SG10201406277RA - Epoxy resin composition and semiconductor device - Google Patents
Epoxy resin composition and semiconductor deviceInfo
- Publication number
- SG10201406277RA SG10201406277RA SG10201406277RA SG10201406277RA SG10201406277RA SG 10201406277R A SG10201406277R A SG 10201406277RA SG 10201406277R A SG10201406277R A SG 10201406277RA SG 10201406277R A SG10201406277R A SG 10201406277RA SG 10201406277R A SG10201406277R A SG 10201406277RA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- resin composition
- epoxy resin
- epoxy
- composition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/02—Copolymers with acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/08—Epoxidised polymerised polyenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
- C08C19/00—Chemical modification of rubber
- C08C19/04—Oxidation
- C08C19/06—Epoxidation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L13/00—Compositions of rubbers containing carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L15/00—Compositions of rubber derivatives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004347743A JP2006152185A (en) | 2004-11-30 | 2004-11-30 | Epoxy resin composition and semiconductor device |
JP2004368714A JP2006176554A (en) | 2004-12-21 | 2004-12-21 | Epoxy resin composition and semiconductor apparatus |
JP2005002381A JP4736432B2 (en) | 2005-01-07 | 2005-01-07 | Epoxy resin composition and semiconductor device |
JP2005039050A JP2006225464A (en) | 2005-02-16 | 2005-02-16 | Epoxy resin composition and semiconductor device |
JP2005099390A JP4736506B2 (en) | 2005-03-30 | 2005-03-30 | Epoxy resin composition and semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201406277RA true SG10201406277RA (en) | 2014-11-27 |
Family
ID=36564976
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201406280UA SG10201406280UA (en) | 2004-11-30 | 2005-11-25 | Epoxy resin composition and semiconductor device |
SG10201406277RA SG10201406277RA (en) | 2004-11-30 | 2005-11-25 | Epoxy resin composition and semiconductor device |
SG10201406279UA SG10201406279UA (en) | 2004-11-30 | 2005-11-25 | Epoxy resin composition and semiconductor device |
SG200906719-0A SG156623A1 (en) | 2004-11-30 | 2005-11-25 | Epoxy resin composition and semiconductor device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201406280UA SG10201406280UA (en) | 2004-11-30 | 2005-11-25 | Epoxy resin composition and semiconductor device |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201406279UA SG10201406279UA (en) | 2004-11-30 | 2005-11-25 | Epoxy resin composition and semiconductor device |
SG200906719-0A SG156623A1 (en) | 2004-11-30 | 2005-11-25 | Epoxy resin composition and semiconductor device |
Country Status (7)
Country | Link |
---|---|
US (5) | US20060157872A1 (en) |
KR (3) | KR101152040B1 (en) |
CN (2) | CN102617981B (en) |
MY (3) | MY150584A (en) |
SG (4) | SG10201406280UA (en) |
TW (3) | TWI478969B (en) |
WO (1) | WO2006059542A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102617981B (en) * | 2004-11-30 | 2016-12-14 | 住友电木株式会社 | Composition epoxy resin and semiconductor device |
JP2008007692A (en) * | 2006-06-30 | 2008-01-17 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing and electronic part device |
JP5306592B2 (en) * | 2006-12-04 | 2013-10-02 | 東レ・ダウコーニング株式会社 | Curable epoxy resin composition, cured product, and use thereof |
JP2009215484A (en) * | 2008-03-12 | 2009-09-24 | Toshiba Corp | Resin composition and semiconductor device using the same |
CN102348736B (en) * | 2009-03-11 | 2014-08-13 | 住友电木株式会社 | Semiconductor-sealing resin composition and semiconductor device |
JP5185890B2 (en) * | 2009-06-17 | 2013-04-17 | 株式会社日立産機システム | Insulating casting resin for high-voltage electrical equipment and high-voltage electrical equipment using the same |
JPWO2011052157A1 (en) * | 2009-10-26 | 2013-03-14 | 住友ベークライト株式会社 | Semiconductor sealing resin composition and semiconductor device using the same |
SG185503A1 (en) * | 2010-05-28 | 2012-12-28 | Sumitomo Bakelite Co | Method of manufacturing esterified substance |
KR101863884B1 (en) * | 2010-12-27 | 2018-06-01 | 다우 코닝 도레이 캄파니 리미티드 | Curable epoxy resin composition |
KR101309820B1 (en) * | 2010-12-29 | 2013-09-23 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same |
JP5598365B2 (en) * | 2011-02-15 | 2014-10-01 | 宇部興産株式会社 | Process for producing modified diene rubber |
JP6051630B2 (en) * | 2011-07-13 | 2016-12-27 | 味の素株式会社 | Semiconductor package |
JP5799694B2 (en) * | 2011-09-12 | 2015-10-28 | 日立化成株式会社 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
JP6181907B2 (en) * | 2011-11-15 | 2017-08-16 | 互応化学工業株式会社 | Resin composition for carboxyl group-containing resin and solder resist |
US8946333B2 (en) * | 2012-09-19 | 2015-02-03 | Momentive Performance Materials Inc. | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
US9434870B2 (en) | 2012-09-19 | 2016-09-06 | Momentive Performance Materials Inc. | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
US20160111380A1 (en) * | 2014-10-21 | 2016-04-21 | Georgia Tech Research Corporation | New structure of microelectronic packages with edge protection by coating |
JP6800227B2 (en) * | 2015-12-01 | 2020-12-16 | スリーエム イノベイティブ プロパティズ カンパニー | B-staged adhesive composition |
WO2017099194A1 (en) * | 2015-12-11 | 2017-06-15 | 日本化薬株式会社 | Epoxy resin composition, prepreg, epoxy resin composition molded body, and cured product thereof |
JP7102093B2 (en) * | 2016-09-28 | 2022-07-19 | 味の素株式会社 | Resin composition, resin sheet, circuit board and semiconductor chip package |
JP7255411B2 (en) * | 2019-07-30 | 2023-04-11 | 味の素株式会社 | resin composition |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4465542A (en) * | 1982-02-19 | 1984-08-14 | Mitsui Petrochemical Industries, Ltd. | Adhesive composition |
US4578425A (en) * | 1985-02-13 | 1986-03-25 | Schenectady Chemicals, Inc. | Phenolic resins, carboxylic resins and the elastomers containing adhesive |
JPH10120873A (en) * | 1996-10-14 | 1998-05-12 | Sumitomo Bakelite Co Ltd | Insulating resin paste for semiconductor |
JP3238340B2 (en) | 1996-12-04 | 2001-12-10 | 住友ベークライト株式会社 | Liquid epoxy resin sealing material |
JPH11140274A (en) * | 1997-11-05 | 1999-05-25 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JPH11172077A (en) | 1997-12-11 | 1999-06-29 | Toshiba Chem Corp | Resin composition for semiconductor sealing |
JP2000007890A (en) * | 1998-04-23 | 2000-01-11 | Nitto Denko Corp | Epoxy resin composition for sealing of semiconductor and production thereof, and semiconductor device |
JP3582576B2 (en) * | 1998-05-15 | 2004-10-27 | 信越化学工業株式会社 | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
JP2000343393A (en) * | 1999-05-28 | 2000-12-12 | Nippei Toyama Corp | Edge grinding device for circular thin plate |
JP2002356538A (en) * | 2001-03-30 | 2002-12-13 | Toray Ind Inc | Epoxy resin composition for sealing semiconductor and semiconductor device using the same |
JP4202632B2 (en) | 2001-09-28 | 2008-12-24 | 株式会社東芝 | Resin sealing structure for batch sealing type semiconductor package and manufacturing apparatus thereof |
US20050090044A1 (en) * | 2001-09-28 | 2005-04-28 | Keiji Kayaba | Epoxy resin compositions and semiconductor devices |
JP3891550B2 (en) * | 2001-10-29 | 2007-03-14 | 住友ベークライト株式会社 | Liquid resin composition, method for manufacturing semiconductor device, and semiconductor device |
JP2004075748A (en) * | 2002-08-12 | 2004-03-11 | Kyocera Chemical Corp | Flame-retardant adhesive composition, flexible copper-clad laminae, cover lay, and adhesive film |
JP2004168907A (en) * | 2002-11-20 | 2004-06-17 | Sumitomo Bakelite Co Ltd | Die attach paste and semiconductor device |
JP2004168922A (en) * | 2002-11-21 | 2004-06-17 | Sumitomo Bakelite Co Ltd | Die attach paste and semiconductor device |
JP2004200034A (en) | 2002-12-19 | 2004-07-15 | Seiko Epson Corp | Electro-optical device and its process of manufacture as well as electronic equipment |
JP4250987B2 (en) | 2003-03-25 | 2009-04-08 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
JP2005162826A (en) * | 2003-12-01 | 2005-06-23 | Kyocera Chemical Corp | Sealing resin composition and resin-sealed semiconductor device |
CN102617981B (en) * | 2004-11-30 | 2016-12-14 | 住友电木株式会社 | Composition epoxy resin and semiconductor device |
-
2005
- 2005-11-25 CN CN201210063222.9A patent/CN102617981B/en active Active
- 2005-11-25 KR KR1020077013906A patent/KR101152040B1/en active IP Right Grant
- 2005-11-25 CN CN201210063230.3A patent/CN102627832B/en active Active
- 2005-11-25 SG SG10201406280UA patent/SG10201406280UA/en unknown
- 2005-11-25 KR KR1020117005937A patent/KR101081723B1/en active IP Right Grant
- 2005-11-25 SG SG10201406277RA patent/SG10201406277RA/en unknown
- 2005-11-25 SG SG10201406279UA patent/SG10201406279UA/en unknown
- 2005-11-25 KR KR1020117005936A patent/KR101081619B1/en active IP Right Grant
- 2005-11-25 WO PCT/JP2005/021658 patent/WO2006059542A1/en active Application Filing
- 2005-11-25 SG SG200906719-0A patent/SG156623A1/en unknown
- 2005-11-29 MY MYPI20113758 patent/MY150584A/en unknown
- 2005-11-29 MY MYPI20113757 patent/MY150607A/en unknown
- 2005-11-29 MY MYPI20055572 patent/MY150688A/en unknown
- 2005-11-29 US US11/289,265 patent/US20060157872A1/en not_active Abandoned
- 2005-11-30 TW TW101128572A patent/TWI478969B/en active
- 2005-11-30 TW TW094142028A patent/TWI378968B/en active
- 2005-11-30 TW TW101128571A patent/TWI527854B/en active
-
2008
- 2008-11-13 US US12/270,162 patent/US8324326B2/en not_active Expired - Fee Related
-
2012
- 2012-11-02 US US13/667,318 patent/US8921461B2/en not_active Expired - Fee Related
- 2012-11-02 US US13/667,367 patent/US8519067B2/en not_active Expired - Fee Related
- 2012-11-02 US US13/667,344 patent/US8697803B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW201245307A (en) | 2012-11-16 |
CN102627832A (en) | 2012-08-08 |
SG10201406280UA (en) | 2014-11-27 |
KR20110041577A (en) | 2011-04-21 |
SG156623A1 (en) | 2009-11-26 |
US8519067B2 (en) | 2013-08-27 |
US20130113122A1 (en) | 2013-05-09 |
US20130119564A1 (en) | 2013-05-16 |
US8697803B2 (en) | 2014-04-15 |
US8324326B2 (en) | 2012-12-04 |
US8921461B2 (en) | 2014-12-30 |
TWI378968B (en) | 2012-12-11 |
US20060157872A1 (en) | 2006-07-20 |
WO2006059542A1 (en) | 2006-06-08 |
CN102617981B (en) | 2016-12-14 |
TWI478969B (en) | 2015-04-01 |
TW201249920A (en) | 2012-12-16 |
US20130134610A1 (en) | 2013-05-30 |
KR101152040B1 (en) | 2012-07-23 |
CN102627832B (en) | 2017-04-26 |
CN102617981A (en) | 2012-08-01 |
MY150584A (en) | 2014-01-30 |
KR20110043762A (en) | 2011-04-27 |
KR101081723B1 (en) | 2011-11-08 |
TWI527854B (en) | 2016-04-01 |
US20090096114A1 (en) | 2009-04-16 |
SG10201406279UA (en) | 2014-11-27 |
TW200626660A (en) | 2006-08-01 |
MY150607A (en) | 2014-01-30 |
KR101081619B1 (en) | 2011-11-09 |
KR20070100253A (en) | 2007-10-10 |
MY150688A (en) | 2014-02-28 |
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