1327109 Ο) 九、發明說明 【發明所屬之技術領域】 本發明是關於，用來將銲錫膏等經由網版模 到基板的網版印刷裝置及其印刷方法，尤其是關 於高密度/高多層基板的網版印刷的網版印刷裝 刷方法。 【先前技術】 一般來說作爲用來連接印刷電路板與半導體 術，是採用稱作覆晶法（flip-chip ) ( FC )方式 錫凸塊（細微的銲錫的突起物）來接合的方式。 ，是藉由在平面上配置銲錫凸塊，而一次能夠連 數萬的連接點，由於IT化的進展，而逐漸高功 導體晶片的連接條件也迅速地精細、高密度、高 而由於近年來半導體的高功能化、高積體化的趨 是封裝基板的銲錫凸塊，也要求要讓印刷凸塊更 〇 銲錫凸塊的印刷裝置，是配合印刷圖案，而 孔部S!的網版模板s載置於工件W上，藉由以 銲錫膏充塡到模板孔S !，來進行印刷的裝置， 用如第4圖所示的網版印刷裝置。該網版印刷裝 基本構造是具有：用來進行工件（基板）W的定 校準部2、使網版模板S上下升降的模板上下驅 印刷頭4、使該印刷頭4上下升降的印刷頭上下 板來印刷 於適合用 置及其印 晶片的技 的使用銲 這種方式 接數千〜 能化的半 點數化。 勢，即使 加精細化 將開設有 印刷頭將 以往是使 置1，其 位的工件 動部3、 驅動部5 -5- (2) (2)1327109 、以及使該印刷頭4朝左右（橫方向）往復移動的印刷頭 往復驅動部6等。在該印刷裝置1，在將工件W載置於工 件校準部2的工作台上之後，進行工件W的定位，接著 藉由銲錫印刷裝置1的模板上下驅動部6，將網版模板S 重疊於工件W上，藉由印刷頭往復驅動部6及印刷頭上 下驅動部5，來移動印刷頭4，藉由將銲錫膏P經由網版 模板S塗敷於工件W上，來將銲錫膏印刷於工件W上。 在該習知的印刷裝置1，作爲印刷頭4 一般是使用： 第5圖所示的橡皮刮板型印刷頭、或在第6圖所示的密閉 型印刷頭。橡皮刮板型印刷頭4，是以橡皮刮板41夾著 銲錫膏P，移動於網版模板S上，在工件W上進行銲錫 凸塊印刷，另一方面，密閉型印刷頭4，在其前端具有噴 嘴42，在用來排出銲錫膏P的噴嘴42接觸於網版模板S 的狀態，使印刷頭4移動於其上，在工件W上進行銲錫 凸塊印刷。 近年來，因應於印刷銲錫凸塊的細微化，讓網版模板 S的模板孔S!也細微化，銲錫膏P爲了防止印刷滴流情 形而高黏度化，所以習知的橡皮刮板型印刷頭4的橡皮刮 板4 1所進行的印刷加壓，很難將銲錫膏充塡到模板孔S j ，而可高壓充塡的密閉型印刷頭則成爲主流。可是，與橡 皮刮板型印刷頭相比，在密閉型印刷頭4，會有噴嘴42 前端的銲錫膏P黏著而導致印刷不良的問題。 第7圖（A)、第7圖（B)，是在噴嘴前端產生銲 錫膏P黏著之前、與產生黏著之後的狀態的說明圖。也就 -6 - 1327109 ⑶ 是說’銲錫膏P，是固體的銲錫粒子與助焊劑溶劑的混合 物’如第7圖（A)所示，在銲錫粒子之間是充滿著銲錫 溶劑’所以銲錫膏P保有流動性。在這方面，在橡皮刮板 型印刷頭，藉由如第5圖所示的印刷動作，銲錫膏P全體 是流動攪拌所以防止黏著而維持流動性，在密閉型印刷頭 ’銲錫膏P是被侷限在噴嘴42內，也沒有印刷動作所造 成的流動，尤其是噴嘴前端附近的銲錫粒子幾乎沒有流動 ’只有液體的助焊劑溶劑，會從噴嘴42與網版模板S的 緊貼面、或網版模板S與工件W的間隙g流出，如第7 圖（B)所示，銲錫粒子彼此會黏著而喪失流動性。而喪 失流動性的銲錫膏P在印刷時不能充分地流入到網版模板 S的模板孔S!，而會成爲銲錫凸塊缺口的不良問題原因。 相對於上述問題，在習知的網版印刷裝置，雖然可以 用定期將黏著在噴嘴前端的銲錫膏P刮出予以廢棄的方法 來因應，而現在每500次的印刷作業就需要該廢棄作業， 在對應於更細微的銲錫凸塊的小型印刷頭，每1 0次的印 刷就需要廢棄作業，而生產性明顯降低。現今，隨著銲錫 凸塊的逐漸細微化，而更要求銲錫凸塊P的銲錫粒子的細 微化/高功能化，由於廢棄作業導致在習知的黏著對應方 法會有銲錫成本升高及生產性降低的問題，所以要求要有 不需要廢棄作業，而高生產性且節省資源的銲錫凸塊的印 刷方法。 【發明內容】 (4) (4)1327109 本發明鑒於上述問題，其目的要提供一種網版印刷裝 置及其印刷方法，不需要定期將黏著於印刷頭的噴嘴前端 的銲錫膏刮出予以廢棄的習知的廢棄作業，即使對於印刷 凸塊的細微化，也能以不需維修的方式因應，可減少銲錫 成本且提高生產性。 本發明的其中一種型態也就是網版印刷裝置，用來將 銲錫膏P供給到印刷頭4的銲錫膏供給機構7，是從印刷 頭4的噴嘴42前端將銲錫膏p供給到印刷頭4，藉此， 藉由讓在印刷時助焊劑溶劑減少的印刷面銲錫膏P，與新 的銲錫膏P混合，則將助焊劑濃度保持在正常的狀態，可 防止印刷不良的情形。於是，不用進行將黏著於噴嘴前端 的銲錫膏予以廢棄的廢棄作業，可無須維修地進行100次 以上的連續印刷8 本發明的該印刷裝置，將銲錫膏供給機構7設置在： 相對於網版模板S ’在印刷頭4的相反側，藉此，藉由在 上下方向來連結銲錫膏供給機構7與印刷頭4，則能從噴 嘴前端來供給銲錫膏P。 在本發明的該印刷裝置，銲錫膏供給機構7的供給口 71a，是設置成緊貼於：網版模板S與工件W相接側的面 部，且在網版模板S的供給口 71a的位置，形成有貫穿孔 S 2，藉此，藉由每經過數次印刷後，將印刷頭4移動到網 版模板S的銲錫膏P供給區域，則能經由網版模板S的貫 穿孔S2,將從銲錫膏供給機構7的供給口 71a所供給的 銲錫膏P，容易地從噴嘴前端供給到印刷頭4。 -8- (5) 1327109 本發明的該印刷裝置，在銲錫膏供給 :用來擠出銲錫膏P的加壓活塞73，藉此 施加適當的加壓力，將其從供給口 71a擠 將助焊劑減少的印刷面銲錫膏P擠入到印 效地讓其與新的銲錫膏P混合。 在本發明的該印刷裝置，又在網版模 設置有：由清洗用紙81與紙輸送滾子82 構8,並且在與清洗機構8對應的位置的 置有貫穿於網版模板S的開口 S3。藉此， 的噴嘴42內部積存有惡化的銲錫膏P( 錫膏）的情況，藉由將印刷頭4移動到網 S3的位置，則能自動地將惡化的銲錫膏 能無須維修地連續印刷。 本發明的其他方式的網版印刷方法， 發明改變爲方法發明，其作用效果，與之 以下，根據附圖及本發明的較佳實施 充分地理解本發明。 【實施方式】 以下，根據圖面針對本發明的實施方 置及其印刷方法來加以說明。本發明的網 其基本構造與第4圖的習知的網版印刷裝 先根據第4圖來簡單地說明其全體構造。 ’基本上是具備有：將在工作台21上所 機構7，設置有 ，能對銲錫膏P 出，在印刷時， 刷頭4內，能有 板S的下面部， 所構成的清洗機 網版模板S，設 即使在印刷頭4 助焊劑減少的銲 版模板S的開口 P予以廢棄，而 是將之前的裝置 前的發明一樣。 方式的記載，能 式的網版印刷裝 版印刷裝置1， 置一樣，所以首 網版印刷裝置1 載置的封裝基板 -9- 1327109 ⑹ 也就是工件W在X軸、Y軸、及0方向進行定位的 校準部2、使網版模板s (以下稱作「網版S」）上 降的模板上下驅動部3、用來排出銲錫膏ρ的印刷頭 使該印刷頭4上下升降的印刷頭上下驅動部5、以及 刷頭4朝橫方向（左右方向）往復移動的印刷頭往復 部6等。 工件校準部2，是藉由：載置保持著工件W的工 21、將該工作台21朝X軸方向移動的X方向移動台 朝Υ軸方向移動的Υ方向移動台23、及朝0方向轉 轉動台24所構成，這些構造是組合在一起而載置於 裝置1的基台11上。工作台21的上面部，是具有多 吸孔（沒有圖示）的吸附面，能在載置著工件W的 將其吸附且加以定位。該吸孔是與沒有圖示的真空泵 接。工作台21，是被支承於X方向移動台22上，X 移動台22是被支承於Υ方向移動台23上，並且Υ 移動台23是被支承於轉動台24上。藉此，讓工作# 上的工件W的位置能在X軸、Υ軸、及0方向進行 。而X軸、Υ軸方向的移動及0方向的轉動，是分別 伺服馬達25所進行。 所謂的網版S，是在模板的表面形成有預定的圖 模板孔S!)，是例如包含金屬模板、或包含狹義的 模板的槪念。該網版S，可藉由模板上下驅動部3而 升降。也就是說，模板上下驅動部3，是藉由：於基ΐ 上所豎立設置的升降導引體12上所安裝的升降用氣£ 工件 下升 4、 使印 驅動 作台 22 ' 動的 印刷 數的 狀態 浦連 方向 方向 ? 21 修正 藉由 案（ 網版 上下 ί 11 ί 31 -10- (7) (7)1327109 、於升降用氣缸31內滑動的活塞體32、固定於該活塞體 32的升降構件33、以及結合於該升降構件33，在兩側保 持著網版S的保持構件34所構成；藉由使升降構件33上 下移動，讓藉由保持構件34所保持著的網版S上下升降 。升降構件33，是藉由例如導入於升降用氣缸31內的流 體所作動。 在印刷裝置1的基台11上所豎立設置的左右的升降 導引體1 2之間，架設有橫架體1 3。在該橫架體1 3，設置 有：與其平行的橫方向的導引體14。在導引體14，嵌合 著：可沿著導引體14朝橫方向往復滑動的往復移動構件 15,在該往復移動構件15安裝有印刷頭上下驅動部5。 而在橫架體1 3上設置有印刷頭往復驅動部6，在該印刷 頭往復驅動部6的往復移動構件61的前端，安裝有印刷 頭上下驅動部5。在第4圖，是採用滾珠螺桿機構來作爲 印刷頭往復驅動部6。於是，根據印刷頭往復驅動部6的 作動所造成的往復移動構件61在橫方向的前進/後退，印 刷頭上下驅動部5也朝橫方向移動。 印刷頭上下驅動部5，是由：於往復移動構件61的 前端所固定的氣缸部51、與於該氣缸部51內滑動的活塞 部52所構成；在該活塞部52的前端部位，安裝有印刷頭 4。印刷頭4，可進行朝橫方向的往復移動及朝上下方向 的升降動作。在上述說明中，是將模板上下驅動部3及印 刷頭上下驅動部5作爲活塞-氣缸機構，而將印刷頭往復 驅動部6作爲滾珠螺桿機構來加以說明，而如果將該驅動 -11 - (8) (8)1327109 部3、5、6作爲直線往復移動機構的話’則可採用活塞-氣缸機構、滾珠螺桿機構、齒條-小齒輪機構、線性馬達 機構等的適當的習知機構。 接著是針對本發明的特徵構造，根據第1圖來加以說 明。 印刷頭4，是藉由：相當於噴嘴42的小直徑的圓筒 狀的第一氣缸42、較第一氣缸42更大直徑的圓筒狀的第 二氣缸43、以及於該第一、第二氣缸42、43內滑動的第 一加壓活塞44所構成。也就是說，第一加壓活塞44，是 以貫穿於兩氣缸42、43的桿部44c，來將於第一氣缸42 內滑動的小直徑活塞44a、及於第二氣缸43內滑動的大 直徑活塞44b予以連結的啞鈴形狀。第二氣缸43是連通 到空氣供給源，藉由將作動流體也就是空氣導入到第二氣 缸43內，第一加壓活塞44會下降，將噴嘴（第一氣缸） 42內的銲錫膏P從噴嘴42前端擠出。該第一加壓活塞44 ，是配置在噴嘴42的後端。 印刷頭4，是設置在網版S的上側，另外在網版S的 下側，設置有銲錫膏供給機構7。銲錫膏供給機構7其基 本構造與印刷頭4相同，是由：具有用來供給銲錫膏p的 供給口 71a的第三氣缸71、作動流體用的第四氣缸72、 及對銲錫膏P施加供給壓力的第二加壓活塞73所構成。 該第二加壓活塞73，也作成：以貫穿於兩氣缸71、72的 桿部73c，來將於第三氣缸71內滑動的活塞73a、及於第 四氣缸72內滑動的活塞73b予以連結的啞鈴形狀。第四 -12- (9) (9)1327109 氣缸72是連通到空氣供給源，藉由將作動流體也就是空 氣導入到第四氣缸72內，第二加壓活塞73會上昇，將銲 錫膏P從第三氣缸71的供給口 71a擠出。 避開在網版S形成有模板孔S!的部位，在網版s穿 設有與噴嘴孔大致相同大小的貫穿孔s2。是以：當將網 版s定位於，在工作台21上所載置的工件W時，讓銲錫 膏供給機構7的供給口 71a與網版S的貫穿孔S2 —致的 方式，而在印刷裝置1設置有可進行固定或調整的銲錫膏 供給機構7。銲錫膏供給機構7，是設置成：讓供給口 71 a緊貼於，網版S的與工件W相接側的面部，在網版S 上在供給口 71a的位置開設有貫穿孔S2，而成爲藉由讓 印刷頭4於供給口 71a的正上方移動，而經由貫穿孔S2 ，來將印刷頭4的噴嘴42前端口與銲錫膏供給機構7的 供給口 71a直接連結的構造。 針對上述構造所構成的本實施方式的網版印刷裝置1 的動作（印刷方法）來加以說明。第2圖（A)〜第2圖 (C)是本實施方式的網版印刷裝置的動作的說明圖，第 2圖（A)是銲錫膏的供給的說明圖，第2圖（B)是銲錫 印刷的說明圖，第2圖（C)是銲錫膏的再次供給的說明 圖。本發明的網版印刷裝置1，也與平常的動作同樣地， 將工件W載置於工作台21上，來進行校準操作，之後藉 由模板上下驅動部3的作動，而網版S下降，而緊貼配置 於工件W上。 首先，如第2圖（A)所示，藉由印刷頭往復驅動部 •13- 1327109 (ίο) 6使印刷頭4移動於銲錫膏供給機構7的正上方， 刷頭上下驅動部5使印刷頭4的噴嘴42前端口緊 版S的貫穿孔S2。而在該情況，銲錫膏供給機構 給口 71a，是從下面部緊貼配置於網版s的貫穿孔 是’噴嘴42前端口與供給口 71a，會經由貫穿孔 通。在該狀態，中斷印刷頭4的第一加壓活塞44 力，藉由將銲錫膏供給機構7的第二加壓活塞73 壓，而將一定量的銲錫膏P供給到印刷頭4 (噴嘴 〇 接著如第2圖（B )所示，一邊藉由印刷頭上 部5使印刷頭4緊貼於網版s的上面部，一邊藉由 往復驅動部6將印刷頭4朝橫方向移動，同時藉由 頭4的第一加壓活塞44進行加壓，藉由對工件W 孔S !供給銲錫膏P，來實施銲錫印刷。銲錫膏P 嘴42的前端口供給到工件W。在紙面的表背方向 置而進行數次該印刷動作。 在經過數次印刷之後，再如第2圖所示，使印 於銲錫膏供給機構7的正上方移動，而成爲與第 說明的構造相同狀態，從銲錫膏供給機構7的供給 ，將銲錫膏P再供給到印刷頭4 (噴嘴42 )內。藉 錫膏P的再供給，將因爲數次的印刷動作而殘留 42前端部位的助焊劑消失減少了的銲錫膏p擠® 供給的銲錫膏P混合。 在本實施方式，由於每數次印刷就從噴嘴前端 藉由印 貼於網 7的供 S2。於 S2而連 的加壓 進行加 42)內 下驅動 印刷頭 將印刷 的模板 是從噴 挪動位 刷頭4 2圖 A □ 71a 由該銲 於噴嘴 ，與新 供給新 • 14- (11) (11)1327109 的銲錫膏P，藉由讓在印刷時助焊劑消失減少了的印刷面 銲錫膏p與新的銲錫膏P混合，則將助焊劑保持在正常的 濃度，防止印刷不良情形。具體來說，如習知技術沒有使 用本實施方式的銲錫膏供給機構的情況，實施約10次的 印刷之後，噴嘴印刷面的銲錫膏就會產生黏著情形，會產 生如第7圖（b )所示的印刷不良情形，相對的，每5次 印刷，從銲錫膏供給機構7將銲錫膏從噴嘴42前端供給 的話，則不會產生印刷不良情形，能無須維修地進行1〇〇 次以上的連續印刷。 第3圖是用來說明本發明的第二實施方式的網版印刷 裝置的主要部分的圖面。在第二實施方式，除了第一實施 方式的銲錫膏供給機構7之外，來設置有：用來清洗噴嘴 前端的清洗機構8。針對銲錫膏供給機構7，針對其構造 、配置及動作，與第一實施方式相同，所以省略其說明。 清洗機構8，是由：清洗用紙81、與使該清洗用紙81移 動的輸送滾子82所構成。清洗機構8，是配置成：與銲 錫膏供給機構7同樣地在網版S的下面側，且隔著工件W 而與銲錫膏供給機構7相對向。在與網版S的清洗機構8 對應的位置，形成有貫穿的長孔形狀的開口 S3。於是， 在清洗機構8的清洗用紙81上藉由印刷頭往復驅動部6 及印刷頭上下驅動部5，來移動印刷頭4，由於清洗用紙 81上的網版S開設有開口 S3，所以能使印刷頭4的噴嘴 42前端面緊貼於清洗用紙81。 在第二實施方式的網版印刷裝置的動作，除了如第2 -15- (12) (12)1327109 圖所示的第一實施方式的動作之外，定期藉由印刷頭往復 驅動部6及印刷頭上下驅動部5，來使印刷頭4朝向噴嘴 42的清洗區域（開口 S3的位置）移動，使印刷頭4的噴 嘴42前端面緊貼於清洗用紙81，藉由將印刷頭4的第— 加壓活塞44進行加壓，將噴嘴42內部的銲錫膏p廢棄於 清洗用紙81上。而清洗用紙81的附著著廢棄銲錫膏的部 位，藉由輸送滾子82所輸送。 在第二實施方式，除了上述的第一實施方式作用效果 之外，即使在噴嘴42內部積存有惡化的銲錫膏p的情況 ’也可將該惡化的銲錫膏自動廢棄，可無須維修地連續進 行印刷。 在本發明，除了上述所說明的作用效果之外，印刷頭 不需要積存用來供給到噴嘴的銲錫膏，只需要保持有銲錫 膏供給與供給之間進行數次印刷所需要的銲錫膏量，所以 能較習知裝置更小型化，而即使在裝置生產後的印刷頭的 清洗’所清洗廢棄的銲錫膏量很少就能完成，所以更節省 資源。 針對本發明，是針對特定的實施方式來詳細說明，而 如果是熟知技藝者，只要不脫離本發明的申請專利範圍及 技術思想，則可進行各種變更、修正。 【圖式簡單說明】 第1圖是用來說明本發明的第一實施方式的網版印刷 裝置的主要部分的剖面圖。 -16- (13) (13)1327109 第2圖（A)〜第2圖（C)是第一實施方式的網版 印刷裝置的動作的說明圖’第2圖（A)是銲錫膏的供給 的說明圖，第2圖（B)是銲錫印刷的說明圖’第2圖（ C)是銲錫膏的再次供給的說明圖。 第3圖是用來說明本發明的第二實施方式的網版印刷 裝置的主要部分的剖面圖。 第4圖是習知的網版印刷裝置的全體構造圖。 第5圖是習知的橡皮刮板型印刷頭的說明圖。 第6圖是習知的密閉型印刷頭的說明圖。 第7圖（A)、第7圖（B)，是針對習知的密閉型 印刷頭的內部銲錫膏與其印刷狀態’在黏著產生前與黏著 產生後的說明圖。 【主要元件符號說明】 1 :網版印刷裝置 2 :工件校準部 3 :模板上下驅動部 4 :印刷頭 5 :印刷頭上下驅動部 6 :印刷頭往復驅動部 7 :銲錫膏供給機構 8 :清洗機構 1 1 :基台 12 :升降導引體 -17- (14)13271091327109 发明) Description of the Invention [Technical Field] The present invention relates to a screen printing apparatus for transferring a solder paste or the like to a substrate via a screen mold, and a printing method thereof, in particular, a high-density/high-multilayer substrate Screen printing method for screen printing. [Prior Art] Generally, as a method for connecting a printed circuit board and a semiconductor, a method called a flip-chip (FC) type tin bump (a fine solder bump) is used. By arranging the solder bumps on the plane, and connecting tens of thousands of connection points at a time, the connection conditions of the high-power conductor wafers are rapidly fine, high-density, and high due to advances in IT. The high functionality and high integration of semiconductors are the solder bumps of the package substrate. It is also required to make the printing bumps more suitable for solder bumps. It is a screen template with a printed pattern and a hole S! A device in which s is placed on the workpiece W and printed by solder paste to the template hole S! is used as the screen printing device shown in Fig. 4. The basic structure of the screen printing apparatus comprises: a fixed calibration unit 2 for performing a workpiece (substrate) W, a template upper and lower drive print head 4 for lifting the screen template S up and down, and a print head for lifting the print head 4 up and down. The board is printed on a soldering method suitable for use with a printed wafer and the like. In addition, even if the refinement is to be performed, the print head will be opened, and the workpiece moving portion 3, the driving portion 5-5-(2) (2) 1327109, and the printing head 4 will be left and right (horizontal). The direction is a reciprocating movement of the print head reciprocating driving portion 6 or the like. In the printing apparatus 1, after the workpiece W is placed on the table of the workpiece aligning unit 2, the positioning of the workpiece W is performed, and then the stencil template S is superposed on the template upper and lower driving unit 6 of the solder printing apparatus 1. On the workpiece W, the print head 4 is moved by the print head reciprocating drive unit 6 and the print head upper and lower drive unit 5, and the solder paste P is applied to the workpiece W via the screen template S to print the solder paste on the workpiece. On the workpiece W. In the conventional printing apparatus 1, as the printing head 4, a squeegee type printing head shown in Fig. 5 or a sealed type printing head shown in Fig. 6 is generally used. The squeegee type printing head 4 is formed by sandwiching the solder paste P between the squeegee 41 and moving it on the screen template S to perform solder bump printing on the workpiece W. On the other hand, the sealed type print head 4 is The tip end has a nozzle 42. The nozzle 42 for discharging the solder paste P comes into contact with the screen template S, and the print head 4 is moved thereon, and solder bump printing is performed on the workpiece W. In recent years, in view of the miniaturization of printed solder bumps, the template hole S! of the screen template S is also miniaturized, and the solder paste P is highly viscous in order to prevent the printing dripping, so the conventional squeegee type printing The printing pressurization by the squeegee 41 of the head 4 makes it difficult to fill the stencil hole S j with the solder paste, and the hermetic type print head which can be charged with high pressure becomes the mainstream. However, in the sealed type print head 4, the solder paste P at the tip end of the nozzle 42 is adhered to cause a problem of printing failure as compared with the rubber blade type print head. Fig. 7(A) and Fig. 7(B) are explanatory views showing a state after the solder paste P is adhered to the tip end of the nozzle and after adhesion occurs. In other words, -6 - 1327109 (3) is to say that 'the solder paste P is a mixture of solid solder particles and flux solvent'. As shown in Fig. 7(A), the solder particles are filled with solder solvent. P maintains liquidity. In this case, in the squeegee type printing head, the entire solder paste P is flow-stirred by the printing operation as shown in Fig. 5, so that the adhesion is prevented and the fluidity is maintained. In the sealed type print head, the solder paste P is Limited to the nozzle 42, there is no flow caused by the printing action, especially the solder particles near the front end of the nozzle have almost no flow. 'Liquid-only flux solvent, from the nozzle 42 to the screen template S, or the mesh The gap g between the plate template S and the workpiece W flows out, and as shown in Fig. 7(B), the solder particles adhere to each other and lose fluidity. The solder paste P which has lost fluidity cannot sufficiently flow into the template hole S! of the screen template S at the time of printing, which may cause a problem of a defective solder bump. With respect to the above problems, in the conventional screen printing apparatus, it is possible to use a method in which the solder paste P adhered to the tip end of the nozzle is scraped off and discarded, and the waste job is required for every 500 printing operations. In a small print head corresponding to a finer solder bump, the printing operation is required every 10 times, and the productivity is remarkably lowered. Nowadays, with the gradual miniaturization of the solder bumps, the solder particles of the solder bumps P are required to be fine/highly functional, and the soldering cost and productivity are improved in the conventional adhesion method due to the disposal operation. The problem of reduction is required, so there is a need for a printing method of high-productivity and resource-saving solder bumps that does not require disposal. SUMMARY OF THE INVENTION (4) (4) 1327109 The present invention has been made in view of the above problems, and an object thereof is to provide a screen printing apparatus and a printing method thereof, which do not need to periodically scrape off solder paste adhered to a nozzle tip of a printing head to be discarded. Conventional waste disposal, even for the miniaturization of printed bumps, can be handled in a maintenance-free manner, reducing soldering costs and improving productivity. One of the forms of the present invention, that is, a screen printing apparatus for supplying the solder paste P to the solder paste supply mechanism 7 of the print head 4, supplies the solder paste p from the front end of the nozzle 42 of the print head 4 to the print head 4. In this way, by mixing the printing surface solder paste P which reduces the flux solvent during printing with the new solder paste P, the flux concentration is maintained in a normal state, and printing defects can be prevented. Therefore, it is not necessary to perform the disposal of discarding the solder paste adhered to the tip end of the nozzle, and the printing apparatus of the present invention can be continuously performed without repairing 100 times or more. The solder paste supply mechanism 7 is disposed on the screen. The template S' is on the opposite side of the print head 4, whereby the solder paste P can be supplied from the tip end of the nozzle by connecting the solder paste supply mechanism 7 and the print head 4 in the vertical direction. In the printing apparatus of the present invention, the supply port 71a of the solder paste supply mechanism 7 is provided so as to be in close contact with the surface on the side where the screen template S is in contact with the workpiece W, and is located at the supply port 71a of the screen template S. The through hole S 2 is formed, whereby the printing head 4 is moved to the solder paste P supply region of the screen template S after each printing, and the through hole S2 of the screen template S can be used. The solder paste P supplied from the supply port 71a of the solder paste supply mechanism 7 is easily supplied to the print head 4 from the tip end of the nozzle. -8- (5) 1327109 The printing apparatus of the present invention supplies a soldering paste 73 for extruding the solder paste P, thereby applying a suitable pressing force to squeeze the flux from the supply port 71a. The reduced printing surface solder paste P is squeezed into the printing effect to be mixed with the new solder paste P. In the printing apparatus of the present invention, the screen printing die is further provided with a cleaning paper 81 and a paper conveying roller 82, and an opening S3 penetrating the screen template S at a position corresponding to the cleaning mechanism 8 is provided. . As a result, the deteriorated solder paste P (solder paste) is accumulated in the nozzle 42. By moving the printing head 4 to the position of the net S3, the deteriorated solder paste can be automatically printed without maintenance. The screen printing method according to another aspect of the present invention is modified to the method invention, and the effects thereof will be fully understood from the following description and the preferred embodiments of the invention. [Embodiment] Hereinafter, embodiments of the present invention and a printing method will be described based on the drawings. The basic structure of the net of the present invention and the conventional screen printing apparatus of Fig. 4 will be briefly described with reference to Fig. 4 for the entire structure. 'Basically: There is a mechanism 7 to be placed on the table 21, which can be used to discharge the solder paste P. In the printing head 4, the lower portion of the plate S can be formed. The plate template S is designed to discard the opening P of the solder plate template S even if the flux is reduced in the printing head 4, but the invention before the previous device. The description of the method is the same as that of the screen printing and printing apparatus 1 of the energy type. Therefore, the package substrate -9- 1327109 (6) placed on the first screen printing apparatus 1 is the workpiece W in the X-axis, the Y-axis, and the 0-direction. The positioning unit 2 for positioning, the template upper and lower driving unit 3 for lowering the screen template s (hereinafter referred to as "screen S"), and the printing head for discharging the solder paste ρ to raise and lower the printing head 4 The upper and lower drive unit 5 and the print head reciprocating portion 6 and the like in which the brush head 4 reciprocates in the lateral direction (left-right direction). The workpiece aligning unit 2 is configured such that the workpiece 21 holding the workpiece W is placed, the X-direction moving table that moves the table 21 in the X-axis direction in the X-axis direction, and the Υ direction moving table 23 and the 0 direction The rotary table 24 is constructed, and these configurations are combined and placed on the base 11 of the apparatus 1. The upper surface portion of the table 21 is an adsorption surface having a plurality of suction holes (not shown), and can be attached and positioned while being placed on the workpiece W. The suction hole is connected to a vacuum pump (not shown). The table 21 is supported by the X-direction moving table 22, the X moving table 22 is supported by the X-direction moving table 23, and the Υ moving table 23 is supported by the rotating table 24. Thereby, the position of the workpiece W on the work # can be performed in the X-axis, the x-axis, and the 0-direction. The movement in the X-axis and the x-axis direction and the rotation in the 0-direction are performed by the servo motor 25, respectively. The so-called screen S is formed with a predetermined pattern template hole S!) on the surface of the template, and is, for example, a metal template or a template containing a narrow sense. The screen S can be raised and lowered by the template upper and lower drive unit 3. That is, the template upper and lower driving portion 3 is driven by the lifting air attached to the lifting guide 12 which is erected on the base, and the workpiece is lifted by 4, and the printing drive 22 is moved. The state of the number of Pulian directions? 21 Correction of the case (screening up and down ί 11 ί 31 -10- (7) (7) 1327109, the piston body 32 sliding in the lifting cylinder 31, fixed to the piston body 32 The lifting member 33 and the holding member 34 coupled to the lifting member 33 and holding the screen S on both sides; and the screen S held by the holding member 34 by moving the lifting member 33 up and down The elevating member 33 is moved by, for example, a fluid introduced into the elevating cylinder 31. The left and right elevating guides 1 2 that are erected on the base 11 of the printing apparatus 1 are horizontally disposed. The frame body 13 is provided with a horizontal direction guide body 14 parallel to the horizontal frame body 13. The guide body 14 is fitted to be reciprocally slidable along the guide body 14 in the lateral direction. The reciprocating member 15 is mounted with a print head on the reciprocating member 15 The printing head reciprocating driving unit 6 is provided on the horizontal frame 1 3, and the printing head vertical driving unit 5 is attached to the front end of the reciprocating member 61 of the printing head reciprocating driving unit 6. In Fig. 4, The ball screw mechanism is used as the print head reciprocating drive unit 6. Thus, the reciprocating member 61 is advanced/retracted in the lateral direction by the operation of the reciprocating drive unit 6 of the print head, and the upper and lower drive portions 5 of the print head are also oriented in the lateral direction. The print head vertical drive unit 5 is composed of a cylinder portion 51 fixed to the tip end of the reciprocating member 61 and a piston portion 52 sliding in the cylinder portion 51. At the front end portion of the piston portion 52, The print head 4 is mounted. The print head 4 can perform reciprocating movement in the lateral direction and lifting operation in the vertical direction. In the above description, the template upper and lower drive unit 3 and the print head upper and lower drive unit 5 are used as the piston-cylinder mechanism. The print head reciprocating drive unit 6 will be described as a ball screw mechanism, and if the drive -11 - (8) (8) 1327109 portions 3, 5, 6 are used as a linear reciprocating mechanism, then a live - a suitable conventional mechanism such as a cylinder mechanism, a ball screw mechanism, a rack-and-pinion mechanism, or a linear motor mechanism. Next, the characteristic structure of the present invention will be described with reference to Fig. 1. The print head 4 is by a cylindrical first cylinder 42 having a small diameter corresponding to the nozzle 42, a cylindrical second cylinder 43 having a larger diameter than the first cylinder 42, and sliding in the first and second cylinders 42, 43 The first pressurizing piston 44 is formed. That is, the first pressurizing piston 44 is a small-diameter piston 44a that slides through the rod portion 44c of the two cylinders 42, 43 to slide in the first cylinder 42, The dumbbell shape in which the large-diameter piston 44b sliding in the second cylinder 43 is coupled is formed. The second cylinder 43 is connected to the air supply source. By introducing the operating fluid, that is, air, into the second cylinder 43, the first pressurizing piston 44 is lowered, and the solder paste P in the nozzle (first cylinder) 42 is removed. The front end of the nozzle 42 is extruded. The first pressurizing piston 44 is disposed at the rear end of the nozzle 42. The print head 4 is provided on the upper side of the screen S, and on the lower side of the screen S, a solder paste supply mechanism 7 is provided. The solder paste supply mechanism 7 has the same basic structure as the print head 4, and includes a third cylinder 71 for supplying the supply port 71a of the solder paste p, a fourth cylinder 72 for operating fluid, and a supply of the solder paste P. The second pressurized piston 73 of pressure is formed. The second pressurizing piston 73 is also connected to the piston 73a that slides in the third cylinder 71 and the piston 73b that slides in the fourth cylinder 72 through the rod portion 73c that penetrates the two cylinders 71 and 72. Dumbbell shape. 4-12-(9) (9) 1327109 The cylinder 72 is connected to the air supply source, and the second pressurized piston 73 rises by introducing the operating fluid, that is, air into the fourth cylinder 72, and the solder paste P It is extruded from the supply port 71a of the third cylinder 71. The portion where the template hole S! is formed in the screen S is avoided, and the screen s is provided with a through hole s2 having substantially the same size as the nozzle hole. Therefore, when the screen s is positioned on the workpiece W placed on the table 21, the supply port 71a of the solder paste supply mechanism 7 and the through hole S2 of the screen S are aligned, and printing is performed. The device 1 is provided with a solder paste supply mechanism 7 that can be fixed or adjusted. The solder paste supply mechanism 7 is provided such that the supply port 71 a is in close contact with the surface of the screen S that is in contact with the workpiece W, and the through hole S2 is formed in the screen S at the position of the supply port 71a. By moving the print head 4 directly above the supply port 71a, the front port of the nozzle 42 of the print head 4 and the supply port 71a of the solder paste supply mechanism 7 are directly coupled via the through hole S2. The operation (printing method) of the screen printing apparatus 1 of the present embodiment configured as described above will be described. 2(A) to 2(C) are explanatory views of the operation of the screen printing apparatus of the present embodiment, and Fig. 2(A) is an explanatory view of the supply of the solder paste, and Fig. 2(B) is An explanatory view of solder printing, and FIG. 2(C) is an explanatory view of re-feeding of solder paste. In the screen printing apparatus 1 of the present invention, the workpiece W is placed on the table 21 in the same manner as the normal operation, and the calibration operation is performed. Then, the screen S is lowered by the operation of the template upper and lower driving unit 3, and the screen S is lowered. It is placed close to the workpiece W. First, as shown in Fig. 2(A), the print head 4 is moved directly above the solder paste supply mechanism 7 by the print head reciprocating drive unit 13-13527109 (ίο) 6, and the upper and lower drive portions 5 of the head are printed. The nozzle 42 of the head 4 is in the through hole S2 of the front port of the plate S. In this case, the solder paste supply mechanism supply port 71a is a through hole which is placed in close contact with the screen s from the lower surface. The nozzle 42 front port and the supply port 71a pass through the through hole. In this state, the force of the first pressurizing piston 44 of the printing head 4 is interrupted, and a certain amount of the solder paste P is supplied to the printing head 4 by pressing the second pressurizing piston 73 of the solder paste supply mechanism 7 (nozzle 〇) Next, as shown in FIG. 2(B), while the print head 4 is brought into close contact with the upper surface portion of the screen s by the upper portion 5 of the print head, the reciprocating drive unit 6 moves the print head 4 in the lateral direction while borrowing Pressurization is performed by the first pressurizing piston 44 of the head 4, and solder printing is performed by supplying the solder paste P to the workpiece W. The front port of the solder paste P nozzle 42 is supplied to the workpiece W. This printing operation is performed several times in the direction. After several times of printing, as shown in FIG. 2, the printing is performed directly above the solder paste supply mechanism 7, and the same state as the structure described above is obtained. The supply of the paste supply mechanism 7 supplies the solder paste P to the print head 4 (nozzle 42). The re-supply of the solder paste P reduces the disappearance of the flux at the tip end portion of the residual portion 42 due to the number of printing operations. Solder paste P is supplied by solder paste P. In this embodiment, For every few printings, the front end of the nozzle is printed on the net 7 by S2. The pressure applied to the S2 is added 42) the inner and lower driving of the print head is to print the template from the spray moving head 4 2 A □ 71a is soldered to the nozzle, and the new solder paste P of the new 14- (11) (11) 1327109 is used, and the solder paste p and the new solder paste are reduced by the flux disappearing during printing. When P is mixed, the flux is maintained at a normal concentration to prevent poor printing. Specifically, as in the case where the solder paste supply mechanism of the present embodiment is not used in the prior art, after about 10 printings are performed, the solder paste on the nozzle printing surface is stuck, which occurs as shown in Fig. 7(b). In the case of the printing failure described above, when the solder paste is supplied from the tip end of the nozzle 42 from the solder paste supply mechanism 7 every five times, no printing failure occurs, and it is possible to perform one or more times without maintenance. Continuous printing. Fig. 3 is a view for explaining a main part of a screen printing apparatus according to a second embodiment of the present invention. In the second embodiment, in addition to the solder paste supply mechanism 7 of the first embodiment, a cleaning mechanism 8 for cleaning the tip end of the nozzle is provided. Since the structure, arrangement, and operation of the solder paste supply mechanism 7 are the same as those of the first embodiment, the description thereof will be omitted. The cleaning mechanism 8 is composed of a cleaning paper 81 and a conveying roller 82 that moves the cleaning paper 81. The cleaning mechanism 8 is disposed on the lower surface side of the screen S in the same manner as the solder paste supply mechanism 7, and is opposed to the solder paste supply mechanism 7 via the workpiece W. An opening S3 having a long hole shape penetrating is formed at a position corresponding to the cleaning mechanism 8 of the screen S. Then, the printing head 4 is moved by the printing head reciprocating driving unit 6 and the printing head vertical driving unit 5 on the cleaning paper 81 of the cleaning mechanism 8, and the opening S3 is opened by the screen S on the cleaning paper 81. The front end surface of the nozzle 42 of the printing head 4 is in close contact with the cleaning paper 81. The operation of the screen printing apparatus according to the second embodiment is periodically performed by the print head reciprocating driving unit 6 in addition to the operation of the first embodiment shown in the second -15-(12), (12) and 1327109. The print head upper and lower drive unit 5 moves the print head 4 toward the cleaning area (the position of the opening S3) of the nozzle 42 so that the front end surface of the nozzle 42 of the print head 4 is in close contact with the cleaning paper 81, and the print head 4 is replaced by — The pressurizing piston 44 is pressurized, and the solder paste p inside the nozzle 42 is discarded on the cleaning paper 81. On the other hand, the portion of the cleaning paper 81 to which the solder paste is adhered is transported by the transport roller 82. In the second embodiment, in addition to the above-described effects of the first embodiment, even if the deteriorated solder paste p is accumulated inside the nozzle 42, the deteriorated solder paste can be automatically discarded, and can be continuously performed without maintenance. print. In the present invention, in addition to the above-described effects, the print head does not need to accumulate solder paste for supply to the nozzle, and it is only necessary to maintain the amount of solder paste required for printing between the supply and supply of the solder paste. It is more compact than conventional devices, and even if the amount of solder paste that is cleaned by the cleaning of the print head after the production of the device is small, it is more resource-saving. The present invention has been described in detail with reference to the specific embodiments thereof, and various modifications and changes can be made without departing from the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing the main part of a screen printing apparatus according to a first embodiment of the present invention. -16- (13) (13) 1327109 Fig. 2 (A) to Fig. 2 (C) are explanatory views of the operation of the screen printing apparatus of the first embodiment. Fig. 2 (A) shows the supply of solder paste. FIG. 2(B) is an explanatory view of solder printing. FIG. 2(C) is an explanatory view of re-feeding of solder paste. Fig. 3 is a cross-sectional view showing the main part of a screen printing apparatus according to a second embodiment of the present invention. Fig. 4 is a view showing the entire configuration of a conventional screen printing apparatus. Fig. 5 is an explanatory view of a conventional squeegee type print head. Fig. 6 is an explanatory view of a conventional sealed type print head. Fig. 7(A) and Fig. 7(B) are explanatory views of the internal solder paste of the conventional sealed type print head and its printing state after the generation of adhesion and adhesion. [Description of main component symbols] 1 : Screen printing apparatus 2 : Workpiece aligning section 3 : Template upper and lower drive section 4 : Print head 5 : Print head up and down drive section 6 : Print head reciprocating drive section 7 : Solder paste supply mechanism 8 : Cleaning Mechanism 1 1 : Abutment 12 : Lifting guide -17- (14) 1327109
13 :橫 14 :導 15 :往 21 :工 22 ： X 23 ： Y 24 :轉 25 :伺 31 :升 32 :活 33 :升 34 :保 42 :第 43 :第 44 :第 44a ： /」 44b ： 44c ： f-5 1 :氣 52 :活 61 :往 71 :第 71a ： ϋ 72 :第 架體 引體 復移動構件 作台 方向移動台 方向移動台 動台 服馬達 降用氣缸 塞體 降構件 持構件 —氣缸 二氣缸 一加壓活塞 、直徑活塞 ：：直徑活塞 F部 缸部 塞部 復移動構件 三氣缸 t給口 四氣缸 -18- (15) (15)1327109 73 :第二加壓活塞 73a :活塞 73b :活塞 73c :桿部 8 1 :清洗用紙 82 :輸送滾子 P :銲錫膏 S :網版 S > :模板孔 52 :貫穿孔 53 :開口 W :工件13 : Horizontal 14 : Guide 15 : To 21 : Work 22 : X 23 : Y 24 : Turn 25 : Servo 31 : L 32 : Live 33 : L 34 : Paul 42 : 43 : 44 : 44a : / " 44b : 44c : f-5 1 : gas 52 : live 61 : to 71 : 71a : ϋ 72 : the first body pull-up moving member as the table direction moving table direction moving table motor table motor reduction cylinder plug body drop member Holding member - cylinder two cylinders - pressurized piston, diameter piston:: diameter piston F cylinder part plug moving part three cylinder t to port four cylinder -18- (15) (15) 1327109 73 : second pressurized piston 73a: piston 73b: piston 73c: rod portion 8 1 : cleaning paper 82: conveying roller P: solder paste S: screen S > template hole 52: through hole 53: opening W: workpiece