JP2008105255A - Solder printing method and solder printing head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solder printing head which can prevent a solder paste from fixing on the tip part of a nozzle. <P>SOLUTION: In this solder printing method, the solder paste P is fed into a space placed between a printing slope 69 and a mask M between nozzle side walls 75, and by moving the solder printing head 51 ahead, the solder paste P is prevented from overflowing both sides of the printing slope 69 by both nozzle side walls 75, and by pressing the solder paste P toward the mask M by the printing slope 69, and by circulating and flowing the solder paste P between the printing slope 69 and the upper face of the mask M, the solder paste P is filled into a mask hole H. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a solder printing method and a solder print head for filling a mask hole with a solder paste by supplying the solder paste onto a printing mask placed on a workpiece.

  As a conventional solder printer, for example, the one shown in FIG. 12 is known. In this solder printer 11, the workpiece W is held via a workpiece jig 13, the screen mask M is held via a mask vertical drive unit 15, and the print head 17 is driven by a head horizontal drive unit 19 and a head vertical drive. It is held via the part 20. Then, the screen mask M with holes formed in accordance with the printing pattern is placed on the workpiece W, and the solder paste P is filled in the holes of the mask by the print head 17, whereby the solder is transferred and printed onto the workpiece with the hole pattern of the screen. To do.

  In recent years, with the increase in functionality and integration of semiconductors, solder printers that form solder bumps on package substrates are required to have finer print bumps. As the bumps become finer, the mask holes become finer, and the solder paste also has a higher viscosity to prevent printing dripping. Therefore, the requirements for the filling power and the accuracy of the filling amount in the mask holes are becoming stricter year by year. Yes.

  A conventionally used squeegee type print head 21 is as shown in FIG. 13A, and a squeegee 25 is mounted on the print head main body 23 at an inclination, and between the squeegee 25 and the mask M. By holding the solder paste P and moving the squeegee 25 in the horizontal direction on the mask M, the paste P is filled into the mask hole H, and the solder paste on the mask M is cut off at the tip of the squeegee. However, solder scraping due to the squeegee entering, and insufficient filling pressure due to the paste flowing in the lateral direction of the squeegee as shown in FIG. For this reason, in recent years, sealed print heads 31 in which uniform printing pressure can be mechanically controlled are becoming mainstream.

  As shown in FIG. 14, the sealed print head 31 pressurizes the solder paste P filled in the cylinder 33 with the piston 35, so that the paste is surely filled into the mask hole H without the pressure spreading. be able to. However, such a sealed print head 31 has a problem that a solder paste adheres to the nozzle tip and causes printing failure.

  The solder paste P is a mixture of solid solder particles 37 and a flux 39 solvent, and has fluidity because the space between the solder particles 37 is filled with the flux 39 as shown in FIG. Therefore, if the fluidity is maintained, the paste P is filled in the mask hole H, and the printed solder paste 41 is placed on the work after the mask is removed. In the squeegee type head, the fluidity of the paste is maintained by the agitation movement caused by the rolling of the paste. However, in the sealed head 31, the solder near the nozzle tip flows only in a small amount even when pressed. Instead, only the liquid flux component flows out from the contact surface between the nozzle and the mask or the gap between the mask and the workpiece. For this reason, as shown in FIG.15 (b), in the solder paste which lost the flux component, solder particles aggregate and adhere. The fixed solder paste has low fluidity even when pressed, and it becomes difficult to fill the mask holes during printing, causing chipping 43 of printed solder and causing defects. Conventional solder printers have dealt with such a situation by periodically discarding the paste with the nozzle tip fixed, but as bumps become finer in the future, the solder paste will become more functional and material. Since the cost would increase, a more resource-saving method was sought.

  In addition, as such a sealed print head, the one shown in Patent Document 1 is known.

JP 2006-264007 A

  The present invention has been made to solve the above problems, and provides a solder print head capable of preventing the solder paste from adhering to the nozzle tip.

  In order to solve the above-mentioned problem, a mask (M) having a mask hole (H) is placed on a work (W), and a solder paste (P) is supplied onto the mask (M), thereby the mask hole. In the solder printing method in which (H) is filled with the solder paste (P), the printing inclined surface that moves on the upper surface of the mask (M) and approaches the upper surface of the mask (M) as it moves from the front to the rear in the moving direction. (69) and side walls (75, 95) provided along both sides in the moving direction of the printing inclined surface (69) and sandwiching the printing inclined surface (69) from both sides (51, 91, 101), the solder paste (P) is supplied to the space between the side walls (75, 95) sandwiched between the printing inclined surface (69) and the mask (M), and the print head (51, 1, 101) is moved forward so that the solder paste (P) is pressed toward the mask (M) without protruding from the side walls (75, 95). A means of filling the mask hole (H) can be employed.

  Moreover, in order to solve the said subject, by mounting the mask (M) which has a mask hole (H) on a workpiece | work (W), and supplying a solder paste (P) on this mask (M), the said A print head (51, 91, 101) for filling the mask hole (M) with the solder paste (P), and moves the upper surface of the mask (M) and moves the mask (M M) A printing inclined surface (69) close to the upper surface, and sidewalls (75, 95) provided along both sides of the printing inclined surface (69) in the moving direction and sandwiching the printing inclined surface (69) from both sides A solder paste (P) is supplied to a space sandwiched between the printing inclined surface (69) and the mask (M) between the side walls (75, 95), and the printing inclined surface ( 69) and side walls (75, 95) By moving forward, the solder paste (P) is pressed toward the mask (M) without protruding the solder paste (P) from the both side walls (75, 95), and the mask hole (H ) Can be used.

  According to such means, the solder paste (P) flows along the inclined surface for printing (69), and the solder paste (P) that does not fully enter the mask hole (H) circulates. As a result, the solder paste (P) from which the flux has flowed out is mixed and stirred with the remaining solder paste so that the content ratio of the flux is maintained normally, and the solder paste can be prevented from sticking.

  In order to solve the above-mentioned problem, a parting inclined surface (73) that is close to the mask (M) surface is provided in front of the printing inclined surface (69) in the moving direction, and moves forward. At this time, the solder paste (P) is filled in the mask hole (M) by the printing inclined surface (69) and the mask (M) surface is formed by the parting inclined surface (73) when moving backward. It is possible to adopt a means of cutting out the solder paste (P) remaining on the top. According to such means, also in the solder parting process, the solder paste (P) flows and circulates along the parting inclined surface (73) in the same manner as the above means. As a result, the solder paste (P) from which the flux has flowed out is mixed and stirred with the remaining solder paste so that the content ratio of the flux is maintained normally, and the solder paste can be prevented from sticking.

  In order to solve the above problem, the printing inclined surface includes a paste supply device (57) for supplying a solder paste (P) between the printing inclined surface (69) and the parting inclined surface (73). (69) The means that the parting inclined surface (73) and the drive device (55) for moving the paste supply device (57) in the moving direction can be employed. Therefore, the paste can be accurately supplied to a predetermined position, and the print head can be moved easily and accurately.

  In order to solve the above problem, when moving forward, the printing edge (69a) of the printing inclined surface (69) is brought into contact with the mask (M) and the cutting-off inclined surface (73) is closed. When the printing edge (73a) is moved away from the mask (M) and moved rearward, the parting edge (73a) is brought into contact with the mask (M) and the printing edge (69a) is moved to the mask. It is possible to adopt a means that it can swing in the front-rear direction so as to be separated from (M). Accordingly, it is possible to prevent the solder paste from adhering to the parting edge (73a) during the printing process and to the printing edge (69a) during the parting process. Therefore, it is possible to prevent the solder attached to the edge in the next step from reattaching to the mask, and to prevent the occurrence of printing defects.

  In order to solve the above problem, when moving forward, the printing edge (69a) of the printing inclined surface (69) is brought into contact with the mask (M) and the cutting-off inclined surface (73) is closed. When the printing edge (73a) is moved away from the mask (M) and moved rearward, the parting edge (73a) is brought into contact with the mask (M) and the printing edge (69a) is moved to the mask. The printing inclined surface (69) and the parting inclined surface (73) may be arranged so as to be movable up and down so as to be separated from (M). Accordingly, it is possible to prevent the solder paste from adhering to the edge for printing (73a) during the printing process in the forward path and the printing edge (69a) during the process of closing out the backward path, and it is not necessary to clean the adhered solder paste. can do.

  In order to solve the above-mentioned problem, the inclined surface for printing (69) is made 15 ° to 30 ° with respect to the mask (M) surface, and the inclined surface for parting (73) is formed on the mask (M). On the other hand, it is possible to adopt a means that the angle is 45 ° to 60 °. Therefore, the printing inclined surface (69) can effectively generate a pressing force against the mask hole (H) and promote the circulation of the paste. The parting inclined surface (73) It is possible to effectively close the paste and promote the circulation of the paste.

  In addition, the code | symbol in the parenthesis attached | subjected to each said means is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 11.

  FIGS. 1A and 1B are views showing a first embodiment of the present invention. In these drawings, reference numeral 51 denotes a solder print head. The solder print head 51 has a frame 53. The frame 53 is connected to a reciprocating drive device 55 formed of a hydraulic cylinder so as to reciprocate the frame 53 in the horizontal direction. A paste supply device 57 is provided on the upper side of the frame 53. The paste supply device 57 includes an air cylinder 61 that is operated by air pressure supplied from an air supply unit 59, and a paste supply cylinder 63 that is driven by the air cylinder 61. The paste supply cylinder 63 is filled with a solder paste P, and is pushed out into a later-described nozzle by a piston driven by the air cylinder portion 63.

  A nozzle 65 having a substantially rectangular horizontal section as shown in FIGS. 2A and 2B is provided below the frame 53. The nozzle 65 has a printing side wall 67 on the rear side in the traveling direction in the paste filling step. At the lower end of the printing side wall 67, there is a printing inclined surface 69 that approaches the mask surface as it goes from the front side to the rear side in the traveling direction in the paste filling process, and a printing edge 69a is formed at the tip thereof. Is formed. The inclination angle A of the printing inclined surface 69 is set to 15 ° to 30 ° with respect to the mask surface in order to apply printing pressure to the mask. The nozzle 65 has a parting side wall 71 on the front side in the traveling direction in the paste filling step. At the lower end of the parting side wall 71, there is a parting inclined surface 73 that approaches the mask surface as it goes from the rear side to the front side in the advancing direction in the paste filling process. Is formed. The inclined surface for parting 73 shears the paste remaining on the mask on the mask, so that the angle B with respect to the mask surface is 45 ° to 60 °.

  On both sides of the printing side wall 67 and the parting side wall 71 in the moving direction, nozzle side walls 75 that connect both ends of the printing side wall 67 and both ends of the parting side wall 71 are provided. And the side wall edge 77 of the lower end of these nozzle side walls is formed in the same height position as the printing edge 69a and the parting edge 73a.

  On the other hand, a work W is placed on the work placing table 79, and a mask M is placed on the upper surface of the work W.

  The nozzle 65 moves in the horizontal direction while contacting the printing edge 69a, the parting edge 73a, and the side wall edge 77 with the upper surface of the mask M.

  A process of performing solder printing on a workpiece using such a solder print head 51 will be described.

  First, as shown in FIG. 3, the solder print head 51 is positioned at the end portion Ma where the print pattern of the mask M does not exist, and the paste supply device 57 is operated. Then, the solder paste P is dropped and supplied to the space surrounded by the printing side wall 67, the parting side wall 71, and the nozzle side wall 75 of the mask M. At this time, as shown in FIG. 3, the paste is supplied in an unfilled state in which the paste dropped on the mask M does not contact the printing side wall 67 and the parting side wall 71 at the same time and a gap is formed. .

  Next, as shown in FIG. 4, the reciprocating drive device 55 is driven to move the solder print head 51 on the mask M. Then, the printing paste 81 is applied to the solder paste P between the printing inclined surface 69 and the mask M by the printing inclined surface 69, and the pressing force 83 to the mask hole is applied to the solder paste P, so that the mask hole H (Printing process).

  Next, as shown in FIG. 5, the solder print head 51 is moved on the mask M in the opposite direction. Then, the solder paste P on the mask M is pressed by the parting inclined surface 73 and moves in the horizontal direction, and the solder paste P filled in the mask hole H is parted by the mask thickness (parting process). By repeating this operation, solder printing is performed. Since the solder paste P is consumed when printing is repeated, the solder paste P is periodically supplied by the paste supply device 57 as shown in FIG.

  Here, as described above, when supplying the solder paste P, as shown in FIG. 3, the solder paste P dropped on the mask M does not contact the printing side wall 67 and the parting side wall 71 at the same time. Like that. In this way, in the printing process shown in FIG. 4, the solder paste inside the nozzle is released by the printing inclined surface 69 and the nozzle side wall 75 while not being in contact with the parting side wall 71 side. Yes. For this reason, the solder paste P flows 85 along the printing inclined surface 69, and the solder paste P that does not fully enter the mask hole H circulates. As a result, the solder paste P from which the flux has flowed out is mixed and stirred with the remaining solder paste by circulation flow. Therefore, the flux content of the solder paste P is maintained normally, and the solder paste can be prevented from sticking. The same applies to the parting process, which eliminates the need for discarding the fixed solder and promotes productivity and resource saving.

  For example, in a small-sized printing machine corresponding to a miniaturized workpiece, the solder paste fixed in the nozzle is automatically discarded every 20 printings, and printing of 80 sheets with 15 g of solder paste is the limit. However, by adopting the method of the present application, no disposal operation is required, and about 400 or more sheets can be printed with the same 15 g of solder paste.

  6 and 7 are diagrams showing a second embodiment of the present invention. This solder print head 91 is configured such that the solder print head 51 shown in FIG. 1 can be tilted back and forth in the moving direction of the head, and parts having basically the same configuration as the solder print head 51 are denoted by the same reference numerals. The description is omitted.

  In the nozzle 93 of the solder print head 91, the printing side wall 67 and the parting side wall 71 have basically the same configuration as the solder printing head 51, but each of the printing side wall 67 and the parting side wall 71 is provided. The shape of the nozzle side wall 95 that connects both ends is different. That is, the nozzle side wall 95 is formed so that the lower end edge thereof protrudes in a triangular shape with the line connecting the printing edge 69a and the parting edge 73a as a base, and the lower side of the printing side formed on the printing edge 69a side. It has an edge 97 and a parting-side lower edge 99 formed on the parting edge 73a side. And this nozzle side wall 95 is made into the shape which turned the shogi piece upside down generally.

  A process of performing solder printing on a work using such a solder print head 91 will be described.

  First, as shown in FIG. 6, the print head 91 is positioned in a state where the printing edge 69 a and the printing-side lower edge 97 are in contact with the mask M and the parting edge 73 a is separated from the mask M.

  Next, as shown in FIG. 7D, the solder paste P is dropped on the mask M into a space surrounded by the printing side wall 67 and the nozzle side wall 95.

  Next, as shown in FIG. 7A, the print head 91 is moved while the printing edge 69 a and the printing-side lower edge 97 are in contact with the mask M. Then, the solder paste P between the printing inclined surface 69 and the mask M is pressed by the printing inclined surface 69 and filled in the mask hole H (printing process). At this time, since the parting edge 73a is spaced upward from the mask surface M, the solder paste does not adhere to the front surface in the traveling direction of the parting edge 73a.

  7B, the print head 91 is swung forward, the parting edge 73a and the parting side lower edge 99 are in contact with the mask M, and the printing edge 69a is separated from the mask M. Position it.

  Next, as shown in FIG. 7C, the print head 91 is moved in the opposite direction while the parting edge 73 a and the parting side lower edge 99 are in contact with the mask M. Then, the solder paste P on the mask M is pressed by the parting inclined surface 73 and moves in the horizontal direction, and the solder paste P filled in the mask hole H is parted by the mask thickness (parting process). At this time, since the printing edge 69a is spaced upward from the mask surface M, the solder paste does not adhere to the front surface in the traveling direction of the printing edge 69a.

  Then, as shown in FIG. 7D, the solder paste P is again supplied onto the mask M, and printing is continued.

  As described above, in the print head 91, the nozzle side wall 95 is formed so that the lower end edge thereof protrudes in a triangular shape with the line connecting the printing edge 69a and the parting edge 73a as the base, and the printing edge. The print-side lower edge 97 formed on the 69a side and the parting-side lower edge 99 formed on the parting edge 73a side are provided. In the forward printing process, the print head 91 is connected to the printing edge 69a. The print-side lower edge 97 is in contact with the mask M, and the parting edge 73a is moved away from the mask M. In the return parting process, the print head 91 is moved to the parting edge 73a and the parting side lower edge. Since 99 is in contact with the mask M and the printing edge 69a is moved away from the mask M in the opposite direction, the parting process is performed on the parting edge 73a during the printing process. Is solder paste printing edge 69a can be prevented from adhering to. Therefore, it is possible to prevent the solder attached to the edge in the next step from reattaching to the mask, and to prevent the occurrence of printing defects. In addition, it is not necessary to clean the attached solder paste, and costs can be reduced.

  8 to 11 are diagrams showing a third embodiment of the present invention. This solder print head 101 is the same as the solder print head 51 shown in FIG. 1 except that the printing side wall 67 and the parting side wall 71 can be moved up and down. The same reference numerals are given and the description thereof is omitted.

  In the solder print head 101, a printing side wall driving device 105 is connected to the printing side wall 67, and a parting side wall driving device 107 is connected to the parting side wall 71, and the printing side wall 67 and the parting side wall 71 are connected. Each can move up and down independently.

  First, as shown in FIG. 8, the printing side wall 67 of the print head 101 is set to a lowered position so that the printing edge 69 a contacts the mask M, and the parting side wall 71 is separated from the mask M. Set to the ascending position.

  Next, as shown in FIG. 8, the solder paste P is dropped on the mask M into a space surrounded by the printing side wall 67 and the nozzle side wall 75.

  Next, as shown in FIG. 9, the print head 101 is moved while the printing edge 69 a and the side wall edge 77 are in contact with the mask M. Then, the solder paste P between the printing inclined surface 69 and the mask M is pressed by the printing inclined surface 69 and filled in the mask hole H (printing process). At this time, since the parting edge 73a is spaced upward from the upper surface of the mask M, the solder paste does not adhere to the front surface in the traveling direction of the parting edge 73a.

  Thereafter, as shown in FIG. 10, the printing side wall driving device 105 and the parting side wall driving device 107 are actuated to raise the printing side wall 67 of the print head 101 so that the printing edge 69 a is separated from the mask M. The parting side wall 71 is set to the lowered position so that the parting edge 73a contacts the mask M.

  Next, as shown in FIG. 11, the solder print head 101 is moved in the opposite direction while being in contact with the parting edge 73a and the side wall edge 77 mask M. Then, the solder paste P on the mask M is pressed by the parting inclined surface 73 and moves in the horizontal direction, and the solder paste P filled in the mask hole H is parted by the mask thickness (parting process). At this time, since the printing edge 69a is spaced upward from the upper surface of the mask M, the solder paste does not adhere to the front surface in the traveling direction of the printing edge 69a.

  As described above, in this solder print head 101, the printing side wall driving device 105 is connected to the printing side wall 67, and the parting side wall driving device 107 is connected to the parting side wall 71. 67, the parting side wall 71 can be moved up and down independently. In the forward printing process, the printing edge 69a and the side wall edge 77 are in contact with the mask M, and the parting edge 73a is in the ascending position and is separated from the mask M. In the return parting process, the parting edge 73a and the side wall edge 77 are in contact with the mask M, and the printing edge 69a is in the raised position and separated from the mask M in the opposite direction. Therefore, the solder paste adheres to the parting edge 73a during the forward printing process and to the printing edge 69a during the backward parting process. Can be prevented, it is possible to dispense with cleaning operation of the deposited solder paste.

It is a figure which shows the solder printing head which is the 1st Embodiment of this invention, Comprising: (a) is the perspective view, (b) is the sectional drawing. It is a figure which shows the nozzle of the solder printing head shown in FIG. 1, Comprising: (a) is the perspective view, (b) is the sectional drawing. Sectional drawing which shows the state which is supplying the solder paste in the solder printing head shown in FIG. Sectional drawing which shows the printing process of an outward path in the solder printing head shown in FIG. Sectional drawing which shows the parting process of a return path in the solder printing head shown in FIG. The perspective view which shows the solder print head which is the 2nd Embodiment of this invention. The figure explaining the printing process of the solder printing head shown in FIG. 6 in order from (a) to (d). Sectional drawing which shows the solder print head which is the 3rd Embodiment of this invention. Sectional drawing which shows the printing process of an outward path in the solder print head shown in FIG. FIG. 9 is a cross-sectional view showing a state in which the printing side wall is raised and the parting side wall is lowered after the forward printing step in the solder print head shown in FIG. 8. FIG. 9 is a cross-sectional view illustrating a parting process for a return path in the solder print head illustrated in FIG. 8. The figure which shows the conventional solder printer. It is the schematic which shows the solder printing using a squeegee, Comprising: (a) is the side view, (b) is the top view. FIG. 3 is a cross-sectional view showing a sealed print head. 4A and 4B are diagrams illustrating a state of a paste inside a sealed print head, where FIG. 4A is a diagram illustrating a state where the paste is not fixed, and FIG.

Explanation of symbols

W Work M Mask H Mask hole 51 Solder print head 55 Reciprocating drive device 57 Paste supply device 67 Side wall for printing 69 Inclined surface for printing 69a Printing edge 71 Side wall for parting 73 Inclined surface for parting 73a Edge for parting 75 Nozzle side wall 77 Side wall edge 91 Solder print head 101 Solder print head

Claims (7)

By placing a mask (M) having a mask hole (H) on the workpiece (W) and supplying a solder paste (P) onto the mask (M), the solder paste is put into the mask hole (H). In the solder printing method for filling (P),
As the upper surface of the mask (M) moves and from the front to the back in the moving direction, the printing inclined surface (69) close to the upper surface of the mask (M) and both sides of the printing inclined surface (69) in the moving direction. Printing heads (51, 91, 101) having side walls (75, 95) provided along the inclined surfaces for printing (69) from both sides,
The solder paste (P) is supplied to a space sandwiched between the printing inclined surface (69) and the mask (M) between the both side walls (75, 95), and the print heads (51, 91, 101) is moved forward to press the solder paste (P) toward the mask (M) without protruding the solder paste (P) from the side walls (75, 95). A solder printing method, wherein the hole (H) is filled. By placing a mask (M) having a mask hole (H) on the workpiece (W) and supplying a solder paste (P) on the mask (M), the solder paste is put into the mask hole (M). A print head (51, 91, 101) for filling (P),
As the upper surface of the mask (M) moves and from the front to the back in the moving direction, the printing inclined surface (69) close to the upper surface of the mask (M) and both sides of the printing inclined surface (69) in the moving direction. A side wall (75, 95) provided along the inclined surface for printing (69) from both sides,
Solder paste (P) is supplied to the space sandwiched between the printing inclined surface (69) and the mask (M) between the both side walls (75, 95), and the printing inclined surface (69) and the side wall are supplied. By moving (75, 95) forward, the solder paste (P) is pressed toward the mask (M) without protruding from the both side walls (75, 95). And filling the mask hole (H). In the moving direction of the printing inclined surface (69), there is provided a parting inclined surface (73) close to the mask (M) surface from the rear to the front.
The solder paste (P) is filled into the mask hole (M) by the inclined surface for printing (69) when moving forward, and the mask is inclined by the inclined surface for closing (73) when moving backward. 3. The solder print head according to claim 2, wherein the solder paste (P) remaining on the (M) surface is cut off.   A paste supply device (57) for supplying a solder paste (P) between the printing inclined surface (69) and the parting inclined surface (73) is provided, the printing inclined surface (69), the parting out The solder print head according to claim 2 or 3, further comprising a drive device (55) for moving the inclined surface (73) and the paste supply device (57) in the moving direction.   When moving forward, the printing edge (69a) of the printing inclined surface (69) is brought into contact with the mask (M), and the parting edge (73a) of the parting inclined surface (73) is brought into contact with the mask (M). When moving away from the mask (M) and moving backward, the parting edge (73a) is brought into contact with the mask (M) and the printing edge (69a) is separated from the mask (M). The solder print head according to any one of claims 2 to 4, wherein the solder print head is swingable in a front-rear direction.   When moving forward, the printing edge (69a) of the printing inclined surface (69) is brought into contact with the mask (M), and the parting edge (73a) of the parting inclined surface (73) is brought into contact with the mask (M). When moving away from the mask (M) and moving backward, the parting edge (73a) is brought into contact with the mask (M) and the printing edge (69a) is separated from the mask (M). 5. The solder printing according to claim 2, wherein the inclined surface for printing (69) and the inclined surface for parting (73) are arranged to be movable up and down. head.   The printing inclined surface (69) is 15 ° to 30 ° with respect to the upper surface of the mask (M), and the parting inclined surface (73) is 45 ° to 60 with respect to the upper surface of the mask (M). The solder print head according to any one of claims 2 to 6, wherein the solder print head is at an angle of 0 °.

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