TWI320422B - Epoxy resin composition and semiconductor device - Google Patents

Epoxy resin composition and semiconductor device

Info

Publication number
TWI320422B
TWI320422B TW94124677A TW94124677A TWI320422B TW I320422 B TWI320422 B TW I320422B TW 94124677 A TW94124677 A TW 94124677A TW 94124677 A TW94124677 A TW 94124677A TW I320422 B TWI320422 B TW I320422B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
resin composition
epoxy resin
epoxy
composition
Prior art date
Application number
TW94124677A
Other languages
English (en)
Other versions
TW200613435A (en
Inventor
Zenbutsu Shinichi
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW200613435A publication Critical patent/TW200613435A/zh
Application granted granted Critical
Publication of TWI320422B publication Critical patent/TWI320422B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW94124677A 2004-07-29 2005-07-21 Epoxy resin composition and semiconductor device TWI320422B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004221780 2004-07-29

Publications (2)

Publication Number Publication Date
TW200613435A TW200613435A (en) 2006-05-01
TWI320422B true TWI320422B (en) 2010-02-11

Family

ID=35786390

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94124677A TWI320422B (en) 2004-07-29 2005-07-21 Epoxy resin composition and semiconductor device

Country Status (7)

Country Link
US (1) US8084520B2 (zh)
JP (1) JP5019251B2 (zh)
KR (1) KR101287712B1 (zh)
CN (1) CN100519651C (zh)
MY (1) MY148463A (zh)
TW (1) TWI320422B (zh)
WO (1) WO2006011662A1 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412506B (zh) * 2006-05-12 2013-10-21 Denki Kagaku Kogyo Kk 陶瓷粉末及其用途
CN101472841B (zh) 2006-05-12 2012-05-02 电气化学工业株式会社 陶瓷粉末及其用途
JP5473196B2 (ja) * 2007-05-16 2014-04-16 東レ・ダウコーニング株式会社 硬化性エポキシ樹脂組成物およびその硬化物
JP4794521B2 (ja) * 2007-08-29 2011-10-19 三洋電機株式会社 固体電解コンデンサ及びその製造方法
KR101017281B1 (ko) * 2008-10-28 2011-02-28 주식회사 현대화이바 탄소나노튜브가 포함된 난연성 수지조성물 및 이를 이용한 프리프레그 제조방법
CN101851386B (zh) * 2009-04-01 2012-09-05 汉高华威电子有限公司 一种环氧树脂组合物
KR101678256B1 (ko) * 2009-10-09 2016-11-21 스미토모 베이클리트 컴퍼니 리미티드 반도체 장치
JP2012012563A (ja) * 2010-06-02 2012-01-19 Nitto Denko Corp 熱硬化性シリコーン樹脂用組成物
US8440012B2 (en) * 2010-10-13 2013-05-14 Rf Micro Devices, Inc. Atomic layer deposition encapsulation for acoustic wave devices
US8313985B2 (en) * 2010-10-21 2012-11-20 Rf Micro Devices, Inc. Atomic layer deposition encapsulation for power amplifiers in RF circuits
CN102477211A (zh) * 2010-11-25 2012-05-30 联茂电子股份有限公司 无卤环氧树脂组合物及其胶片与基板
JP5650033B2 (ja) * 2011-03-29 2015-01-07 富士フイルム株式会社 難燃性樹脂組成物、その製造方法、及び成形品
BR112014020987B1 (pt) * 2012-03-01 2021-05-04 Sumitomo Bakelite Co., Ltd composição de resina para fixação de rotor, rotor e veículo automotivo
KR101882556B1 (ko) * 2012-03-16 2018-07-26 스미또모 베이크라이트 가부시키가이샤 밀봉용 수지 조성물 및 이것을 사용한 전자 장치
CN111527147A (zh) * 2017-12-28 2020-08-11 日立化成株式会社 球栅阵列封装密封用环氧树脂组合物、环氧树脂固化物和电子部件装置
JP6516115B1 (ja) * 2018-05-16 2019-05-22 山栄化学株式会社 溶解性・非溶解性粒子含有硬化性樹脂組成物
US20210384573A1 (en) * 2018-11-01 2021-12-09 Sumitomo Bakelite Co., Ltd. Encapsulating resin composition for power device and power device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188855A (ja) 1990-11-22 1992-07-07 Nitto Denko Corp 半導体装置
JP3649524B2 (ja) * 1995-07-10 2005-05-18 住友ベークライト株式会社 エポキシ樹脂組成物および半導体装置
JP3649540B2 (ja) 1996-12-27 2005-05-18 住友ベークライト株式会社 エポキシ樹脂組成物
JPH11140277A (ja) * 1997-11-10 1999-05-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びこれを用いた半導体装置
JPH11166073A (ja) * 1997-12-04 1999-06-22 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
US6297306B1 (en) * 1998-05-15 2001-10-02 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
JP3537082B2 (ja) 1999-02-09 2004-06-14 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2001122943A (ja) 1999-10-28 2001-05-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2001220497A (ja) 1999-11-29 2001-08-14 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
CN1286906C (zh) 2000-09-30 2006-11-29 住友电木株式会社 环氧树脂组合物和半导体装置
JP2002128991A (ja) * 2000-10-27 2002-05-09 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4797243B2 (ja) * 2000-12-20 2011-10-19 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP4961635B2 (ja) * 2001-05-30 2012-06-27 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2003155326A (ja) 2001-11-20 2003-05-27 Sumitomo Bakelite Co Ltd 樹脂組成物及び電子部品装置
JP2003252959A (ja) 2002-03-05 2003-09-10 Toray Ind Inc エポキシ系樹脂組成物およびそれを用いた半導体装置
JP2003277585A (ja) 2002-03-25 2003-10-02 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2003292731A (ja) 2002-03-29 2003-10-15 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4030786B2 (ja) 2002-03-29 2008-01-09 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP4040367B2 (ja) 2002-06-03 2008-01-30 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2004018790A (ja) * 2002-06-19 2004-01-22 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2005281623A (ja) * 2004-03-30 2005-10-13 Kyocera Chemical Corp エポキシ樹脂組成物および半導体装置
JP4525139B2 (ja) * 2004-03-31 2010-08-18 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物の製造方法。
JP4608950B2 (ja) * 2004-05-31 2011-01-12 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP5298400B2 (ja) * 2004-07-13 2013-09-25 日立化成株式会社 封止用エポキシ樹脂成形材料及び電子部品装置

Also Published As

Publication number Publication date
CN100519651C (zh) 2009-07-29
US20080064791A1 (en) 2008-03-13
CN1984961A (zh) 2007-06-20
KR20070046817A (ko) 2007-05-03
MY148463A (en) 2013-04-30
WO2006011662A1 (ja) 2006-02-02
JPWO2006011662A1 (ja) 2008-05-01
US8084520B2 (en) 2011-12-27
TW200613435A (en) 2006-05-01
JP5019251B2 (ja) 2012-09-05
KR101287712B1 (ko) 2013-07-19

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