TWI311857B - - Google Patents

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Publication number
TWI311857B
TWI311857B TW092119310A TW92119310A TWI311857B TW I311857 B TWI311857 B TW I311857B TW 092119310 A TW092119310 A TW 092119310A TW 92119310 A TW92119310 A TW 92119310A TW I311857 B TWI311857 B TW I311857B
Authority
TW
Taiwan
Prior art keywords
lead
mounting
piezoelectric
terminal
lead frame
Prior art date
Application number
TW092119310A
Other languages
English (en)
Chinese (zh)
Other versions
TW200414676A (en
Inventor
Yugo Koyama
Katsuhiko Miyazaki
Kazuhiko Shimodaira
Yukari Nakajima
Original Assignee
Seiko Epson Corporatio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corporatio filed Critical Seiko Epson Corporatio
Publication of TW200414676A publication Critical patent/TW200414676A/zh
Application granted granted Critical
Publication of TWI311857B publication Critical patent/TWI311857B/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
TW092119310A 2002-12-10 2003-07-15 Piezoelectric oscillator and production method thereof, portable phone device, and electronic apparatus TW200414676A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002358392 2002-12-10
JP2003106598 2003-04-10
JP2003171195 2003-06-16

Publications (2)

Publication Number Publication Date
TW200414676A TW200414676A (en) 2004-08-01
TWI311857B true TWI311857B (ja) 2009-07-01

Family

ID=32512123

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092119310A TW200414676A (en) 2002-12-10 2003-07-15 Piezoelectric oscillator and production method thereof, portable phone device, and electronic apparatus

Country Status (4)

Country Link
KR (1) KR100661690B1 (ja)
CN (1) CN100471037C (ja)
TW (1) TW200414676A (ja)
WO (1) WO2004054089A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012060041A1 (ja) * 2010-11-01 2014-05-12 日本電気株式会社 発振装置及び携帯装置
JP2014060245A (ja) * 2012-09-18 2014-04-03 Mitsubishi Electric Corp 半導体装置
JP6643213B2 (ja) * 2016-09-16 2020-02-12 新光電気工業株式会社 リードフレーム及びその製造方法と電子部品装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01189151A (ja) * 1988-01-25 1989-07-28 Oki Electric Ind Co Ltd 面実装型半導体装置の外部リード
JPH01145140U (ja) * 1988-03-28 1989-10-05
JPH04116416U (ja) * 1991-03-28 1992-10-19 京セラ株式会社 水晶発振器
US5912592A (en) * 1994-07-04 1999-06-15 Seiko Epson Corporation Piezoelectric oscillator
JPH09219491A (ja) * 1996-02-08 1997-08-19 Toshiba Corp リードフレーム及び半導体装置
KR100214561B1 (ko) * 1997-03-14 1999-08-02 구본준 버틈 리드 패키지
JP2000170568A (ja) * 1998-09-28 2000-06-20 Toyota Motor Corp 車両のエンジン自動停止・再始動制御装置
JP2000150720A (ja) * 1998-11-05 2000-05-30 Fuji Electric Co Ltd 樹脂封止型半導体デバイス
JP2001332932A (ja) * 2000-05-22 2001-11-30 Daishinku Corp 圧電発振器
JP3436249B2 (ja) * 2000-11-21 2003-08-11 株式会社大真空 圧電振動デバイス用パッケージおよび圧電発振器
JP2002330027A (ja) * 2001-04-27 2002-11-15 Nippon Dempa Kogyo Co Ltd 表面実装用の温度補償水晶発振器

Also Published As

Publication number Publication date
KR20040078692A (ko) 2004-09-10
WO2004054089A1 (ja) 2004-06-24
KR100661690B1 (ko) 2006-12-26
TW200414676A (en) 2004-08-01
CN100471037C (zh) 2009-03-18
CN1630977A (zh) 2005-06-22

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