制， 而在刮除用側壁71側並沒有接觸而沒有限制。因此，焊 錫膏Ρ會沿著印刷用傾斜面69進行流動85，沒有進入到 模板孔Η的焊錫膏Ρ會進行循環。結果’助焊劑流出的 焊錫膏Ρ，因爲循環流動而會與剩餘的焊錫膏混合攪拌。 於是，能使焊錫膏Ρ的助焊劑的含有比率維持正常’能防 止焊錫膏黏著。刮除步驟的情形也一樣’藉此則不需要將 黏著的焊錫廢棄，可促進生產性及更節省資源。 -13- 1358250 例如，在對應於細微化工件的小型 十次印刷，則對於噴嘴內黏著的焊錫: 作，1 5克的焊錫膏進行八十次印刷已 由採用本案的方法，則不需要廢棄動作 焊錫膏大約可進行400次以上的印刷。 第6圖及第7圖，是本發明的第 圖。該焊錫印刷頭91，是能將第1圖 51朝印刷頭的移動方向前後傾斜的構 刷頭51基本上相同構造的部分，是用 明。 在焊錫印刷頭91的噴嘴93，印刷 用側壁7 1基本上是與焊錫印刷頭5 1爲 該印刷用側壁67與刮除用側壁71的各 的噴嘴側壁95的形狀不同。也就是說 下端緣是突出形成爲：以印刷用邊緣 73 a的連結線作爲底邊的三角形，具； 69a側所形成的印刷側下緣97、與在刮 形成的刮除側下緣99。該噴嘴側壁95 的棋子倒過來的形狀。 針對使用印刷頭9 1而在工件上進 來加以說明。 首先，如第6圖所示，使印刷頭S 刷用邊緣69a與印刷側下緣97接觸於 緣73a離開模板Μ的狀態》 印刷機，每經過二 膏進行自動廢棄動 是極限》可是，藉 ，以同樣1 5克的 二實施方式的顯示 所示的焊錫印刷頭 造，針對與焊錫印 相同圖號而省略說 丨用側壁6 7與刮除 同樣的構造，而將 兩側端部予以連結 ，噴嘴側壁95，其 69a與刮除用邊緣 每：在印刷用邊緣 除用邊緣73a側所 大致爲將棋（日本） 行焊錫印刷的步驟 > 1位置成爲：其印 模板Μ，刮除用邊 • 14 · 1358250 接著，如第7圖（d)所示，使焊錫膏P落下到在模板 Μ上以印刷用側壁67與噴嘴側壁95所圍繞的空間。 接著，如第7圖（a)所示，使印刷頭91，以讓其印刷 用邊緣69a、印刷側下緣97接觸於模板Μ的狀態而移 動。則印刷用傾斜面69與模板Μ之間的焊錫膏Ρ，被印Next, as shown in Fig. 5, the solder print head 51 is moved in the opposite direction on the template stack. Then, the solder paste on the template is scraped by the scraping surface 73 and moved horizontally, and the solder paste which is filled in the template hole is scraped off by the template thickness (scraping step). Solder printing is performed by repeating this operation. Since the solder paste is consumed by repeating the printing, as shown in Fig. 3, the solder paste supply device 57 is periodically supplied with the solder paste. As described above, when the solder paste is supplied, as shown in Fig. 3, the solder paste which is dropped onto the template 不会 does not simultaneously contact the printing side wall 67 and the side wall for the squeegee 7 1 » as shown in Fig. 4 In the printing step, the solder paste inside the nozzle is restricted by the printing inclined surface 69 and the nozzle side wall 75, and there is no contact on the side of the scraping side wall 71 without limitation. Therefore, the solder paste 流动 flows along the printing inclined surface 69, and the solder paste which does not enter the template hole 循环 circulates. As a result, the solder paste which flows out of the flux is mixed with the remaining solder paste because of the circulating flow. Therefore, the content ratio of the flux of the solder paste can be maintained normal, and the solder paste can be prevented from adhering. The same is true for the scraping step. This eliminates the need to discard the adhered solder, which promotes productivity and saves resources. -13- 1358250 For example, in the case of small ten-time printing corresponding to the fine-grained workpiece, the solder adhered to the nozzle: For the printing of 15 grams of solder paste for 80 times, the method of this case is used, and no waste is required. The action solder paste can be printed approximately 400 times or more. Fig. 6 and Fig. 7 are diagrams of the present invention. The solder print head 91 is a portion having substantially the same structure in which the first print head 51 can be tilted forward and backward in the moving direction of the print head, and is used. In the nozzle 93 of the solder print head 91, the printing side wall 71 is substantially different from the shape of the nozzle side wall 95 of each of the printing side wall 67 and the wiping side wall 71. That is, the lower end edge is formed by a triangular shape having a connecting line of the printing edge 73a as a base, a printing side lower edge 97 formed on the side of the 69a, and a lower side 99 of the scraping side formed by the scraping. The shape of the pawl side wall 95 of the chess piece is reversed. Description will be made on the workpiece by using the print head 91. First, as shown in Fig. 6, the printing head S brush edge 69a and the printing side lower edge 97 are brought into contact with the edge 73a away from the template 》." The printing machine is automatically discarded every time the two pastes are passed." The same applies to the solder print head shown in the display of the second embodiment of the same 15 gram, and the same structure as the solder print is omitted, and the side walls 6 7 and the scraping structure are omitted, and the both end portions are connected. The nozzle side wall 95, the 69a and the scraping edge are: the step of printing the chess (Japan) by the edge of the edge of the printing edge 73a. The position of the sheet is: the printing template Μ, the scraping Side • 14 · 1358250 Next, as shown in Fig. 7(d), the solder paste P is dropped onto the space surrounded by the printing side walls 67 and the nozzle side walls 95 on the template enamel. Next, as shown in Fig. 7(a), the print head 91 is moved in a state where the printing edge 69a and the printing side lower edge 97 are in contact with the template Μ. Then, the solder paste between the inclined surface 69 for printing and the template Ρ is printed.
刷用傾斜面69擠壓而充塡到模板孔Η(印刷步驟）。此 時，刮除用邊緣73a從模板面Μ朝上方分離，所以在刮 除用邊緣73a的行進方向前面不會附著焊錫膏。 然後，如第7圖（b)所示，使印刷頭91朝前方擺動， 其刮除用邊緣73a與刮除側下緣99接觸於模板Μ，印刷 用邊緣69a位於與模板Μ分離的狀態。 * 接著，如第7圖（c)所示，印刷頭91在其刮除用邊緣 73a、刮除側下緣99接觸於模板Μ的狀態而朝相反方向 移動。則模板Μ上的焊錫膏Ρ，被刮除用傾斜面7 3擠壓 而朝水平方向移動，並且充塡到模板孔Η的焊錫膏Ρ是 以模板厚度被刮除（刮除步驟）。此時，印刷用邊緣69a從 模板面Μ朝上方分離，所以在印刷用邊緣69a的行進方 向前面不會附著焊錫膏。 如第7圖（d)所示，再次將焊錫膏ρ供給到模板Μ 上，繼續進行印刷。 在該印刷頭9 1，噴嘴側壁95，其下端緣是突出形成 爲：以印刷用邊緣69a與刮除用邊緣73 a的連結線作爲底 邊的三角形’具有：在印刷用邊緣69a側所形成的印刷側 下緣97、與在刮除用邊緣73a側所形成的刮除側下緣 -15- 1358250 99，在往前通路的印刷步驟，印刷頭9 1是以：其印刷用 邊緣69a與印刷側下緣97接觸於模板Μ，而刮除用邊緣 73 a從模板Μ分離的狀態來移動，在回復通路的刮除步 驟，印刷頭91是以：其刮除用邊緣7 3 a、刮除側下緣99 接觸於模板Μ，印刷用邊緣69a從模板Μ分離的狀態而 朝相反方向移動，所以可防止在印刷步驟時焊錫膏附著於 刮除用邊緣73a，及可防止在刮除用步驟時焊錫膏附著於 印刷用邊緣69a。於是，就能防止在接下來的步驟附著於 邊緣的焊錫再附著於模板，可防止產生印刷不良的情形。 而不需要進行對於附著的焊錫的清洗作業，而能減少成 本。 第8圖〜第11圖，是本發明的第三實施方式的顯示 圖。該焊錫印刷頭1 〇 1，在第1圖所示的印刷頭51，是分 別將印刷用側壁67、刮除用側壁7 1作成可上下移動，而 針對基本上與印刷頭51相同構造的部分，是用相同圖號 而省略其說明。 在焊錫印刷頭1〇1，在印刷用側壁67連結著印刷側 側壁驅動裝置1 05，在刮除用側壁7 1，連結著刮除側側壁 驅動裝置1 07，印刷用側壁67、刮除側側壁7 1分別可獨 立上下移動。 首先，如第8圖所示，將印刷頭1 〇 1的印刷用側壁 67設定在：印刷用邊緣69a接觸於模板Μ的下降位置， 將刮除用側壁71設定在：刮除用邊緣73a從模板Μ分離 的上升位置。 •16- 1358250 接著，如第8圖所示’使焊錫膏p落下至：在模板μ 上以印刷用側壁67與噴嘴側壁75所圍繞的空間。The brush is pressed by the inclined surface 69 to be filled into the template hole (printing step). At this time, since the scraping edge 73a is separated upward from the template surface, the solder paste is not attached to the front side in the traveling direction of the scraping edge 73a. Then, as shown in Fig. 7(b), the printing head 91 is swung forward, and the scraping edge 73a and the scraping side lower edge 99 are in contact with the template Μ, and the printing edge 69a is separated from the template Μ. * Next, as shown in Fig. 7(c), the print head 91 moves in the opposite direction with the scraping edge 73a and the scraping lower edge 99 contacting the template stack. Then, the solder paste on the template is scraped off by the scraping surface 7 3 and moved in the horizontal direction, and the solder paste which is filled into the template hole is scraped off by the template thickness (scraping step). At this time, since the printing edge 69a is separated upward from the template surface, the solder paste is not attached to the front side in the traveling direction of the printing edge 69a. As shown in Fig. 7(d), the solder paste ρ is again supplied onto the template ,, and printing is continued. In the print head 193, the lower end edge of the nozzle side wall 95 is formed such that a triangle "having a connecting line between the printing edge 69a and the scraping edge 73a as a base" has a side formed on the printing edge 69a side. The printing side lower edge 97 and the scraping side lower edge -15-1358250 99 formed on the scraping edge 73a side, in the printing step of the forward path, the printing head 91 is such that the printing edge 69a and The printing side lower edge 97 is in contact with the template Μ, and the squeegee edge 73a is moved away from the template ,. In the scraping step of the recovery path, the printing head 91 is: scraping the edge 7 3 a, scraping Since the side edge 99 is in contact with the template Μ, the printing edge 69a is moved in the opposite direction from the state of the template ,, so that the solder paste can be prevented from adhering to the blade edge 73a during the printing step, and the blade edge can be prevented from being scraped. In the step, the solder paste is attached to the printing edge 69a. Therefore, it is possible to prevent the solder adhered to the edge from adhering to the template in the next step, and it is possible to prevent the occurrence of poor printing. There is no need to perform cleaning operations on the attached solder, and the cost can be reduced. 8 to 11 are views showing a third embodiment of the present invention. In the print head 1 shown in FIG. 1, the print head 51 and the side wall 7 for scraping are respectively movable up and down, and the portion having the same structure as that of the print head 51 is formed. , the same figure number is used and the description is omitted. In the solder print head 1〇1, the printing side wall drive unit 105 is coupled to the printing side wall 67, and the wiping side wall driving unit 107 is coupled to the wiping side wall unit 171, the printing side wall 67, and the wiping side. The side walls 71 can be independently moved up and down. First, as shown in Fig. 8, the printing side wall 67 of the printing head 1 〇 1 is set such that the printing edge 69a is in contact with the lowering position of the template ,, and the squeegee side wall 71 is set at the squeegee edge 73a. The ascending position of the template Μ separation. • 16-1358250 Next, as shown in Fig. 8, the solder paste p is dropped to a space surrounded by the printing side wall 67 and the nozzle side wall 75 on the template μ.
接著，如第9圖所示，使印刷頭1 〇 1，在其印刷用邊 緣69a、側壁邊緣77接觸於模板Μ的狀態下移動。則印 刷用傾斜面69與模板Μ之間的焊錫膏Ρ，藉由印刷用傾 斜面69所擠壓而充塡到模板孔Η(印刷步驟）。此時，刮 除用邊緣73a從模板Μ的上面部朝上方分離，所以在刮 除用邊緣73a的行進方向前面，不會有焊錫膏附著。 然後，如第1 〇圖所示，使印刷側側壁驅動裝置1 05 與刮除側側壁驅動裝置1 〇7分別作動，將印刷頭1 0 1的印 刷用側壁67設定在：印刷用邊緣69a從模板Μ分離的上 升位置，將刮除用側壁71設定在：刮除用邊緣73a接觸 於模板Μ的下降位置。 接著，如第1 1圖所示，使焊錫印刷頭1 〇 1其刮除用 邊緣73a、側壁邊緣77接觸於模板Μ的狀態而朝相反方 向移動。則模板Μ上的焊錫膏Ρ，會被刮除用傾斜面73 擠壓而朝水平方向移動，並且充塡到模板孔Η的焊錫膏Ρ 是以模板厚度被刮除（刮除步驟）。此時，印刷用邊緣69a 從模板面Μ朝上方分離，所以在印刷用邊緣69a的行進 方向前面不會附著焊錫膏》 在該焊錫印刷頭1 0 1，在印刷用側壁67連結著印刷 側側壁驅動裝置1 05，在刮除側側壁7 1連結著刮除側側 壁驅動裝置107，將印刷用側壁67、刮除側側壁71分別 作成可獨立上下移動，在往前通路的印刷步驟，在印刷用 -17- 1358250 邊緣69a與側壁邊緣77接觸於模板Μ，刮除用邊緣73 a 在上昇位置從模板Μ分離的狀態，而移動，在回復通路 的刮除步驟，則是在刮除用邊緣73a與側壁邊緣77接觸 於模板Μ，印刷用邊緣69a在上昇位置而從模板Μ分離 的狀態，而朝相反方向移動，在往前通路的印刷步驟時， 可防止焊錫膏附著在刮除用邊緣73a，在回復通路的刮除 用步驟時，可防止焊錫膏附著在印刷用邊緣69a，而能不 需要進行對於附著的焊錫膏的清洗作業。 【圖式簡單說明】 第1圖是本發明的第一實施方式的印刷頭的顯示圖， (a)是其立體圖，（b)是其剖面圖。 第2圖是第1圖所顯示的印刷頭的噴嘴的顯示圖，（a) 是其立體圖，（b)是其剖面圖。 第3圖是顯示在第1圖所示的印刷頭中，供給焊錫膏 的狀態的剖面圖。 第4圖是顯示在第1圖所示的印刷頭中的往前通路的 印刷步驟的剖面圖。 第5圖是顯示在第1圖所示的印刷頭中的回復通路的 印刷步驟的剖面圖。 第6圖是顯示本發明的第二實施方式的焊錫印刷頭的 立體圖。 第7圖是以從（a)〜（d)圖的順序來說明第6圖所示的 印刷頭的印刷步驟的說明圖。 -18- 1358250 第8圖是顯示本發明的第三實施方式的焊錫印刷頭的 剖面圖。 第9圖是顯示在第8圖所示的印刷頭中的往前通路的 印刷步驟的剖面圖。 第10圖是顯示在第8圖所示的焊錫印刷頭中的往前 通路的印刷步驟之後，使印刷用側壁上昇而使刮除用側壁 下降的狀態的剖面圖。 第11圖是顯示在第8圖所示的印刷頭之中的回復通 路的刮除步驟的剖面圖。 第12圖是習知的焊錫印刷機的顯示圖。 第13圖是顯示使用橡皮刮板的焊錫印刷的槪略圖， (a)是其側面圖，（b)是其俯視圖。 第1 4圖是顯示密閉型印刷頭的剖面圖。 第15圖是密閉型印刷頭內部的焊錫膏的狀態的顯示 圖，（a)是沒有黏著的狀態的顯示圖，（b)是黏著之後的狀 態的顯示圖。 【主要元件符號說明】 W :工件 Μ :模板 Η :模板孔 5 1 :焊錫印刷頭 55 :往復驅動裝置 5 7 :焊錫膏供給裝置 -19- 1358250 67 :印刷用側壁 69 :印刷用傾斜面 6 9 a :印刷用邊緣 7 1 :刮除用側壁 73 :刮除用傾斜面 73a :刮除用邊緣 75 :噴嘴側壁Next, as shown in Fig. 9, the print head 1 〇 1 is moved in a state where the printing edge 69a and the side wall edge 77 are in contact with the template Μ. Then, the solder paste between the inclined surface 69 for printing and the template Ρ is pressed by the printing inclined surface 69 to be filled into the template hole (printing step). At this time, since the scraping edge 73a is separated upward from the upper surface portion of the template cymbal, the solder paste does not adhere to the front side in the traveling direction of the scraping edge 73a. Then, as shown in Fig. 1, the printing side wall drive unit 105 and the wiping side wall drive unit 1 are respectively actuated, and the printing side wall 67 of the printing head 101 is set at the printing edge 69a. The rising position of the template Μ separation is set such that the scraping side wall 71 is in contact with the lowering position of the squeegee edge 73a. Next, as shown in Fig. 1, the soldering print head 1 〇 1 is moved in the opposite direction by the blade edge 73a and the side wall edge 77 contacting the template Μ. Then, the solder paste on the template is pressed by the scraping surface 73 to be horizontally moved, and the solder paste which is filled into the template hole is scraped off by the template thickness (scraping step). At this time, since the printing edge 69a is separated upward from the template surface, the solder paste is not attached to the front side in the traveling direction of the printing edge 69a. In the soldering print head 101, the printing side wall is connected to the printing side wall 67. In the driving device 105, the wiping side wall driving device 107 is coupled to the wiping side wall 71, and the printing side wall 67 and the wiping side wall 71 are separately movable up and down, and the printing step in the forward path is printed. With the edge of the -17- 1358250 edge 69a and the side wall edge 77 in contact with the template Μ, the scraping edge 73 a is separated from the template 在 in the ascending position, and the scraping step in the recovery path is at the edge of the scraping edge. 73a and the side wall edge 77 are in contact with the template Μ, and the printing edge 69a is separated from the template 在 in the ascending position and moved in the opposite direction, and the solder paste is prevented from adhering to the edge for scraping during the printing step of the forward path. 73a, in the step of scraping the recovery path, the solder paste can be prevented from adhering to the printing edge 69a, and the cleaning operation for the attached solder paste can be eliminated. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a print head according to a first embodiment of the present invention, (a) is a perspective view thereof, and (b) is a cross-sectional view thereof. Fig. 2 is a view showing a nozzle of the print head shown in Fig. 1, (a) is a perspective view thereof, and (b) is a cross-sectional view thereof. Fig. 3 is a cross-sectional view showing a state in which solder paste is supplied to the print head shown in Fig. 1. Fig. 4 is a cross-sectional view showing the printing step of the forward path in the printing head shown in Fig. 1. Fig. 5 is a cross-sectional view showing a printing step of a return path in the printing head shown in Fig. 1. Fig. 6 is a perspective view showing a solder print head according to a second embodiment of the present invention. Fig. 7 is an explanatory view for explaining a printing procedure of the printing head shown in Fig. 6 in the order of (a) to (d). -18- 1358250 Fig. 8 is a cross-sectional view showing a solder print head according to a third embodiment of the present invention. Fig. 9 is a cross-sectional view showing the printing step of the forward path in the printing head shown in Fig. 8. Fig. 10 is a cross-sectional view showing a state in which the side wall for printing is raised and the side wall for scraping is lowered after the printing step of the forward path in the solder print head shown in Fig. 8. Fig. 11 is a cross-sectional view showing the step of scraping the return path among the print heads shown in Fig. 8. Fig. 12 is a view showing a conventional solder printing machine. Fig. 13 is a schematic view showing solder printing using a squeegee, (a) is a side view thereof, and (b) is a plan view thereof. Fig. 14 is a cross-sectional view showing the sealed type print head. Fig. 15 is a view showing a state of the solder paste inside the sealed type printing head, (a) is a display view showing a state in which it is not adhered, and (b) is a display view showing a state after adhesion. [Description of main component symbols] W: Workpiece Μ : Template Η : Template hole 5 1 : Solder print head 55 : Reciprocating drive device 5 7 : Solder paste supply device -19 - 1358250 67 : Printing side wall 69 : Printing inclined surface 6 9 a : printing edge 7 1 : scraping side wall 73 : scraping inclined surface 73a : scraping edge 75 : nozzle side wall
7 7 :側壁邊緣 91 :焊錫印刷頭 1 〇 1 :焊錫印刷頭7 7 : Side wall edge 91 : Solder print head 1 〇 1 : Solder print head
-20--20-
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| JP2006289925A JP4853229B2 (en) | 2006-10-25 | 2006-10-25 | Solder printing method and solder printing head |
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| Publication Number | Publication Date |
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| TW200820861A TW200820861A (en) | 2008-05-01 |
| TWI358250B true TWI358250B (en) | 2012-02-11 |
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| TW96127062A TW200820861A (en) | 2006-10-25 | 2007-07-25 | Solder printing method and solder printing head |
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| JP (1) | JP4853229B2 (en) |
| TW (1) | TW200820861A (en) |
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| KR101038774B1 (en) * | 2008-10-29 | 2011-06-03 | 삼성전기주식회사 | Inkjet head and printing method using the same |
| CN103101293A (en) * | 2013-02-04 | 2013-05-15 | 宏茂光电（苏州）有限公司 | Splash-proof printing machine used for light diffusion pieces |
| JP6790373B2 (en) * | 2016-02-05 | 2020-11-25 | 富士電機株式会社 | Printing equipment, printing tools and printing methods |
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| JPH03193347A (en) * | 1989-12-22 | 1991-08-23 | Oki Electric Ind Co Ltd | Structure of squeegee holder for printer |
| JP3685097B2 (en) * | 2001-07-12 | 2005-08-17 | 松下電器産業株式会社 | Screen printing apparatus and screen printing method |
| JP3593595B2 (en) * | 2001-09-11 | 2004-11-24 | 株式会社 日立インダストリイズ | PRINT HEAD AND PRINTING METHOD USING THE PRINT HEAD |
| JP2004017374A (en) * | 2002-06-13 | 2004-01-22 | Matsushita Electric Ind Co Ltd | Squeegee for filling electroconductive paste, filling method and device for electroconductive paste |
| JP4258267B2 (en) * | 2003-05-09 | 2009-04-30 | 株式会社日立プラントテクノロジー | Cream solder printing machine |
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