TWI301652B - Semiconductor device and its manufacturing method - Google Patents

Semiconductor device and its manufacturing method Download PDF

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Publication number
TWI301652B
TWI301652B TW096136616A TW96136616A TWI301652B TW I301652 B TWI301652 B TW I301652B TW 096136616 A TW096136616 A TW 096136616A TW 96136616 A TW96136616 A TW 96136616A TW I301652 B TWI301652 B TW I301652B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
semiconductor wafer
lead
support substrate
insulating member
Prior art date
Application number
TW096136616A
Other languages
English (en)
Chinese (zh)
Other versions
TW200811973A (en
Inventor
Yoshinori Miyaki
Hiromichi Suzuki
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW200811973A publication Critical patent/TW200811973A/zh
Application granted granted Critical
Publication of TWI301652B publication Critical patent/TWI301652B/zh

Links

Classifications

    • H10W72/00—
    • H10W70/413—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/884—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
TW096136616A 2000-10-20 2001-10-12 Semiconductor device and its manufacturing method TWI301652B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000320794A JP2002134674A (ja) 2000-10-20 2000-10-20 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
TW200811973A TW200811973A (en) 2008-03-01
TWI301652B true TWI301652B (en) 2008-10-01

Family

ID=18799021

Family Applications (2)

Application Number Title Priority Date Filing Date
TW096136616A TWI301652B (en) 2000-10-20 2001-10-12 Semiconductor device and its manufacturing method
TW090125297A TWI292213B (enExample) 2000-10-20 2001-10-12

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW090125297A TWI292213B (enExample) 2000-10-20 2001-10-12

Country Status (4)

Country Link
US (3) US6661081B2 (enExample)
JP (1) JP2002134674A (enExample)
KR (1) KR100764405B1 (enExample)
TW (2) TWI301652B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100533722C (zh) * 2002-07-01 2009-08-26 株式会社瑞萨科技 半导体器件
CN100413043C (zh) * 2003-08-29 2008-08-20 株式会社瑞萨科技 半导体器件的制造方法
US8648458B2 (en) * 2009-12-18 2014-02-11 Nxp B.V. Leadframe circuit and method therefor
US10267506B2 (en) 2010-11-22 2019-04-23 Cree, Inc. Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
WO2012109225A1 (en) 2011-02-07 2012-08-16 Cree, Inc. Components and methods for light emitting diode (led) lighting
US9431582B2 (en) * 2012-01-06 2016-08-30 Luminus Devices, Inc. Packaging method and system for LEDs
JP2013149779A (ja) * 2012-01-19 2013-08-01 Semiconductor Components Industries Llc 半導体装置
US9806246B2 (en) 2012-02-07 2017-10-31 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US9786825B2 (en) 2012-02-07 2017-10-10 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US8895998B2 (en) 2012-03-30 2014-11-25 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components and methods
US9538590B2 (en) 2012-03-30 2017-01-03 Cree, Inc. Solid state lighting apparatuses, systems, and related methods
USD738542S1 (en) 2013-04-19 2015-09-08 Cree, Inc. Light emitting unit
US9826581B2 (en) 2014-12-05 2017-11-21 Cree, Inc. Voltage configurable solid state lighting apparatuses, systems, and related methods
DE112016007241B4 (de) * 2016-09-20 2021-08-19 Mitsubishi Electric Corporation Halbleitervorrichtung
USD823492S1 (en) 2016-10-04 2018-07-17 Cree, Inc. Light emitting device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02217995A (ja) * 1989-02-18 1990-08-30 Kubota Ltd 自動販売機
JP2734463B2 (ja) * 1989-04-27 1998-03-30 株式会社日立製作所 半導体装置
US5068708A (en) * 1989-10-02 1991-11-26 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
US5177032A (en) * 1990-10-24 1993-01-05 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
JPH0536862A (ja) 1991-07-31 1993-02-12 Nec Ic Microcomput Syst Ltd 半導体装置
JPH05160304A (ja) 1991-12-06 1993-06-25 Toshiba Corp 半導体装置
JP3080333B2 (ja) 1992-02-25 2000-08-28 日立電線株式会社 半導体装置
US5457340A (en) * 1992-12-07 1995-10-10 Integrated Device Technology, Inc. Leadframe with power and ground planes
JPH06291217A (ja) 1993-03-30 1994-10-18 Hitachi Cable Ltd 熱放散型リードフレーム
JP3049466B2 (ja) 1993-11-30 2000-06-05 株式会社三井ハイテック 半導体装置用リ−ドフレ−ム
JPH08116012A (ja) 1994-10-18 1996-05-07 Dainippon Printing Co Ltd 放熱板とそれを用いたリードフレーム部材及び樹脂封止型半導体装置、および放熱板の製造方法
US5650663A (en) 1995-07-03 1997-07-22 Olin Corporation Electronic package with improved thermal properties
JPH09312375A (ja) * 1996-03-18 1997-12-02 Hitachi Ltd リードフレーム、半導体装置及び半導体装置の製造方法
JPH11289040A (ja) 1998-02-09 1999-10-19 Shinko Electric Ind Co Ltd リードフレーム及びこれを用いた半導体装置
US6404067B1 (en) * 1998-06-01 2002-06-11 Intel Corporation Plastic ball grid array package with improved moisture resistance
JP2000252404A (ja) 1999-02-25 2000-09-14 Toshiba Microelectronics Corp 半導体パッケージ及びその製造方法
WO2009002600A1 (en) 2007-06-27 2008-12-31 Tabula, Inc. Restructuring data from a trace buffer of a configurable ic

Also Published As

Publication number Publication date
KR100764405B1 (ko) 2007-10-05
US20020047189A1 (en) 2002-04-25
US20040089923A1 (en) 2004-05-13
US6962836B2 (en) 2005-11-08
TWI292213B (enExample) 2008-01-01
JP2002134674A (ja) 2002-05-10
TW200811973A (en) 2008-03-01
KR20020031050A (ko) 2002-04-26
US6661081B2 (en) 2003-12-09
US20040051167A1 (en) 2004-03-18

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