JP2005317998A5 - - Google Patents
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- Publication number
- JP2005317998A5 JP2005317998A5 JP2005214601A JP2005214601A JP2005317998A5 JP 2005317998 A5 JP2005317998 A5 JP 2005317998A5 JP 2005214601 A JP2005214601 A JP 2005214601A JP 2005214601 A JP2005214601 A JP 2005214601A JP 2005317998 A5 JP2005317998 A5 JP 2005317998A5
- Authority
- JP
- Japan
- Prior art keywords
- surface side
- semiconductor element
- semiconductor device
- lead frame
- frame material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 59
- 239000000463 material Substances 0.000 claims description 22
- 238000007747 plating Methods 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 229910000510 noble metal Inorganic materials 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005214601A JP3947750B2 (ja) | 2005-07-25 | 2005-07-25 | 半導体装置の製造方法及び半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005214601A JP3947750B2 (ja) | 2005-07-25 | 2005-07-25 | 半導体装置の製造方法及び半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19322599A Division JP3780122B2 (ja) | 1999-07-07 | 1999-07-07 | 半導体装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007067330A Division JP4137981B2 (ja) | 2007-03-15 | 2007-03-15 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005317998A JP2005317998A (ja) | 2005-11-10 |
| JP2005317998A5 true JP2005317998A5 (enExample) | 2007-02-01 |
| JP3947750B2 JP3947750B2 (ja) | 2007-07-25 |
Family
ID=35445024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005214601A Expired - Lifetime JP3947750B2 (ja) | 2005-07-25 | 2005-07-25 | 半導体装置の製造方法及び半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3947750B2 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8115285B2 (en) | 2008-03-14 | 2012-02-14 | Advanced Semiconductor Engineering, Inc. | Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof |
| TWI372458B (en) | 2008-05-12 | 2012-09-11 | Advanced Semiconductor Eng | Stacked type chip package structure |
| CN101651126A (zh) * | 2008-08-12 | 2010-02-17 | 三星电子株式会社 | 芯片封装件及其制造方法 |
| US20100044850A1 (en) | 2008-08-21 | 2010-02-25 | Advanced Semiconductor Engineering, Inc. | Advanced quad flat non-leaded package structure and manufacturing method thereof |
| US8659131B2 (en) | 2008-09-25 | 2014-02-25 | Lg Innotek Co., Ltd. | Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut |
| KR101064755B1 (ko) * | 2008-12-24 | 2011-09-15 | 엘지이노텍 주식회사 | 다열 리드형 리드프레임 및 이를 이용한 반도체 패키지의 제조방법 |
| JP2011517069A (ja) | 2009-03-06 | 2011-05-26 | カイシン インコーポレイテッド | 高密度コンタクトを有するリードレス集積回路パッケージ |
| US7858443B2 (en) | 2009-03-09 | 2010-12-28 | Utac Hong Kong Limited | Leadless integrated circuit package having standoff contacts and die attach pad |
| CN102395981B (zh) | 2009-04-03 | 2014-12-03 | 凯信公司 | Ic封装的引线框架和制造方法 |
| US8124447B2 (en) | 2009-04-10 | 2012-02-28 | Advanced Semiconductor Engineering, Inc. | Manufacturing method of advanced quad flat non-leaded package |
| US9362138B2 (en) | 2009-09-02 | 2016-06-07 | Kaixin, Inc. | IC package and method for manufacturing the same |
| KR101445759B1 (ko) | 2010-03-30 | 2014-10-06 | 해성디에스 주식회사 | 리드 프레임 및 이를 사용한 집적회로 소자 |
| KR101128999B1 (ko) * | 2010-07-08 | 2012-03-23 | 엘지이노텍 주식회사 | 칩 패키지 제조 방법 및 이에 의해 제조된 칩 패키지 |
| JP2016171101A (ja) * | 2015-03-11 | 2016-09-23 | Ａｍテクノワークス株式会社 | 放熱基板の製造方法および放熱基板 |
| US9570381B2 (en) | 2015-04-02 | 2017-02-14 | Advanced Semiconductor Engineering, Inc. | Semiconductor packages and related manufacturing methods |
-
2005
- 2005-07-25 JP JP2005214601A patent/JP3947750B2/ja not_active Expired - Lifetime
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