TWI324798B - Polishing apparatus and method of manufacturing an ic - Google Patents

Polishing apparatus and method of manufacturing an ic Download PDF

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Publication number
TWI324798B
TWI324798B TW093102797A TW93102797A TWI324798B TW I324798 B TWI324798 B TW I324798B TW 093102797 A TW093102797 A TW 093102797A TW 93102797 A TW93102797 A TW 93102797A TW I324798 B TWI324798 B TW I324798B
Authority
TW
Taiwan
Prior art keywords
metal
period
integrated circuit
etchant
polishing
Prior art date
Application number
TW093102797A
Other languages
English (en)
Chinese (zh)
Other versions
TW200507093A (en
Inventor
Hoang Viet Nguyen
Roel Daamen
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Publication of TW200507093A publication Critical patent/TW200507093A/zh
Application granted granted Critical
Publication of TWI324798B publication Critical patent/TWI324798B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
TW093102797A 2003-02-11 2004-02-06 Polishing apparatus and method of manufacturing an ic TWI324798B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03100284 2003-02-11

Publications (2)

Publication Number Publication Date
TW200507093A TW200507093A (en) 2005-02-16
TWI324798B true TWI324798B (en) 2010-05-11

Family

ID=32865028

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093102797A TWI324798B (en) 2003-02-11 2004-02-06 Polishing apparatus and method of manufacturing an ic

Country Status (7)

Country Link
US (1) US7709387B2 (https=)
EP (1) EP1595286A1 (https=)
JP (1) JP2006517737A (https=)
KR (1) KR20050094481A (https=)
CN (1) CN100568485C (https=)
TW (1) TWI324798B (https=)
WO (1) WO2004073060A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006040585B4 (de) * 2006-08-30 2013-02-07 Infineon Technologies Ag Verfahren zum Auffüllen eines Grabens in einem Halbleiterprodukt
CN103985668B (zh) * 2014-05-13 2018-02-23 上海集成电路研发中心有限公司 铜互连的制备方法
US11898081B2 (en) 2019-11-21 2024-02-13 Tokyo Ohka Kogyo Co., Ltd. Ruthenium-etching solution, method for manufacturing ruthenium-etching solution, method for processing object to be processed, and method for manufacturing ruthenium-containing wiring
JP6895577B2 (ja) * 2019-11-21 2021-06-30 東京応化工業株式会社 エッチング液、エッチング液の製造方法、被処理体の処理方法、及びルテニウム含有配線の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5854140A (en) * 1996-12-13 1998-12-29 Siemens Aktiengesellschaft Method of making an aluminum contact
US5934980A (en) * 1997-06-09 1999-08-10 Micron Technology, Inc. Method of chemical mechanical polishing
JP4095731B2 (ja) * 1998-11-09 2008-06-04 株式会社ルネサステクノロジ 半導体装置の製造方法及び半導体装置
JP3293783B2 (ja) * 1998-11-10 2002-06-17 日本電気株式会社 半導体装置の製造方法
JP2001085378A (ja) 1999-09-13 2001-03-30 Sony Corp 半導体装置およびその製造方法
JP4264781B2 (ja) 1999-09-20 2009-05-20 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
US6436829B1 (en) * 2000-08-04 2002-08-20 Agere Systems Guardian Corp. Two phase chemical/mechanical polishing process for tungsten layers
US20020098673A1 (en) * 2001-01-19 2002-07-25 Ming-Shi Yeh Method for fabricating metal interconnects
US6660627B2 (en) * 2002-03-25 2003-12-09 United Microelectronics Corp. Method for planarization of wafers with high selectivities

Also Published As

Publication number Publication date
CN100568485C (zh) 2009-12-09
TW200507093A (en) 2005-02-16
CN1748302A (zh) 2006-03-15
WO2004073060A1 (en) 2004-08-26
US7709387B2 (en) 2010-05-04
US20060134915A1 (en) 2006-06-22
JP2006517737A (ja) 2006-07-27
EP1595286A1 (en) 2005-11-16
KR20050094481A (ko) 2005-09-27

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