TWI299293B - - Google Patents
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- Publication number
- TWI299293B TWI299293B TW092113548A TW92113548A TWI299293B TW I299293 B TWI299293 B TW I299293B TW 092113548 A TW092113548 A TW 092113548A TW 92113548 A TW92113548 A TW 92113548A TW I299293 B TWI299293 B TW I299293B
- Authority
- TW
- Taiwan
- Prior art keywords
- glass substrate
- cooling
- substrate
- scribing
- glass
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 121
- 238000000034 method Methods 0.000 claims description 53
- 238000001816 cooling Methods 0.000 claims description 51
- 238000010438 heat treatment Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 19
- 238000009826 distribution Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 description 134
- 239000013256 coordination polymer Substances 0.000 description 15
- 230000003287 optical effect Effects 0.000 description 12
- 239000002826 coolant Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000000498 cooling water Substances 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000006124 Pilkington process Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002170520A JP4408607B2 (ja) | 2002-06-11 | 2002-06-11 | スクライブ方法及びスクライブ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200307586A TW200307586A (en) | 2003-12-16 |
| TWI299293B true TWI299293B (enExample) | 2008-08-01 |
Family
ID=29996454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092113548A TW200307586A (en) | 2002-06-11 | 2003-05-20 | Scribing method and scribing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4408607B2 (enExample) |
| KR (1) | KR100925287B1 (enExample) |
| CN (1) | CN100431108C (enExample) |
| TW (1) | TW200307586A (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4615231B2 (ja) * | 2004-02-02 | 2011-01-19 | 三星ダイヤモンド工業株式会社 | スクライブ装置およびこの装置を用いたスクライブ方法 |
| KR101043674B1 (ko) * | 2004-05-11 | 2011-06-23 | 엘지디스플레이 주식회사 | 스크라이빙 장치 및 방법 |
| US20080286943A1 (en) * | 2004-05-20 | 2008-11-20 | Mitsuboshi Diamond Industrial Co., Ltd. | Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium |
| KR100602623B1 (ko) * | 2004-05-31 | 2006-07-19 | 윤종진 | 덩어리 고무의 절단장치 |
| US7820941B2 (en) * | 2004-07-30 | 2010-10-26 | Corning Incorporated | Process and apparatus for scoring a brittle material |
| KR101096733B1 (ko) | 2004-12-27 | 2011-12-21 | 엘지디스플레이 주식회사 | 기판의 절단장치 및 이를 이용한 기판의 절단방법 |
| US7423818B2 (en) * | 2005-07-15 | 2008-09-09 | Electro Scientific Industries, Inc. | Method of suppressing distortion of a working laser beam of a laser link processing system |
| JP4851795B2 (ja) * | 2006-01-13 | 2012-01-11 | 株式会社ディスコ | ウエーハの分割装置 |
| JP4251203B2 (ja) * | 2006-08-29 | 2009-04-08 | セイコーエプソン株式会社 | 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法 |
| JP5235987B2 (ja) * | 2007-04-30 | 2013-07-10 | コーニング インコーポレイテッド | 移動中の帯状ガラスに切断線を設ける装置、システム及び方法 |
| US7982162B2 (en) * | 2007-05-15 | 2011-07-19 | Corning Incorporated | Method and apparatus for scoring and separating a brittle material with a single beam of radiation |
| US8051679B2 (en) * | 2008-09-29 | 2011-11-08 | Corning Incorporated | Laser separation of glass sheets |
| US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| US8426767B2 (en) * | 2009-08-31 | 2013-04-23 | Corning Incorporated | Methods for laser scribing and breaking thin glass |
| US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| TWI513670B (zh) | 2010-08-31 | 2015-12-21 | Corning Inc | 分離強化玻璃基板之方法 |
| JP5202595B2 (ja) | 2010-09-10 | 2013-06-05 | 三星ダイヤモンド工業株式会社 | レーザ割断装置 |
| TW201231421A (en) * | 2010-11-30 | 2012-08-01 | Corning Inc | Methods for separating a sheet of brittle material |
| US8978528B2 (en) | 2011-08-05 | 2015-03-17 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Method for cutting panel substrate and substrate cutting apparatus |
| CN102390923A (zh) * | 2011-08-05 | 2012-03-28 | 深圳市华星光电技术有限公司 | 面板基板切割方法及基板切割装置 |
| DE102011084128A1 (de) * | 2011-10-07 | 2013-04-11 | Schott Ag | Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante |
| JP5879106B2 (ja) * | 2011-11-25 | 2016-03-08 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のスクライブ方法 |
| US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
| JP6268805B2 (ja) * | 2013-08-13 | 2018-01-31 | 日本電気硝子株式会社 | ガラス板の製造方法 |
| TW201628751A (zh) * | 2014-11-20 | 2016-08-16 | 康寧公司 | 彈性玻璃基板之回饋控制的雷射切割 |
| US20200324429A1 (en) * | 2016-05-31 | 2020-10-15 | Faurecia (China) Holding Co., Ltd. | Release agent supply device for cold knife weakening and a cold knife system comprising such a device |
| CN107336369B (zh) * | 2017-06-20 | 2019-01-04 | 杭州师范大学钱江学院 | 玻璃瓶分割回收环保装置 |
| CN108032354B (zh) * | 2017-10-25 | 2020-03-17 | 苏州三鑫时代新材料股份有限公司 | 一种光扩散板的切边自动分离方法及自动分离装置 |
| CN113751789B (zh) * | 2021-09-29 | 2022-11-11 | 南通东海机床制造集团有限公司 | 一种剪板机剪切快速定位装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY120533A (en) * | 1997-04-14 | 2005-11-30 | Schott Ag | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass. |
| JP2001130921A (ja) * | 1999-10-29 | 2001-05-15 | Mitsuboshi Diamond Industrial Co Ltd | 脆性基板の加工方法及び装置 |
| AU1790001A (en) * | 1999-11-24 | 2001-06-04 | Applied Photonics, Inc. | Method and apparatus for separating non-metallic materials |
| KR100673073B1 (ko) * | 2000-10-21 | 2007-01-22 | 삼성전자주식회사 | 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치 |
-
2002
- 2002-06-11 JP JP2002170520A patent/JP4408607B2/ja not_active Expired - Fee Related
-
2003
- 2003-05-20 TW TW092113548A patent/TW200307586A/zh not_active IP Right Cessation
- 2003-05-30 KR KR1020030034598A patent/KR100925287B1/ko not_active Expired - Fee Related
- 2003-06-11 CN CNB031412890A patent/CN100431108C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100431108C (zh) | 2008-11-05 |
| KR20030095233A (ko) | 2003-12-18 |
| CN1468695A (zh) | 2004-01-21 |
| JP2004010466A (ja) | 2004-01-15 |
| JP4408607B2 (ja) | 2010-02-03 |
| KR100925287B1 (ko) | 2009-11-05 |
| TW200307586A (en) | 2003-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |